NXP Semiconductors

MRF7S19080HR3 - 24W 1.99GHz RF Power LDMOS | NXP | Base Station

N.º da peça: MRF7S19080HR3 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
65 V Vdss 750 mA Id NI-780H-2L (ceramic, flanged) Package 1930 MHz to 1990 MHz Speed
A partir de $36.2 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-15
Preços por volume
Qtd. Preço unitário Total
1 $52.62 $52,62
10 $47.36 $473,60
100 $42.1 $4.210,00
250 $38.95 $9.737,50
500 $36.2 $18.100,00
ℹ️ Todos os preços estão em USD

MRF7S19080HR3 Visão geral

The NXP MRF7S19080HR3 is a single W-CDMA lateral N-channel RF power MOSFET (LDMOS) designed for CDMA base station applications, delivering 24 W average output power across 1930-1990 MHz from a 28 V supply in a NI-780H-2L ceramic package. It provides 18 dB power gain, 32 % drain efficiency at 24 W Pout, and -38 dBc ACPR at 5 MHz offset for 3.84 MHz channel bandwidth W-CDMA signals, with quiescent current IDQ = 750 mA.

A lateral N-channel enhancement-mode RF power MOSFET (LDMOS) is a high-power transistor architecture in which the current-carrying channel is oriented laterally along the die, enabling high breakdown voltage, high gain, and excellent ruggedness under severe mismatch (high VSWR). Within the broader taxonomy it sits as: LDMOS -> RF power MOSFET -> power transistor -> discrete semiconductor. LDMOS dominates the cellular base-station PA market from 700 MHz to 2.7 GHz because of its high efficiency, broadband response, and ability to be driven directly from 50 ohm matching networks.

Key features of the MRF7S19080HR3 include integrated ESD protection, optimized for Doherty and linear amplifier topologies, broadband response covering the full 1930-1990 MHz PCS/cellular band, and a Ni-plated ceramic NI-780H-2L package with two flanged mounting holes that provide low thermal resistance and reliable screw-down assembly. Typical two-carrier W-CDMA drive performance is characterized at IDQ = 750 mA with 28 V VDD, the standard bias point for Class AB linear operation.

The internal die uses NXP's HV7 LDMOS process with a drain-source breakdown rating of 65 V, providing substantial headroom above the 28 V operating rail for transient over-voltage events. The NI-780H-2L package has a low thermal resistance path designed for forced-air cooling or heatsink mounting, and the gate is internally matched for simplified board-level integration.

Typical applications include W-CDMA/CDMA2000 base-station power amplifiers, TD-SCDMA cellular infrastructure, multi-carrier linear PAs for PCS/cellular bands, Class AB driver stages in Doherty amplifier chains, and tactical or industrial RF links operating in the 1.9 GHz band. Engineers choose MRF7S19080HR3 when a proven, broadband 28 V LDMOS with documented W-CDMA ACPR performance is required.

When designing with this device, prioritize a low-inductance drain bias feed and a properly modeled load-pull match at the target frequency. The part is rated for high VSWR mismatch; however, designing the output matching network for the documented 50 ohm load remains the safest path to datasheet-typical gain and efficiency.

Alternativas drop-in para MRF7S19080HR3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MRF7S19080HR3 (mesmo formato e footprint) — diferindo em Lead Free Status, Package, Technology, Transistor Type, Configuration.

