P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP
N.º da peça: P1013NXN2LFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.2 | $48,20 |
| 10 | $43.1 | $431,00 |
| 100 | $38.55 | $3.855,00 |
| 500 | $35.2 | $17.600,00 |
| 1.000 | $32.85 | $32.850,00 |
P1013NXN2LFB Visão geral
QorIQ P1 series SoCs belong to the Power Architecture (PowerPC) family of integrated communications processors, sitting in the taxonomy: QorIQ P1022 -> Power Architecture SoC -> communications processor -> microprocessor -> integrated circuit. The e500v2 core executes the Power ISA with double-precision FPU, MMU, and a 32 KB instruction / 32 KB data L1 cache per core, plus a coherent 256 KB L2 platform cache.
Key features include a 64-bit DDR2/DDR3 memory controller with ECC, three 10/100/1000 Ethernet MACs (two via SGMII/HS SerDes, one RGMII), two PCI Express Gen 1.1 controllers (x4/x1), one USB 2.0 with PHY, an enhanced local bus, eSDHC, eSPI, I2C, UARTs, and an LCD controller. The device is built on a 45 nm SOI process with low-power idle, dynamic frequency switching, and deep-sleep modes for fan-less embedded systems.
Typical applications include industrial control and factory automation, secure networking appliances, IP gateways, LTE/small-cell baseband, smart-grid gateways, networked printers, and automotive telematics/ECUs. The wide temperature range and ECC memory make P1013NXN2LFB especially suited to harsh-environment and long-life industrial designs.
When designing with P1013NXN2LFB, follow NXP hardware-reference-manual layout guidelines: place the DDR3 channel as close as possible with matched trace lengths, and provide adequate bulk decoupling on the 1.0 V core and 1.5 V/1.8 V/2.5 V/3.3 V I/O rails. Use JTAG/cOP boundary-scan for first-board bring-up.
This page synthesizes distributor pricing, drop-in alternatives from the same NXP QorIQ P1/P1022 family, and practical board-design notes that complement the official NXP hardware reference manual.
Alternativas drop-in para P1013NXN2LFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1013NXN2LFB (mesmo formato e footprint) — diferindo em Memory Controller, USB, Core Architecture, Ethernet MACs, L2 Cache.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1022NXN2LFB
✅ Drop-In✓ Em estoque
$78.4 / unidade
Ver ficha técnica →P1012NSN2LFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1013NSN2LFB
✅ Drop-In✓ Em estoque
$53.2 / unidade
Ver ficha técnica →P1011NXN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1022NSN2LFB
✅ Drop-In✓ Em estoque
$71.2 / unidade
Ver ficha técnica →P2020NXE2MMB
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
P1013NXN2LFB Classificações máximas e características elétricas
| Family | QorIQ P1022 (P1 series) |
| Core Architecture | 32-bit Power Architecture e500v2 |
| Number of Cores | 1 |
| Core Frequency | 1.067 GHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB platform cache |
| Memory Controller | DDR2/DDR3 with ECC, 64-bit data bus |
| Ethernet MACs | 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII) |
| PCI Express | 2 x PCIe Gen 1.1 (x4 / x1) |
| USB | 1 x USB 2.0 with integrated PHY |
| Other Interfaces | eSDHC, eSPI, I2C, UART, eLBC, LCD controller |
| Encapsulamento | 689-ball TEPBGA II (31 mm x 31 mm) |
| Temperatura de operação | -40C to +125C (junction) |
| Process | 45 nm SOI |
| Tensão de alimentação | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Security | SEC 4.0 (optional crypto accelerator) on die variant |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free ball finish) |
Guia de Configuração de Pinos do P1013NXN2LFB 689-ball tepbga ii (31 mm x 31 mm)
Configuração de pinos para P1013NXN2LFB (pacote 689-ball tepbga ii (31 mm x 31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1013NXN2LFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1013NXN2LFB é adequado para 7 aplicaçãos: Industrial IoT Gateway, Network Attached Storage Controller, Automotive Telematics ECU, Smart Grid Energy Gateway, Small-Cell LTE Baseband, Networked Multifunction Printer, Secure VPN/Router Appliance.
