MX30LF4G28AB - 4Gbit SLC NAND Flash, 3V Parallel | Macronix
N.º da peça: MX30LF4G28AB ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.42 | $34,20 |
| 100 | $2.98 | $298,00 |
| 500 | $2.61 | $1.305,00 |
| 1.000 | $2.34 | $2.340,00 |
| 3.000 | $2.05 | $6.150,00 |
MX30LF4G28AB Visão geral
SLC (Single-Level Cell) NAND Flash is a non-volatile memory technology that stores one bit per memory cell, providing higher endurance (typically 60,000 to 100,000 program/erase cycles), faster write throughput, and longer data retention than MLC or TLC NAND. SLC NAND sits in the hierarchy: NAND Flash -> non-volatile memory -> memory IC -> semiconductor. It is commonly used where reliability, deterministic write performance, and wide-temperature operation outweigh the bit-density advantages of MLC/TLC parts. The MX30LF4G28AB divides its array into two planes, with 64 pages of (2,048+112) bytes per page, providing a 2,160-byte on-chip data register for page read, program, and cache operations.
Key features include hardware data protection via the WP# pin, a Ready/Busy (R/B#) open-drain status output, ONFI-compliant unique ID read, and status register read. The page size of 2,048 bytes plus 112 bytes of spare area per page allows the host to apply ECC (typically BCH or Hamming) for bit-error correction without sacrificing user data capacity. The 48-TSOP-I package is backward-compatible with the 48-TSOP footprint used by many 2 Gb and 4 Gb parallel NAND parts, easing migration from older designs.
Typical applications include industrial routers and gateways, factory automation controllers, automotive infotainment and instrument clusters, set-top box boot/media storage, point-of-sale terminals, and IoT edge devices. The wide -40 C to +85 C industrial operating range and ONFI compliance make it a fit for designs that require predictable behavior across temperature and across vendor sourcing.
When designing with this device, allow margin for program/erase wear by implementing a wear-leveling algorithm and a robust ECC scheme (BCH-4 or stronger is recommended for 3x nm-class die). Decoupling: place a 0.1 uF and a 4.7 uF ceramic capacitor close to VCC/VCCQ, and route R/B# as an open-drain signal with a pull-up resistor to VCCQ to avoid in-rush current glitches.
This page synthesizes distributor pricing, drop-in and cross-brand equivalents documented in Macronix application notes AN0280V2 (vs Spansion S34ML04G200) and AN0281V2 (vs Spansion S34ML04G100), and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para MX30LF4G28AB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MX30LF4G28AC-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF2G28AB-TI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF4G28AB-XKI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S34ML04G100TF100
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S34ML04G200TFI00
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TC58NVG2S0FBAI4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MX30LF4G28AB Classificações máximas e características elétricas
| Tipo de memória | Non-volatile NAND Flash (SLC) |
| Density | 4 Gbit (512 M x 8) |
| Interface | Parallel asynchronous, 8-bit |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Page Size | 2,048 + 112 bytes (data + spare) |
| Plane Organization | 2 planes, 64 pages per string |
| Random Access Time | 20 ns (typical) |
| ONFI Compliance | ONFI 1.0 |
| Hardware Write Protect | WP# pin, active low |
| Ready/Busy Output | R/B# pin, open-drain |
| Status Register Read | Supported |
| Unique ID Read | Supported (ONFI) |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Encapsulamento | 48-pin TSOP-I (TI suffix) or 63-ball VFBGA (XKI suffix) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do MX30LF4G28AB
| Pino 1 | NC — Not connected |
| Pino 2 | NC — Not connected |
| Pino 3 | NC — Not connected |
| Pino 4 | NC — Not connected |
| Pino 5 | NC — Not connected |
| Pino 6 | NC — Not connected |
| Pino 7 | R/B# — Ready/Busy output, open-drain |
| Pino 8 | RE# — Read enable, active low |
| Pino 9 | CE# — Chip enable, active low |
| Pino 10 | NC — Not connected |
| Pino 11 | NC — Not connected |
| Pino 12 | VCC — Power supply (2.7 V to 3.6 V) |
| Pino 13 | VSS — Ground |
| Pino 14 | NC — Not connected |
| Pino 15 | NC — Not connected |
| Pino 16 | CLE — Command latch enable |
| Pino 17 | ALE — Address latch enable |
| Pino 18 | WE# — Write enable, active low |
| Pino 19 | WP# — Write protect, active low |
| Pino 20 | NC — Not connected |
| Pino 21 | NC — Not connected |
| Pino 22 | NC — Not connected |
| Pino 23 | NC — Not connected |
| Pino 24 | NC — Not connected |
| Pino 25 | NC — Not connected |
| Pino 26 | NC — Not connected |
| Pino 27 | NC — Not connected |
| Pino 28 | NC — Not connected |
| Pino 29 | I/O0 — Data input/output 0 |
| Pino 30 | I/O1 — Data input/output 1 |
| Pino 31 | I/O2 — Data input/output 2 |
| Pino 32 | I/O3 — Data input/output 3 |
| Pino 33 | VCCQ — I/O supply (2.7 V to 3.6 V) |
| Pino 34 | VSS — Ground |
| Pino 35 | I/O4 — Data input/output 4 |
| Pino 36 | I/O5 — Data input/output 5 |
| Pino 37 | I/O6 — Data input/output 6 |
| Pino 38 | I/O7 — Data input/output 7 |
| Pino 39 | NC — Not connected |
| Pino 40 | NC — Not connected |
| Pino 41 | NC — Not connected |
| Pino 42 | NC — Not connected |
| Pino 43 | NC — Not connected |
| Pino 44 | NC — Not connected |
| Pino 45 | NC — Not connected |
| Pino 46 | NC — Not connected |
| Pino 47 | NC — Not connected |
| Pino 48 | VSS — Ground |
Aplicações típicas
MX30LF4G28AB é adequado para 6 aplicaçãos: Industrial Router and Gateway Storage, Factory Automation and PLC Data Logging, Set-Top Box Boot and Media Storage, Point-of-Sale Terminal Transaction Storage, Automotive Infotainment Boot Storage, IoT Edge Gateway Data Buffering.
