MPXS3015VMS180 - 180MHz Dual-Core MCU, 1.5MB Flash | NXP
N.º da peça: MPXS3015VMS180 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $32.6713 | $32,67 |
| 10 | $32.6713 | $326,71 |
| 100 | $32.6713 | $3.267,13 |
| 500 | $32.6713 | $16.335,65 |
| 1.000 | $32.6713 | $32.671,30 |
MPXS3015VMS180 Visão geral
A microcontroller is a semiconductor system containing a processor core, nonvolatile program memory, RAM, peripherals, and interface logic on one integrated device. The MPXS3015VMS180 belongs to the hierarchy MCU, embedded processor, 32-bit microcontroller, and integrated circuit. Its dual e200z7d cores and substantial memory make it suitable for systems that need concurrent control tasks and embedded software rather than only basic input/output sequencing.
The verified data confirms 32-bit processing, two cores, a 180 MHz operating speed, and 1.5 MB of flash. A separate verified specification source identifies RAM as 384 Kbytes by 8 bits. The 473-MAPBGA package has a 19 mm by 19 mm body and uses balls rather than wire leads. Partstack further classifies the terminal form as BALL and the package code as LFBGA, while its temperature-grade classification is automotive.
This combination of dual-core compute and 1.5 MB program memory can support automotive-oriented embedded controllers, industrial equipment, networking appliances, and other multi-task systems where software organization benefits from parallel instruction streams. The available data does not identify individual communication interfaces, analog functions, supply limits, security features, or pin multiplexing, so those capabilities must be checked in the manufacturer documentation before design release.
Thermal and layout planning are critical because a 473-ball BGA concentrates many connections in a 19 mm by 19 mm footprint. Board assembly, ball pitch, escape routing, exposed-pad treatment, and the manufacturer’s recommended land pattern must be verified from the datasheet. A numerically complete 473-pin assignment cannot be reproduced from the supplied snippets without risking incorrect ball mapping.
For new designs, engineers should obtain the official Freescale or NXP documentation, confirm the exact pinout and electrical limits, validate software-tool support for the e200z7d architecture, and run lifecycle and supply checks before committing to production. Distributor availability does not by itself establish manufacturer lifecycle status or guaranteed stock.
This page combines the verified distributor specifications, pricing evidence, package information, sourcing links, and engineering cautions in one place. It also distinguishes confirmed facts from unavailable parameters and avoids presenting unverified pin assignments or substitute parts as drop-in replacements.
Alternativas drop-in para MPXS3015VMS180 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPXS3015VMS180 (mesmo formato e footprint) — diferindo em Core Count, Program Memory Size, RAM Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMPXS3015VMS180 Classificações máximas e características elétricas
| Product Type | 32-bit dual-core PX microcontroller |
| Processor Core | e200z7d |
| Core Count | 2 cores |
| CPU Word Width | 32 bit |
| Maximum Stated Speed | 180 MHz |
| Program Memory Size | 1.5 MB (1.5M x 8 bits) |
| Program Memory Type | Flash |
| RAM Size | 384 Kbytes x 8 bits |
| Package Code | LFBGA |
| Package Type | 473-MAPBGA |
| Terminal Count | 473 balls |
| Terminal Form | Ball |
| Package Shape | Square |
| Package Body Size | 19 mm x 19 mm |
| Tipo de montagem | Surface mount |
| Temperature Grade | Automotive |
| Manufacturer | Freescale Semiconductor, now represented by NXP Semiconductors |
Guia de Configuração de Pinos do MPXS3015VMS180 19 mm x 19 mm
Configuração de pinos para MPXS3015VMS180 (pacote 19 mm x 19 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPXS3015VMS180.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPXS3015VMS180 é adequado para 6 aplicaçãos: Automotive Electronic Control Unit, Industrial Multi-Task Controller, Network Edge Control Module, Robotics Motion Controller, Data Acquisition and Monitoring System, Secure Network Appliance Controller.
Automotive Electronic Control Unit
The MPXS3015VMS180 fits an automotive-oriented controller that benefits from two 32-bit e200z7d cores operating at a stated 180 MHz. The 1.5 MB flash capacity provides room for embedded application code, while 384 Kbytes of RAM supports working data and concurrent tasks. Partstack and Vyrian classify the ordering code as automotive temperature grade, but engineers must separately verify AEC-Q100 status, temperature limits, safety requirements, and functional-safety evidence. The 473-MAPBGA package also demands a controlled assembly process, exact ball mapping, and sufficient thermal design verification.
