MPC8545VTATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP
N.º da peça: MPC8545VTATGD557 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265.5 | $2.655,00 |
| 100 | $232 | $23.200,00 |
| 500 | $198.75 | $99.375,00 |
| 1.000 | $175 | $175.000,00 |
MPC8545VTATGD557 Visão geral
A PowerQUICC III integrated processor is a system-on-chip that combines a high-performance PowerPC host core with on-chip peripheral controllers (Ethernet, ATM, HDLC, PCI, RapidIO), allowing original equipment manufacturers to build complete communications line cards with minimal external logic. Within the broader IC hierarchy, the MPC8545 sits between general-purpose microcontrollers and dedicated network processors (NPUs), filling the role of a control-plane CPU with hardware-accelerated packet handling.
Key features include hardware-accelerated encryption via the integrated SEC 3.0 engine (AES, 3DES, MD-5, SHA-1, Kasumi, public-key accelerator), a DDR2 memory controller supporting up to 2 GB of addressable memory, and four Gigabit Ethernet MACs with SGMII/1000Base-X PHY interfaces. The part is offered in industrial temperature grades (T suffix indicates -40°C to +105°C ambient operation).
Typical applications include multi-service routers, DSLAM line cards, wireless base-station controllers, RAID storage controllers, and industrial automation gateways. The 783-FCPBGA package with 1 mm ball pitch requires an 8-layer or denser PCB with controlled-impedance routing for DDR2 and high-speed serial links.
When designing with this part, allocate at least four PCB layers for power/ground planes to maintain signal integrity on the DDR2 bus. The core voltage (1.2V nominal) requires a high-efficiency buck regulator capable of 10 A continuous output, while the 1.8V/2.5V/3.3V I/O rails each need separate decoupling and controlled rise times. Thermal management with the 29x29 mm package relies primarily on the PCB copper pour and forced airflow at 1.2 GHz operation.
This page consolidates datasheet excerpts, current distributor pricing as of 2026-10-17, same-package alternative MPNs in the PowerQUICC III family, and application guidance that complements the NXP hardware specifications document.
Alternativas drop-in para MPC8545VTATGD557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8545VTATGD557 (mesmo formato e footprint) — diferindo em Core Architecture, Core Frequency, Package, Core Voltage, Ethernet.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8545EVTANGD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8545VTATGD
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →MPC8545CHXANGA
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8545CHXANGB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC8545VTAQGD
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$135.5 / unidade
Ver ficha técnica →MPC8548EVTAQGD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8545VTATGD557 Classificações máximas e características elétricas
| Core Architecture | PowerPC e500 (32-bit) |
| Core Frequency | 1.2 GHz |
| Number of Cores | 1 |
| L2 Cache | 512 KB |
| Memory Controller | DDR2 SDRAM, up to 2 GB |
| Ethernet Interfaces | 4x Gigabit Ethernet MACs (SGMII/1000BASE-X) |
| PCI Interface | PCI / PCI-X |
| Security Engine | SEC 3.0 (AES, 3DES, SHA-1, MD5, public-key) |
| Local Bus Speed | 200 MHz |
| Serial RapidIO | Yes |
| Voltage - I/O | 1.8V / 2.5V / 3.3V |
| Core Voltage | 1.2 V nominal |
| Temperatura de operação | -40°C to +105°C (T suffix, industrial) |
| Encapsulamento | 783-FCPBGA (29x29 mm, 1.0 mm pitch) |
| Product Family | PowerQUICC III (MPC85xx) |
Configuração de pinos do MPC8545VTATGD557
| Pino A1 | VSS — Ground |
| Pino B5 | VDD_CORE — Core supply 1.2 V nominal |
| Pino C12 | MDQS0 — DDR2 MDQS data strobe |
| Pino G24 | TSEC1_TXD0 — Gigabit Ethernet 1 transmit data bit 0 |
| Pino H12 | PCI_AD31 — PCI address/data bit 31 |
| Pino AD8 | LA[27] — Local bus address bit 27 |
| Pino AK21 | GND_OBS — Ground observation pin |
| Pino AN1 | GND — Ground |
| Pino AN30 | TSE_CLK — Ethernet reference clock input |
| Pino D25 | JTAG_TMS — JTAG test mode select |
Aplicações típicas
MPC8545VTATGD557 é adequado para 6 aplicaçãos: Multi-Service Router Line Card, DSLAM Line Card Controller, RAID Storage Controller, Industrial Automation Gateway, Wireless Base Station Controller, Network Security Appliance.
