MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MPN: MSC8256ESAG1000B ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $270.75 | $2,707.50 |
| 100 | $245.5 | $24,550.00 |
| 500 | $219 | $109,500.00 |
| 1,000 | $198.75 | $198,750.00 |
MSC8256ESAG1000B Overview
A digital signal processor (DSP) is a specialized microprocessor whose architecture, instruction set, and on-chip memory hierarchy are optimized for the high-throughput, real-time numerical workloads found in signal processing. Unlike general-purpose CPUs or microcontrollers, DSPs expose dedicated execution units, zero-overhead looping, hardware saturation arithmetic, and tightly coupled DMA paths, and they sit in the broader category hierarchy of microprocessor -> embedded processor -> DSP -> multicore DSP. The MSC8256 occupies the multicore-DSP tier with six independent cores that share DDR and packet-processing infrastructure, designed for designs where a single-core DSP cannot meet throughput targets but a CPU is too power-hungry or lacks deterministic interrupt latency.
Key features include six 1 GHz SC3850 cores delivering up to 12 GMACs per core of fixed-point performance, hardware-accelerated TDM support with up to four independent links running at 62.5 Mbps each, glueless interface to E1/T1 framers and H-MVIP/H.110 devices, and an integrated SEC block for IPsec, SRTP, and SSL/TLS termination at line rate. The device also provides 1000BASE-T compatible Ethernet MACs with QoS-aware queue management that make it well-suited as a packet-plane engine.
The architecture combines an SC3850 Superscalar core variant that issues up to six operations per cycle with a MAPLE-B2P baseband accelerator, balanced interconnect, and a DDR2/3 controller with ECC to keep large memory footprints reliable in long-lifecycle industrial products. Software support includes NXP's SmartDSP OS, an Eclipse-based IDE, and reference frameworks for LTE PHY, voice-over-IP media gateways, and radar baseband.
Typical applications include high-density voice gateways, LTE small-cell base stations, industrial test and measurement instruments, defense and aerospace signal processing, and high-throughput medical imaging pipelines. The combination of SRIO and GbE lets the MSC8256 act as a DSP array node in a RapidIO backplane or as the compute plane in an Ethernet-attached cluster.
Designers should pay particular attention to PCB layout around the FC-PBGA. Use a 12-layer or thicker stack-up with matched-length impedance control for DDR3 traces, keep SRIO lanes within 0.15 mm tolerance, and provide a continuous ground-reference plane under the BGA balls to control return paths at GHz-edge frequencies.
This page synthesizes distributor pricing, lifecycle notes, and drop-in comparator information not found in the manufacturer datasheet, complementing the official NXP MSC8256 product documentation.
Drop-in alternatives for MSC8256ESAG1000B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MSC8256ESAG1000B (same form factor and footprint) — differing in Core Architecture, Package, Operating Temperature, Mounting Type, Number of Cores.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MSC8256ETAG1000B
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8251SVT1000B
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →DSPB56720AG
✅ Drop-In✓ In Stock
$20.1 / Unit
View Datasheet →MSC8256SAG1000B
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8256ESAG1000B Specifications
| Core Architecture | StarCore SC3850 VLIW DSP |
| Number of Cores | 6 |
| Core Frequency | 1 GHz |
| DDR Memory Interface | DDR2/DDR3 with ECC |
| Serial RapidIO | SRIO (peripheral) |
| PCI Express | PCIe (peripheral) |
| Gigabit Ethernet | GbE MACs (peripheral) |
| Security Engine | SEC (IPsec/SRTP/SSL) |
| Queue Engine | QE (peripheral) |
| Package | 783-FCPBGA (29x29 mm) |
| Mounting Type | Surface Mount, BGA |
| Operating Temperature | 0°C to 105°C |
| MSL Level | 3 |
| Peak Reflow Temperature | 245°C (JEDEC J-STD-020) |
| Terminal Finish | Tin Silver Copper (e1, JESD-609) |
| TDM Links | Up to 4 independent, 62.5 Mbps each |
| RoHS Status | Compliant |
MSC8256ESAG1000B 783-fcpbga (29x29 mm) Pin Configuration Guide
Pin configuration for MSC8256ESAG1000B (783-fcpbga (29x29 mm) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MSC8256ESAG1000B.
Refer to the datasheet for full pin configuration.
Typical Applications
MSC8256ESAG1000B is suitable for 7 applications: LTE Small-Cell Base Station PHY, Voice-over-IP Media Gateway, Defense Radar Baseband Processing, Industrial Test & Measurement Instrument, Medical Imaging Pipeline, High-Throughput Audio/Video Broadcast Encoder, Secure Industrial Router / Encryption Accelerator.
LTE Small-Cell Base Station PHY
The MSC8256ESAG1000B's six 1 GHz SC3850 cores provide up to 72 GMACs aggregate, sufficient to execute a 2x2 LTE PHY chain including FFT/iFFT, MIMO decoding, and CRC verification on a single chip. The integrated SRIO connects to an FPGA-based front-end radio while the SEC engine terminates the S1 backhaul with IPsec. DDR3 with ECC keeps the symbol buffer reliable across long industrial uptime. Per the NXP datasheet, the 783-FCPBGA's 0.8 mm ball pitch allows routing on a 12-layer PCB with matched-length SRIO lanes, ideal for outdoor small-cell enclosures.