NXP Semiconductors
Lead Free Status: Yes (per datasheet)
Package: NI-880H-2L (ceramic, metal-sealed cofired, flange mount)
Technology: RF Power Field Effect Transistor
Comparar com MRF7S19080HR3 →
NXP Semiconductors
Lead Free Status: Lead Free per datasheet
Package: TO-270 WB-4 (overmolded plastic, 4-lead)
Technology: RF Power MOSFET (Gen7 HV8 LDMOS)
Comparar com MRF7S19080HR3 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MRF7S19080HSR3

✅ Drop-In
📦 NI-780S-2L
same die, NI-780S-2L flange vs NI-780H-2L flange, electrical drop-in

📋 Alternativa de referência (fora do catálogo)

MRF7S19080HR5

✅ Drop-In ⚠️ Especificações não verificadas
📦 NI-780H-2L
same NI-780H-2L footprint, factory-packaging variant of MRF7S19080HR3

📋 Alternativa de referência (fora do catálogo)

MRF7S19120NR1

✅ Drop-In ⚠️ Especificações não verificadas
NXP Semiconductors
📦 NI-780H-2L
LDMOS, N-Channel Enhancement-Mode Lateral · RF Power MOSFET (Gen7 HV8 LDMOS) · 1930 MHz to 1990 MHz · 36 W · 65 V (rated) · 28 V · 1.2 A · 18 dB at 1.99 GHz

✓ Em estoque

$73 / unidade

Ver ficha técnica →

AFT20P140-4WNR3

✅ Drop-In
📦 OM-780-4 (ceramic flange)
same NXP family, OM-780-4 flange, 1.8-2.0 GHz 140W pulsed - higher power class, same manufacturer

📋 Alternativa de referência (fora do catálogo)

MRF7S19080HR3 Classificações máximas e características elétricas

Tipo de transistor LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Technology HV7 RF Power LDMOS
Frequency Range 1930 MHz to 1990 MHz
Test Frequency 1.99 GHz (1987.5 MHz)
Drain-Source Voltage (Vdss) Rated 65 V
Operating Drain Voltage (VDD) 28 V
Quiescent Current (IDQ) 750 mA
Output Power (Pout, Avg.) 24 W (W-CDMA)
Power Gain (Gp) 18 dB
Drain Efficiency 32 % at 24 W Avg.
ACPR @ 5 MHz Offset -38 dBc in 3.84 MHz channel
Device Output Signal PAR 6.2 dB @ 0.01 % CCDF
Encapsulamento NI-780H-2L (ceramic, flanged)
Tipo de montagem Surface Mount / Screw Mount
Lead Free Status Lead Free
Status RoHS Compliant
Configuration Single, Push-Pull

Configuração de pinos do MRF7S19080HR3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 DRAIN — RF output / Drain bias (28 V VDD)
Pino 2 GATE — RF input / Gate bias
Pino 3 SOURCE / FLANGE — Source and thermal ground (bolted to heatsink)

Área de Operação Segura (DC)

Operação contínua em CC

Aplicações típicas

MRF7S19080HR3 é adequado para 6 aplicaçãos: W-CDMA Base-Station Power Amplifier, CDMA2000 PCS Cellular Infrastructure, TD-SCDMA Cellular Power Amplifier, Doherty Amplifier Carrier Stage, Multi-Carrier Linear Power Amplifier, Industrial / Tactical 1.9 GHz RF Link.

🌐

W-CDMA Base-Station Power Amplifier

The MRF7S19080HR3 is purpose-built for 1930-1990 MHz W-CDMA base-station PAs. At 28 V VDD and IDQ = 750 mA the part delivers 24 W average output with 18 dB gain and 32 % drain efficiency. ACPR is -38 dBc at 5 MHz offset in a 3.84 MHz channel, meeting 3GPP linearity requirements. The NI-780H-2L flange provides low thermal resistance for continuous base-station duty. Designers use this part in the final stage of macro-cell PA modules behind a digital predistortion (DPD) loop. Recommended companion MPNs: MRF7S19080HSR3 (carrier-amp second source), AFT20P140-4WNR3 (peak-amp option).

🌐

CDMA2000 PCS Cellular Infrastructure

The 1930-1990 MHz band covers the CDMA2000 PCS downlink. MRF7S19080HR3 is characterized for IS-95/CDMA2000 multi-carrier signals at 28 V with 18 dB gain and 24 W average output. Its lateral N-channel LDMOS structure provides high ruggedness under antenna-mismatch VSWR events common in field-deployed base stations. Engineers integrate this part into macro-cell and micro-cell PA lineups, often as the final stage after a lower-power driver. Recommended companion MPNs: MRF7S19080HR3 driver (lower power), MRF8HP21130HSR3 (AWS band variant).

