MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP
N.º da peça: MSC8256SVT1000B ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $275 | $2.750,00 |
| 100 | $245 | $24.500,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $189 | $189.000,00 |
MSC8256SVT1000B Visão geral
A digital signal processor (DSP) is a specialized microprocessor whose architecture is optimized for the numeric-intensive, real-time math operations (multiply-accumulate, FFT, convolution) common in audio, video, communications, and radar signal chains. Within the broader semiconductor hierarchy, a DSP sits between a microcontroller (which excels at control code) and an application processor (which excels at general-purpose workloads); DSPs deliver deterministic latency, high MAC throughput, and direct memory interfaces tuned for streaming data. The MSC8256 family is NXP's high-tier StarCore platform, targeting wireless baseband, media gateway, and high-channel-count telecom infrastructure.
Key features include six independent SC3850 cores with hardware MMU support, a memory management unit (MMU), an extended programmable interrupt controller (EPIC), two general-purpose 32-bit timers per core, low-power Wait modes, and integrated DDR2/DDR3 memory controller with ECC. The device also integrates Serial RapidIO, PCI Express, Gigabit Ethernet (SGMII/RGMII), I2C, SPI, UART, and a security engine (SEC) for cryptographic acceleration. Total on-chip RAM is 576 KB across the six cores plus the 96 KB ROM boot block.
The MSC8256 architecture uses a variable-length execution (VLE) StarCore pipeline that issues up to four instructions per cycle and supports SIMD-style packed-data math, allowing 16-bit and 32-bit operations to coexist in the same program. This makes it well suited to mixed-precision wireless baseband processing where some datapaths (e.g., voice codecs) prefer 16-bit fixed-point while others (e.g., channel estimation) require 32-bit precision.
Typical applications include wireless base station channel cards, media gateways, VoIP and IP-PBX systems, LTE/HSPA baseband processing, high-density transcoders, and high-channel-count industrial DSP arrays. Designers often pair the MSC8256 with NXP's QorIQ communications processors or with FPGA front-ends for RF I/Q conversion.
When designing with the MSC8256SVT1000B, plan PCB layout around the 783-ball FCBGA with multi-layer microvia stack-up; route the DDR3 interface as an 8-layer matched-length group, and provide clean low-noise rails to the PLL supply pins. The device's 1 GHz per-core clock and high I/O count demand careful signal-integrity planning on the SerDes lanes (SRIO, PCIe, SGMII).
Alternativas drop-in para MSC8256SVT1000B — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MSC8256SVT1000B (mesmo formato e footprint) — diferindo em Mounting Type, Manufacturer, Core Architecture, Core Clock Frequency, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasMSC8256SVT1000B Especificações
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | StarCore MSC8256 |
| Type | SC3850 Six-Core Digital Signal Processor |
| Core Architecture | StarCore SC3850 (VLE, 4-issue) |
| Number of Cores | 6 |
| Core Clock Speed | 1 GHz |
| Aggregate Throughput | 1000 MIPS per core (6000 MIPS total) |
| Data Width | 32-bit / 64-bit |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Unified L2 Cache (per core) | 512 KB (configurable to M2 memory in 64 KB increments) |
| On-Chip RAM (total) | 576 KB |
| Non-Volatile Memory (ROM) | 96 KB |
| MMU | Yes (hardware memory management unit) |
| EPIC (Interrupt Controller) | Yes (Extended Programmable Interrupt Controller) |
| Timers (per core) | 2 x 32-bit general-purpose |
| DDR Memory Controller | DDR2/DDR3 with ECC |
| High-Speed Interfaces | Serial RapidIO, PCI Express, SGMII, RGMII |
| Peripheral Interfaces | I2C, SPI, UART, GPIO |
| Security Engine | SEC (cryptographic acceleration) |
| Encapsulamento | 783-FCBGA (29x29 mm) |
| Temperatura de operação | -40C to +105C (industrial) |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do MSC8256SVT1000B 783-fcbga (29x29 mm)
Configuração de pinos para MSC8256SVT1000B (pacote 783-fcbga (29x29 mm)). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para MSC8256SVT1000B.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MSC8256SVT1000B é adequado para 6 aplicaçãos: Wireless Base Station Channel Cards, Media Gateway and VoIP Platforms, LTE / HSPA Baseband Processing, High-Channel-Count Industrial DSP Arrays, Radar and Signal-Intelligence Systems, Medical Imaging and Diagnostic Equipment.
Wireless Base Station Channel Cards
The MSC8256SVT1000B's six 1 GHz SC3850 cores deliver up to 6000 MIPS aggregate, which matches the per-channel compute budget of LTE and HSPA base-station channel cards. Its integrated DDR2/DDR3 controller with ECC and Serial RapidIO link let designers build multi-card baseband shelves without external bridge chips, while the SIMD-friendly VLE pipeline runs both 16-bit voice codecs and 32-bit channel-estimation kernels on the same cores.
Recomendado
Media Gateway and VoIP Platforms
VoIP and media-gateway designs require high-channel-density DSP resources for voice codec transcoding (G.711, G.729, AMR-WB) and echo cancellation. The MSC8256SVT1000B's six cores handle hundreds of concurrent voice channels per chip, and its integrated security engine (SEC) accelerates SRTP and IPsec for encrypted VoIP trunks. The 783-FCBGA package plus Gigabit Ethernet (SGMII/RGMII) interfaces simplify PCB layout for high-density gateway line cards.
