MPC860PZQ80D4 - 80MHz PowerQUICC MPU | NXP | BGA-357
N.º da peça: MPC860PZQ80D4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.75 | $387,50 |
| 100 | $35.2 | $3.520,00 |
| 500 | $32.8 | $16.400,00 |
| 1.000 | $30.95 | $30.950,00 |
MPC860PZQ80D4 Visão geral
A PowerQUICC microprocessor (often abbreviated MPU or comms processor) is a specialized integrated processor that combines a general-purpose embedded CPU with a dedicated communications engine on a single die. Within the broader taxonomy it is a microprocessor -> embedded processor -> integrated communications controller -> PowerQUICC family -> MPC8xx sub-family. The CPM offloads serial, ATM, and Ethernet processing from the main core, freeing CPU cycles for protocol stacks such as TCP/IP, HDLC, and PPP, which made the PowerQUICC architecture a workhorse for routers, switches, and telecom equipment in the late 1990s and 2000s.
Key differentiating specifications include the 80 MHz core clock, the integrated 10/100 Mbps Ethernet MAC (Fast Ethernet), dual serial communications controllers (SCCs) plus four serial management controllers (SMCs), a PCMCIA host adapter, and the 357-ball PBGA package. The device operates from a 3.3 V supply with a typical internal core voltage of approximately 2.2 V generated by an on-chip regulator. An external bus can address up to 8 MB of memory-mapped space per memory controller, and the part supports 8-, 16-, and 32-bit ROM/Flash/SRAM peripherals.
Architecturally the MPC860PZQ80D4 uses a 0.32 micrometer CMOS process and pairs the embedded PowerPC core with the CPM (Communications Processor Module). The CPM contains its own microsequencer, dedicated serial channels, and time-division multiplexing support, achieving wire-speed handling of multiple serial protocols without CPU intervention. The 357 PBGA provides ample thermal headroom and signal integrity for industrial temperature (-40C to +95C) operation.
Typical applications for the MPC860PZQ80D4 include enterprise and industrial routers, remote-access concentrators, ISDN modem banks, telecom control planes, and legacy networking line cards where the integrated CPM replaces external ASICs. It is also used in industrial serial-protocol gateways and in long-lifecycle defense and aerospace programs that require a stable, mature embedded communications controller.
When designing with this part, verify supply availability early: NXP has formally classified this product family as End of Life and offers recommended replacement guidance on the NXP product page. Original PBGA layout, BIOS/firmware, and JTAG tooling should be retained for any board that may need to be re-qualified with a successor device.
Alternativas drop-in para MPC860PZQ80D4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC860PZQ80D4 (mesmo formato e footprint) — diferindo em Core Architecture, Package, RoHS Status, Mounting Type, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC855TZQ80D4
✅ Drop-In✓ Em estoque
$61.4 / unidade
Ver ficha técnica →MPC860DTZQ80D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860PZQ66D4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$102.02 / unidade
Ver ficha técnica →MPC866PCZP100A
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860SRCZQ66D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860PZQ80D4 Classificações máximas e características elétricas
| Core Architecture | PowerPC MPC8xx (32-bit) |
| Core Count | 1 |
| Core Frequency | 80 MHz |
| Bit Width | 32-bit |
| Family | PowerQUICC MPC86x |
| Encapsulamento | 357-PBGA (25 x 25 mm) |
| Nominal Supply Voltage | 3.3 V |
| Process Technology | 0.32 um CMOS |
| Communications Processor Module (CPM) | Integrated |
| Serial Communications Controllers (SCC) | 2 |
| Serial Management Controllers (SMC) | 4 |
| Ethernet MAC | 10/100 Mbps (Fast Ethernet) |
| PCMCIA Host Adapter | Yes |
| Tipo de montagem | Surface Mount (PBGA) |
| Status RoHS | Non-compliant (legacy product) |
Guia de Configuração de Pinos do MPC860PZQ80D4 357-pbga (25 x 25 mm)
Configuração de pinos para MPC860PZQ80D4 (pacote 357-pbga (25 x 25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC860PZQ80D4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC860PZQ80D4 é adequado para 6 aplicaçãos: Enterprise Router Control Plane, Remote Access Concentrator / RAS, ISDN Modem Bank / NT/TE Equipment, Industrial Serial Protocol Gateway, Telecom Line Card / Edge Router, Aerospace / Defense Long-Lifecycle Controller.
Enterprise Router Control Plane
The MPC860PZQ80D4 fits enterprise router control-plane duties because its integrated CPM offloads HDLC, PPP, and 10/100 Ethernet processing from the PowerPC core. With the 80 MHz core and 4 SCCs-worth of serial channels (2 SCC + 4 SMC), the part handles T1/E1 framing and IPsec tunneling without external ASICs. The 357-PBGA offers adequate thermal headroom for fanless router chassis. Design trade-off: at 80 MHz the MPC860PZQ80D4 cannot sustain gigabit line-rate, so it is limited to Fast Ethernet uplinks - pair with an external switch ASIC for GigE aggregation.
Recomendado
Remote Access Concentrator / RAS
The MPC860PZQ80D4 suits remote-access server applications because the CPM runs multiple HDLC/PPP channels simultaneously, freeing the core for RADIUS/TACACS+ and IP routing. The integrated Ethernet MAC terminates the LAN side while the SCCs/SMCs terminate up to eight V.90/ISDN serial links. Power consumption stays under 1.5 W typical at 3.3 V, which is acceptable for 1U pizza-box RAS appliances. Trade-off: the part's small internal SRAM requires an external SDRAM for session tables.