🌐

TD-SCDMA Cellular Power Amplifier

The MRF7S19080HR3 is recommended for TD-SCDMA base-station PAs covering 1880-1920 MHz and 2010-2025 MHz, with the part's 1930-1990 MHz optimized response extending into the TD-SCDMA downlink band. Per the NXP datasheet it is suitable for Class AB and Class C operation. Designers use it in time-division duplex (TDD) PA modules where the LDMOS part must handle high peak-to-average ratios without memory-effect distortion. Recommended companion MPNs: MRF7S19080HSR3 (variant), MRF8S21100HR5 (UMTS band reference).

🌐

Doherty Amplifier Carrier Stage

In Doherty amplifier architectures, the MRF7S19080HR3 functions as the carrier (main) PA, biased in Class AB at IDQ = 750 mA. Its 18 dB gain and 32 % efficiency at 24 W average make it an excellent choice for the carrier path, while a higher-power peaking device handles the upper power range. The NI-780H-2L flange provides repeatable thermal performance for paralleling multiple carriers in a multi-sector PA. Recommended companion MPNs: AFT20P140-4WNR3 (peaking amplifier).

🌐

Multi-Carrier Linear Power Amplifier

The MRF7S19080HR3's -38 dBc ACPR at 5 MHz offset makes it ideal for multi-carrier PCS amplifiers where two or more W-CDMA carriers are combined. Its high linearity reduces intermodulation distortion between carriers. NXP characterizes the part explicitly for multi-carrier use, and the NI-780H-2L package handles the resulting thermal load with proper heatsinking. Recommended companion MPNs: MRF7S19080HSR3 (redundant carrier PA), MRF8HP21130HSR3 (AWS multi-carrier reference).

📡

Industrial / Tactical 1.9 GHz RF Link

Outside cellular infrastructure, the MRF7S19080HR3's 1930-1990 MHz coverage supports industrial and tactical RF links in the 1.9 GHz band. The LDMOS ruggedness handles antenna mismatch common in mobile deployments. Engineers use this part in private-network base stations, public-safety repeaters, and tactical communications amplifiers where commercial W-CDMA silicon is acceptable for the application. Recommended companion MPNs: MRF7S19080HSR3 (production second source).

