MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
N.º da peça: MPC860PZQ66D4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $170.04 | $170,04 |
| 10 | $153.04 | $1.530,40 |
| 100 | $136.03 | $13.603,00 |
| 500 | $119.03 | $59.515,00 |
| 1.000 | $102.02 | $102.020,00 |
MPC860PZQ66D4 Visão geral
Background Knowledge: A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system, executing instructions fetched from external memory. The PowerQUICC architecture merges a general-purpose PowerPC processor core with dedicated on-chip peripherals (communications processor module, memory controller, timers, serial interfaces) so a single chip can manage both control-plane software and real-time data-plane I/O. This hypernym hierarchy runs: MPU -> embedded processor -> communications processor -> system-on-chip. The MPC8xx family is the legacy predecessor to today's QorIQ and Layerscape product lines, but remains specified for long-lifecycle industrial and telecom designs.
Key features include a 32-bit PowerPC core, integrated CPM with multiple SCCs (serial communication controllers), Ethernet MAC, HDLC support, four 16-bit timers, a DRAM controller, and an interrupt controller. The 357-PBGA package provides high pin density for the rich peripheral set and is rated for industrial temperature operation. The 'D4' silicon revision brings refined power management relative to earlier revs.
The architecture combines a RISC-style PowerPC integer unit with a dedicated CPM that offloads communications DMA, enabling wire-speed serial handling without burdening the core. The 3.3 V I/O and internal logic simplify mixed-voltage designs in legacy 3.3 V systems, though level shifters are required for 5 V peripherals.
Typical applications include telecom line cards, ISDN routers, xDSL modems, industrial Ethernet switches, and embedded control systems requiring integrated serial-channel management. The combined core-plus-CPM topology makes the MPC860PZQ66D4 well suited to designs where deterministic serial throughput and CPU-driven control share the same silicon.
When designing with this part, allocate the BGA's thermal pad with multiple inner-plane vias and use a four-layer PCB with a solid ground pour to dissipate the ~2 W typical dissipation. Verify boot-mode configuration resistor strapping against the datasheet before layout finalization, and ensure the 60x bus interface timing budget is met under worst-case loading. Note that this part is in End-of-Life status; design new production with an active QorIQ successor in mind.
This page synthesizes current distributor inventory, lifecycle status, and same-package PowerQUICC alternates not found in a single manufacturer document.
Alternativas drop-in para MPC860PZQ66D4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC860PZQ66D4 (mesmo formato e footprint) — diferindo em RoHS Status, Core Architecture, Operating Temperature, Package / Case, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC860SRZQ66D4
✅ Drop-In✓ Em estoque
$128.33 / unidade
Ver ficha técnica →MPC860TCZQ66D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860TZQ66D4
✅ Drop-In✓ Em estoque
$81.28 / unidade
Ver ficha técnica →MPC860SRCZQ66D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860DTVR66D4
✅ Drop-In✓ Em estoque
$78.9 / unidade
Ver ficha técnica →MPC860PZQ66D4 Classificações máximas e características elétricas
| Processor Family | PowerQUICC MPC8xx |
| Core Architecture | 32-bit PowerPC |
| Core Count | 1 |
| Maximum CPU Clock | 66 MHz |
| Tensão de alimentação de operação | 3.3 V |
| Encapsulamento | 357-PBGA (25x25 mm) |
| Tipo de montagem | Surface Mount |
| Lead Status | Contains Lead (non-RoHS) |
| Status RoHS | Non-Compliant (Contains Lead) |
| Packaging | Tray |
| On-chip Communications Module | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | DRAM, SRAM, Flash, EPROM |
| Timers | 4 x 16-bit |
| Process Technology | 0.32 um CMOS |
| Temperatura de operação | -40C to +95C (industrial, per D4 revision) |
| Nível MSL | 3 |
| Series | PowerQUICC |
Guia de Configuração de Pinos do MPC860PZQ66D4 357-pbga (25x25 mm)
Configuração de pinos para MPC860PZQ66D4 (pacote 357-pbga (25x25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC860PZQ66D4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC860PZQ66D4 é adequado para 6 aplicaçãos: Telecom Line Cards, ISDN Routers and xDSL Modems, Industrial Ethernet Switches, PBX and Base Station Controllers, Embedded Industrial Control Systems, Legacy Networking Equipment Maintenance.
Telecom Line Cards
The MPC860PZQ66D4 fits telecom line cards because its integrated communications processor module (CPM) provides multiple SCCs and HDLC controllers that handle TDM and packet serial streams wire-speed without burdening the PowerPC core. The 66 MHz CPU clock offers sufficient throughput for call-control and signalling software, while the 3.3 V supply aligns with legacy central-office backplanes. Placed on a 357-PBGA footprint with local SDRAM and a TDM framer companion, it forms a deterministic line-card subsystem. Power dissipation is approximately 2 W typical, manageable with a solid ground pour and inner-plane thermal vias. According to NXP PowerQUICC family literature, the MPC860 architecture was specifically designed for this application class.
Recomendado
ISDN Routers and xDSL Modems
The MPC860PZQ66D4 is well suited to ISDN router and xDSL modem designs because it combines a 32-bit PowerPC core with an integrated Ethernet MAC and HDLC controller on a single die, eliminating external bridge ASICs. The 66 MHz CPU clock supports routing table lookup and PPPoE termination, while the CPM offloads DMA for serial DSL framer interfaces. Housed in a 357-PBGA 25x25 mm package, it occupies modest board real estate despite the rich peripheral set. Compared to a discrete CPU-plus-MAC solution, this integration reduces BOM by several parts. The 'D4' silicon revision delivers refined power management versus earlier revs, lowering idle consumption in always-on CPE designs.
