NXP Semiconductors

MPC860SRZQ66D4557 - PowerQUICC 32-bit MPU, 66 MHz | NXP

N.º da peça: MPC860SRZQ66D4557 ✗ Fim de vida
3.3 V core / I/O Vdss 357-ball BGA (ZQ suffix) Package 66 MHz Speed
MOQ: 1 |

MPC860SRZQ66D4557 Visão geral

The NXP (formerly Freescale/Motorola) MPC860SRZQ66D4557 is a 32-bit PowerQUICC integrated communications controller microprocessor running at 66 MHz, housed in a 357-ball BGA package (ZQ suffix). It integrates a PowerPC core with the CPM (Communications Processor Module), making it a single-chip solution for embedded networking and telecom designs.

A PowerQUICC processor is a specialized microprocessor that combines a PowerPC CPU core with dedicated communications peripherals on a single die. It sits in the embedded MPU hierarchy as: microprocessor -> 32-bit embedded processor -> communications controller. PowerQUICC parts are widely deployed in legacy telecom, industrial control, and networking equipment where deterministic communications processing is required.

Key features include a 66 MHz core clock, 4 KB instruction cache and 4 KB data cache, dual UART, dual SCC (Serial Communication Controller) channels for HDLC/PPP/ATM, I2C and SPI interfaces, a 10/100 Ethernet MAC, and on-chip DRAM controller. The integrated CPM offloads protocol processing from the CPU, freeing the core for application-level tasks.

Architecturally, the MPC860 uses a Harvard-style cache, separate instruction and data buses, and a dedicated peripheral bus for the CPM. The 66 MHz 'SR' speed grade is one tier below the 80 MHz 'VR' grade but offers equivalent peripheral set, providing a cost-optimized option for designs that do not require maximum throughput.

Typical applications include industrial routers, ISDN terminal adapters, set-top box controllers, factory automation bridges, and legacy telecom line cards. The wide operating temperature range (0 to 95 C) and integrated peripherals simplify board design and reduce BOM cost for these embedded systems.

When designing with this part, note that the 357-ball BGA requires careful PCB layout with via-in-pad recommended for thermal dissipation. Designers should also verify errata documents from NXP, as the MPC860 family has several documented silicon revisions (D4557 masks). Use the Freescale/NXP development toolchain (CodeWarrior) for firmware development.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers sourcing legacy PowerQUICC parts evaluate the MPC860SRZQ66D4557 against modern alternatives.

Alternativas drop-in para MPC860SRZQ66D4557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

MPC860SRZQ66D

✅ Drop-In ⚠️ Especificações não verificadas
📦 357-ball BGA (ZQ)
same 357-BGA ZQ footprint, same 66 MHz SR grade, earlier mask revision (D vs D4557)

📋 Alternativa de referência (fora do catálogo)

MPC860VRZQ80D4557

✅ Drop-In ⚠️ Especificações não verificadas
📦 357-ball BGA (ZQ)
same 357-BGA ZQ footprint, +14 MHz core clock (80 vs 66 MHz, +21 percent performance), same D4557 mask

📋 Alternativa de referência (fora do catálogo)

MPC860SRZQ80D4557

✅ Drop-In ⚠️ Especificações não verificadas
📦 357-ball BGA (ZQ)
same 357-BGA ZQ footprint, SR prefix indicates 50 MHz (vs 66 MHz in this part), same D4557 mask - LOWER performance

📋 Alternativa de referência (fora do catálogo)

MPC860SRZQ66D4556

✅ Drop-In ⚠️ Especificações não verificadas
📦 357-ball BGA (ZQ)
same 357-BGA ZQ footprint, same 66 MHz SR grade, prior mask revision (D4556 vs D4557)

📋 Alternativa de referência (fora do catálogo)

MPC860DTZQ66D4557

✅ Drop-In ⚠️ Especificações não verificadas
📦 357-ball BGA (ZQ)
same 357-BGA ZQ footprint, same 66 MHz, DT suffix indicates extended temperature grade (-40 to +105 C vs 0 to 95 C)

📋 Alternativa de referência (fora do catálogo)

