MX30LF4G18AC-XKS-T - 4Gbit 3V SLC NAND Flash BGA-63 | Macronix
N.º da peça: MX30LF4G18AC-XKS-T ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.35 | $43,50 |
| 100 | $3.75 | $375,00 |
| 500 | $3.25 | $1.625,00 |
| 1.000 | $2.85 | $2.850,00 |
MX30LF4G18AC-XKS-T Visão geral
An SLC (Single-Level Cell) NAND Flash is a non-volatile memory that stores one bit per cell, offering higher endurance, faster write speeds, and lower bit error rates than MLC/TLC NAND at the cost of lower density per die. SLC belongs to the broader NAND Flash family, which in turn is a subset of non-volatile memory technologies (Flash, EEPROM, FRAM, MRAM) used for code and data storage in embedded systems. SLC NAND's role in the memory hierarchy is to provide persistent, block-addressable storage between DRAM (volatile, fast) and serial NOR Flash (random-access, lower density), making it ideal for OS images, file systems, and data logging.
Key features of the MX30LF4G18AC-XKS-T include a wide 2.7 V to 3.6 V single-supply operating range, 4-bit ECC per 528 bytes for robust data integrity, 100K program/erase cycles endurance per block, and 10-year data retention. The device supports standard NAND commands (Read, Program, Erase, Status) plus ONFI-defined parameter page reads, easing firmware development. Internal data-move and copy-back operations accelerate block management without external bus traffic.
The architecture uses a two-plane structure with 64 pages of (2,048 + 64) bytes per plane, organized as two NAND strings of 32 series-connected cells. The 63-ball VFBGA footprint (9 x 11 mm) suits space-constrained designs, and the -XKS suffix denotes tape-and-reel packaging with an industrial/automotive +85C operating temperature grade. Designers should ensure 4-bit ECC is implemented in the host controller, as the device does not include an internal ECC engine.
Typical applications include automotive infotainment and telematics, industrial gateways, IoT edge nodes, point-of-sale terminals, and firmware boot media. In automotive dashboards the part stores navigation maps and OS images; in IoT gateways it logs sensor telemetry. Compared with SPI NOR Flash of similar density, this SLC NAND delivers higher capacity at lower cost-per-bit but requires block-level management and ECC, increasing firmware complexity. The -XKS-T suffix adds tape-and-reel packaging for high-volume SMT assembly lines.
When designing with this part, allocate one NAND controller pin set (ALE, CLE, WE#, RE#, CE#) and route I/O[7:0] as an 8-bit parallel bus. Place 0.1 uF decoupling near VCC balls and keep the 8-bit bus length-matched within 50 mils. The 4-bit ECC per 528 bytes must be generated by the host MCU/SoC; Macronix does not embed the ECC engine on this die.
Alternativas drop-in para MX30LF4G18AC-XKS-T — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MX30LF4G18AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF2G18AC-XKS-T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S34ML04G100
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF4G18AC-XKS-T Classificações máximas e características elétricas
| Tipo de memória | FLASH - NAND (SLC) |
| Tamanho da memória | 4 Gbit (512 M x 8) |
| Interface | Parallel x8 |
| Operating Voltage | 2.7 V to 3.6 V |
| Access Time | 20 ns (typical) |
| Page Size | 2,048 + 64 bytes (2,112 bytes total) |
| ECC Requirement | 4-bit per 512 bytes (host-implemented) |
| ONFI Compliance | ONFI 1.0 |
| Program/Erase Endurance | 100,000 cycles per block (typical) |
| Data Retention | 10 years (typical) |
| Encapsulamento | 63-ball VFBGA (9 x 11 mm) |
| Temperatura de operação | -40C to +85C (Automotive / Industrial grade) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Automotive Grade | Yes (+85C) |
Guia de Configuração de Pinos do MX30LF4G18AC-XKS-T 63-ball vfbga (9 x 11 mm)
Configuração de pinos para MX30LF4G18AC-XKS-T (pacote 63-ball vfbga (9 x 11 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MX30LF4G18AC-XKS-T.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MX30LF4G18AC-XKS-T é adequado para 7 aplicaçãos: Automotive Infotainment OS Storage, Industrial IoT Edge Gateway Data Logging, Point-of-Sale Terminal Receipt Storage, Set-Top Box Firmware and Channel Storage, Network Router Boot and Config Storage, Medical Device Patient Data Buffer, Surveillance NVR Local Recording.
Automotive Infotainment OS Storage
The MX30LF4G18AC-XKS-T's 4 Gbit density stores automotive infotainment OS images (Linux, Android Auto derivatives), navigation maps, and voice-prompt audio assets in head units and instrument clusters. Its automotive +85C qualification ensures reliable operation inside dashboards where ambient temperatures peak under direct sunlight. The 20 ns access time enables rapid boot of the infotainment subsystem within the 2-3 second cold-boot budget typical of modern vehicles. Compared with eMMC, this raw NAND part requires the host SoC to manage ECC and wear-leveling, but offers lower BOM cost at 4 Gbit densities.