Recommended
Voice-over-IP Media Gateway
Across the four TDM links the MSC8256ESAG1000B terminates up to four E1/T1 lines at 62.5 Mbps each, glueless to H-MVIP/H.110 framers, and converts them to RTP packets on the GbE port. The SEC block handles SRTP encryption for secure SIP trunks and the QoS-aware queue engine preserves voice timing. StarCore VLIW DSPs are engineered for the G.711, G.729, and Opus codecs, and the part supports the SmartDSP OS reference frameworks advertised in the NXP datasheet.
Recommended
Defense Radar Baseband Processing
A single MSC8256ESAG1000B platform sustains multi-channel pulse compression, moving-target-indication filtering, and FFT on radar return data thanks to the six 1 GHz SC3850 cores. The SRIO peripheral links the device to a backplane of identical nodes in a phased-array rack, while PCIe provides a path to the host mission computer. The 0-105°C industrial thermal class supports the ruggedized chassis baselines typical in ground and naval radar, and the SEC engine protects classified data on shared backplane links.
Recommended
Industrial Test & Measurement Instrument
The MSC8256ESAG1000B executes real-time signal generation and acquisition algorithms such as cross-correlation, spectral kurtosis, and digital down-conversion, all of which benefit from the SC3850 superscalar issue rate. Its GbE port streams measurement results to a host PC, while the DDR3 with ECC buffer stores multi-second waveform captures in long-life-cycle factory automation rigs. Lead-time constraints mean only stockpiled parts qualify for next-decade test platforms, so designers often pair this device with the MSC8251 quad-core for cost-engineered variants.
Recommended
Medical Imaging Pipeline
Ultrasound beamforming and MRI image reconstruction can be distributed across the six SC3850 cores, with the SEC engine protecting PHI flows over network interfaces. The PCI Express interface attaches a high-resolution ADC front-end, and the GbE port exports DICOM-compatible imagery to the clinical network. The 783-FCPBGA enables compact single-board medical carts, and the 0-105°C thermal range suits typical medical-image acquisition chassis.
Recommended
High-Throughput Audio/Video Broadcast Encoder
A single MSC8256ESAG1000B can run multiple HD video codecs concurrently because the SC3850 issue rate scales well with the data-parallel structure of H.264/AVC intra-frame prediction. The DDR3 bandwidth feeds reference frames at high motion search rates, while the GbE output streams encoded TS over IP. The SEC engine signs and encrypts premium content with SRTP/RTP, and the SRIO link aggregates multiple encoders into a single broadcast farm.
Recommended
Secure Industrial Router / Encryption Accelerator
The SEC engine in the MSC8256ESAG1000B accelerates IPsec and SSL/TLS at multi-gigabit line rate, making the device well-suited as a data-plane crypto engine on industrial routers tied to SCADA systems. Gigabit Ethernet provides redundancy-capable multi-port aggregation, and the QoS queue engine preserves the deterministic latency essential for closed-loop industrial control. The 0-105°C industrial temperature class and 783-FCPBGA footprint support fanless industrial rack-mount chassis.
Recommended
Recommended Products Summary
Engineering reference data for MSC8256ESAG1000B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MSC8256ETAG1000B | MSC8251SVT1000B | DSPB56720AG | MSC8256SAG1000B |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | BGA (DSP family) | 783-FCPBGA (29x29 mm) - same |
| Core Count | 6 | 6 | 4 | 4-6 | 6 |
| Core Frequency | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Memory Interface | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR3/DDR4 | DDR2/DDR3 with ECC |
| SEC Engine | Yes (IPsec/SRTP/SSL) | Yes | Yes | Yes (updated) | Yes |
| Operating Temperature | 0°C to 105°C | 0°C to 105°C | -40°C to 105°C | Industrial | 0°C to 105°C |
| Lifecycle / Stock Status | Last-time-buy (Rochester stocking) | Last-time-buy | Last-time-buy | Active production | Last-time-buy (Rochester) |
Key Differentiators
- Six SC3850 cores at 1 GHz in a single BGA (vs MSC8251SVT1000B)
- Last-time-buy availability through Rochester (vs DSPB56720AG)
- Industrial 'E' thermal designator qualified (vs MSC8256SAG1000B)
Design Notes
Estimated at 1 GHz StarCore core clock, the 783-ball FC-PBGA requires at least a 12-layer PCB stack-up with continuous ground planes under the BGA to control return-path impedance for DDR3 and SRIO. Match SRIO lane lengths within 0.15 mm and provide 100 Ω differential impedance, per the NXP hardware-design checklist, to avoid timing-margin losses.
Under full-core 6-core load the MSC8256ESAG1000B dissipation is estimated in the 5-8 W class based on the SC3850 family power figures. A heatsink with a thermal pad is recommended for enclosed industrial racks; mechanical airflow over 1 m/s keeps the junction below 105°C in the upper end of the industrial range.
Do not assume that the 'E' designator means industrial-extended (-40°C to 105°C); the MSC8256ESAG1000B datasheet specifies 0°C to 105°C only. Confirm the designator in your BOM against the planned operating envelope and stock a -40°C variant if the deployment is genuinely outdoor-facing.
Compliance Information
RoHS compliant per Partstack terminal-finish code e1 (SnAgCu). Reach and conflict-mineral data not specified in verified sources.
