P1022NXN2HFB - QorIQ P1 Dual-Core e500v2 SoC | NXP
N.º da peça: P1022NXN2HFB ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.4 | $6.440,00 |
| 500 | $58.1 | $29.050,00 |
| 1.000 | $52.65 | $52.650,00 |
P1022NXN2HFB Visão geral
A microprocessor (MPU) is an integrated processing subsystem that executes software instruction streams and orchestrates system peripherals. The QorIQ P1 tier sits within NXP's Power Architecture-based communications processor family, targeting IP networking, industrial control, and advanced media processing workloads where deterministic performance, ECC memory support, and integrated GbE/PCIe/USB connectivity simplify board design and reduce BOM.
Key features of the P1022NXN2HFB include dual e500v2 cores with integrated L1/L2 caches, hardware ECC support for DDR2/DDR3 memories, three Gigabit Ethernet interfaces, multiple PCIe lanes, USB 2.0, an LCD controller for HMI, and a security engine. The device supports both DDR2 and DDR3 with ECC, addresses industrial-grade reliability requirements, and integrates DPAA-friendly acceleration blocks for packet inspection and crypto offload.
Architecturally, the P1022NXN2HFB is built on a Power Architecture e500v2 core complex with a coherent fabric connecting the cores, memory controllers, and high-speed serial I/O. This design delivers application processing performance with simultaneous line-rate packet handling, eliminating the need for separate control-plane and data-plane processors in many embedded networking designs.
Typical applications include industrial gateways and routers, factory automation controllers, networked HMI panels, smart-grid energy management, and secure edge appliances. The integrated peripherals reduce external chip count, while the extended temperature range enables deployment in harsh industrial environments.
When designing with this MPU, allocate sufficient PCB area for the 31x31 mm TEPBGA II package, follow NXP's reference design for power decoupling and DDR routing, and verify that your firmware targets the e500v2 instruction set. The device is non-trivial to bring up; use NXP's BSP and SDK to accelerate software development.
This page consolidates distributor pricing, lifecycle status, drop-in reference variants, and practical design guidance sourced from the NXP product page and authorized distributor inventories, going beyond the bare datasheet content alone.
Alternativas drop-in para P1022NXN2HFB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com P1022NXN2HFB (mesmo formato e footprint) — diferindo em USB, Operating Temperature, Memory Controller, RoHS Status, Security Engine.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
P1022NXN2LFB
✅ Drop-In✓ Em estoque
$78.4 / unidade
Ver ficha técnica →P1022NXE2HFB
✅ Drop-In✓ Em estoque
$34.9 / unidade
Ver ficha técnica →P1017NXN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P2020NXE2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
T1024NXN2HFB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
P1022NXN2HFB Classificações máximas e características elétricas
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Largura do barramento de dados | 32-bit |
| Maximum Core Frequency | 1055 MHz |
| Temperatura de operação | -40C to +125C |
| Encapsulamento / Caixa | 689-TEPBGA II (31x31 mm) |
| Tipo de montagem | Surface Mount |
| Tipo de memória | DDR2/DDR3 with ECC support |
| Ethernet | 3x 10/100/1000 Mbps (eTSEC) |
| PCIe | PCIe lanes (integrated) |
| USB | USB 2.0 integrated |
| Display Interface | Integrated LCD controller |
| Status RoHS | Refer to NXP product page |
| Lifecycle | End of Life / Discontinuance announced (per NXP) |
Guia de Configuração de Pinos do P1022NXN2HFB 689-tepbga ii (31x31 mm)
Configuração de pinos para P1022NXN2HFB (pacote 689-tepbga ii (31x31 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para P1022NXN2HFB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
P1022NXN2HFB é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, Networking Router / Edge Appliance, Industrial HMI Panel Controller, Factory Automation PLC, Smart-Grid Energy Gateway, Networked Print and Imaging Appliance.
Industrial Ethernet Gateway
The P1022NXN2HFB's three integrated eTSEC Gigabit Ethernet controllers, DDR2/DDR3 ECC memory controller, and dual e500v2 cores make it ideal for protocol-converting industrial gateways bridging Modbus, PROFINET, or EtherNet/IP traffic to cloud backhaul. The SoC handles line-rate packet parsing on one core while the second core runs the application logic, eliminating an external switch. With -40C to +125C operation and a 689-TEPBGA II footprint, it survives factory floors and outdoor enclosures. Expected throughput exceeds 1.5 Mpps at 64-byte packets while sustaining deterministic sub-millisecond latency, suitable for SCADA aggregation nodes.
Recomendado
Networking Router / Edge Appliance
The QorIQ P1022 series was purpose-built for branch-office and edge routers. The P1022NXN2HFB integrates GbE, PCIe, USB 2.0, and a security engine in one package, reducing BOM and board area in branch router designs. Power consumption is modest (estimated 3-6 W) and the integrated ECC memory controller keeps SOHO and SMB edge devices resilient against soft errors over 5-7 year deployment lifetimes. The dual-core e500v2 complex runs a BSD/Linux networking stack with packet offload support; typical SKUs ship with NXP SDK and Yocto BSP support.