Industrial IoT Gateway
The P1013NXN2LFB fits industrial IoT gateways because it integrates three Gigabit Ethernet MACs (two SGMII via High-Speed SerDes, one RGMII) directly, eliminating an external PHY/switch stack and shrinking the BOM. Running the single e500v2 core at up to 1.067 GHz with Linux + openWRT gives the headroom to aggregate Modbus/TCP, BACnet, OPC UA, and MQTT southbound, while forwarding northbound over GbE/PCIe with hardware crypto for TLS. The 64-bit DDR2/DDR3 controller with ECC protects against soft-bit-induced crashes in 24x7 factory deployments. Combined with the -40C to +125C junction rating and industrial EMC tolerance, the part suits DIN-rail or wall-mount cabinets without active cooling.
Recomendado
Network Attached Storage Controller
The P1013NXN2LFB is a drop-in controller for small/medium NAS appliances because the e500v2 cores plus on-die eSDHC boot and eSPI peripherals eliminate an extra microcontroller for housekeeping, while the dual PCIe Gen 1.1 ports host a SATA RAID HBA or a 10 GbE NIC. Its integrated SEC 4.0 crypto block accelerates AES-256-GCM at line rate, an essential feature for encrypted SMB/iSCSI throughput without offloading to a discrete accelerator. The ECC memory controller catches bitflips that would otherwise corrupt ZFS/Btrfs parity, which is the leading cause of silent data corruption in NAS arrays. Board designers can drive four to eight SATA SSDs directly over the PCIe-to-SATA bridge for cost-effective 4-bay chassis.
Recomendado
Automotive Telematics ECU
The P1013NXN2LFB is well matched to automotive telematics and V2X ECUs because it is rated for -40C to +125C junction operation, supports ECC memory for transient-bit-flip robustness, and integrates three independent GbE MACs that can host a vehicle camera network, a cellular modem link, and an automotive Ethernet switch port simultaneously. The Power Architecture e500v2 core is autosar-friendly and supported by long-life-class NXP drivers, while the SEC engine accelerates TLS/DTLS for secure OTA updates. The PCI Express Gen 1.1 port provides a high-bandwidth pipe to an LTE-Advanced or 5G modem SoC, and the on-chip LCD controller can drive an in-cabin display without a graphics coprocessor.
Recomendado
Smart Grid Energy Gateway
The P1013NXN2LFB is a natural fit for smart-grid energy gateways and IEC 61850 substations because its 1.067 GHz single e500v2 core provides deterministic latency under IEC 61850 GOOSE/SV streams, while the ECC memory controller meets NERC-CIP reliability requirements. The three Gigabit Ethernet ports split roles: one to the protection-network bus, one to the metering LAN, and one to the SCADA north-bound WAN, all sharing the on-chip SEC engine for MACsec/IPsec. Industrial -40C to +125C operation tolerates substation cabinet temperature swings, and the low-power idle modes lower BTU dissipation in battery-buffered cabinets.
Recomendado
Small-Cell LTE Baseband
The P1013NXN2LFB serves as baseband for enterprise/indoor LTE small cells because the e500v2 core can run L1 PHY and L2/MAC protocols at 1.067 GHz while the dual PCIe Gen 1.1 ports each link to a separate radio transceiver card. The integrated USB 2.0 with PHY streamlines backhaul connectivity via a 4G/5G modem dongle for smaller picocell designs. Hardware SEC accelerates Kasumi/SNOW-3G confidentiality for LTE crypto, and the wide-temperature rating suits outdoor-enclosure deployments. The eSDHC/eLBC combination supports a removable configuration card for operator provisioning.
Recomendado
Networked Multifunction Printer
The P1013NXN2LFB drives networked multifunction printers because it integrates the Ethernet, USB, eSDHC, and LCD controller that an MFP needs without an external SCB. A 1 GHz-class core is sufficient for 30-40 ppm monochrome rendering, JPEG rasterization, and TLS-secured IPP at line rate. The LCD controller drives the 4-7 inch operator panel directly, and the ECC memory controller catches bit-flip-induced PCL corruption, a known reliability issue in long-duty-cycle office equipment. The eSPI controller manages a Wi-Fi companion module for wireless office printing.
