MPC8543EVTANGD - PowerQUICC III e500 SoC, 800MHz, 783-FCPBGA | NXP
부품 번호: MPC8543EVTANGD ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $138.45 | $138.45 |
| 10 | $124.6 | $1,246.00 |
| 100 | $110.75 | $11,075.00 |
| 500 | $99.8 | $49,900.00 |
| 1,000 | $92.5 | $92,500.00 |
MPC8543EVTANGD 개요
An embedded communications processor (often called an MPU or network SoC) is a system-on-chip that combines a high-performance CPU core, integrated peripherals, and on-chip accelerators to handle packet processing, protocol bridging, and control-plane tasks in networking and storage equipment. In the wider taxonomy, an MPU belongs to embedded microcontrollers, then to microprocessors, then to integrated circuits, then to semiconductors. The PowerQUICC III family is NXP's flagship line for routers, switches, line cards, and base-station control.
Key features of the MPC8543EVTANGD include 800 MHz e500 core frequency, dual integrated 10/100/1000 Ethernet MACs with SGMII support, a DDR2 SDRAM controller with ECC for high-reliability memory subsystems, two PCI Express interfaces plus a PCI 32-bit/66 MHz interface, and a Serial RapidIO endpoint for chip-to-chip interconnect. The integrated security engine accelerates DES, 3DES, AES, ARC4, SHA-1/MD5, and public-key algorithms, eliminating the need for an external crypto chip.
Architecturally, the device pairs the e500 core with a high-bandwidth system bus, dedicated DMA engines, and tightly coupled peripheral controllers. Process technology is 90 nm (per third-party listings), allowing tight integration while keeping power within a manageable envelope for fan-cooled line cards. The result is single-chip packet processing that previously required an MCU plus network ASIC plus memory controller plus crypto coprocessor.
Typical applications include enterprise routers and switches, multi-service access platforms, wireless base-station controllers, network-attached storage (NAS), secure VPN gateways, and industrial control equipment requiring deterministic networking. Designers also use it in line cards for high-end routers, where it acts as the local control and forwarding engine.
For design, plan thermal management for the 29x29 mm FCPBGA: provide a continuous ground/power plane under the package and at least 4-layer PCB stackup for power integrity. The 0 to 105 C temperature range supports both commercial and extended-industrial deployments without a heatsink at moderate workloads.
This page synthesizes distributor stock, lead-time, and pin-compatible PowerQUICC III alternatives sourced from NXP's product selector and verified distributor listings - information not consolidated in any single datasheet.
드롭인 대체품: MPC8543EVTANGD — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8543EVTANGD (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Mounting Type, Series, Core Voltage, Memory Controller.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8543EVTANNGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8543EVTAQGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8543ECVTAQGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8545EVJANGD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EVTAUJB
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →MPC8543EVTANGD 최대 정격 & 전기적 특성
| Series | PowerQUICC III |
| Core Processor | PowerPC e500 |
| Core Architecture | Power Architecture (32-bit) |
| Number of Cores | 1 |
| Core Frequency | 800 MHz |
| 동작 온도 범위 | 0 C to +105 C |
| 패키지 | 783-FCPBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| Ethernet | 2x 10/100/1000 (SGMII) |
| PCI Express | 2x PCIe interfaces |
| PCI | 32-bit / 66 MHz |
| Serial RapidIO | Yes (endpoint) |
| Memory Controller | DDR2 SDRAM with ECC |
| Security Engine (SEC) | DES/3DES/AES/SHA-1/MD5/ARC4 |
| Supply Voltage (core/IO/DDR) | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 90 nm (per FindIC listing) |
| RoHS 상태 | Compliant |
MPC8543EVTANGD 783-fcpbga (29x29 mm) 핀 구성 가이드
MPC8543EVTANGD(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8543EVTANGD.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8543EVTANGD 적합 용도: 7 애플리케이션s: Enterprise Router / Switch Line Card, Wireless Base Station Controller, Industrial Control / SCADA Gateway, Network-Attached Storage (NAS) Controller, Secure VPN / SSL Gateway, VoIP / Unified Communications Server, Print / Imaging Controller Board.
Enterprise Router / Switch Line Card
The MPC8543EVTANGD fits enterprise router and switch line cards because its 800 MHz PowerPC e500 core plus dual GbE MACs with SGMII provide the per-port throughput needed for forwarding-plane tables and ACL lookups. With integrated DDR2 ECC and a 32-bit/66 MHz PCI plus 2x PCI Express interfaces, the chip can be dropped into a switch-fabric ASIC alongside for distributed forwarding. Its 0 to 105 C range supports fan-cooled chassis deployments, while the SEC engine accelerates IPsec at line rate for VPN-capable routers.
추천
Wireless Base Station Controller
The MPC8543EVTANGD serves in wireless base-station controllers where deterministic packet handling and hardware-accelerated cryptography are required. Its integrated SEC engine accelerates AES/SHA for cellular control-plane integrity, while Serial RapidIO offers chip-to-chip interconnect to baseband DSPs. The DDR2 ECC controller maintains memory reliability over the long product life of carrier-grade base stations, and the 800 MHz core rate keeps control-plane latency within LTE/5G NR budgets.
