MT28FW02GBBA1HPC-0AAT - 2Gb x16 3V Automotive NOR Flash | Micron Technology
N.º da peça: MT28FW02GBBA1HPC-0AAT ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MT28FW02GBBA1HPC-0AAT Visão geral
A parallel NOR flash is a nonvolatile memory category that performs read operations through a wide asynchronous interface rather than a serial protocol. Parallel NOR belongs to the flash-memory hierarchy, alongside NAND flash, but offers fast random reads and direct memory-mapped execution of stored code. MT28FW devices combine this deterministic read behavior with x16 data width, making them suitable for embedded platforms that need broad data paths and predictable firmware access.
Key features include a 2Gb density, x16 organization, 105 ns access time, 2.7 V to 3.6 V operating voltage, and an automotive temperature range of -40 C to +105 C. The device also supports ECC-related and security features identified in the family documentation, although exact feature-byte details should be confirmed against the manufacturer datasheet before implementation. The package is designed for surface-mount PCB assembly.
The MT28FW02GBBA1HPC-0AAT uses parallel NOR architecture rather than NAND's page-oriented interface. This difference matters for firmware designers because code can be mapped for rapid execution without the block-transfer overhead associated with managed NAND. The x16 bus reduces the number of connected data lines compared with x8 devices while retaining compatibility with systems designed around 16-bit memory buses.
Typical applications include automotive infotainment controllers, instrument clusters, telematics units, advanced driver-assistance controllers, gateway modules, engine controllers, and other embedded systems that require reliable nonvolatile storage. The 2Gb capacity is useful for larger boot images, diagnostic data, configuration records, and update images, while the -40 C to +105 C range supports automotive environmental requirements.
When laying out a board, follow the manufacturer's recommended ball assignments, power and ground distribution, and decoupling guidance. Place bypass capacitors close to the device supply connections and maintain controlled-impedance routing for the x16 data bus. Confirm signal integrity, timing margins, reset behavior, and programming/erase timing against the specific host processor before releasing a production layout.
This product page combines the verified manufacturer and distributor information with practical selection, layout, and procurement guidance. It is intended to help engineers distinguish the 2Gb MT28FW02G part from lower-density family members and to plan a qualified automotive flash design.
Alternativas drop-in para MT28FW02GBBA1HPC-0AAT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MT28FW02GBBA1LPC-0AAT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT28FW01GABA1HPC-0AAT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT28FW512ABA1LPC-0AAT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT28FW02GBBA1HPC-0AAT Classificações máximas e características elétricas
| Tipo de memória | NOR Flash |
| Memory Technology | SLC (Single-Level Cell) |
| Memory Density | 2 Gb |
| Organização da memória | x16 |
| Interface | Parallel |
| Access Time | 105 ns |
| Tensão de alimentação | 2.7 V to 3.6 V |
| Operating Modes | Program, erase, read |
| Internal Die Configuration | Two 1Gb stacked dies |
| Temperatura de operação | -40 C to +105 C |
| Encapsulamento | 64-LBGA |
| Package Dimensions | 11 mm x 13 mm |
| Tipo de montagem | Surface Mount |
| Product Family | MT28FW Automotive Parallel NOR |
| FBGA Code | RB175 |
| Chipset Validation | N/A |
| Product Longevity Program | No |
| AEC-Q100 Qualification | Automotive MT28FW family; qualification details not specified in supplied data |
Guia de Configuração de Pinos do MT28FW02GBBA1HPC-0AAT 11 mm x 13 mm
Configuração de pinos para MT28FW02GBBA1HPC-0AAT (pacote 11 mm x 13 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MT28FW02GBBA1HPC-0AAT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MT28FW02GBBA1HPC-0AAT é adequado para 6 aplicaçãos: Automotive Infotainment Controller, Automotive Telematics Unit, Instrument Cluster and Gateway Electronics, Advanced Driver-Assistance Controller, Engine and Chassis Control Unit, Industrial and Embedded Control System.
Automotive Infotainment Controller
The MT28FW02GBBA1HPC-0AAT fits infotainment controllers that need substantially more room for boot code, operating-system images, configuration data, and diagnostic logs than a small serial flash can provide. Its 2Gb density supports larger firmware sets while the x16 parallel interface allows memory-mapped code access on processors designed for a 16-bit external bus. The 105 ns access specification helps simplify timing design when the host uses wait states or a dedicated memory controller.
Recomendado
Automotive Telematics Unit
A telematics controller can use the MT28FW02GBBA1HPC-0AAT for application firmware, network configuration, event data, and update images. Its 2Gb capacity provides more storage than a 1Gb alternative while retaining a 2.7 V to 3.6 V operating range suitable for a 3 V embedded system. The -40 C to +105 C rating is relevant for in-vehicle temperature exposure, although the final design must verify system-level thermal and qualification requirements.