Resumo dos produtos recomendados

MRF7S19080HSR3 Same die, alternate flange variant Usado em: W-CDMA Base-Station Power Amplifier, CDMA2000 PCS Cellular Infrastructure, TD-SCDMA Cellular Power Amplifier, Multi-Carrier Linear Power Amplifier, Industrial / Tactical 1.9 GHz RF Link AFT20P140-4WNR3 Higher-power reference for Doherty peaking Usado em: W-CDMA Base-Station Power Amplifier, Doherty Amplifier Carrier Stage MRF8HP21130HSR3 NXP Semiconductors Usado em: CDMA2000 PCS Cellular Infrastructure MRF8S21100HR5 NXP Semiconductors Usado em: TD-SCDMA Cellular Power Amplifier
What is the operating frequency range of the MRF7S19080HR3?
The MRF7S19080HR3 operates from 1930 MHz to 1990 MHz, optimized for the PCS/cellular and W-CDMA bands. According to the NXP datasheet for MRF7S19080H, the part is characterized at 1987.5 MHz with 28 V VDD and IDQ = 750 mA, delivering 18 dB power gain at 24 W average output power. This band covers CDMA2000, W-CDMA, and TD-SCDMA base-station downlinks.
What output power can the MRF7S19080HR3 deliver?
The MRF7S19080HR3 delivers 24 W average output power in single-carrier W-CDMA service at 1987.5 MHz, 28 V VDD, and IDQ = 750 mA. At this bias point drain efficiency is 32 % and ACPR is -38 dBc at 5 MHz offset in a 3.84 MHz channel. The part uses NXP HV7 LDMOS technology and is rated for high-VSWR mismatch conditions typical of base-station antennas.
What is the difference between MRF7S19080HR3 and MRF7S19080HSR3?
The MRF7S19080HR3 and MRF7S19080HSR3 share the same silicon and RF performance per the NXP datasheet, but use different package flanges. The HR3 is the NI-780H-2L flange variant while the HSR3 uses the NI-780S-2L flange for different mechanical/thermal mounting. Both are 1930-1990 MHz, 24 W, 28 V single W-CDMA lateral N-channel RF power MOSFETs. Either is a drop-in electrical replacement if the board footprint matches.
Is the MRF7S19080HR3 suitable for Doherty amplifier designs?
Yes, the MRF7S19080HR3 is well suited for Doherty amplifier designs in the 1.9 GHz PCS band. Its 18 dB gain, 32 % drain efficiency, and -38 dBc ACPR at 24 W average make it an effective carrier or peaking device in symmetrical and asymmetrical Doherty topologies. NXP characterizes the part for Class AB linear operation at IDQ = 750 mA, which matches the bias point typically used for the peaking amplifier leg.
Where can I download the MRF7S19080HR3 datasheet PDF?
The official MRF7S19080HR3 datasheet is published on NXP's website at https://www.nxp.com/docs/en/data-sheet/MRF7S19080H.pdf. The PDF contains the full 1930-1990 MHz test data, package outline drawings for NI-780H-2L, S-parameter tables, and reference design layouts for W-CDMA base-station amplifiers. The datasheet document covers both MRF7S19080HR3 and MRF7S19080HSR3 variants.
What package does the MRF7S19080HR3 use and what is the pinout?
The MRF7S19080HR3 is housed in the NI-780H-2L ceramic flange package, a Ni-plated ceramic carrier with two mounting holes for screw-down assembly. The package has three functional leads: gate (input), drain (output), and source (grounded through the flange). The flange itself serves as the primary thermal path and must be bolted to a heatsink or spreader with thermal compound for reliable operation.
Where can I buy the MRF7S19080HR3 and what is the current price?
As of 2026-10-16, the MRF7S19080HR3 is in stock at DigiKey (NXP USA Inc. listing) and listed at LCSC at approximately USD 52.62 per unit at qty 1. Authorized distributors include DigiKey, Mouser, and LCSC. Volume pricing drops to roughly USD 36 per unit at qty 500. Lead time is typically 4-8 weeks from NXP franchised distributors, with shorter stock available from authorized partners.
What is the lead time for the MRF7S19080HR3?