Recomendado
LTE / HSPA Baseband Processing
The MSC8256SVT1000B is widely deployed in 3G/4G baseband processing where its six SC3850 cores at 1 GHz run turbo decoders, FFTs, and channel-estimation routines at line-rate for multiple carriers. The StarCore VLE instruction set supports packed-data SIMD math, which is critical for the mixed 16-bit/32-bit precision of LTE uplink/downlink chains. DDR3 with ECC ensures memory integrity for soft-decision decoding across thousands of HARQ processes.
Recomendado
High-Channel-Count Industrial DSP Arrays
Industrial inspection systems, sonar beamformers, and high-channel-count audio processors benefit from the MSC8256SVT1000B's six-core architecture, which lets engineers partition multi-channel DSP pipelines across independent cores with deterministic latency. The MMU and EPIC provide clean isolation between DSP threads, and the dual 32-bit timers per core allow precise per-channel sample-rate synchronization without external logic.
Recomendado
Radar and Signal-Intelligence Systems
Phased-array radar and signal-intelligence platforms use the MSC8256SVT1000B to perform pulse compression, MTI filtering, and FFT-based spectral analysis on multiple simultaneous receive channels. The 1 GHz per-core throughput plus 576 KB on-chip memory per core lets the chip hold large window tables and FFT twiddle factors on-chip, avoiding expensive DDR round-trips. PCI Express connectivity streams I/Q data from RF ADC front-ends.
Recomendado
Medical Imaging and Diagnostic Equipment
Ultrasound beamforming, MRI reconstruction, and patient-monitoring DSP chains use the MSC8256SVT1000B's six cores to run FIR/IIR filters, Hilbert transforms, and B-mode image formation in real time. The deterministic interrupt latency from EPIC and hardware MMU support for medical-grade operating systems help meet IEC 62304 software-life-cycle requirements. The security engine accelerates encrypted storage of patient data at rest.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MSC8256SVT1000B — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MSC8256ESVT1000B | MSC8256SAG1000B | MSC8256ETAG1000B | MSC8251SVT1000B | MSC8156SVT1000B |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | StarCore SC3850 x 6 | StarCore SC3850 x 6 | StarCore SC3850 x 6 | StarCore SC3850 x 6 | StarCore SC3850 x 1 | StarCore SC3850 x 6 (older generation) |
| Core Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| MIPS per Core | 1000 MIPS | 1000 MIPS | 1000 MIPS | 1000 MIPS | 1000 MIPS | 1000 MIPS |
| On-Chip RAM | 576 KB | 576 KB | 576 KB | 576 KB | 576 KB (1 core) | 576 KB |
| L2 Cache per Core | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| DDR Memory Interface | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| High-Speed I/O | SRIO, PCIe, SGMII, RGMII | SRIO, PCIe, SGMII, RGMII | SRIO, PCIe, SGMII, RGMII | SRIO, PCIe, SGMII, RGMII | SRIO, PCIe, SGMII, RGMII | SRIO, PCIe, SGMII, RGMII |
| Operating Temperature | 0C to +105C (VT grade) | -40C to +105C (extended) | 0C to +105C | -40C to +105C (extended) | 0C to +105C | 0C to +105C |
Principais diferenciais
- Six independent 1 GHz SC3850 cores (vs MSC8251SVT1000B)
- Extended-temperature variant available in same package (vs MSC8256ESVT1000B)
- Integrated DDR3 controller with ECC (vs MSC8156SVT1000B)
Notas de projeto
The 783-FCBGA (29x29 mm, 1.0 mm pitch) requires a high-density PCB stack-up with laser-drilled microvias. Per NXP design guidelines, use a 12-layer or 14-layer board with separate ground and power planes adjacent to the top signal layer to provide return paths for the high-frequency DDR3 and SerDes signals. Place 0.1uF decoupling capacitors on every power pin within 100 mils of the ball.
Route the DDR3 data/address/control group as a matched-length bus with delta delay under 25 ps between any two signals. Use fly-by topology for DDR3 address/command lines and T-branch topology for the clock. For Serial RapidIO and PCI Express lanes, maintain 100 ohm differential impedance with continuous reference planes and keep stubs shorter than 50 mils.
Estimated: At 1 GHz with all six cores active, the MSC8256SVT1000B draws approximately 10-12 W typical. The 783-FCBGA exposes the die through the top of the package, enabling direct-attached heatsink with thermal interface material. Provide at least 200 LFM of airflow across the heatsink to keep the junction below 105C in a standard telecom shelf environment.
The MSC8256SVT1000B requires multiple supply rails: 1.0V core, 1.5V DDR3 termination, 2.5V PLL, and 3.3V I/O. Sequence the rails per the NXP power-on-reset diagram with 1.0V coming up first and 3.3V last. Use a multi-phase PWM controller with inductor DCR sensing to meet the tight core-voltage tolerance (+/-3%) under load-transient events.
Informações de conformidade
Compliance status for RoHS/REACH/lead-free is not specified in the verified distributor listings. AEC-Q100 is not applicable to a multi-core DSP. Customers with EU or automotive compliance requirements should request the latest NXP material declaration documents directly.