Multi-Service Router Line Card
The MPC8545VTATGD557's 1.2 GHz e500 core, four Gigabit Ethernet MACs, and SEC 3.0 hardware encryption make it ideal for service-provider line cards that handle mixed voice, video, and data traffic. The DDR2 controller drives up to 2 GB of packet buffer memory, while PCI-X/PCI interfaces connect to upstream switch fabrics. In a typical design, the MPC8545VTATGD557 acts as the control-plane CPU while an NPU such as NXP's B4860 handles the data plane - the two communicating via the integrated Serial RapidIO link. Power dissipation at 1.2 GHz with all MACs active stays within a 10 W envelope, manageable with 4-layer PCB thermal design.
Recomendado
DSLAM Line Card Controller
DSL Access Multiplexer (DSLAM) line cards aggregate thousands of subscriber channels while feeding aggregation uplinks. The MPC8545VTATGD557's hardware-accelerated HDLC, ATM, and Ethernet MACs handle the protocol conversion in hardware, freeing the e500 core for traffic shaping, QoS policies, and subscriber management. Operating at industrial temperature and supporting SEC 3.0 for IPSec, it also addresses encrypted backhaul scenarios. Per reference designs, designers usually pair it with an external UTOPIA/SPI bridge for DSL PHY connectivity, while DRAM timing is controlled via POR configuration word 4 for tight DDR2-667 margins.
Recomendado
RAID Storage Controller
RAID controllers in mid-range enterprise arrays need deterministic I/O scheduling and hardware CRC/XOR acceleration - both provided by the MPC8545VTATGD557. Four GbE MACs feed SATA/SAS bridge chips (such as the LSISAS2008), while the DDR2 controller buffers stripe writes. The SEC 3.0 engine accelerates drive-encryption on write paths. Reference designs distribute stripe writes across 8-16 disks using the host PCI-X interface to a downstream expander. Power dissipation under 10 W at 1.2 GHz suits 1U rack chassis with restricted airflow.
Recomendado
Industrial Automation Gateway
Industrial gateways translate between fieldbus protocols (PROFIBUS, EtherCAT, Modbus) and IP/Ethernet networks. The MPC8545VTATGD557's industrial temperature range (-40°C to +105°C) supports deployments in factory floors and outdoor cabinets. Four GbE MACs fan out to upstream switches while UART/SPI connect to sensor hubs. The SEC 3.0 block secures OPC-UA telemetry, and the PCI bus allows connection to specialized industrial IO modules. Typical reference designs integrate an NXP T1023 as companion Ethernet switch, with the MPC8545 handling the protocol translation compute load.
Recomendado
Wireless Base Station Controller
Small-cell base stations and picocells require a control-plane CPU to manage radio-resource allocation, timing synchronization, and backhaul encryption. The MPC8545VTATGD557's SEC 3.0 engine handles IPSec tunnels, while its Serial RapidIO connects to DSP arrays such as the NXP MSC8156. Deterministic interrupt response makes it suitable for LTE MAC-layer scheduling. Reference designs include a 1 GbE SGMII link to the radio front-end, with local 1 GB DDR2 absorbing transient data bursts. Industrial temperature rating tolerates outdoor cabinet mounting.
