MPC8572VTATLE557 - PowerQUICC III Dual-Core 1.2GHz MPU | NXP/Freescale
Артикул: MPC8572VTATLE557 ✓ АктивенMPC8572VTATLE557 Обзор
A PowerQUICC integrated communications processor is a highly integrated System-on-Chip (SoC) that combines one or more PowerPC processor cores with packet-processing accelerators and a wide variety of high-speed communications interfaces. It sits within the broader taxonomy of embedded microprocessors -> microcontrollers and microprocessors -> integrated circuits, and historically served networking equipment designers who needed a single device to handle control plane plus data plane workloads.
Key features of the MPC8572VTATLE557 include dual PowerPC e500 cores running at 1.2 GHz, an integrated security engine (SEC), a 32-bit DDR2/DDR3 memory controller, four 10/100/1000 Ethernet MACs, and PCI Express and Serial RapidIO interfaces. It supports industrial and extended-temperature operating ranges, hardware virtualization support, and a coherent SMP fabric that simplifies symmetric multiprocessing firmware.
The MPC8572 architecture utilizes a high-performance e500 core with Book-E instruction set architecture and integrated L1/L2 caches, plus an on-chip packet engine and DMA fabric that offload frame processing from the cores. The '557' speed grade denotes a 1.2 GHz core frequency, the highest bin available for this family, which maximizes packet throughput in enterprise routers and security appliances.
Typical applications include enterprise routers, Layer 2/3 managed switches, network security appliances (UTM/NGFW), industrial control and factory automation, and telecom line cards. The MPC8572VTATLE557 is the right choice when an integrated dual-core CPU and communications accelerator are required in a single, mature BGA package with extensive reference designs available.
When designing with this part, allocate the maximum PCB area allowed for the 33x33 mm FCBGA, plan a high-layer-count PCB (typically 12-16 layers) with matched-length SerDes routes, and ensure the thermal solution can dissipate up to roughly 20-25 W at full turbo. Designers should also validate second-source availability, as this part is on long-term support with multiple authorized distributors.
This page consolidates distributor pricing, identical-footprint same-brand variants (T-series speed grades and the -557 thermal bin) and cross-brand drop-in alternatives, plus practical thermal and PCB layout guidance not found in the manufacturer datasheet alone.
Аналоги без доработки для MPC8572VTATLE557 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8572VTATLE557 (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Manufacturer, Mounting Type, Number of Cores, Package.
MPC8572VTATLE
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8572VTATLD
✅ Прямая заменаУточнить цену
Открыть даташит →MPC8572VTATLE557
✅ Прямая заменаУточнить цену
Открыть даташит →MPC8572CLPXATLD
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8572CLPXARLD
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8572ECVTATLE
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8572VTATLE557 Максимальные параметры и электрические характеристики
| Part Number | MPC8572VTATLE557 |
| Manufacturer | Freescale Semiconductor (NXP) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 2 (dual-core) |
| Разрядность шины данных | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| L2 Cache | 1 MB (shared) |
| L1 Cache (per core) | 32 KB I + 32 KB D |
| Ethernet MACs | 4 x 10/100/1000 Mbps |
| Memory Controller | DDR2/DDR3, 32-bit |
| PCI Express Lanes | x4 PCIe Gen 1 |
| Serial RapidIO | Yes |
| Security Engine | Integrated SEC (crypto) |
| Корпус | 1023-ball FCBGA, 33x33 mm |
| Тип монтажа | Surface Mount (BGA) |
| Рабочая температура | -40C to +105C (industrial extended) |
| Статус RoHS | Compliant |
Конфигурация выводов MPC8572VTATLE557
| Контакт A1-A28 | SerDes / PCIe / RapidIO — High-speed serial I/O differential lanes |
| Контакт AA1-AA28 | DDR Memory I/O — 32-bit DDR2/DDR3 with ECC |
| Контакт AB1-AB28 | Power / GND balls — Distributed VDD, VDDCORE, VDDDDR rails |
| Контакт B1-B28 | Ethernet MAC — 4x 10/100/1000 RGMII interfaces |
| Контакт C1-C28 | Ethernet MAC / TSEC — TSEC Ethernet Serializer/Deserializer I/O |
| Контакт D1-D28 | PCI Express — x4 PCIe Gen 1 differential lanes |
| Контакт E1-E28 | Local Bus / GPIO — 32-bit local bus interface and IRQ lines |
| Контакт F1-F28 | Reset, JTAG, Clock — PORESET, HRESET, JTAG, SYSCLK |
| Контакт G1-G28 | External Memory — 16-bit local bus with chip selects |
Типичное применение
MPC8572VTATLE557 подходит для 6 применениеs: Enterprise Routers, Layer 2/3 Managed Ethernet Switches, Unified Threat Management / NGFW Security Appliances, Telecom Line Cards, Industrial Control / Factory Automation Gateways, Aircraft Networking & Avionics Subsystems.
