MPXS3020VMS180 - 180MHz Dual-Core e200z7d MCU 473-MAPBGA | NXP
N.º da peça: MPXS3020VMS180 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $96.87 | $96,87 |
| 10 | $87.18 | $871,80 |
| 100 | $77.5 | $7.750,00 |
| 500 | $68.2 | $34.100,00 |
| 1.000 | $61.95 | $61.950,00 |
MPXS3020VMS180 Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash for program code, SRAM for runtime data), and a rich set of on-chip peripherals (timers, communication controllers, ADCs, GPIO) on a single die. The PXS30 family belongs to the broader power-architecture microcontroller taxonomy: e200z7d core -> Power Architecture MCU -> 32-bit automotive microcontroller -> embedded processing IC. The dual-core architecture provides asymmetric lockstep support for safety-critical applications where one core executes code while the second verifies operation in lockstep, enabling ISO 26262 ASIL-D capable systems when paired with the correct safety libraries.
Key features include hardware security module (HSE) support for secure boot and cryptographic acceleration, dual e200z7d cores with FPU, a FlexRay communication controller for automotive networking, multi-channel CAN-FD interfaces, two Ethernet controllers (FEC), a 12-bit ADC with up to 48 channels, and a memory protection unit. The 473-MAPBGA package exposes the full peripheral set and supports external bus interfaces for SRAM, NOR Flash, and SDRAM expansion.
The PXS30 architecture uses a superscalar e200z7d core with dual-issue capability and a single-precision FPU, achieving high Dhrystone MIPS performance per MHz. Dual cores can operate in either dual-core parallel mode for performance or lockstep mode for safety, with the chip's Error Correction Code (ECC) on Flash and SRAM enabling reliable operation in harsh automotive environments. The integrated crossbar switch provides simultaneous access to Flash, SRAM, and peripherals from both cores without contention.
Typical applications include automotive electronic control units (ECUs), advanced driver assistance systems (ADAS) sensor fusion, chassis domain controllers, electric vehicle (EV) battery management systems (BMS), and industrial functional-safety controllers. The FlexRay and CAN-FD peripherals make the device particularly well-suited to chassis and powertrain networks, while the Ethernet MACs support modern zonal architectures.
Design consideration: The 473-MAPBGA package requires at least a 4-layer PCB with microvia technology and a 0.8 mm ball pitch footprint; a thermal management strategy with multiple vias under the exposed pad is required to keep junction temperature within the automotive Grade 1 / Grade 2 limits. Power sequencing must follow the NXP reference manual to avoid internal block corruption during cold-boot.
This page synthesizes distributor pricing, same-family and cross-family NXP drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MPXS3020VMS180 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPXS3020VMS180 (mesmo formato e footprint) — diferindo em Core Count, Program Memory Size, RAM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPXS3015VMS180
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$32.6713 / unidade
Ver ficha técnica →SPC5675KFAVMS2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
SPC5675KF0VMS2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPXS3020VMS180 Classificações máximas e características elétricas
| Core Architecture | e200z7d (dual-core) |
| Largura do barramento de dados | 32-bit |
| Core Count | 2 |
| Maximum Clock Speed | 180 MHz |
| Program Memory Size | 2 MB (2M x 8) FLASH |
| RAM Size | 512 KB |
| Encapsulamento / Caixa | 473-MAPBGA (19x19 mm) |
| Supply Voltage Range | 3 V to 5.5 V |
| Temperature Grade | Automotive |
| Terminal Form | BALL |
| Number of Terminals | 473 |
| Package Code | LFBGA |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Family | PXS30 |
Guia de Configuração de Pinos do MPXS3020VMS180 lfbga
Configuração de pinos para MPXS3020VMS180 (pacote lfbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPXS3020VMS180.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPXS3020VMS180 é adequado para 6 aplicaçãos: Automotive Chassis Domain Controller, EV Battery Management System (BMS), ADAS Sensor Fusion ECU, Industrial Functional-Safety Controller, Powertrain Control Unit (PCU), Body Domain Controller with Gateway.
Automotive Chassis Domain Controller
The MPXS3020VMS180 is well-suited to chassis domain ECUs because its dual e200z7d cores support lockstep operation for ASIL-D, while the integrated FlexRay and CAN-FD peripherals handle real-time chassis bus traffic. At 180 MHz per core the device can run the chassis control loops plus AUTOSAR RTE without offloading. Compared with a single-core MCU, the dual-core lockstep eliminates the need for an external safety companion chip and reduces BOM cost. Pair the MPXS3020VMS180 with an NXP FS65 power SBC for voltage supervision and CAN-FD transceivers such as the TJA1145 for physical layer connection.
Recomendado
EV Battery Management System (BMS)
The MPXS3020VMS180 fits battery management system master controllers because its 2 MB Flash accommodates large cell-balancing lookup tables and state-of-charge algorithms, while the 512 KB SRAM buffers telemetry from multiple slave BMS ICs. The 12-bit ADC with up to 48 channels supports pack-level voltage and temperature sampling. The dual-core architecture lets one core run the BMS algorithm and the other core handle CAN-FD/CAN communication, ensuring deterministic latency on the vehicle bus. Pair with NXP MC33771B battery cell controllers and an FS65 SBC for ASIL-D functional safety compliance.