MPC860SRZQ66D4557 Classificações máximas e características elétricas

Core Architecture PowerPC 32-bit
Family PowerQUICC MPC860
Core Clock Speed 66 MHz
Temperatura de operação 0 C to 95 C
Encapsulamento 357-ball BGA (ZQ suffix)
Tipo de montagem Surface Mount
Tensão de alimentação 3.3 V core / I/O
Instruction Cache 4 KB
Data Cache 4 KB
Communications Processor Module (CPM) Yes (integrated)
Serial Communication Controllers (SCC) 2
Ethernet MAC 10/100 Mbps (1 channel)
UART 2 channels
I2C / SPI Yes / Yes
DRAM Controller Yes (integrated)
Mask / Die Revision D4557 (per part suffix)

Guia de Configuração de Pinos do MPC860SRZQ66D4557 357-ball bga (zq suffix)

Configuração de pinos para MPC860SRZQ66D4557 (pacote 357-ball bga (zq suffix)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.

Diagrama de pinagem do pacote 357-ball bga (zq suffix) para MPC860SRZQ66D4557

Nenhum dado detalhado de pinagem disponível para MPC860SRZQ66D4557.

Consulte a ficha técnica para a configuração completa dos pinos.

Aplicações típicas

MPC860SRZQ66D4557 é adequado para 6 aplicaçãos: Industrial Router and Gateway, ISDN Terminal Adapter, Set-Top Box Controller, Factory Automation Bridge, Legacy Telecom Line Card, Embedded Print Server.

🌐

Industrial Router and Gateway

The MPC860SRZQ66D4557 integrates a PowerPC core with two SCC channels and a 10/100 Ethernet MAC, making it a single-chip solution for industrial routers and protocol-conversion gateways. Its 66 MHz core provides deterministic throughput for routing table updates, while the CPM offloads PPP, HDLC, and frame-relay processing. At 66 MHz, the part handles multi-megabit WAN aggregation without external protocol ASICs, reducing BOM and board area in DIN-rail industrial routers used in factory automation cells.

📞

ISDN Terminal Adapter

The MPC860SRZQ66D4557 was designed for ISDN terminal adapters where its dual SCC channels handle the ISDN D-channel and B-channel simultaneously. The integrated CPM processes HDLC framing in hardware, freeing the 66 MHz PowerPC core for upper-layer protocol stacks. The 357-ball BGA package supports compact PCI-card or desktop-adapter form factors while maintaining the thermal headroom needed for sustained ISDN BRI/PRI operation at room temperature.

📺

Set-Top Box Controller

Set-top box designs of the PowerQUICC era used the MPC860SRZQ66D4557 to control the front-panel display, demodulator interface, and out-of-band telemetry channel. The 66 MHz core is sufficient for MPEG transport-stream demultiplexing on low-to-mid tier boxes, and the Ethernet MAC enables IP-based conditional-access back-channels. The integrated DRAM controller eliminates an external memory controller chip, reducing BOM cost in volume STB production.

🏭

Factory Automation Bridge

In factory-automation bridging applications, the MPC860SRZQ66D4557 connects legacy fieldbus networks (Profibus, Interbus) to Ethernet TCP/IP backbones. Its dual UART channels handle RS-485 fieldbus masters while the Ethernet MAC uplinks to plant-wide MES systems. The 0 to 95 C operating temperature range covers most cabinet-mounted industrial PCs, and the 357-ball BGA withstands typical factory vibration profiles when properly PCB-mounted with via-in-pad and underfill.

📡

Legacy Telecom Line Card

Telecom line cards in legacy T1/E1 and DSLAM systems use the MPC860SRZQ66D4557 as the central controller, offloading per-channel HDLC and PPP framing to the CPM. The 66 MHz SR speed grade is well-matched to per-channel T1/E1 processing, and the integrated Ethernet MAC connects to the shelf controller backplane. The ZQ 357-ball BGA supports high-density line-card PCB layouts where space is constrained by the multiple transceivers.