Recomendado
Network Security Appliance
Dedicated security appliances - VPN concentrators, firewalls, IPS/IDS - rely on hardware-accelerated encryption to maintain multi-Gb/s throughput. The MPC8545VTATGD557's SEC 3.0 engine provides AES, 3DES, SHA-1, MD5, and Kasumi at line rate, while the e500 core handles policy inspection and logging. Four GbE MACs route in/out traffic without external switches for low-port-count SKUs. The PCI-X interface connects option cards for additional 10 GbE or fiber channel. Reference designs bundle an external watchdog timer (e.g., MAX6749) for software-locked core recovery.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8545VTATGD557 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8545EVTANGD | MPC8545VTATGD | MPC8545CHXANGA | MPC8548EVTAQGD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 1.2 GHz | 1.0 GHz | 1.2 GHz | 800 MHz | 1.5 GHz |
| Cores | 1 | 1 | 1 | 1 | 1 |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Ethernet MACs | 4x GbE | 4x GbE | 4x GbE | 4x GbE | 4x GbE |
| Encryption Engine | SEC 3.0 | SEC 3.0 | SEC 3.0 | SEC 3.0 | SEC 3.3 |
| Operating Temperature | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | -40°C to +105°C | 0°C to +105°C |
| Memory Controller | DDR2 up to 2 GB | DDR2 up to 2 GB | DDR2 up to 2 GB | DDR2 up to 2 GB | DDR2 up to 2 GB |
Principais diferenciais
- Hardware-accelerated SEC 3.0 encryption engine (vs MPC8545CHXANGA)
- Industrial temperature range (-40°C to +105°C) (vs MPC8548EVTAQGD)
- 1.2 GHz peak core frequency in T grade (vs MPC8545EVTANGD)
Notas de projeto
Estimated: at 1.2 GHz operation with all four GbE MACs and the SEC engine active, the MPC8545VTATGD557 dissipates approximately 7-9 W. The 783-FCPBGA package thermal pad must be soldered to a PCB copper plane with at least 25 thermal vias for sustained operation. Without forced airflow (e.g. in a sealed enclosure), throttle to 1.0 GHz or select the lower-speed MPC8545CHXANGA variant. Derate -1.5°C per 2000 ft above 5000 ft altitude.
DDR2 traces on a 783-FCPBGA with 1 mm pitch require matched impedance (50 ohm single-ended, 100 ohm differential), length matching within ±25 mils on the byte lanes, and 8-layer or denser stack-up with continuous ground stitching vias under the BGA. Keep VTT termination trace stubs under 0.1 inch. Refer to the NXP AN4240 application note for the recommended Layer 1-4 stack-up and decoupling capacitor placement.
Core voltage (1.2 V nominal) requires a buck regulator with at least 10 A continuous rating and ±1% tolerance - candidates include the NXP MMPF0100 PMIC or a discrete VIN=5V step-down. I/O rails at 1.8V, 2.5V, and 3.3V each need independent LDOs or bucks with 1.5 A capacity. Decouple with 0.1 µF X7R capacitors placed within 50 mils of every supply ball, plus bulk 22 µF polymer tantalum caps at each rail entry.
Do not power up without programming the POR configuration word through cfg_reset_source[3:0] pins - the device latches from sampling these and the HWCFG_LAW0/1 registers on POR. JTAG_TDO has a 4.7k pull-up requirement. Skipping the e500 reset configuration sequence results in bus errors or DMA faults. Always run a baseline POST with all peripherals disconnected before bringing up the DDR2 controller.
SGMII and Serial RapidIO links require AC coupling caps near the transmitter, with 100 ohm differential routing and length matching <1 mm between P/N pairs. Use a 4-layer PCB minimum, with each SGMII lane staying over a continuous ground reference plane. Source-series termination is generally not recommended - rely on transmitter pre-emphasis set via RCW (reset configuration word). Insert a 0.1 µF AC-coupling cap between MPC8545 and external PHY, no closer than 0.5 inch to the BGA.
Informações de conformidade
RoHS-compliant per NXP product page. AEC-Q100 not applicable (industrial temperature IC, not automotive-qualified). Lead-free VQFN ball finish. Halogen-free status not verified from data.