Recomendado
Instrument Cluster and Gateway Electronics
Instrument clusters and vehicle gateway modules often combine boot software, configuration data, calibration records, and event information. The 2Gb MT28FW02GBBA1HPC-0AAT provides room for multiple images and data partitions, while its parallel x16 architecture is useful when the host processor exposes a wide external memory interface. Engineers should route the bus carefully in the 64-LBGA footprint and confirm reset, erase, program, and power-sequencing behavior from the exact datasheet.
Recomendado
Advanced Driver-Assistance Controller
ADAS controllers may require high-density nonvolatile storage for boot code, application firmware, calibration data, and diagnostic information. The MT28FW02GBBA1HPC-0AAT's 2Gb capacity can reduce the need to split small firmware areas across multiple memories, while 105 ns access supports direct memory-mapped execution in suitable processor architectures. Because ADAS systems are safety-relevant, the designer should confirm reliability, qualification, and fault-handling requirements beyond the basic flash specifications.
Recomendado
Engine and Chassis Control Unit
Engine-control and chassis-control electronics can use the MT28FW02GBBA1HPC-0AAT for control firmware, calibration data, diagnostic records, and software update storage. Its 2Gb density allows larger images than lower-density members of the MT28FW family, while the parallel interface can reduce protocol overhead compared with serial flash. The -40 C to +105 C range makes it a candidate for harsh in-vehicle environments, subject to confirmation of the exact device qualification and application safety requirements.
Recomendado
Industrial and Embedded Control System
Although the MT28FW02GBBA1HPC-0AAT is identified as automotive parallel NOR, its 2Gb density, 3 V supply, and x16 interface can also suit embedded controllers needing larger nonvolatile firmware storage. The wide bus is beneficial when the host has a 16-bit memory port and can map firmware for rapid execution. The 11 x 13 mm 64-LBGA package still requires careful escape routing, thermal assessment, and signal-integrity validation outside the automotive temperature environment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MT28FW02GBBA1HPC-0AAT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MT28FW02GBBA1LPC-0AAT | MT28FW01GABA1HPC-0AAT | MT28FW512ABA1LPC-0AAT |
|---|---|---|---|---|
| Memory type | Parallel NOR Flash | Related MT28FW parallel NOR family | Parallel NOR Flash | Parallel NOR Flash |
| Memory density | 2Gb | 2Gb related family variant | 1Gb | 512Mb |
| Organization | x16 | x16 family variant | x16 | x16 |
| Supply voltage | 2.7 V to 3.6 V | 3 V family variant; exact range requires verification | 3 V family variant; exact range requires verification | 3 V family variant; exact range requires verification |
| Package | 64-LBGA, 11 mm x 13 mm | 64-LBGA family package; exact drawing requires verification | 64-LBGA family package; exact drawing requires verification | 64-LBGA family package; exact drawing requires verification |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Technology | SLC | MT28FW family; exact technology requires verification | MT28FW family; exact technology requires verification | MT28FW family; exact technology requires verification |
Principais diferenciais
- Higher storage density than lower-density MT28FW references (vs MT28FW01GABA1HPC-0AAT)
- Large capacity versus the 512Mb family option (vs MT28FW512ABA1LPC-0AAT)
- Wide x16 parallel interface (vs Serial NOR alternatives)
- Automotive-oriented temperature and product family (vs General-purpose commercial NOR memory)
Notas de projeto
Use the exact Micron 64-LBGA land pattern and ball map rather than a generic BGA footprint. Route the x16 data bus as a controlled-length or impedance-controlled group, minimize right-angle transitions, and provide adequate return paths beneath the package. Confirm address, data, control, reset, and configuration pins against the current datasheet before releasing the PCB.
Place the required bypass capacitors close to the MT28FW02GBBA1HPC-0AAT VCC and ground balls, following the manufacturer power-distribution recommendation. The device operates from 2.7 V to 3.6 V for read, program, and erase, so supply transients and voltage sequencing must remain within the datasheet limits. Do not assume that bulk capacitance alone can substitute for a clean power tree.
The 105 ns access specification must be evaluated together with host-processor timing, chip-enable control, board skew, and load capacitance. A memory-mapped design should include adequate wait-state control and verified reset behavior. Because parallel NOR has many simultaneous data lines, discontinuities and mismatched routing can create timing failures even when the nominal access-time value is acceptable.
Plan the memory map for boot code, application images, configuration data, diagnostics, and update staging before finalizing the software architecture. The 2Gb density provides more capacity than lower-density MT28FW alternatives, but it does not remove the need for erase-block management, wear leveling where required, power-fail recovery, and data-integrity checks in firmware. Use the manufacturer's programming and erase sequences exactly.
Informações de conformidade
The supplied results identify the part as an automotive MT28FW family device, but they do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Verify the latest manufacturer product documentation and declaration before procurement.