Recomendado
Industrial Multi-Task Controller
The two e200z7d cores in MPXS3015VMS180 can divide communication, diagnostics, and real-time control into concurrent software workloads. At 180 MHz and with 384 Kbytes of RAM, the device provides substantially more compute-oriented capability than basic 8-bit controllers, while 1.5 MB of flash supports a larger application image. The verified records do not list specific industrial interfaces, so a design must map every required UART, CAN, Ethernet, fieldbus, analog, and I/O function against the manufacturer datasheet before choosing this MCU.
Recomendado
Network Edge Control Module
MPXS3015VMS180 can serve as the processing core of a network edge controller when concurrent protocol handling and local control are required. Its dual 32-bit e200z7d cores can run at a stated 180 MHz, and the available 1.5 MB flash may accommodate networking firmware plus application logic. However, no Ethernet MAC, PHY interface, protocol accelerator, or connector specification is present in the verified data. Those functions must be verified directly in the datasheet and evaluated for throughput, packet loss, security, boot behavior, and thermal margin.
Recomendado
Robotics Motion Controller
The MPXS3015VMS180’s dual e200z7d architecture is relevant to robotics because motion coordination, sensor processing, and safety monitoring can run as separate workloads. The stated 180 MHz speed and 384 Kbytes RAM offer room for embedded algorithms, while 1.5 MB flash stores control software. Actual suitability depends on verified timer, PWM, encoder, communications, interrupt, and real-time-control resources, none of which are quantified in the supplied snippets. The 473-ball package also requires careful power delivery, decoupling, and BGA layout.
Recomendado
Data Acquisition and Monitoring System
A monitoring system can use the MPXS3015VMS180 when concurrent sampling control, local filtering, communications, and event logging require more capability than a basic controller. The dual e200z7d cores are stated to operate at 180 MHz, and 384 Kbytes RAM provides working space beyond simple register-level control. Engineers still need to verify ADC resolution and rate, timers, external-memory interfaces, sensor interfaces, and communications from the official documentation. Accurate analog performance and calibration support are not established by the distributor snippets.
Recomendado
Secure Network Appliance Controller
MPXS3015VMS180 may fit a secure appliance controller when firmware partitioning, protocol processing, and administrative logic benefit from dual-core execution. The verified capacity of 1.5 MB flash and 384 Kbytes RAM provides a defined memory baseline, while two e200z7d cores can support separated tasks. Security capability, cryptographic acceleration, boot authentication, debug restrictions, and secure-update mechanisms are not stated in the supplied data. Engineers must verify these functions and conduct system-level security analysis before assigning security boundaries between the cores.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPXS3015VMS180 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Principais diferenciais
- The verified architecture combines two 32-bit e200z7d cores with a stated 180 MHz operating speed. (vs SPC5675KFF0MMS2)
- The target includes 384 Kbytes RAM and 1.5 MB flash in one identified ordering code. (vs SPC5675KFF0MMS2)
- The package is a verified square 473-MAPBGA measuring 19 mm by 19 mm. (vs SPC5675KFF0MMS2)
Notas de projeto
Treat the MPXS3015VMS180 as a demanding BGA layout project. The verified package is a 473-terminal, 19 mm by 19 mm MAPBGA, but the supplied data does not include the ball map or land pattern. Do not infer routing from body size alone; obtain the manufacturer pin table and PCB recommendations, then use the exact ball coordinates to plan power, ground, signal escape routing, and assembly-process compatibility.
Do not design the supply network until the manufacturer datasheet supplies the operating voltage, absolute maximum ratings, pin-specific decoupling, and power-up requirements. The supplied distributor snippets contain processor and memory information but no verified electrical limits. Confirm which balls belong to each supply domain and follow the reference decoupling network exactly; otherwise transient current and package-level power integrity could exceed the device's intended operating conditions.
Thermal design requires the power dissipation, junction-temperature limit, package thermal model, and board construction, none of which are supplied. Do not estimate reliability from the stated 180 MHz frequency alone because actual loss depends on core activity, voltage, memory traffic, peripherals, and ambient conditions. Capture the manufacturer's thermal data and use the intended multilayer PCB and enclosure to calculate junction temperature before production release.
The ordering code contains VMS180 and is described as automotive temperature grade, but neither detail alone establishes full automotive qualification. Avoid assuming AEC-Q100 compliance, identical behavior with a VMS100 variant, or interchangeability with an SPC5675 MCU. Review the official ordering table, qualification documents, errata, and device pinout for the exact suffix before schematic sign-off.
Informações de conformidade
The supplied data identifies automotive temperature grade but does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance. No compliance claim is inferred from the temperature-grade classification.