As of 2026-10-16 the MRF7S19080HR3 is currently in stock at NXP franchised distributors including DigiKey and Mouser with same-day shipping available for small quantities. Factory lead time for volume orders of 1k+ units is approximately 8-12 weeks. The part is also offered via Rochester Electronics for legacy and long-term supply. Customers should verify current stock on distributor websites before placing firm orders.
MRF7S19080HR3 vs MRF8HP21130HSR3 - which is better for 2 GHz base-station PA design?
The MRF7S19080HR3 and MRF8HP21130HSR3 target different frequency bands: the MRF7S19080HR3 covers 1930-1990 MHz at 24 W average, while the MRF8HP21130HSR3 targets 2110-2170 MHz at higher power levels per the NXP family roadmap. Choose MRF7S19080HR3 for PCS/cellular 1.9 GHz band designs and MRF8HP21130HSR3 for AWS/UMTS 2.1 GHz band designs. They are not drop-in replacements due to different package families (NI-780H-2L vs NI-780S-4).
What is the best drop-in replacement for the MRF7S19080HR3?
The best drop-in replacement for the MRF7S19080HR3 is the MRF7S19080HSR3, which uses the same die and the same NI-780 family ceramic flange but a slightly different screw-hole pattern (NI-780S-2L). For identical NI-780H-2L mechanical compatibility, the MRF7S19080HR3 itself is the only NXP option; cross-brand drop-in parts in the same NI-780H-2L package are not commonly available because each RF power MOSFET manufacturer tunes its own flange pattern.
What is the AFT20P140-4WNR3 and is it equivalent to the MRF7S19080HR3?
The AFT20P140-4WNR3 is an NXP RF power transistor targeting a different frequency band (1.8-2.0 GHz, 140 W pulsed) in an OM-780-4 ceramic package. It is NOT a drop-in equivalent to the MRF7S19080HR3 - the package, pinout, and power class differ. Engineers sometimes use AFT20P140-4WNR3 as a reference for higher-power 1.9 GHz designs but it requires a different board footprint and matching network than the MRF7S19080HR3.
Is the MRF7S19080HR3 RoHS compliant and lead-free?
Yes, the MRF7S19080HR3 is RoHS compliant and lead-free per the NXP product page and DigiKey listing. The Ni-plated ceramic NI-780H-2L package is fully RoHS-compliant and meets current environmental directives for use in commercial cellular infrastructure. The part is also halogen-free per NXP's HV7 family materials declaration.
What quiescent current should be used for Class AB linear operation?
The MRF7S19080HR3 datasheet recommends IDQ = 750 mA for Class AB linear operation at 28 V VDD. This bias point optimizes the trade-off between linearity (lowest ACPR) and efficiency: at IDQ = 750 mA the part delivers 24 W average output with 32 % drain efficiency and -38 dBc ACPR in a single-carrier W-CDMA signal. Biasing lower than 500 mA causes gain compression and higher ACPR; biasing higher than 1 A reduces efficiency without improving linearity.
What are the key specifications of the MRF7S19080HR3 that engineers should know?
The MRF7S19080HR3 is a 28 V, 1930-1990 MHz, 24 W average, 18 dB gain LDMOS in an NI-780H-2L ceramic flange package. Key specifications are: drain efficiency 32 %, ACPR -38 dBc at 5 MHz offset, quiescent current 750 mA, and Vdss rating 65 V. The device is part of NXP's HV7 family and is designed for W-CDMA, CDMA2000, and TD-SCDMA base-station power amplifier stages.
When should I choose the MRF7S19080HR3 over a GaN transistor?
Choose the MRF7S19080HR3 LDMOS over GaN when cost per watt is the dominant factor and efficiency targets are 30-35 %. LDMOS still delivers excellent linearity and proven reliability in 1.9 GHz base-station PAs, with mature ecosystem of matching components and reference designs. Choose GaN instead when you need higher efficiency (>50 %), wider bandwidth (multi-octave), or higher power density per mm of die area. For a 24 W average 1.9 GHz W-CDMA PA, the MRF7S19080HR3 is typically the most cost-effective solution.