🖨️

Embedded Print Server

Networked print servers of the early 2000s used the MPC860SRZQ66D4557 to bridge parallel-port or USB-connected printers onto Ethernet networks. The PowerPC core runs the embedded TCP/IP stack and print-job spooler, while the Ethernet MAC provides 10/100 connectivity. The dual UART channels can interface with mid-range laser-printer controllers, and the integrated DRAM controller supports the buffer memory needed for print-job queuing.

Resumo dos produtos recomendados

MPC860VRZQ80D4557 Same-family 80 MHz drop-in for higher throughput Usado em: Industrial Router and Gateway, Set-Top Box Controller, Legacy Telecom Line Card MPC8272VRPIEA Modern active-lifecycle successor with integrated Fast Ethernet Usado em: Industrial Router and Gateway, Embedded Print Server MPC860SRZQ66D4556 Prior mask revision for legacy firmware validation Usado em: ISDN Terminal Adapter, Embedded Print Server MPC860DTZQ66D4557 Extended-temperature variant for outdoor NT1 enclosures Usado em: ISDN Terminal Adapter, Factory Automation Bridge MPC8349EZUAJD Modern PowerQUICC II successor with integrated security Usado em: Set-Top Box Controller MPC8272CVRMIBA NXP Semiconductors Usado em: Factory Automation Bridge MPC8349ECVVAJ Modern NXP PowerQUICC II for new line-card designs Usado em: Legacy Telecom Line Card
What is the operating frequency of the MPC860SRZQ66D4557?
The MPC860SRZQ66D4557 operates at a 66 MHz core clock frequency, as indicated by the '66' in the part suffix. According to the NXP PowerQUICC MPC860 datasheet, this 'SR' speed grade sits one tier below the 80 MHz 'VR' grade but provides identical peripheral integration including two SCC channels, dual UART, and a 10/100 Ethernet MAC.
What does the 'D4557' suffix mean on the MPC860 part number?
The 'D4557' suffix on the MPC860SRZQ66D4557 denotes the silicon mask / die revision revision 4.5.57, a specific stepping of the MPC860 family. NXP/Freescale documents known errata per mask revision in dedicated errata sheets, so designers should consult the errata document corresponding to mask D4557 when validating firmware behavior at the hardware boundary.
Where can I buy the MPC860SRZQ66D4557?
The MPC860SRZQ66D4557 is available from authorized distributors including LCSC Electronics (listed at $1.00 unit price, in-stock) and the Freescale/NXP authorized stock visible on DigiKey Marketplace. As of 2026-10-17, the part is in NRND (Not Recommended for New Designs) lifecycle status, meaning supply is limited to existing inventory and aftermarket channels.
What is the lead time for the MPC860SRZQ66D4557?
Lead time for the MPC860SRZQ66D4557 varies by distributor and lot size as of 2026-10-17. LCSC indicates in-stock availability with immediate shipping for small orders, while larger quantities may require quote-based lead times because the part is in NRND status. Always confirm lead time with the distributor at order entry for production quantities.
What is the price of the MPC860SRZQ66D4557?
The MPC860SRZQ66D4557 lists at approximately $1.00 USD per unit at quantity 1 as of 2026-10-17, according to LCSC Electronics pricing. Volume discounts reduce the price to approximately $0.76 at the 1000-piece break. Pricing fluctuates because the part is in NRND lifecycle, so confirm current pricing directly with the distributor before committing to a BOM.
Is the MPC860SRZQ66D4557 the same as the MPC860SR?
The MPC860SRZQ66D4557 is a specific variant of the MPC860SR family that differs in three details: the 'ZQ' denotes the 357-ball BGA package, the '66' denotes the 66 MHz core clock, and 'D4557' identifies the silicon mask revision. The base MPC860SR at 50 MHz or MPC860VR at 80 MHz would not be drop-in replacements due to speed-grade and mask differences.
What is the difference between MPC860 and MPC850?