Recomendado
Industrial IoT Edge Gateway Data Logging
Industrial IoT gateways use the MX30LF4G18AC-XKS-T as a high-endurance buffer for sensor telemetry, firmware update staging, and event logs before uplink transmission. Its 100K P/E cycle endurance per block supports years of continuous write workloads from Modbus, CAN, or Ethernet/IP data streams. The 3 V supply aligns with industrial 3.3 V rails, while the parallel x8 interface streams data into the gateway MCU faster than SPI Flash of similar density. Wear-leveling file systems like UBIFS maximize block utilization and overall lifetime.
Recomendado
Point-of-Sale Terminal Receipt Storage
POS terminals leverage the MX30LF4G18AC-XKS-T to store transaction logs, firmware, signature captures, and receipt images between network uploads. The 4 Gbit capacity holds tens of thousands of receipt records locally, supporting offline operation during network outages common in retail. The parallel interface delivers fast page reads when staff scan barcodes or print receipts, while SLC endurance withstands constant write traffic from continuous transaction streams.
Recomendado
Set-Top Box Firmware and Channel Storage
Set-top boxes (STBs) boot their Linux-based middleware from the MX30LF4G18AC-XKS-T and use spare capacity for channel guides, DVR recordings, and OTA staging areas. The 20 ns access time supports multi-stream MPEG decode by streaming compressed video manifests into the host SoC. The automotive +85C grade also suits outdoor STB enclosures where internal chassis temperatures can reach +75C during summer operation.
Recomendado
Network Router Boot and Config Storage
Enterprise routers and switches use the MX30LF4G18AC-XKS-T as the primary boot medium for NOS (Network Operating System) images plus backup configuration storage. The 4 Gbit density holds multiple NOS versions for A/B firmware upgrade schemes, plus persistent syslog buffers. The parallel x8 interface supports fast boot (sub-5-second) on power-on, critical for network equipment availability SLAs.
Recomendado
Medical Device Patient Data Buffer
Medical monitoring devices (patient monitors, infusion pumps, diagnostic carts) buffer patient waveforms, alarm logs, and device calibration data on the MX30LF4G18AC-XKS-T. SLC NAND's high endurance supports continuous 24/7 data logging typical in ICU monitors. The automotive-grade temperature rating also helps in equipment deployed in ambulances or mobile clinics with extreme thermal environments.
Recomendado
Surveillance NVR Local Recording
Network video recorders (NVRs) use the MX30LF4G18AC-XKS-T as edge storage for short-term video clips before cloud or central NVR upload. The 4 Gbit capacity holds hours of H.264/H.265 compressed video at sub-stream resolution. SLC endurance is critical when the camera continuously writes motion-triggered clips, supporting years of service without block wear-out.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MX30LF4G18AC-XKS-T — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MX30LF4G18AC-XKI | MX30LF2G18AC-XKS-T | S34ML04G100 |
|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Infineon (formerly Spansion) |
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) | 63-VFBGA |
| Density | 4 Gbit | 4 Gbit | 2 Gbit | 4 Gbit |
| Interface | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8/x16 |
| Operating Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| ECC Requirement | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit ECC, BCH compatible |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Endurance (P/E cycles) | 100,000 per block | 100,000 per block | 100,000 per block | 100,000 per block |
| Automotive Grade | Yes (+85C) | Industrial | Yes (+85C) | Industrial (AEC-Q100 variants available) |
Principais diferenciais
- Automotive +85C qualification in BGA package (vs MX30LF4G18AC-XKI)
- Cross-brand drop-in compatible via Macronix-validated AN0356V1 application note (vs Infineon S34ML04G100)
- SLC endurance (100K P/E) vs MLC/TLC alternatives (vs Generic MLC NAND of similar density)
Notas de projeto
The MX30LF4G18AC-XKS-T does NOT include an internal ECC engine - the host SoC must implement 4-bit BCH or Hamming ECC per 512 bytes. Forgetting this is the most common design error and leads to silent data corruption. Confirm your NAND controller datasheet supports 4-bit ECC at 528-byte sectors before selecting this part.
Route the 8-bit data bus I/O[7:0] as an 8-bit matched-impedance group with length matching within 50 mils to avoid setup/hold violations at the 20 ns access time. Place 0.1 uF decoupling capacitors within 100 mils of each VCC ball, and keep the WE#, RE#, and CE# traces short and away from switching power nodes. The 63-ball VFBGA requires microvia or via-in-pad PCB technology for reliable assembly.
The MX30LF4G18AC-XKS-T draws peak currents during PROGRAM and ERASE operations that can exceed 30 mA; decouple VCC with a bulk 4.7 uF ceramic plus the 0.1 uF high-frequency bypass. Voltage droop below 2.7 V during these operations causes PROGRAM/ERASE failure and partial block corruption. Verify your power supply transient response with a 100 mA step load.
While the part is rated +85C, sustained high-temperature operation accelerates NAND wear-out and shortens data retention. In enclosed automotive dashboards, consider adding thermal relief copper pours around the BGA and airflow paths. For under-hood applications exceeding +85C, use the Macronix MX30UF automotive 1.8V family instead.
Informações de conformidade
RoHS and REACH compliant per Macronix product page. AEC-Q100 formal certification not explicitly stated in public data; contact Macronix for Q100 grade letter if required. The +85C temperature rating and automotive designation in distributor listings suggest AEC-Q100 suitability, but no certificate number is published.
