MPC870ZT80 - PowerQUICC MPC870 80MHz MPU | NXP | Embedded
N.º da peça: MPC870ZT80 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $16.92 | $169,20 |
| 100 | $14.5 | $1.450,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $9.85 | $9.850,00 |
MPC870ZT80 Visão geral
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions from external memory. The MPC870 belongs to the PowerQUICC family, which historically sits at the intersection of microprocessor (MPU) and microcontroller (MCU) architectures. Its taxonomy is: microprocessor -> 32-bit embedded processor -> PowerPC core -> communications processor (PowerQUICC) -> semiconductor IC. PowerQUICC parts are widely recognized for integrating a CPU with optimized communication engines, reducing system BOM in routing, switching, and industrial control.
Key features include an 80 MHz core clock, PowerPC instruction set support, integrated serial communications peripherals, a flexible memory controller, and a wide operating temperature range suitable for industrial environments. The device uses a low-voltage CMOS process and supports both little-endian and big-endian byte ordering. Integrated peripherals reduce the need for external logic, allowing compact PCB designs.
The architecture combines a PowerPC integer unit with dedicated communication peripherals, dual UART channels, and a flexible system bus interface. This eliminates the need for a separate companion communications controller, simplifying board design and reducing overall power consumption compared with a CPU-plus-discrete-ASIC approach.
Typical applications include industrial Ethernet routers, telecom edge devices, low-end protocol converters, factory automation controllers, and embedded serial communications gateways. Its combination of deterministic interrupt response and an 80 MHz clock rate enables real-time protocol handling without an external RTOS in many designs.
When designing with this device, verify signal integrity on the external memory bus and provide adequate decoupling near the supply pins. The BGA package requires X-ray inspection after reflow, and a 4-layer PCB with a continuous ground plane is recommended for EMI control.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design considerations that go beyond what is found on the manufacturer datasheet alone.
Alternativas drop-in para MPC870ZT80 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC870ZT80 (mesmo formato e footprint) — diferindo em Core Architecture, Manufacturer, Operating Temperature, Series, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC875ZT80
✅ Drop-In✓ Em estoque
$26.4 / unidade
Ver ficha técnica →MPC870VT80
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC870CZT80
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MPC860TZP80
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC850DSLZQ66BUR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC870ZT80 Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC (PQ I HIP6W DUET) |
| Core Architecture | PowerPC 32-bit |
| Core Clock Speed | 80 MHz |
| Temperatura de operação | -40C to +85C (industrial) |
| Package Type | BGA (surface mount) |
| Tipo de montagem | Surface Mount |
| Tipo de memória | External memory controller (SRAM/DRAM/Flash) |
| Communication Interfaces | UART, SPI, parallel system bus |
| Instruction Set | PowerPC |
| Endianness | Big-endian and little-endian support |
| Process Technology | CMOS |
| Status do ciclo de vida | Obsolete - last time buy on legacy stock |
Guia de Configuração de Pinos do MPC870ZT80 bga (surface mount)
Configuração de pinos para MPC870ZT80 (pacote bga (surface mount)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC870ZT80.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC870ZT80 é adequado para 6 aplicaçãos: Industrial Ethernet Router, Telecom Edge Device Controller, Factory Automation Controller, Serial Communications Gateway, Low-End Protocol Converter, Embedded Remote Telemetry Unit (RTU).
Industrial Ethernet Router
The MPC870ZT80's 80 MHz PowerPC core and integrated UART/SPI peripherals make it a fit for low-port-count industrial Ethernet routers and protocol bridges. The PowerPC integer unit executes TCP/IP forwarding at wire speed for sub-100 Mbps links without requiring an external RTOS, while the integrated peripherals handle RS-485 to Ethernet bridging. Compared with a discrete CPU+ASIC solution, the MPC870ZT80 reduces BOM and PCB area by 30-40%. For industrial deployments, the -40C to +85C operating range tolerates cabinet and outdoor-enclosure environments. Recommended companion parts: PHY transceiver (e.g., NXP DP83848) and external SRAM/Flash.
Recomendado
Telecom Edge Device Controller
In telecom edge equipment such as DSLAM line cards, voice-over-IP gateways, and remote terminal units, the MPC870ZT80 handles call-control signaling and serial port management. The 80 MHz core is sufficient for G.711/G.729 codec control and H.248 signaling, while the flexible memory controller supports external SDRAM for call-state buffering. Deterministic interrupt latency on the PowerPC core is well-suited to TDM bus interfaces. Pin compatibility with other PowerQUICC members enables migration to higher-clock MPC875ZT80 variants when more headroom is needed.
Recomendado
Factory Automation Controller
The MPC870ZT80 serves as the central controller in PLC-style factory automation nodes, where its 80 MHz PowerPC core runs ladder-logic or soft-PLC firmware in real time. Integrated UART channels support Modbus RTU master/slave slave access to motor drives and sensors, while SPI interfaces connect to high-speed ADC/DAC peripherals for closed-loop motion control. The industrial -40C to +85C operating range and CMOS process technology support long-term reliability on the factory floor. Compared with ARM Cortex-M alternatives, the MPC870 offers more deterministic interrupt behavior at the cost of higher power consumption.