Recomendado
ISDN Modem Bank / NT/TE Equipment
The MPC860PZQ80D4 is widely used in ISDN terminal adapters and NT1/NET3 side equipment because its SCCs natively support HDLC framing required by ISDN D-channel signaling. The on-chip serial DMA handles the 144 kbps B-channel data plus 16 kbps D-channel without CPU intervention, which is essential for multi-port modem banks. The 357-PBGA's industrial-temperature grade makes it suitable for outdoor DSLAM cabinets. Trade-off: the integrated Ethernet MAC is 10/100 only, so GigE uplinks require an external switch.
Recomendado
Industrial Serial Protocol Gateway
In factory automation the MPC860PZQ80D4 is used as a multi-protocol gateway bridging Modbus, Profibus, and CAN to Ethernet. Its CPM hardware-accelerates serial framing, and the four SMCs provide enough channels to terminate eight RS-485 ports through external transceivers. The 357-PBGA's wide pin pitch supports conformal coating for harsh industrial environments. Trade-off: the part is EOL with limited long-term supply, so new factory designs should evaluate the NXP QorIQ successor family.
Recomendado
Telecom Line Card / Edge Router
The MPC860PZQ80D4 fits legacy telecom line cards where multiple T1/E1 spans need HDLC framing and the integrated Ethernet MAC provides the switch-fabric uplink. The CPM's TDM interface connects directly to T1 framer ICs without glue logic, and the 80 MHz core runs routing/bridging software such as VxWorks or pSOS+ with adequate headroom. The 357-PBGA accepts conventional BGA rework for repair on existing line-card designs. Trade-off: the 3.3 V I/O is non-RoHS, blocking new greenfield deployments in RoHS-only regions.
Recomendado
Aerospace / Defense Long-Lifecycle Controller
The MPC860PZQ80D4 remains in service on aerospace and defense programs that specified the PowerQUICC architecture in the early 2000s and require decades of stable supply. The part's documented silicon revision history and MIL-spec temperature screening make it acceptable for avionics and naval communications subsystems. The integrated CPM provides deterministic serial throughput required for MIL-STD-1553 bridging in some custom designs. Trade-off: aerospace programs must qualify each lot, and EOL status means future redesigns will be mandatory.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC860PZQ80D4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC855TZQ80D4 | MPC860DTZQ80D4 | MPC860PZQ66D4 | MPC866PCZP100A | MPC860SRCZQ66D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA - same family | 357-PBGA (25x25) - same |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 66 MHz | 100 MHz | 66 MHz |
| Core Architecture | MPC8xx (PowerPC 32-bit) | MPC8xx (PowerPC 32-bit) | MPC8xx (PowerPC 32-bit) | MPC8xx (PowerPC 32-bit) | MPC8xx (PowerQUICC II) | MPC8xx (PowerPC 32-bit) |
| SCC Channels | 2 | 1 | 4 (dual-CPM) | 2 | 2 | 2 |
| SMC Channels | 4 | 2 | 8 (dual-CPM) | 4 | 4 | 4 |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps (x2 dual-CPM) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Lifecycle Status | EOL | EOL | EOL | EOL | Obsolete | EOL |
| PCMCIA Host Adapter | Yes | No | Yes | Yes | Yes | Yes |
Principais diferenciais
- Original PowerQUICC single-CPM 80 MHz member (vs MPC855TZQ80D4)
- Single-CPM design instead of dual-CPM (vs MPC860DTZQ80D4)
- Higher core speed than the 66 MHz legacy part (vs MPC860PZQ66D4)
Notas de projeto
The MPC860PZQ80D4 uses an external 3.3 V supply and an on-chip regulator to derive the internal core voltage. Decoupling per the Freescale/NXP hardware specification requires a 10 uF bulk capacitor near the Vdd pins plus 0.1 uF ceramics on every power pin pair. Power-rail sequencing must assert 3.3 V before driving any input signal above 3.3 V tolerant threshold. Estimated: at full Ethernet and CPM activity the 3.3 V supply typically draws 350 to 450 mA, giving 1.2 to 1.5 W board dissipation.
The 357-PBGA package dissipates up to 1.5 W at full Ethernet + CPM load. Thermal design requires an array of thermal vias under the die-down BGA pad connecting to inner copper ground planes. With theta_JA around 20 C/W on a 4-layer PCB, junction temperature rise above 85 C ambient is approximately 12 C - well within industrial-temperature limits. Estimated: with 1 oz copper and 0.5 m/s airflow, junction-to-air thermal resistance is in the 18 to 22 C/W range.
PBGA layout requires 1.27 mm ball pitch with non-solder-mask-defined (NSMD) pads to survive thermal cycling. The 357-ball map occupies a 25 x 25 mm area, so PCB escape routing needs micro-via stacks to fan out the inner rows. Match the BGA escape pattern shown in the NXP hardware specification to keep trace impedance at 50 ohms single-ended for the Ethernet MII lines.
Common pitfalls on this part: (1) assuming any MPC860 suffix is drop-in - the PZ (357-BGA), TC (357-BGA alternate map), and CV (357-BGA ceramic) variants have different pinouts despite identical ball count; (2) leaving the reset configuration word in default - check the reset configuration pins in the datasheet before board bring-up; (3) using non-EOL-aware distributors - because the part is EOL, require a Certificate of Conformance from any independent-distributor source.
Informações de conformidade
Legacy pre-RoHS product. NXP product page lists the part as End of Life; consult NXP cross-reference for current recommended replacement.
