MPC860SRZQ66D4557 - PowerQUICC 32-bit MPU, 66 MHz | NXP
부품 번호: MPC860SRZQ66D4557 ✗ 단종MPC860SRZQ66D4557 개요
A PowerQUICC processor is a specialized microprocessor that combines a PowerPC CPU core with dedicated communications peripherals on a single die. It sits in the embedded MPU hierarchy as: microprocessor -> 32-bit embedded processor -> communications controller. PowerQUICC parts are widely deployed in legacy telecom, industrial control, and networking equipment where deterministic communications processing is required.
Key features include a 66 MHz core clock, 4 KB instruction cache and 4 KB data cache, dual UART, dual SCC (Serial Communication Controller) channels for HDLC/PPP/ATM, I2C and SPI interfaces, a 10/100 Ethernet MAC, and on-chip DRAM controller. The integrated CPM offloads protocol processing from the CPU, freeing the core for application-level tasks.
Architecturally, the MPC860 uses a Harvard-style cache, separate instruction and data buses, and a dedicated peripheral bus for the CPM. The 66 MHz 'SR' speed grade is one tier below the 80 MHz 'VR' grade but offers equivalent peripheral set, providing a cost-optimized option for designs that do not require maximum throughput.
Typical applications include industrial routers, ISDN terminal adapters, set-top box controllers, factory automation bridges, and legacy telecom line cards. The wide operating temperature range (0 to 95 C) and integrated peripherals simplify board design and reduce BOM cost for these embedded systems.
When designing with this part, note that the 357-ball BGA requires careful PCB layout with via-in-pad recommended for thermal dissipation. Designers should also verify errata documents from NXP, as the MPC860 family has several documented silicon revisions (D4557 masks). Use the Freescale/NXP development toolchain (CodeWarrior) for firmware development.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers sourcing legacy PowerQUICC parts evaluate the MPC860SRZQ66D4557 against modern alternatives.
드롭인 대체품: MPC860SRZQ66D4557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MPC860SRZQ66D
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC860VRZQ80D4557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC860SRZQ80D4557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC860SRZQ66D4556
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC860DTZQ66D4557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC860SRZQ66D4557 최대 정격 & 전기적 특성
| Core Architecture | PowerPC 32-bit |
| Family | PowerQUICC MPC860 |
| Core Clock Speed | 66 MHz |
| 동작 온도 | 0 C to 95 C |
| 패키지 | 357-ball BGA (ZQ suffix) |
| 실장 유형 | Surface Mount |
| 공급 전압 | 3.3 V core / I/O |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| Communications Processor Module (CPM) | Yes (integrated) |
| Serial Communication Controllers (SCC) | 2 |
| Ethernet MAC | 10/100 Mbps (1 channel) |
| UART | 2 channels |
| I2C / SPI | Yes / Yes |
| DRAM Controller | Yes (integrated) |
| Mask / Die Revision | D4557 (per part suffix) |
MPC860SRZQ66D4557 357-ball bga (zq suffix) 핀 구성 가이드
MPC860SRZQ66D4557(357-ball bga (zq suffix) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC860SRZQ66D4557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC860SRZQ66D4557 적합 용도: 6 애플리케이션s: Industrial Router and Gateway, ISDN Terminal Adapter, Set-Top Box Controller, Factory Automation Bridge, Legacy Telecom Line Card, Embedded Print Server.
Industrial Router and Gateway
The MPC860SRZQ66D4557 integrates a PowerPC core with two SCC channels and a 10/100 Ethernet MAC, making it a single-chip solution for industrial routers and protocol-conversion gateways. Its 66 MHz core provides deterministic throughput for routing table updates, while the CPM offloads PPP, HDLC, and frame-relay processing. At 66 MHz, the part handles multi-megabit WAN aggregation without external protocol ASICs, reducing BOM and board area in DIN-rail industrial routers used in factory automation cells.
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ISDN Terminal Adapter
The MPC860SRZQ66D4557 was designed for ISDN terminal adapters where its dual SCC channels handle the ISDN D-channel and B-channel simultaneously. The integrated CPM processes HDLC framing in hardware, freeing the 66 MHz PowerPC core for upper-layer protocol stacks. The 357-ball BGA package supports compact PCI-card or desktop-adapter form factors while maintaining the thermal headroom needed for sustained ISDN BRI/PRI operation at room temperature.
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Set-Top Box Controller
Set-top box designs of the PowerQUICC era used the MPC860SRZQ66D4557 to control the front-panel display, demodulator interface, and out-of-band telemetry channel. The 66 MHz core is sufficient for MPEG transport-stream demultiplexing on low-to-mid tier boxes, and the Ethernet MAC enables IP-based conditional-access back-channels. The integrated DRAM controller eliminates an external memory controller chip, reducing BOM cost in volume STB production.