Dados de referência de engenharia para MRF7S19080HR3 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MRF7S19080HR3 when designing a 1930-1990 MHz W-CDMA, CDMA2000, or TD-SCDMA base-station power amplifier with 24 W average output. The part is optimized for Class AB linear operation at 28 V VDD and IDQ = 750 mA, delivering 18 dB gain and 32 % drain efficiency. Use the MRF7S19080HSR3 if your mechanical design requires the NI-780S-2L flange variant (same die, same RF performance). For higher output power (140 W pulsed), consider the AFT20P140-4WNR3 from the same NXP family but note it uses the OM-780-4 package and 50 V VDD - it is NOT a drop-in replacement. For AWS band (2110-2170 MHz) designs, switch to the MRF8HP21130HSR3 instead.

Comparação com alternativas

Parâmetro Este produto MRF7S19080HSR3 MRF7S19080HR5 MRF7S19120NR1 AFT20P140-4WNR3
Package NI-780H-2L NI-780S-2L NI-780H-2L NI-780H-2L OM-780-4
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Frequency Range 1930-1990 MHz 1930-1990 MHz 1930-1990 MHz 1930-1990 MHz 1800-2000 MHz
Output Power (Avg.) 24 W 24 W 24 W ~28 W 140 W pulsed
Power Gain 18 dB 18 dB 18 dB 18 dB 16 dB
Operating VDD 28 V 28 V 28 V 28 V 50 V

Principais diferenciais

  • Documented W-CDMA ACPR performance at production bias point (vs Generic 1.9 GHz RF MOSFETs)
  • Higher 65 V Vdss rating provides margin above 28 V operating rail (vs Lower-voltage RF MOSFETs (Vdss < 50 V))
  • Integrated NI-780H-2L ceramic flange reduces thermal resistance (vs Plastic-packaged RF MOSFETs)

Notas de projeto

The NI-780H-2L flange is the primary thermal path for the MRF7S19080HR3. At 28 V VDD and 24 W average RF output with 32 % drain efficiency, the part dissipates approximately 51 W of DC power, so the flange MUST be bolted to a heatsink or cold plate using thermal compound. Estimated: with theta_JC of approximately 0.3 C/W and a 50 C/W heatsink-to-ambient thermal resistance, junction temperature rise is roughly 35 C above the heatsink. Insufficient thermal mounting is the most common failure mode for this part.

Use low-inductance drain bias feeds (multiple vias, short traces) to prevent feedback instability at 1.9 GHz. Place gate and drain matching networks on Rogers RO4350B or equivalent low-loss PCB substrate with controlled-impedance (50 ohm) microstrip lines. Keep the input (gate) matching network physically separated from the output (drain) matching network to minimize coupling. Per NXP application notes, the source leads must be bonded directly to the ground plane with maximum via density under the flange.

Do not exceed Vdss = 65 V (including transient overshoot from load-mismatch). Ensure the bias sequencing turns on the gate first (negative voltage, typically -5 V) before applying 28 V VDD, then ramps gate voltage to achieve IDQ = 750 mA. Reverse biasing or fast hot-switching of VDD can cause device failure. Designers should also include a drain voltage clamp or TVS for severe antenna-mismatch conditions, even though the LDMOS part is rated for high VSWR.

For W-CDMA linearity, maintain IDQ = 750 mA within +/-50 mA across the operating temperature range. Drain efficiency drops roughly 0.1 % per 1 C temperature rise at constant IDQ; for thermally stable operation mount a thermistor to the flange for active bias compensation. ACPR at 5 MHz offset is sensitive to bias drift, so closed-loop bias control is recommended for production base-station designs.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant and lead-free per NXP product page. Designed for commercial cellular infrastructure; not AEC-Q100 qualified (not applicable for RF power MOSFET in automotive).

Dados verificados em: 2026-10-16 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

MRF7S19080HR3 datasheet MRF7S19080HR3 price NXP MRF7S19080HR3 buy MRF7S19080HR3 vs MRF7S19080HSR3 1930-1990 MHz 24W RF MOSFET NI-780H-2L LDMOS package W-CDMA base station power amplifier LDMOS MRF7S19080HR3 pinout NI-780H-2L MRF7S19080HR3 drop-in replacement NXP HV7 RF power transistor 1.9 GHz Doherty amplifier 24W 1.9 GHz LDMOS MRF7S19080HR3 lead time stock

Componentes & termos relacionados

NXP Semiconductors MRF7S19080HR3 MRF7S19080HSR3 AFT20P140-4WNR3 LDMOS lateral N-channel MOSFET RF power transistor power MOSFET discrete semiconductor W-CDMA CDMA2000 TD-SCDMA NI-780H-2L ceramic flange package PSRR ACPR drain efficiency Doherty amplifier Class AB base station VSWR ESD protection RoHS AEC-Q100
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