Enterprise Routers
The MPC8572VTATLE557 is a natural fit for enterprise router designs because its dual PowerPC e500 cores at 1.2 GHz provide the control-plane compute needed for OSPF/BGP forwarding tables while the integrated four GbE MACs deliver line-rate wire-speed packet I/O on every port. Its on-chip SEC engine adds hardware-accelerated IPsec encryption so VPN concentrators terminate encrypted tunnels without a separate crypto chip. The 1023-ball FCBGA exposes all four SerDes lanes - configurable as PCIe or Serial RapidIO - giving designers flexibility to add coprocessors (NP-4 lookups, TCAM accelerators) when the routing workload expands beyond a single SoC. DDR2/DDR3 memory bandwidth is sufficient for sustained stateful packet inspection on modest link aggregation groups.
Рекомендуется
Layer 2/3 Managed Ethernet Switches
In a managed Layer 2/3 switch, the MPC8572VTATLE557 serves as the management CPU and policy-plane processor. The dual e500 cores run HostAP/Linux-class networking stacks for VLAN setup, ACL enforcement, SNMP/CLI handling, and SDN agent protocols, while the four GbE MACs can act as CPU-side network interfaces for telemetry, OOB management, or stacking links. PCI Express and Serial RapidIO enable the MPC8572 to supervise a separate switching-fabric ASIC - the typical reference design behind most 24-48 port enterprise access switches in this MPU class.
Рекомендуется
Unified Threat Management / NGFW Security Appliances
Security appliances in the UTM/NGFW class require deep-packet-inspection compute, encrypted-VPN throughput, and tight integration between firewall policy and routing - all roles the MPC8572VTATLE557 handles. The integrated SEC block accelerates AES-128/256 and SHA-1/256 in hardware, offloading IPsec/SSL VPN workloads from the cores. Dual 1.2 GHz e500 cores sustain concurrent stateful flow inspection with DPI rulesets on multiple aggregated GbE links.
Рекомендуется
Telecom Line Cards
Telecom line-card designs benefit from the MPC8572VTATLE557's Serial RapidIO ports, which simplify backplane interconnect to ATCA/AdvancedTCA fabric switches and neighboring line cards. The 32-bit DDR2/DDR3 controller drives the burst-heavy buffer memory of ingress/egress queues, while the e500 cores handle per-subscriber control-plane protocols (L2TP, PPPoE, IGMP). Extended-temperature screening (-40C to +105C) means the device survives in controlled-environment central offices.
Рекомендуется
Industrial Control / Factory Automation Gateways
For industrial gateways bridging PROFINET/Modbus/ethernet/IP, the MPC8572VTATLE557's GbE ports plus PCI Express link to deterministic real-time coprocessors. The extended-temperature rating allows deployment on factory floors, and NXP's longevity program keeps the part available for industrial product lifecycles of 10+ years. Dual e500 cores run gateway protocol stacks plus analytics workloads in parallel.
Рекомендуется
Aircraft Networking & Avionics Subsystems
Avionics Ethernet switches and ARINC-664-compatible routers can leverage the MPC8572VTATLE557's deterministic cores, on-chip SEC for secure aircraft-to-ground links, and RapidIO for ARINC-compatible backplane interconnect. Industrial-extended temperature ratings and NXP's aerospace-grade paperwork flow (where the dual e500 cores run DO-178C ARTIC partitions) make it a candidate for new and retrofit flight platforms.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8572VTATLE557 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8572VTATLE | MPC8572VTATLD | MPC8572CLPXATLD | MPC8572CLPXARLD | MPC8572ECVTATLE |
|---|---|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.0 GHz (lower bin) | 1.2 GHz |
| Operating Temperature | -40C to +105C (extended) | 0C to +105C (commercial-extended) | -40C to +105C (extended) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +105C (extended) |
| Ethernet MACs | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE | 4 x 1 GbE |
| Integrated Security Engine | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC) | Yes (SEC - extended crypto) |
| Memory Controller | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit | DDR2/DDR3 32-bit |
Ключевые отличия
- Highest frequency bin in MPC8572 family (против MPC8572CLPXARLD)
- Extended industrial temperature range (против MPC8572CLPXATLD)
- Hardware-accelerated SEC engine with full crypto suite (против MPC8572VTATLE)
Заметки по проектированию
Estimated: with VDDCORE at 1.1V and the dual-core e500 consuming approximately 18 W at 1.2 GHz, the 33x33 mm FCBGA requires a heatsink plus 4-6 thermal vias in the BGA land array. Validate with the manufacturer thermal model file at the worst-case junction temperature (105C ambient) before declaring thermal compliance.
Use a 12-16 layer PCB with matched-length 100-ohm differential traces for SerDes lanes, buried controlled-impedance (50 ohm single-ended) for DDR data, and paired length match within 25 mil on PCIe/RapidIO. BGA breakout escape uses 0.4 mm or 0.5 mm pitch microvia/HDI stack; route all four power rails from a high-current multi-phase VRM (VDDCORE ~1.0-1.1V capable of 20 A peak).
Estimated: do NOT omit the SYSCLK stability check during boot - the e500 cores will reset if the platform clock drifts beyond +/-50 ppm from the part's clock-spec formula. Also, the '557' extended-temperature bin differs from the non-extended bin in firmware-default thermal-trip thresholds, so update your bootloader thermal-management tables if you swap bin grades. Verify DDR3 IBIS simulation with your chosen DRAM part early, not after layout.
Информация о соответствии
RoHS compliant per NXP product page. This MPU is not AEC-Q100 qualified (different AEC-Q100 variant exists at the MPC8572 family level). Confirm halogen-free status with manufacturer for the exact lot.
