MTFC4GACAJCN-4M IT - 32Gb eMMC NAND Flash 153-VFBGA | Micron
N.º da peça: MTFC4GACAJCN-4M IT ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.32 | $7,32 |
| 10 | $6.85 | $68,50 |
| 100 | $6.41 | $641,00 |
| 500 | $6.02 | $3.010,00 |
| 1.000 | $5.78 | $5.780,00 |
MTFC4GACAJCN-4M IT Visão geral
An eMMC (embedded MultiMediaCard) is a managed flash memory that combines raw NAND with a controller on the same die, exposing a standardized MMC interface rather than raw NAND timing. Within the storage hierarchy, eMMC sits between raw NAND and higher-level UFS/eMCP solutions, functioning as a block storage device that abstracts wear leveling, bad-block mapping, and ECC from the host processor. This makes it easier to integrate than raw NAND while remaining more cost-effective than UFS for mid-density storage in embedded systems.
Key features of this part include built-in wear leveling, bad-block management, ECC error correction, secure erase, and a hardware reset. The integrated MMC controller manages NAND-specific concerns internally, exposing only standard MMC commands to the host CPU. The 153-VFBGA package offers a compact 11.5 x 13 mm footprint with an industrial operating range suitable for factory automation, point-of-sale terminals, and industrial IoT gateways.
The architecture pairs Micron's 32 Gb L83A MLC NAND die with the company's MMC 5.0 controller IP, supporting HS200 and HS400 interface modes (per JEDEC/MMC 5.0). The host interface uses 1.8 V or 3.3 V signaling on VCCQ while the NAND core runs on 3.3 V VCC. This separation enables low-power host signaling while preserving noise immunity on the memory core supply.
Typical applications include industrial HMI panels, automotive infotainment booting media, IoT gateways, point-of-sale terminals, factory automation controllers, and Linux/Android embedded systems that need reliable managed flash with predictable performance. Designers should ensure the host SoC's MMC driver supports the JEDEC 5.0 HS200/HS400 modes to fully exploit the bus bandwidth.
The MTFC4GACAJCN-4M IT has been designated EOL by Micron under PCN32195, with the MTFC8GAKAJCN-4M IT recommended as the direct replacement. Engineers starting new layouts should consider the newer 8 GB J55U family unless exact 4 GB capacity matching is required for firmware compatibility.
This page synthesizes distributor pricing, EOL status, drop-in and replacement alternatives, and practical design notes that go beyond the raw datasheet.
Alternativas drop-in para MTFC4GACAJCN-4M IT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MTFC4GACAJCN-4M IT TR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MTFC8GAKAJCN-4M IT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MTFC4GMVEA-4M IT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MTFC4GMDEA-4M IT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
KLM4G1FE3B-B001
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MTFC4GACAJCN-4M IT Classificações máximas e características elétricas
| Tipo de memória | eMMC NAND Flash (Non-Volatile) |
| Tamanho da memória | 32 Gbit (4 GB) |
| Memory Organization | 4G x 8 |
| NAND Technology | MLC (L83A process) |
| NAND Configuration | 1 x NAND die |
| Controller Standard | JEDEC/MMC v5.0 |
| VCC (Core Supply) | 2.7 V to 3.6 V |
| VCCQ (I/O Supply, Dual Voltage) | 1.7 V to 1.95 V or 2.7 V to 3.6 V |
| Temperatura de operação | -40 °C to +85 °C (Industrial / TA) |
| Package Type | 153-ball VFBGA |
| Package Dimensions | 11.5 mm x 13 mm |
| Built-in Features | Wear leveling, bad-block management, ECC, secure erase, hardware reset |
| Interface | MMC (8-bit data, 1-bit/4-bit/8-bit bus) |
| RoHS Compliance | RoHS compliant (green package) |
| PCN Status | EOL - replaced by MTFC8GAKAJCN-4M IT |
Guia de Configuração de Pinos do MTFC4GACAJCN-4M IT 11.5 mm x 13 mm
Configuração de pinos para MTFC4GACAJCN-4M IT (pacote 11.5 mm x 13 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MTFC4GACAJCN-4M IT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MTFC4GACAJCN-4M IT é adequado para 6 aplicaçãos: Industrial HMI Touch Panels, Point-of-Sale Terminals, Industrial IoT Gateways, Factory Automation Controllers, Automotive Infotainment (Cabin) Boot Media, Linux/Android Embedded Boards.