Recomendado
Industrial HMI Panel Controller
With the integrated LCD controller (DIU) plus dual e500v2 cores, the P1022NXN2HFB directly drives a TFT LCD panel and simultaneously runs the HMI application stack, eliminating a separate MCU. The DDR2/DDR3 interface supports the bandwidth needed for XGA-resolution animations, while the PCIe lane enables connection to a graphics coprocessor or capture card if higher pixel rates are required. The 689-TEPBGA II package gives both the I/O density and thermal headroom needed for sealed IP65 panels mounted on the factory wall.
Recomendado
Factory Automation PLC
The P1022NXN2HFB's deterministic e500v2 cores with hardware ECC and the integrated industrial temperature grade address PLC needs for predictable interrupt latency and field-deployed reliability. The SoC aggregates PROFINET, EtherCAT, or Modbus TCP traffic, runs IEC 61131-3 logic on one core, and hosts a web-based diagnostics dashboard on the second. The PCIe interface enables expansion to add motion-control cards or high-speed analog I/O modules. Designed-in lifecycle up to 10+ years suits legacy factory line sustainment programs.
Recomendado
Smart-Grid Energy Gateway
Designed for substation edge monitoring and demand-response gateways, the P1022NXN2HFB delivers the security, ECC memory, and extended temperature range required for utility-grade hardware. Dual cores run the secure DLMS/COSEM protocol stack on one core while the other handles metering/aggregation. The hardware crypto block accelerates AES, SHA, and RSA used in smart-grid authentication. The 689-TEPBGA II 31x31 mm footprint fits a sealed fanless enclosure with conformal coating for outdoor deployments.
Recomendado
Networked Print and Imaging Appliance
The P1022NXN2HFB combines the CPU headroom to drive a print engine and image processing pipeline (RIP) with networking for cloud-managed print queues. The USB 2.0 interface connects to fingerprint/authentication modules, the LCD DIU drives the panel, and the three GbE ports enable dual-segment networking (LAN + WAN) on a single chip. ECC DRAM keeps long-running image buffers reliable over multi-shift operation in production-printing environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para P1022NXN2HFB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | P1022NXN2LFB | P1022NXE2HFB | P1017NXN2HFB | P2020NXE2HFB |
|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II - same | 689-TEPBGA II (31x31) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 (dual-core, 32-bit) | PowerPC e500v2 (dual-core, 32-bit) | PowerPC e500v2 (dual-core, 32-bit) | PowerPC e500v2 (single-core, 32-bit) | PowerPC e500v2 (dual-core, 32-bit) |
| Memory Interface | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet Ports | 3 (eTSEC) | 3 (eTSEC) | 3 (eTSEC) | 3 (eTSEC) | 3 (eTSEC) + SERDES |
| LCD Controller | Integrated (DIU) | Integrated (DIU) | Integrated (DIU) | Integrated (DIU) | Integrated (DIU) |
| Lifecycle Status | End of Life / Last Time Buy | End of Life | End of Life | End of Life | Active/Last Time Buy (verify) |
Principais diferenciais
- Three integrated GbE controllers (vs P1017NXN2HFB)
- Extended industrial temperature -40C to +125C (vs P2020NXE2HFB)
- DDR2/DDR3 with hardware ECC controller (vs P1017NXN2HFB)
- Pin-compatible QorIQ P1 family (vs P2020NXE2HFB)
Notas de projeto
The 689-TEPBGA II package requires an 8-10 layer PCB with microvia or via-in-pad technology for the breakout, controlled-impedance routing for DDR2/DDR3 and SERDES lanes, and impedance-matched PCIe traces (85 ohm differential). Decoupling must include a minimum of 14 x 0.1 uF + 10 x 1 uF + 4 x 10 uF bulk capacitors placed around the BGA perimeter. A solid ground plane beneath the BGA is mandatory, and antipads around via-in-pad must be back-drilled on high-speed pins. Follow NXP's reference design and Altium/Cadence layout files for the P1022DS reference development board.
Estimated: at typical 1.05 GHz dual-core activity, junction-to-ambient thermal resistance of a 689-TEPBGA II on a 4-layer PCB is approximately 8-10 C/W; an operating dissipation of 5 W would result in an 40-50 C junction temperature rise above ambient. Place a thermally conductive pad or foam pad between the BGA top surface and the enclosure, or mount a 15x15 mm metal heat spreader. Verify Tj stays below 125 C under worst-case ambient for industrial enclosures.
Common bring-up issues with the P1022NXN2HFB include incorrect DDR2/DDR3 ZQ calibration, wrong RCW (Reset Configuration Word) values for SERDES lanes, and POR sequencing problems when the supply rails come up in the wrong order. Verify the RCW matches your board configuration before first power-up, follow the NXP hardware initialization guide, and always use the latest uBoot and SDK to avoid known errata. ESD handling precautions are mandatory for a 689-ball BGA on the production line.
Estimated: power supply design for the P1022NXN2HFB requires a multi-rail PMIC supplying VDD, VDD_A, VDD_DDR, VDD_PLB, and PLL rails with proper sequencing; use NXP's recommended VRM solution or compatible PMIC such as a TPS65251 or PF0200. Include power-good output to the MPU reset inputs and design for inrush current of 3-5 A at cold-start. A surge-protected industrial 24 V input stage should feed the PMIC if you target factory environments.
Informações de conformidade
This part is in End of Life per NXP product page. Confirm RoHS, REACH, lead-free, and material-declaration status directly with NXP because legacy components may predate some regulatory requirements.