Recomendado
Secure VPN/Router Appliance
The P1013NXN2LFB is right for SMB VPN/router appliances because the on-die SEC 4.0 engine accelerates IPSec AES-GCM and SHA-2 at multi-gigabit rates while the e500v2 core handles routing/QoS and Linux VPN daemons. Three Gigabit Ethernet MACs support WAN + LAN + DMZ or a hardware failover pair without an external switch. The DDR2/DDR3 with ECC protects the routing table against soft errors, and the -40C to +125C junction rating suits outdoor or industrial cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1013NXN2LFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1022NXN2LFB | P1012NSN2LFB | P1013NSN2LFB | P1011NXN2HFB | P1022NSN2LFB |
|---|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same-brand | NXP Semiconductors - same-brand | NXP Semiconductors - same-brand | NXP Semiconductors - same-brand | NXP Semiconductors - same-brand |
| Core Architecture | e500v2 | e500v2 | e500v2 | e500v2 | e500v2 | e500v2 |
| Number of Cores | 1 | 2 | 1 | 1 | 1 | 2 |
| Core Frequency (max) | 1.067 GHz | 1.0 GHz | 0.8 GHz | 1.067 GHz | 0.8 GHz | 1.0 GHz |
| SEC Crypto Engine | Yes (SEC 4.0 enabled) | Yes (SEC 4.0 enabled) | No | No | Yes (SEC 4.0 enabled) | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Single-core QorIQ P1022 family with SEC 4.0 enabled (vs P1022NSN2LFB)
- Highest core-frequency tier in the single-core P1 family (vs P1012NSN2LFB)
- Lower power than dual-core P1022 in single-thread workloads (vs P1022NXN2LFB)
- Same BGA footprint across the entire QorIQ P10x family (vs P1011NXN2HFB)
Notas de projeto
Estimated: at a reference SoC power of about 3 W at 1.067 GHz full load with all three GbE ports active, you can typically run P1013NXN2LFB on a 4-layer board with the inner ground plane unbroken under the BGA, but the design MUST follow the NXP hardware reference manual for the DDR3 routing. Use matched trace lengths (within 25 mil) on DDR3 byte lanes, place VTT decoupling within 200 mil of each DDR3 chip, and keep the two SerDes lanes length-matched to 5 mil with 100-ohm differential impedance.
The P1013NXN2LFB requires a sequenced multi-rail tree: 3.3 V first, then 1.5/1.8 V DDR I/O, then 1.0 V core. Power sequencing errors are the leading cause of 689-ball BGA field failures; use a power-supply sequencer IC (e.g. UCD9090 or TPS65310) and add per-rail bulk capacitance of 47 uF polymer plus 0.1 uF/1 uF/10 uF ceramic. Verify with the NXP power-up/reset timing diagram in the hardware reference manual - the PORESET signal must remain asserted until all rails are stable for at least 32 core cycles.
Estimated: the VTEPbga-31x31 has a typical theta-JA of about 12 C/W on a 4-layer JEDEC test board (theta-JB about 6 C/W). At 3 W total power, junction-to-ambient rise is roughly 36 C, so 8-layer boards can keep Tj well below 125 C without a heatsink for indoor industrial designs. Outdoor cabinets over 60 C ambient need a metal-shield frame or clip-on heatsink plus thermal interface material, especially at the maximum 1.067 GHz core speed grade.
Do not assume 'pin-compatible' implies software-compatible. The P1010/P1013/P1022 family share footprint but boot ROM contents differ, so a U-Boot image built for a P1013 may fail on a P1022 in field-service replacement without retooling. Verify the board's SYS_REBOOT signal, JTAG cOP/CodeWarrior setup, and SerDes protocol selection (SGMII vs PCIe) via the RCW (reset configuration word) before swap. Also: do not mix the P1022NXN2LFB into a board tuned for single-core cooling - dual core increases power dissipation about 70% under sustained load.
For automotive/industrial EMC compliance (CISPR 25 / EN 55011), place a ferrite bead on each GbE PHY analog supply (1.0 V) and use spread-spectrum clocking on the DDR3 reference clock to suppress 5 dBuV radiated emission peaks at the DDR3 clock harmonic. The P1013NXN2LFB SerDes outputs require 100-ohm differential microstrip on the inner PCB layer; do not route at the surface, where EMI radiates 10-15 dB higher.
Informações de conformidade
Per NXP product environmental data, P1013NXN2LFB is RoHS compliant and uses Pb-free ball finish. REACH SVHC status is reported compliant; halogen-free status is not explicitly listed - treat as unknown. The part is published as last-time-buy per the NXP EOL notice page; AEC-Q100 qualification is not stated. Per Vyrian product record, the temperature grade is industrial/automotive -40C to +125C junction.
