MPC8543EVTANGD - PowerQUICC III e500 SoC, 800MHz, 783-FCPBGA | NXP
N.º da peça: MPC8543EVTANGD ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $138.45 | $138,45 |
| 10 | $124.6 | $1.246,00 |
| 100 | $110.75 | $11.075,00 |
| 500 | $99.8 | $49.900,00 |
| 1.000 | $92.5 | $92.500,00 |
MPC8543EVTANGD Visão geral
An embedded communications processor (often called an MPU or network SoC) is a system-on-chip that combines a high-performance CPU core, integrated peripherals, and on-chip accelerators to handle packet processing, protocol bridging, and control-plane tasks in networking and storage equipment. In the wider taxonomy, an MPU belongs to embedded microcontrollers, then to microprocessors, then to integrated circuits, then to semiconductors. The PowerQUICC III family is NXP's flagship line for routers, switches, line cards, and base-station control.
Key features of the MPC8543EVTANGD include 800 MHz e500 core frequency, dual integrated 10/100/1000 Ethernet MACs with SGMII support, a DDR2 SDRAM controller with ECC for high-reliability memory subsystems, two PCI Express interfaces plus a PCI 32-bit/66 MHz interface, and a Serial RapidIO endpoint for chip-to-chip interconnect. The integrated security engine accelerates DES, 3DES, AES, ARC4, SHA-1/MD5, and public-key algorithms, eliminating the need for an external crypto chip.
Architecturally, the device pairs the e500 core with a high-bandwidth system bus, dedicated DMA engines, and tightly coupled peripheral controllers. Process technology is 90 nm (per third-party listings), allowing tight integration while keeping power within a manageable envelope for fan-cooled line cards. The result is single-chip packet processing that previously required an MCU plus network ASIC plus memory controller plus crypto coprocessor.
Typical applications include enterprise routers and switches, multi-service access platforms, wireless base-station controllers, network-attached storage (NAS), secure VPN gateways, and industrial control equipment requiring deterministic networking. Designers also use it in line cards for high-end routers, where it acts as the local control and forwarding engine.
For design, plan thermal management for the 29x29 mm FCPBGA: provide a continuous ground/power plane under the package and at least 4-layer PCB stackup for power integrity. The 0 to 105 C temperature range supports both commercial and extended-industrial deployments without a heatsink at moderate workloads.
This page synthesizes distributor stock, lead-time, and pin-compatible PowerQUICC III alternatives sourced from NXP's product selector and verified distributor listings - information not consolidated in any single datasheet.
Alternativas drop-in para MPC8543EVTANGD — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8543EVTANGD (mesmo formato e footprint) — diferindo em Core Architecture, Mounting Type, Series, Core Voltage, Memory Controller.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8543EVTANNGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8543EVTAQGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8543ECVTAQGD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8545EVJANGD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8548EVTAUJB
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →MPC8543EVTANGD Classificações máximas e características elétricas
| Series | PowerQUICC III |
| Core Processor | PowerPC e500 |
| Core Architecture | Power Architecture (32-bit) |
| Number of Cores | 1 |
| Core Frequency | 800 MHz |
| Faixa de temperatura de operação | 0 C to +105 C |
| Encapsulamento | 783-FCPBGA (29x29 mm) |
| Tipo de montagem | Surface Mount |
| Ethernet | 2x 10/100/1000 (SGMII) |
| PCI Express | 2x PCIe interfaces |
| PCI | 32-bit / 66 MHz |
| Serial RapidIO | Yes (endpoint) |
| Memory Controller | DDR2 SDRAM with ECC |
| Security Engine (SEC) | DES/3DES/AES/SHA-1/MD5/ARC4 |
| Supply Voltage (core/IO/DDR) | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 90 nm (per FindIC listing) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do MPC8543EVTANGD 783-fcpbga (29x29 mm)
Configuração de pinos para MPC8543EVTANGD (pacote 783-fcpbga (29x29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8543EVTANGD.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8543EVTANGD é adequado para 7 aplicaçãos: Enterprise Router / Switch Line Card, Wireless Base Station Controller, Industrial Control / SCADA Gateway, Network-Attached Storage (NAS) Controller, Secure VPN / SSL Gateway, VoIP / Unified Communications Server, Print / Imaging Controller Board.
Enterprise Router / Switch Line Card
The MPC8543EVTANGD fits enterprise router and switch line cards because its 800 MHz PowerPC e500 core plus dual GbE MACs with SGMII provide the per-port throughput needed for forwarding-plane tables and ACL lookups. With integrated DDR2 ECC and a 32-bit/66 MHz PCI plus 2x PCI Express interfaces, the chip can be dropped into a switch-fabric ASIC alongside for distributed forwarding. Its 0 to 105 C range supports fan-cooled chassis deployments, while the SEC engine accelerates IPsec at line rate for VPN-capable routers.
Recomendado
Wireless Base Station Controller
The MPC8543EVTANGD serves in wireless base-station controllers where deterministic packet handling and hardware-accelerated cryptography are required. Its integrated SEC engine accelerates AES/SHA for cellular control-plane integrity, while Serial RapidIO offers chip-to-chip interconnect to baseband DSPs. The DDR2 ECC controller maintains memory reliability over the long product life of carrier-grade base stations, and the 800 MHz core rate keeps control-plane latency within LTE/5G NR budgets.