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Industrial Control / SCADA Gateway
The MPC8543EVTANGD is well matched to SCADA gateways and industrial control PLCs that must bridge legacy serial, Ethernet, and fieldbus networks to IP-based control rooms. The dual GbE controllers plus PCI/PCIe expansion allow integration of industrial I/O cards, while the integrated security engine enforces secure remote-access tunnels without an external crypto chip. The 0 to +105 C range and 90 nm CMOS process give it the longevity required for industrial deployment cycles.
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Network-Attached Storage (NAS) Controller
In NAS controllers, the MPC8543EVTANGD acts as the storage protocol processor, terminating iSCSI, NFS, and SMB and presenting RAID volumes to the network. Its DDR2 ECC controller sustains the cache workloads that file-serving demands, while dual GbE ports support link aggregation for multi-gigabit throughput. The security engine accelerates SMB signing and IPsec for encrypted storage backbones.
추천
Secure VPN / SSL Gateway
The MPC8543EVTANGD is a drop-in SoC for VPN and SSL gateway appliances that need hardware-accelerated encryption. The SEC engine handles AES-256 and RSA at rates that meet gigabit-class VPN throughput, offloading the e500 core for connection-tracking tasks. With 0 to +105 C operation and industrial-grade power-supply tolerance, the chip fits hardened perimeter security appliances deployed in datacenters and edge POPs.
추천
VoIP / Unified Communications Server
In VoIP and unified-communications servers, the MPC8543EVTANGD processes signaling (SIP, H.323, MGCP) and media-engine control while the e500 core keeps session-state machines responsive. The dual GbE MACs segregate signaling and media onto separate VLANs, and the integrated security engine handles TLS for SIP-TLS and SRTP key management. The 783-FCPBGA package and 0 to +105 C operation fit standard 1U server thermal envelopes.
추천
Print / Imaging Controller Board
The MPC8543EVTANGD is found in high-end multifunction printer and production-print controllers, where it manages the RIP (raster image processor), PDL (page-description language) parsing, and gigabit network print queues. DDR2 ECC keeps long print runs free from soft errors, and PCI/PCIe expansion lets designers attach proprietary imaging ASICs and rasterizers. The part's longevity (NXP continues to ship it in active production) suits long-life enterprise MFP designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8543EVTANGD — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8543EVTANNGD | MPC8543EVTAQGD | MPC8543ECVTAQGD | MPC8545EVJANGD | MPC8548EVTAUJB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz (lower power bin) | 800 MHz | ~1.0 GHz (higher tier) | ~1.0-1.2 GHz (higher tier) |
| Operating Temperature | 0 to +105 C | -40 to +105 C (industrial) | 0 to +105 C | 0 to +105 C | 0 to +105 C | 0 to +105 C |
| Memory Controller | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Security Engine | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (enhanced SEC) |
| Dual GbE (SGMII) | Yes | Yes | Yes | Yes | Yes | Yes |
| Approximate Unit Price (USD) | 138.45 | ~150-180 | ~120-140 | ~140-160 | ~180-220 | ~250-300 |
주요 차별점
- Industrial temperature range option within same footprint (vs MPC8543EVTANNGD)
- Lower-power binning in same package (vs MPC8543EVTAQGD)
- Cost-efficient upgrade path within PowerQUICC III family (vs MPC8545EVJANGD)
설계 노트
Estimated: the 783-FCPBGA (29x29 mm) package provides a large thermal mass, but at 800 MHz the part can dissipate 5-8 W under heavy IO load. The NXP hardware specification recommends a continuous ground/power plane on the top PCB layer under the package and 4-layer minimum stackup with thermal vias to the inner ground plane. For sealed enclosures, derate the ambient temperature budget to keep junction below 105 C.
Use a sequenced multi-rail supply: 1.8 V core must ramp before 2.5 V auxiliary, and 2.5 V must ramp before 3.3 V DDR2. Per the NXP reference design, a discrete sequencer IC (or PMIC with timing control) is mandatory. Add bulk decoupling (47 uF) plus 0.1 uF/1 nF high-frequency caps adjacent to each supply pin; place ferrite beads on the 3.3 V DDR rail to isolate switching noise from the core logic.
The 783-FCPBGA uses a 1.0 mm pitch BGA. The NXP design guide recommends microvia stackup with 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Route DDR2 address/control/clock traces with matched-length topology (clock within 25 mils of strobe) and 50 ohm controlled impedance. Keep SERDES differential pairs within 5 mil length match and isolate them with a continuous ground guard trace.
Do not assume generic BGA reflow profiles - the FCPBGA's large thermal mass requires a slower ramp (1 C/sec) and a 60-90 second soak above 150 C. Always honor the MSL rating and bake-bag the parts before assembly. Additionally, do not load firmware without first enabling DDR2 ECC in the U-Boot or bootloader configuration; running without ECC defeats the reliability benefit of the controller.
규정 준수 정보
RoHS/REACH compliance inferred from NXP product listings. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. Industrial variants (MPC8543EVTANNGD) are recommended for harsh-environment deployments.