Recomendado
Industrial Ethernet Switches
The MPC860PZQ66D4 fits managed industrial Ethernet switches because its integrated Ethernet MAC and SCCs allow direct PHY connection and serial management-port interfacing without external glue logic. The 66 MHz PowerPC core runs the switch management stack (SNMP, web UI, spanning tree), while the industrial temperature rating of the D4 revision supports factory-floor deployments. The 357-PBGA package provides high pin density for the multiple Ethernet and serial interfaces typical of a managed switch. Placed alongside a PHY array and a small CPLD for port-LED logic, the part delivers a compact switching platform. Power dissipation is bounded by the 3.3 V supply and modest CPU activity.
Recomendado
PBX and Base Station Controllers
The MPC860PZQ66D4 is appropriate for PBX and base-station controller cards where deterministic TDM handling and host CPU processing share the same silicon. The integrated CPM provides hardware-accelerated HDLC and time-slot assignment, offloading the 66 MHz PowerPC core to focus on signalling stacks like Q.931 or LAPD. The 357-PBGA package and 3.3 V supply match central-office power budgets, while the legacy -40C to +95C industrial temperature grade supports outdoor cabinet installations. According to the NXP PowerQUICC family description, the MPC860 architecture was designed for this exact communications-infrastructure use case, balancing deterministic serial throughput with general-purpose control.
Recomendado
Embedded Industrial Control Systems
The MPC860PZQ66D4 fits embedded industrial controllers requiring both deterministic serial I/O and CPU-driven control logic in one chip. The four 16-bit timers handle PWM and event capture, the SCCs manage fieldbus protocols such as Modbus or Profibus via external transceivers, and the 66 MHz core runs the control application. The 357-PBGA 25x25 mm package and 3.3 V supply suit compact industrial boards, while the industrial temperature rating supports harsh environments. Compared to a microcontroller-only design, the PowerPC core offers headroom for HMI and protocol stacks. Note the EOL status requires migration planning for new production.
Recomendado
Legacy Networking Equipment Maintenance
The MPC860PZQ66D4 is widely used as a replacement part for maintaining installed-base networking equipment such as legacy routers, switches, and access multiplexers that were originally designed around the PowerQUICC architecture. Because it shares the 357-PBGA footprint with multiple MPC860 CPM variants (SR, TC, T, SRC, DT), field-service engineers can stock a single board layout and substitute features on a per-repair basis. The EOL status means authorized aftermarket suppliers such as Rochester Electronics are the primary source for replacement units. Power and thermal characteristics remain identical across variants, simplifying board bring-up after a swap.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC860PZQ66D4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC860SRZQ66D4 | MPC860TCZQ66D4 | MPC860TZQ66D4 | MPC860SRCZQ66D4 | MPC860DTVR66D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| CPU Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Silicon Revision | D4 | D4 | D4 | D4 | D4 | D4 |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| CPM Feature Designator | P (full-featured, Ethernet + HDLC) | SR (different SCC/Ethernet mix) | TC (different CPM mix) | T (different CPM mix) | SRC (different CPM mix) | DT (different CPM mix, VR) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
| RoHS Compliance | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) |
Principais diferenciais
- Full-featured 'P' designator with integrated Ethernet and HDLC (vs MPC860TZQ66D4)
- D4 silicon revision with refined power management (vs Earlier MPC860 revisions (D1, D2, D3))
- 66 MHz CPU clock at the top of the MPC860 speed grade (vs MPC860 DTCZQ50D4 (50 MHz variant))
Notas de projeto
Estimated: The MPC860PZQ66D4 dissipates approximately 2 W typical at 66 MHz / 3.3 V. With a 357-PBGA package thermal resistance of roughly 20 C/W (junction to ambient with a 4-layer JEDEC test board), the junction rise is around 40 C above ambient. Place a solid ground pour under the BGA and stitch the inner ground plane with multiple thermal vias directly under the die-shadow region. Add copper pours on outer layers connected by vias to spread heat; without this, expect 10-15 C higher junction rise.
The 357-PBGA at 1.27 mm pitch requires a 4-layer PCB with a solid ground plane for return-path integrity, and ideally a dedicated power plane for the 3.3 V core. Match the BGA fanout to a 1.27 mm via-pitch escape pattern that routes signals out through the inner layers; keep high-speed Ethernet and HDLC traces length-matched within the CPM timing budget. Place SDRAM as close as possible to the address/data bus balls to minimize bus loading and reflections on the 66 MHz bus.
Because the MPC860PZQ66D4 is in End-of-Life status, do NOT design it into new production. New designs should migrate to active QorIQ (LS1012A, T1042) or PowerQUICC II (MPC82xx) parts that share the PowerPC heritage but offer modern peripherals, RoHS compliance, and longer supply. For maintenance of installed-base equipment, source from authorized aftermarket suppliers such as Rochester Electronics and verify date-code authenticity. Note also that the BGA is non-RoHS (Contains Lead) per the NXP product page, which constrains use in regions requiring RoHS compliance.
Configure the reset, boot-mode, and clock-configuration pins per the MPC860 hardware specifications datasheet BEFORE finalizing board layout - changing these later requires board rework. Provide a JTAG test access port (TAP) header for boundary-scan and debug access; the TAP balls must be brought out to a 0.1-inch header. Decouple the 3.3 V supply with a bulk capacitor and multiple 0.1 uF / 0.01 uF ceramic capacitors placed within 5 mm of each power pin group. Series-termination resistors on the address/data bus improve signal integrity at 66 MHz.
Informações de conformidade
Contains Lead per NXP product listing - non-RoHS. AEC-Q100 not applicable (industrial/telecom MPU, not automotive grade). REACH, halogen-free, and conflict-minerals status not explicitly stated in available web data - marked unknown.
