MPC8572VTATLE557 - PowerQUICC III Dual-Core 1.2GHz MPU | NXP/Freescale
N.º da peça: MPC8572VTATLE557 ✓ AtivoMPC8572VTATLE557 Visão geral
A PowerQUICC integrated communications processor is a highly integrated System-on-Chip (SoC) that combines one or more PowerPC processor cores with packet-processing accelerators and a wide variety of high-speed communications interfaces. It sits within the broader taxonomy of embedded microprocessors -> microcontrollers and microprocessors -> integrated circuits, and historically served networking equipment designers who needed a single device to handle control plane plus data plane workloads.
Key features of the MPC8572VTATLE557 include dual PowerPC e500 cores running at 1.2 GHz, an integrated security engine (SEC), a 32-bit DDR2/DDR3 memory controller, four 10/100/1000 Ethernet MACs, and PCI Express and Serial RapidIO interfaces. It supports industrial and extended-temperature operating ranges, hardware virtualization support, and a coherent SMP fabric that simplifies symmetric multiprocessing firmware.
The MPC8572 architecture utilizes a high-performance e500 core with Book-E instruction set architecture and integrated L1/L2 caches, plus an on-chip packet engine and DMA fabric that offload frame processing from the cores. The '557' speed grade denotes a 1.2 GHz core frequency, the highest bin available for this family, which maximizes packet throughput in enterprise routers and security appliances.
Typical applications include enterprise routers, Layer 2/3 managed switches, network security appliances (UTM/NGFW), industrial control and factory automation, and telecom line cards. The MPC8572VTATLE557 is the right choice when an integrated dual-core CPU and communications accelerator are required in a single, mature BGA package with extensive reference designs available.
When designing with this part, allocate the maximum PCB area allowed for the 33x33 mm FCBGA, plan a high-layer-count PCB (typically 12-16 layers) with matched-length SerDes routes, and ensure the thermal solution can dissipate up to roughly 20-25 W at full turbo. Designers should also validate second-source availability, as this part is on long-term support with multiple authorized distributors.
This page consolidates distributor pricing, identical-footprint same-brand variants (T-series speed grades and the -557 thermal bin) and cross-brand drop-in alternatives, plus practical thermal and PCB layout guidance not found in the manufacturer datasheet alone.
Alternativas drop-in para MPC8572VTATLE557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8572VTATLE557 (mesmo formato e footprint) — diferindo em Core Architecture, Manufacturer, Mounting Type, Number of Cores, Package.
MPC8572VTATLE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8572VTATLD
✅ Drop-InConsulte o preço
Ver ficha técnica →MPC8572VTATLE557
✅ Drop-InConsulte o preço
Ver ficha técnica →MPC8572CLPXATLD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8572CLPXARLD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8572ECVTATLE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8572VTATLE557 Classificações máximas e características elétricas
| Part Number | MPC8572VTATLE557 |
| Manufacturer | Freescale Semiconductor (NXP) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 (dual-core) |
| Largura do barramento de dados | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| L2 Cache | 1 MB (shared) |
| L1 Cache (per core) | 32 KB I + 32 KB D |
| Ethernet MACs | 4 x 10/100/1000 Mbps |
| Memory Controller | DDR2/DDR3, 32-bit |
| PCI Express Lanes | x4 PCIe Gen 1 |
| Serial RapidIO | Yes |
| Security Engine | Integrated SEC (crypto) |
| Encapsulamento | 1023-ball FCBGA, 33x33 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40C to +105C (industrial extended) |
| Status RoHS | Compliant |
Configuração de pinos do MPC8572VTATLE557
| Pino A1-A28 | SerDes / PCIe / RapidIO — High-speed serial I/O differential lanes |
| Pino AA1-AA28 | DDR Memory I/O — 32-bit DDR2/DDR3 with ECC |
| Pino AB1-AB28 | Power / GND balls — Distributed VDD, VDDCORE, VDDDDR rails |
| Pino B1-B28 | Ethernet MAC — 4x 10/100/1000 RGMII interfaces |
| Pino C1-C28 | Ethernet MAC / TSEC — TSEC Ethernet Serializer/Deserializer I/O |
| Pino D1-D28 | PCI Express — x4 PCIe Gen 1 differential lanes |
| Pino E1-E28 | Local Bus / GPIO — 32-bit local bus interface and IRQ lines |
| Pino F1-F28 | Reset, JTAG, Clock — PORESET, HRESET, JTAG, SYSCLK |
| Pino G1-G28 | External Memory — 16-bit local bus with chip selects |
Aplicações típicas
MPC8572VTATLE557 é adequado para 6 aplicaçãos: Enterprise Routers, Layer 2/3 Managed Ethernet Switches, Unified Threat Management / NGFW Security Appliances, Telecom Line Cards, Industrial Control / Factory Automation Gateways, Aircraft Networking & Avionics Subsystems.