Recomendado
ADAS Sensor Fusion ECU
The MPXS3020VMS180 works as a sensor fusion ECU that aggregates data from front-camera and radar pre-processors via Ethernet. Its dual 10/100 Ethernet MACs support modern zonal architectures and deliver deterministic latency for sensor data. The 180 MHz dual-core throughput runs simple object fusion and tracking algorithms; for higher-complexity perception, this MCU acts as a gateway forwarding raw sensor streams to a more powerful S32G or Layerscape central computer. Hardware Security Engine (HSE) on the device supports secure boot and signed firmware validation.
Recomendado
Industrial Functional-Safety Controller
In industrial safety controllers, the MPXS3020VMS180 enables SIL-3 / ASIL-D capable designs through dual-core lockstep execution and Error Correction Code (ECC) on all memory. The 473-MAPBGA package exposes all FlexRay, CAN-FD, and Ethernet channels for redundant fieldbus communication, making the MCU useful in safety PLCs and industrial servo drives. Compared with discrete watchdog + safety MCU architectures, the dual-core on-chip lockstep reduces PCB area and BOM cost while meeting IEC 61508 SIL-3 requirements. Pair with the FS65 SBC for ISO 26262 ASIL-D system-level compliance.
Recomendado
Powertrain Control Unit (PCU)
The MPXS3020VMS180 serves in powertrain ECUs where deterministic real-time control and high-temperature operation are required. Its automotive Grade 1 temperature range (up to +125 C junction) supports under-hood installation. The 2 MB Flash provides ample code space for combustion or hybrid powertrain control algorithms with multiple injection maps, while the FlexRay bus enables high-speed powertrain networking. The dual-core architecture supports both engine control and transmission control as separate cores with cross-core communication via shared SRAM.
Recomendado
Body Domain Controller with Gateway
As a body domain controller, the MPXS3020VMS180 bridges classic CAN, CAN-FD, and Ethernet networks into a single zonal gateway. The dual Ethernet MACs allow direct connection to two Ethernet zonal segments, while the four CAN-FD controllers aggregate legacy body bus traffic. Its 2 MB Flash supports gateway routing tables and security policies, and the 512 KB SRAM buffers high-rate CAN-FD streams. The hardware security engine (HSE) protects against unauthorized network access through secure boot and message authentication.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPXS3020VMS180 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPXS3015VMS180 | SPC5675KFAVMS2 | SPC5675KF0VMS2 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 473-MAPBGA (19x19) | 473-MAPBGA (19x19) - same | 473-MAPBGA - same | 473-MAPBGA - same |
| Core Architecture | Dual e200z7d | Dual e200z7d | Single e200z6 | Single e200z6 |
| Maximum Clock Speed | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 2 MB | 1.5 MB (-25%) | 2 MB | 2 MB |
| SRAM | 512 KB | 256 KB (-50%) | 256 KB (-50%) | 256 KB (-50%) |
| Hardware Security Engine (HSE) | Yes | Yes | No | No |
| ASIL Capability | ASIL-D capable (lockstep) | ASIL-D capable (lockstep) | ASIL-D capable | ASIL-D capable |
Principais diferenciais
- Dual-core lockstep with Hardware Security Engine (HSE) (vs SPC5675KFAVMS2)
- Larger SRAM for high-end chassis / BMS applications (vs MPXS3015VMS180)
- Automotive Grade 1 temperature range (vs SPC5675KF0VMS2)
Notas de projeto
The 473-MAPBGA (19x19) package has a relatively high theta_JB, so multiple thermal vias directly under the center exposed pad are required to keep junction temperature below the automotive Grade 1 limit of +125 C. In chassis ECUs drawing ~3 W at full CPU load, a thermal pad of at least 6 cm^2 of 2 oz copper with 0.3 mm via pitch is recommended. Avoid placing heat-generating components within 5 mm of the package perimeter.
Layout must follow NXP's BGA escape pattern with 0.8 mm pitch and microvia-in-pad technology on at least 4 PCB layers. Power decoupling requires 100 nF X7R capacitors placed within 2 mm of each VDDCORE / VDDIO pin pair, plus 4.7 uF bulk capacitors on the supply rails. The external SDRAM bus, if used, must be length-matched to within 0.5 mm with proper impedance control (50 ohm single-ended).
Power sequencing requires VDDIO to ramp before VDDCORE, and HSE core voltage must be present before code execution begins; failure to follow the reference manual sequencing can cause permanent HSE block damage. Use an NXP FS65 or PF8 power management IC to enforce sequencing and provide voltage supervision. Brown-out detection must be enabled in firmware to handle automotive cold-crank events down to 3.0 V.
Do not omit the external 32 kHz crystal for RTC operation; the internal RC is not accurate enough for FlexRay or CAN-FD time synchronization. The HSE firmware image must be signed by NXP and loaded before user code, otherwise the MCU will lock out debug access. ECC initialization must be performed on all SRAM regions at startup to prevent spurious single-bit corrections from being misinterpreted as faults.
Informações de conformidade
AEC-Q100 qualified per NXP PXS30 family datasheet. RoHS and REACH compliance confirmed via NXP product page. Halogen-free status not explicitly listed in verified data - marked unknown.