Industrial HMI Touch Panels
The MTFC4GACAJCN-4M IT's 4 GB capacity and -40 °C to +85 °C industrial temperature range make it a strong fit for industrial human-machine-interface touch panels. It reliably stores the Linux/QT image, configuration data, and recipe files for factory-floor HMIs where a -40 °C cold-start in unheated enclosures is mandatory. The integrated MMC 5.0 controller exposes a simple block device, eliminating raw-NAND ECC and wear-leveling work in the host MCU, while the 153-VFBGA 11.5 x 13 mm footprint fits the compact back of a 5-10 inch panel PCB.
Recomendado
Point-of-Sale Terminals
POS terminals need reliable managed flash for the OS, transaction logs, and signature capture while operating in retail environments with wide temperature swings. This Micron part provides 4 GB of MMC 5.0 storage with built-in wear leveling and ECC, critical for write-heavy logging workloads. The secure-erase and hardware-reset features help with payment-data sanitization at end-of-life, while the 153-VFBGA package drops onto the small main board common in countertop POS hardware. Designers can boot the embedded OS directly from eMMC, leaving any SD card slot free for user media.
Recomendado
Industrial IoT Gateways
Industrial IoT gateways aggregate sensor data from Modbus, CAN, and Ethernet nodes and need persistent storage for buffering when backhaul links drop. The MTFC4GACAJCN-4M IT's 4 GB capacity stores weeks of buffered telemetry, while its industrial -40 °C to +85 °C rating tolerates outdoor and factory-cabinet environments. The MMC 5.0 interface runs HS200/HS400 modes, so gateways can stream high-rate sensor bursts without bus bottlenecks. The integrated bad-block management and ECC simplify firmware: the host gateway Linux kernel treats eMMC as a standard block device, with no NAND-specific drivers required.
Recomendado
Factory Automation Controllers
Factory automation PLCs and motion controllers run real-time operating systems that boot from managed flash and require deterministic storage latency. The MTFC4GACAJCN-4M IT's JEDEC/MMC 5.0 controller provides predictable read/write timing versus raw NAND, simplifying worst-case execution-time analysis. Its 153-VFBGA package and 11.5 x 13 mm dimensions fit the compact backplane of modular PLC racks, while the 2.7-3.6 V VCC matches industrial 3.3 V power rails. Dual-voltage VCCQ at 1.8 V or 3.3 V allows pairing with both legacy and modern host SoCs.
Recomendado
Automotive Infotainment (Cabin) Boot Media
In non-safety-critical cabin infotainment, the MTFC4GACAJCN-4M IT can boot Linux/Android IVI stacks while operating across automotive temperature swings in the dash. The -40 °C to +85 °C industrial grade handles cold-soak winter starts and hot-summer soak conditions for cabin-mounted head units. Note that AEC-Q100 qualification is NOT stated for this part; for under-hood or safety-critical ECUs, an AEC-Q100-qualified eMMC is required. The 4 GB capacity is appropriate for base-trim IVI systems without onboard navigation maps.