Industrial Router and Gateway Storage
The MX30LF4G28AB's 4 Gbit density and 48-TSOP-I package suit industrial routers and gateways that need reliable firmware and configuration storage across -40 C to +85 C. With ONFI 1.0 compliance and 20 ns access time, it pairs naturally with MIPS- or ARM-based SoCs that boot from parallel NAND, while SLC endurance handles daily log writes and configuration churn far better than MLC or TLC alternatives. Designers typically apply BCH-4 ECC across the 112-byte spare area per page to correct bit errors accumulated over the part's lifetime.
Recomendado
Factory Automation and PLC Data Logging
Factory PLCs and process controllers use the MX30LF4G28AB as non-volatile storage for recipe data, alarm logs, and trend history. SLC NAND's 60,000+ program/erase cycle endurance and 20 ns read latency tolerate continuous logging workloads, while the 48-TSOP-I footprint supports legacy PLC backplane layouts. The -40 C to +85 C industrial temperature rating covers cabinet and panel-mount environments without derating, and the WP# pin enables hardware write protection during firmware update windows.
Recomendado
Set-Top Box Boot and Media Storage
Set-top boxes use the MX30LF4G28AB to store bootloaders, OS images, and small media files where MLC/TLC density is overkill. The 20 ns tR enables fast SoC boot, and ONFI 1.0 command portability eases firmware porting across vendor sources. The 48-TSOP-I package is a standard drop-in for STB mainboards, and Macronix's mature 3 V SLC roadmap keeps the part in long-term production for consumer electronics life cycles that often span 7-10 years.
Recomendado
Point-of-Sale Terminal Transaction Storage
POS terminals store transaction logs, signature images, and firmware updates on the MX30LF4G28AB, where SLC endurance and 20 ns access time outclass consumer-grade MLC. The wide operating temperature range handles kitchen and outdoor kiosk environments, and the WP# pin supports regulatory write-once modes required for tamper-evident logs. ECC implementation in the host SoC protects against power-loss corruption common in unattended terminals.
Recomendado
Automotive Infotainment Boot Storage
The MX30LF4G28AB's industrial -40 C to +85 C rating suits automotive infotainment and instrument-cluster boot storage, where SLC reliability and predictable write behavior are valued. The 48-TSOP package drops onto legacy automotive PCB footprints, and the ONFI 1.0 standardized command set simplifies firmware validation. Designers should still prefer an AEC-Q100 qualified part for safety-critical clusters, but the MX30LF4G28AB is widely deployed in non-safety infotainment systems.
Recomendado
IoT Edge Gateway Data Buffering
IoT edge gateways use the MX30LF4G28AB to buffer sensor data before forwarding to the cloud, benefiting from 4 Gbit capacity, low 3 V power, and ONFI 1.0 portability. The 20 ns access time keeps latency low for time-sensitive telemetry, while the -40 C to +85 C range handles outdoor enclosures. The 48-TSOP and 63-VFBGA package options let designers trade PCB real estate for thermal and routing flexibility across gateway form factors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MX30LF4G28AB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MX30LF4G28AC-XKI | MX30LF2G28AB-TI | S34ML04G100TF100 | S34ML04G200TFI00 | TC58NVG2S0FBAI4 |
|---|---|---|---|---|---|---|
| Package | 48-TSOP-I / 63-VFBGA | 63-VFBGA (9x11) | 48-TSOP-I | 48-TSOP-I | 48-TSOP-I | 63-VFBGA |
| Brand | Macronix | Macronix | Macronix | Infineon (Spansion) | Infineon (Spansion) | Toshiba |
| Density | 4 Gbit | 4 Gbit | 2 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Random Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| SLC NAND Type | SLC | SLC | SLC | SLC | SLC | SLC |
Principais diferenciais
- Documented cross-compatibility with Spansion S34ML04G1/G2 (vs S34ML04G100TF100)
- Wider operating temperature than MX30UF family (vs MX30UF 1.8 V family)
- Higher density than 2 Gbit companion part (vs MX30LF2G28AB-TI)
Notas de projeto
Place a 0.1 uF and a 4.7 uF ceramic decoupling capacitor within 5 mm of the VCC and VCCQ pins. The R/B# pin is open-drain and requires a pull-up resistor (typically 10 kohm to VCCQ) to avoid false-busy glitches during power-up. Keep the CE#, RE#, and WE# traces short and length-matched to maintain timing margins at 20 ns access.
SLC NAND requires a robust ECC strategy (BCH-4 minimum for 3x nm-class die). Without ECC, raw bit error rates can corrupt boot images. Implement bad-block management by scanning the factory-marked bad-block table at first power-up and creating a runtime skip list. Avoid writing to the same block more than 60,000 times without wear-leveling.
The 8-bit I/O bus (I/O0-I/O7) should be routed with matched lengths and a 33 ohm series-termination resistor when the bus exceeds 50 mm. Place the WP# pin pull-up to VCCQ via 10 kohm and ensure firmware drives WP# high during read operations to avoid spurious write protection. The CLE and ALE signals should be held low during data read/write phases to prevent command/address misinterpretation.
Informações de conformidade
RoHS and REACH compliant per Macronix product page. NOT AEC-Q100 qualified - use AEC-Q100 qualified 3 V SLC NAND for automotive safety-critical designs. Lead-free and halogen-free per Macronix declaration.