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Factory Automation Bridge
In factory-automation bridging applications, the MPC860SRZQ66D4557 connects legacy fieldbus networks (Profibus, Interbus) to Ethernet TCP/IP backbones. Its dual UART channels handle RS-485 fieldbus masters while the Ethernet MAC uplinks to plant-wide MES systems. The 0 to 95 C operating temperature range covers most cabinet-mounted industrial PCs, and the 357-ball BGA withstands typical factory vibration profiles when properly PCB-mounted with via-in-pad and underfill.
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Legacy Telecom Line Card
Telecom line cards in legacy T1/E1 and DSLAM systems use the MPC860SRZQ66D4557 as the central controller, offloading per-channel HDLC and PPP framing to the CPM. The 66 MHz SR speed grade is well-matched to per-channel T1/E1 processing, and the integrated Ethernet MAC connects to the shelf controller backplane. The ZQ 357-ball BGA supports high-density line-card PCB layouts where space is constrained by the multiple transceivers.
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Embedded Print Server
Networked print servers of the early 2000s used the MPC860SRZQ66D4557 to bridge parallel-port or USB-connected printers onto Ethernet networks. The PowerPC core runs the embedded TCP/IP stack and print-job spooler, while the Ethernet MAC provides 10/100 connectivity. The dual UART channels can interface with mid-range laser-printer controllers, and the integrated DRAM controller supports the buffer memory needed for print-job queuing.
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추천 제품 요약
엔지니어링 참조 데이터: MPC860SRZQ66D4557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC860SRZQ66D | MPC860VRZQ80D4557 | MPC860SRZQ80D4557 | MPC860SRZQ66D4556 | MPC860DTZQ66D4557 |
|---|---|---|---|---|---|---|
| Package | 357-ball BGA (ZQ) | 357-ball BGA (ZQ) - same | 357-ball BGA (ZQ) - same | 357-ball BGA (ZQ) - same | 357-ball BGA (ZQ) - same | 357-ball BGA (ZQ) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 66 MHz | 66 MHz | 80 MHz | 50 MHz | 66 MHz | 66 MHz |
| Mask Revision | D4557 | D (unspecified earlier) | D4557 | D4557 | D4556 | D4557 |
| Operating Temperature | 0 to 95 C | 0 to 95 C | 0 to 95 C | 0 to 95 C | 0 to 95 C | -40 to +105 C |
| Speed Grade | SR (66 MHz) | SR (66 MHz) | VR (80 MHz) | SR (50 MHz) | SR (66 MHz) | DT (extended temp, 66 MHz) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| SCC Channels | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | NRND | NRND | NRND | NRND | Obsolete | NRND |
주요 차별점
- 66 MHz SR speed grade offers balance of cost and throughput (vs MPC860VRZQ80D4557 (80 MHz VR grade))
- Mask D4557 includes all known errata workarounds in firmware (vs MPC860SRZQ66D4556 (earlier mask D4556))
- Standard 0 to 95 C operating temperature (vs MPC860DTZQ66D4557 (extended temperature))
설계 노트
The 357-ball BGA package requires via-in-pad construction for reliable thermal and electrical performance. Use 0.5 mm pitch BGA fanout with microvias to inner signal layers, and place a minimum 4-layer PCB stackup with dedicated ground and power planes directly beneath the package. The thermal pad must be soldered to a copper pad with at least 25 thermal vias to the inner ground plane to dissipate the 3.3 V core current at 66 MHz.
Always cross-reference the NXP/Freescale errata document for mask D4557 before firmware validation. Several documented errata affect CPM behavior at specific SCC configurations and bus clock ratios, and firmware workarounds may be required. Designers transitioning from earlier masks such as D4556 should review the full errata delta, not just the headline list. Failure to validate against the correct mask can produce intermittent frame-check errors in HDLC channels.
Estimated: At 3.3 V core supply and 66 MHz operation, the MPC860SRZQ66D4557 core current is approximately 250 mA, dissipating about 0.83 W. Total board power including I/O and CPM clocks typically reaches 1.2 W. Plan decoupling with 100 nF X7R ceramic capacitors on every power pin and a 10 uF bulk tantalum near the package, placed within 5 mm of the supply pins to minimize switching noise on the 3.3 V rail.
규정 준수 정보
Compliance information for the MPC860SRZQ66D4557 was not available in the Verified Web Data provided. The part originates from the Motorola/Freescale legacy PowerQUICC line and is in NRND status. RoHS and REACH compliance should be confirmed directly with NXP or via lot-specific certification documents from the distributor at time of order.