Recomendado
Linux/Android Embedded Boards
Single-board computers and embedded Linux modules frequently use the MTFC4GACAJCN-4M IT to boot a root filesystem and user data partition. With 4 GB of MMC 5.0 storage, designers can fit a slim Debian or Yocto image plus application data, while the host CPU treats the eMMC as a standard MMC block device. The 153-VFBGA footprint is reflow-compatible with standard lead-free SMT lines, and the part's industrial temperature window matches outdoor enclosure use cases. For projects requiring more headroom, the MTFC8GAKAJCN-4M IT successor doubles capacity without changing the footprint family.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MTFC4GACAJCN-4M IT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MTFC4GACAJCN-4M IT TR | MTFC8GAKAJCN-4M IT | MTFC4GMVEA-4M IT | MTFC4GMDEA-4M IT | KLM4G1FE3B-B001 |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Package | 153-VFBGA (11.5x13) | 153-VFBGA (11.5x13) - same | 153-VFBGA (11.5x13) - same | 153-VFBGA (11.5x13) - same | 153-VFBGA (11.5x13) - same | 153-VFBGA (11.5x13) - same |
| Memory Capacity | 32 Gbit (4 GB) | 32 Gbit (4 GB) | 64 Gbit (8 GB) | 32 Gbit (4 GB) | 32 Gbit (4 GB) | 32 Gbit (4 GB) |
| NAND Generation | L83A MLC | L83A MLC | L85B MLC (J55U) | L83A MLC | L83A MLC | Samsung MLC |
| MMC Standard | JEDEC/MMC 5.0 | JEDEC/MMC 5.0 | JEDEC/MMC 5.0 | JEDEC/MMC 5.0 | JEDEC/MMC 5.0 | JEDEC/MMC 4.5/5.0 |
| VCC Supply | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
Principais diferenciais
- Official Micron-documented EOL with named replacement (vs MTFC8GAKAJCN-4M IT)
- Dual-voltage VCCQ (1.8 V and 3.3 V) (vs KLM4G1FE3B-B001 (Samsung))
- Industrial temperature range with MMC 5.0 controller (vs MTFC4GMVEA-4M IT (alternate Micron 4 GB))
Notas de projeto
The 153-ball VFBGA package requires controlled-impedance PCB routing for the MMC clock (CLK) and 8-bit data bus (DAT0-DAT7). Use microvia stackups and match trace lengths within the timing budget defined by JEDEC/MMC 5.0 HS200/HS400 modes. Decouple VCC and VCCQ with 100 nF + 4.7 µF ceramic capacitors placed within 2 mm of the balls, and keep the BGA escape region on the top layer to minimize via stubs on the high-speed MMC signals.
Power sequencing: VCCQ may be applied before VCC or vice-versa per JEDEC/MMC 5.0, but the host must hold CLK low and CMD in tri-state until both rails are within spec. Brown-out detection on the host SoC is recommended to issue a hardware reset (RST_n) if VCC drops below 2.7 V, preventing corruption of the internal controller's mapping tables. The hardware-reset signal should be pulled up per datasheet and driven low only for at least 1 µs per the JEDEC reset timing.
Do not use this part in new long-life production designs without a migration plan: Micron PCN32195 marks the J54U 4 GB family EOL, so authorized stock will deplete. Plan a transition to the MTFC8GAKAJCN-4M IT 8 GB successor or an alternate 4 GB cross-brand part. Also note: this part is industrial-grade (-40 °C to +85 °C), NOT AEC-Q100 qualified - do not substitute into safety-critical automotive ECUs.
Place the 153-VFBGA on a layer that allows direct fan-out to inner signal layers via microvias. Keep VSS balls stitched together with a continuous ground plane on layer 2 to provide a low-inductance return path for the MMC bus. If the design uses HS400 mode (DDR at 200 MHz), match the CLK trace length to within ±0.5 mm of the DAT strobe length and route all signals over a continuous reference plane to avoid impedance discontinuities.
Informações de conformidade
RoHS-compliant green package confirmed by Micron datasheet excerpt. AEC-Q100 qualification is NOT stated for this part - industrial temperature only, not automotive safety-critical. REACH, halogen-free, and conflict-minerals status not directly stated in the verified web data.