Recomendado
Serial Communications Gateway
The MPC870ZT80's multiple integrated UART channels and flexible system bus make it ideal for multi-protocol serial gateways that bridge RS-232, RS-485, and Ethernet networks. The PowerPC core runs protocol-conversion firmware with deterministic latency, supporting Modbus, DNP3, and IEC 60870-5-101/104 stacks. At 80 MHz, the part handles 4-8 serial ports at full baud rate while encoding/decoding packets on the fly. The BGA package and external memory controller simplify adding Flash for protocol stack storage and SRAM for packet buffering.
Recomendado
Low-End Protocol Converter
Used as a building block in protocol-converter modules, the MPC870ZT80 translates between legacy industrial fieldbus (Profibus, DeviceNet, CANopen) and modern Ethernet/IP protocols. The PowerPC core executes fieldbus stack libraries, while the integrated UART/SPI peripherals interface to transceiver ASICs. The 80 MHz clock rate provides sufficient headroom for stack processing at 1 ms cycle times. Engineers choosing this part benefit from NXP's reference firmware and the mature PowerPC toolchain including GNU gcc and CodeWarrior.
Recomendado
Embedded Remote Telemetry Unit (RTU)
In SCADA remote telemetry units for utilities and pipeline monitoring, the MPC870ZT80 aggregates data from multiple field sensors over serial links and forwards to central SCADA hosts. The 80 MHz PowerPC core is well-suited to running DNP3 and IEC 60870-5-104 stacks, while the flexible memory controller supports battery-backed SRAM for outage-tolerant data storage. The -40C to +85C industrial temperature range tolerates outdoor cabinet environments without active cooling. Recommended companions: industrial temperature sensor, isolated RS-485 transceiver, and low-power RTC.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC870ZT80 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC875ZT80 | MPC870VT80 | MPC870CZT80 | MPC860TZP80 | MPC850DSLZQ66BUR |
|---|---|---|---|---|---|---|
| Package | BGA | BGA - same | BGA - same | BGA - same | BGA - same family | BGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Core Clock Speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 66 MHz (-17.5%) |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Communication Interfaces | UART, SPI, system bus | UART, SPI, wider system bus | UART, SPI, system bus | UART, SPI, system bus | UART, SPI, system bus | UART, SPI, system bus (reduced) |
| Endianness | Big and little-endian | Big and little-endian | Big and little-endian | Big and little-endian | Big and little-endian | Big and little-endian |
Principais diferenciais
- Lowest-cost member of the MPC870 family with industrial temperature grade (vs MPC875ZT80)
- Industrial temperature grade (-40C to +85C) versus commercial variant (vs MPC870VT80)
- 80 MHz clock rate with PowerPC architecture for deterministic real-time (vs MPC850DSLZQ66BUR)
Notas de projeto
The MPC870ZT80 uses a BGA package requiring 4-layer PCB construction with a continuous ground plane beneath the device. Per IPC-2221 and IPC-7351, route signal traces on inner layers with the BGA fan-out using microvias or via-in-pad. Maintain a 0.2mm via-to-pad pitch, controlled-impedance routing for the external memory bus (typically 50 ohm single-ended), and 50 ohm differential for Ethernet MII if used. Place decoupling capacitors (100nF + 10uF) within 2mm of each BGA supply ball. X-ray inspection after reflow is mandatory per IPC-7095 to verify solder joint integrity.
Estimated: At maximum core activity and 3.3V core supply, the MPC870ZT80 dissipates approximately 1.5-2.0W. The BGA package typically has theta_JC of 5 C/W and theta_JA of 25 C/W with a 4-layer PCB. Junction temperature rise above ambient is therefore ~37-50 C at full load, leaving comfortable margin below the 125C junction limit at 85C ambient. For sealed enclosures without airflow, consider a 1 oz copper pour under the BGA thermal pad (if present) and ensure the PCB has thermal vias to inner ground planes for heat spreading.
Do not confuse the MPC870ZT80 (80 MHz PowerQUICC) with the MPC860 family, which has different peripheral mapping and BGA pin assignments despite the similar part-number prefix. Power-on reset must hold for at least 100 stable clock cycles after the 3.3V rail reaches regulation per the NXP hardware specifications. JTAG TRST must be pulled low for proper boundary-scan operation. For new production, request a counterfeit-avoidance inspection (decapsulation, X-ray, electrical test) from authorized distributors like Rochester Electronics, since the part is obsolete and broker channels carry elevated counterfeit risk per IPC-A-610 and AS6081.
The external memory bus operates at half the core clock (40 MHz at 80 MHz core) and requires source-termination or series-resistor damping on heavily-loaded address and control lines. Maintain matched trace lengths within +/- 2mm for the data byte lanes (D0-D7, D8-D15, etc.) to preserve setup/hold margins. Use a 4-layer stack-up with the second layer as a continuous ground plane and the third layer for power; this provides reference planes for the memory bus signals and minimizes crosstalk. For SDRAM interfaces, place a ground guard trace between clock and address lines.
Informações de conformidade
Compliance status not available in current manufacturer documentation because the device is obsolete. Request compliance certificates from Rochester Electronics at the time of order. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-qualified part.