Recomendado
Industrial Control / SCADA Gateway
The MPC8543EVTANGD is well matched to SCADA gateways and industrial control PLCs that must bridge legacy serial, Ethernet, and fieldbus networks to IP-based control rooms. The dual GbE controllers plus PCI/PCIe expansion allow integration of industrial I/O cards, while the integrated security engine enforces secure remote-access tunnels without an external crypto chip. The 0 to +105 C range and 90 nm CMOS process give it the longevity required for industrial deployment cycles.
Recomendado
Network-Attached Storage (NAS) Controller
In NAS controllers, the MPC8543EVTANGD acts as the storage protocol processor, terminating iSCSI, NFS, and SMB and presenting RAID volumes to the network. Its DDR2 ECC controller sustains the cache workloads that file-serving demands, while dual GbE ports support link aggregation for multi-gigabit throughput. The security engine accelerates SMB signing and IPsec for encrypted storage backbones.
Recomendado
Secure VPN / SSL Gateway
The MPC8543EVTANGD is a drop-in SoC for VPN and SSL gateway appliances that need hardware-accelerated encryption. The SEC engine handles AES-256 and RSA at rates that meet gigabit-class VPN throughput, offloading the e500 core for connection-tracking tasks. With 0 to +105 C operation and industrial-grade power-supply tolerance, the chip fits hardened perimeter security appliances deployed in datacenters and edge POPs.
Recomendado
VoIP / Unified Communications Server
In VoIP and unified-communications servers, the MPC8543EVTANGD processes signaling (SIP, H.323, MGCP) and media-engine control while the e500 core keeps session-state machines responsive. The dual GbE MACs segregate signaling and media onto separate VLANs, and the integrated security engine handles TLS for SIP-TLS and SRTP key management. The 783-FCPBGA package and 0 to +105 C operation fit standard 1U server thermal envelopes.
Recomendado
Print / Imaging Controller Board
The MPC8543EVTANGD is found in high-end multifunction printer and production-print controllers, where it manages the RIP (raster image processor), PDL (page-description language) parsing, and gigabit network print queues. DDR2 ECC keeps long print runs free from soft errors, and PCI/PCIe expansion lets designers attach proprietary imaging ASICs and rasterizers. The part's longevity (NXP continues to ship it in active production) suits long-life enterprise MFP designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8543EVTANGD — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8543EVTANNGD | MPC8543EVTAQGD | MPC8543ECVTAQGD | MPC8545EVJANGD | MPC8548EVTAUJB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz (lower power bin) | 800 MHz | ~1.0 GHz (higher tier) | ~1.0-1.2 GHz (higher tier) |
| Operating Temperature | 0 to +105 C | -40 to +105 C (industrial) | 0 to +105 C | 0 to +105 C | 0 to +105 C | 0 to +105 C |
| Memory Controller | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Security Engine | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (enhanced SEC) |
| Dual GbE (SGMII) | Yes | Yes | Yes | Yes | Yes | Yes |
| Approximate Unit Price (USD) | 138.45 | ~150-180 | ~120-140 | ~140-160 | ~180-220 | ~250-300 |
Principais diferenciais
- Industrial temperature range option within same footprint (vs MPC8543EVTANNGD)
- Lower-power binning in same package (vs MPC8543EVTAQGD)
- Cost-efficient upgrade path within PowerQUICC III family (vs MPC8545EVJANGD)
Notas de projeto
Estimated: the 783-FCPBGA (29x29 mm) package provides a large thermal mass, but at 800 MHz the part can dissipate 5-8 W under heavy IO load. The NXP hardware specification recommends a continuous ground/power plane on the top PCB layer under the package and 4-layer minimum stackup with thermal vias to the inner ground plane. For sealed enclosures, derate the ambient temperature budget to keep junction below 105 C.
Use a sequenced multi-rail supply: 1.8 V core must ramp before 2.5 V auxiliary, and 2.5 V must ramp before 3.3 V DDR2. Per the NXP reference design, a discrete sequencer IC (or PMIC with timing control) is mandatory. Add bulk decoupling (47 uF) plus 0.1 uF/1 nF high-frequency caps adjacent to each supply pin; place ferrite beads on the 3.3 V DDR rail to isolate switching noise from the core logic.
The 783-FCPBGA uses a 1.0 mm pitch BGA. The NXP design guide recommends microvia stackup with 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Route DDR2 address/control/clock traces with matched-length topology (clock within 25 mils of strobe) and 50 ohm controlled impedance. Keep SERDES differential pairs within 5 mil length match and isolate them with a continuous ground guard trace.
Do not assume generic BGA reflow profiles - the FCPBGA's large thermal mass requires a slower ramp (1 C/sec) and a 60-90 second soak above 150 C. Always honor the MSL rating and bake-bag the parts before assembly. Additionally, do not load firmware without first enabling DDR2 ECC in the U-Boot or bootloader configuration; running without ECC defeats the reliability benefit of the controller.
Informações de conformidade
RoHS/REACH compliance inferred from NXP product listings. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. Industrial variants (MPC8543EVTANNGD) are recommended for harsh-environment deployments.