The MPC860 and MPC850 differ primarily in peripheral integration: the MPC860 includes a 10/100 Ethernet MAC and dual SCC channels, while the MPC850 has a single SCC and reduced communications throughput. The MPC860SRZQ66D4557 specifically provides two SCCs, an integrated Ethernet MAC, dual UART, I2C, and SPI, making it suitable for richer telecom and networking designs than the MPC850.
Where can I download the MPC860SRZQ66D4557 datasheet?
The MPC860SRZQ66D4557 datasheet can be downloaded from the NXP product page at nxp.com and from third-party datasheet aggregators including AllDatasheet (PDF link in our data sources). The NXP MPC860 hardware specification document is approximately 242 pages and covers register definitions, electrical characteristics, and bus timing. Always cross-reference the errata document for mask D4557 alongside the datasheet.
Where can I find the MPC860SRZQ66D4557 pinout?
The MPC860SRZQ66D4557 pinout is documented in the NXP MPC860 hardware specification datasheet (chapter on signal descriptions and chapter on package information). The ZQ 357-ball BGA ball map assigns each peripheral pin to a specific ball coordinate; designers should consult the package drawing in the datasheet appendix for the exact ball-to-signal mapping before PCB layout.
What is the difference between MPC860SRZQ66D4557 and MPC860VRZQ80D4557?
The MPC860SRZQ66D4557 runs at 66 MHz core clock (SR speed grade), while the MPC860VRZQ80D4557 runs at 80 MHz core clock (VR speed grade). Both share the 357-ball BGA package and the D4557 mask revision, so they are pin-compatible but differ in maximum core throughput. The VR grade provides about 21 percent higher CPU performance at typically higher power consumption.
Is the MPC860SRZQ66D4557 suitable for new designs in 2026?
The MPC860SRZQ66D4557 is in NRND (Not Recommended for New Designs) status as of 2026-10-17, so NXP does not recommend it for new design starts. For new designs, consider modern NXP Layerscape or i.MX RT crossover processors that provide PowerQUICC-equivalent peripheral integration with active lifecycle and longer-term supply assurance.
What can replace the MPC860SRZQ66D4557?
Direct drop-in replacements for the MPC860SRZQ66D4557 in the same 357-ball BGA package are limited because the PowerQUICC family is mature and most alternatives require PCB redesign. Same-family drop-in alternatives include MPC860SRZQ66D (different mask) and MPC860SRZQ80D4557 (80 MHz grade). For modern drop-in-class replacements on a new footprint, evaluate NXP MPC8272 or MPC8349 with appropriate PCB rework.
What is the best NXP alternative for the MPC860SRZQ66D4557?
The best NXP same-family drop-in alternative for the MPC860SRZQ66D4557 is the MPC860VRZQ80D4557 (80 MHz speed grade, same D4557 mask), which offers higher performance in the identical 357-ball BGA package. For modern equivalents with longer lifecycle, the NXP MPC8272 or MPC8349 family provides equivalent communications processing with active lifecycle status, though in different packages.
Does the MPC860SRZQ66D4557 support Ethernet?
Yes, the MPC860SRZQ66D4557 integrates a 10/100 Mbps Ethernet MAC as part of the Communications Processor Module (CPM), accessible through one of the SCC channels. The MAC supports MII and RMII PHY interfaces, allowing direct connection to industrial Ethernet PHYs without an external MAC device, simplifying BOM and board area for networking applications.
What development tools support the MPC860SRZQ66D4557?
The MPC860SRZQ66D4557 is supported by the Freescale/NXP CodeWarrior Development Studio for Power Architecture, which includes a compiler, linker, debugger, and hardware-aware profiling tools. Third-party RTOS support includes VxWorks, Nucleus, and several Linux variants (legacy). Engineers should verify the specific IDE version against the silicon mask D4557 errata before production deployment.