Enterprise Routers
The MPC8572VTATLE557 is a natural fit for enterprise router designs because its dual PowerPC e500 cores at 1.2 GHz provide the control-plane compute needed for OSPF/BGP forwarding tables while the integrated four GbE MACs deliver line-rate wire-speed packet I/O on every port. Its on-chip SEC engine adds hardware-accelerated IPsec encryption so VPN concentrators terminate encrypted tunnels without a separate crypto chip. The 1023-ball FCBGA exposes all four SerDes lanes - configurable as PCIe or Serial RapidIO - giving designers flexibility to add coprocessors (NP-4 lookups, TCAM accelerators) when the routing workload expands beyond a single SoC. DDR2/DDR3 memory bandwidth is sufficient for sustained stateful packet inspection on modest link aggregation groups.
Recomendado
Layer 2/3 Managed Ethernet Switches
In a managed Layer 2/3 switch, the MPC8572VTATLE557 serves as the management CPU and policy-plane processor. The dual e500 cores run HostAP/Linux-class networking stacks for VLAN setup, ACL enforcement, SNMP/CLI handling, and SDN agent protocols, while the four GbE MACs can act as CPU-side network interfaces for telemetry, OOB management, or stacking links. PCI Express and Serial RapidIO enable the MPC8572 to supervise a separate switching-fabric ASIC - the typical reference design behind most 24-48 port enterprise access switches in this MPU class.
Recomendado
Unified Threat Management / NGFW Security Appliances
Security appliances in the UTM/NGFW class require deep-packet-inspection compute, encrypted-VPN throughput, and tight integration between firewall policy and routing - all roles the MPC8572VTATLE557 handles. The integrated SEC block accelerates AES-128/256 and SHA-1/256 in hardware, offloading IPsec/SSL VPN workloads from the cores. Dual 1.2 GHz e500 cores sustain concurrent stateful flow inspection with DPI rulesets on multiple aggregated GbE links.
Recomendado
Telecom Line Cards
Telecom line-card designs benefit from the MPC8572VTATLE557's Serial RapidIO ports, which simplify backplane interconnect to ATCA/AdvancedTCA fabric switches and neighboring line cards. The 32-bit DDR2/DDR3 controller drives the burst-heavy buffer memory of ingress/egress queues, while the e500 cores handle per-subscriber control-plane protocols (L2TP, PPPoE, IGMP). Extended-temperature screening (-40C to +105C) means the device survives in controlled-environment central offices.
Recomendado
Industrial Control / Factory Automation Gateways
For industrial gateways bridging PROFINET/Modbus/ethernet/IP, the MPC8572VTATLE557's GbE ports plus PCI Express link to deterministic real-time coprocessors. The extended-temperature rating allows deployment on factory floors, and NXP's longevity program keeps the part available for industrial product lifecycles of 10+ years. Dual e500 cores run gateway protocol stacks plus analytics workloads in parallel.
Recomendado
Aircraft Networking & Avionics Subsystems
Avionics Ethernet switches and ARINC-664-compatible routers can leverage the MPC8572VTATLE557's deterministic cores, on-chip SEC for secure aircraft-to-ground links, and RapidIO for ARINC-compatible backplane interconnect. Industrial-extended temperature ratings and NXP's aerospace-grade paperwork flow (where the dual e500 cores run DO-178C ARTIC partitions) make it a candidate for new and retrofit flight platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8572VTATLE557 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8572VTATLE | MPC8572VTATLD | MPC8572CLPXATLD | MPC8572CLPXARLD | MPC8572ECVTATLE |
|---|---|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.0 GHz (lower bin) | 1.2 GHz |
| Operating Temperature | -40C to +105C (extended) | 0C to +105C (commercial-extended) | -40C to +105C (extended) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +105C (extended) |
| Ethernet MACs | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE |
| Integrated Security Engine | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC - extended crypto) |
| Memory Controller | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit |
Principais diferenciais
- Highest frequency bin in MPC8572 family (vs MPC8572CLPXARLD)
- Extended industrial temperature range (vs MPC8572CLPXATLD)
- Hardware-accelerated SEC engine with full crypto suite (vs MPC8572VTATLE)
Notas de projeto
Estimated: with VDDCORE at 1.1V and the dual-core e500 consuming approximately 18 W at 1.2 GHz, the 33x33 mm FCBGA requires a heatsink plus 4-6 thermal vias in the BGA land array. Validate with the manufacturer thermal model file at the worst-case junction temperature (105C ambient) before declaring thermal compliance.
Use a 12-16 layer PCB with matched-length 100-ohm differential traces for SerDes lanes, buried controlled-impedance (50 ohm single-ended) for DDR data, and paired length match within 25 mil on PCIe/RapidIO. BGA breakout escape uses 0.4 mm or 0.5 mm pitch microvia/HDI stack; route all four power rails from a high-current multi-phase VRM (VDDCORE ~1.0-1.1V capable of 20 A peak).
Estimated: do NOT omit the SYSCLK stability check during boot - the e500 cores will reset if the platform clock drifts beyond +/-50 ppm from the part's clock-spec formula. Also, the '557' extended-temperature bin differs from the non-extended bin in firmware-default thermal-trip thresholds, so update your bootloader thermal-management tables if you swap bin grades. Verify DDR3 IBIS simulation with your chosen DRAM part early, not after layout.
Informações de conformidade
RoHS compliant per NXP product page. This MPU is not AEC-Q100 qualified (different AEC-Q100 variant exists at the MPC8572 family level). Confirm halogen-free status with manufacturer for the exact lot.