Dados de referência de engenharia para MPC860SRZQ66D4557 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MPC860SRZQ66D4557 when you need a 66 MHz PowerQUICC 32-bit communications controller in a 357-ball BGA package and your design falls within the 0 to 95 C commercial temperature window. It is well suited to industrial routers, ISDN terminal adapters, set-top boxes, and legacy telecom line cards. Choose the MPC860VRZQ80D4557 if you need higher throughput on the same BGA footprint without PCB redesign. Choose the MPC860DTZQ66D4557 if your design must operate below 0 C or above 95 C (extended temperature). Choose the MPC860SRZQ66D4556 only if you are maintaining an existing D4556-based design and cannot revalidate firmware on D4557. All four variants share the identical 357-ball BGA package and peripheral set, enabling PCB layout reuse across speed grades and mask revisions. For new designs in 2026, evaluate modern NXP MPC8272 or MPC8349 family parts instead, since the MPC860SRZQ66D4557 is in NRND status.

Comparação com alternativas

Parâmetro Este produto MPC860SRZQ66D MPC860VRZQ80D4557 MPC860SRZQ80D4557 MPC860SRZQ66D4556 MPC860DTZQ66D4557
Package 357-ball BGA (ZQ) 357-ball BGA (ZQ) - same 357-ball BGA (ZQ) - same 357-ball BGA (ZQ) - same 357-ball BGA (ZQ) - same 357-ball BGA (ZQ) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Clock 66 MHz 66 MHz 80 MHz 50 MHz 66 MHz 66 MHz
Mask Revision D4557 D (unspecified earlier) D4557 D4557 D4556 D4557
Operating Temperature 0 to 95 C 0 to 95 C 0 to 95 C 0 to 95 C 0 to 95 C -40 to +105 C
Speed Grade SR (66 MHz) SR (66 MHz) VR (80 MHz) SR (50 MHz) SR (66 MHz) DT (extended temp, 66 MHz)
Ethernet MAC 10/100 Mbps 10/100 Mbps 10/100 Mbps 10/100 Mbps 10/100 Mbps 10/100 Mbps
SCC Channels 2 2 2 2 2 2
Lifecycle Status NRND NRND NRND NRND Obsolete NRND

Principais diferenciais

  • 66 MHz SR speed grade offers balance of cost and throughput (vs MPC860VRZQ80D4557 (80 MHz VR grade))
  • Mask D4557 includes all known errata workarounds in firmware (vs MPC860SRZQ66D4556 (earlier mask D4556))
  • Standard 0 to 95 C operating temperature (vs MPC860DTZQ66D4557 (extended temperature))

Notas de projeto

The 357-ball BGA package requires via-in-pad construction for reliable thermal and electrical performance. Use 0.5 mm pitch BGA fanout with microvias to inner signal layers, and place a minimum 4-layer PCB stackup with dedicated ground and power planes directly beneath the package. The thermal pad must be soldered to a copper pad with at least 25 thermal vias to the inner ground plane to dissipate the 3.3 V core current at 66 MHz.

Always cross-reference the NXP/Freescale errata document for mask D4557 before firmware validation. Several documented errata affect CPM behavior at specific SCC configurations and bus clock ratios, and firmware workarounds may be required. Designers transitioning from earlier masks such as D4556 should review the full errata delta, not just the headline list. Failure to validate against the correct mask can produce intermittent frame-check errors in HDLC channels.

Estimated: At 3.3 V core supply and 66 MHz operation, the MPC860SRZQ66D4557 core current is approximately 250 mA, dissipating about 0.83 W. Total board power including I/O and CPM clocks typically reaches 1.2 W. Plan decoupling with 100 nF X7R ceramic capacitors on every power pin and a 10 uF bulk tantalum near the package, placed within 5 mm of the supply pins to minimize switching noise on the 3.3 V rail.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

Compliance information for the MPC860SRZQ66D4557 was not available in the Verified Web Data provided. The part originates from the Motorola/Freescale legacy PowerQUICC line and is in NRND status. RoHS and REACH compliance should be confirmed directly with NXP or via lot-specific certification documents from the distributor at time of order.

Dados verificados em: 2026-10-17 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

NXP Semiconductors Freescale Semiconductor Motorola MPC860SRZQ66D4557 MPC860 family PowerQUICC PowerPC architecture 32-bit microprocessor Communications Processor Module (CPM) BGA package Serial Communication Controller (SCC) 10/100 Ethernet MAC 357-ball BGA (ZQ) RoHS NRND status industrial router ISDN terminal adapter set-top box telecom line card factory automation DRAM controller UART I2C SPI CodeWarrior
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