PC28F256P33TFE - 256Mb Parallel NOR Flash, 95ns, 64-LBGA | Micron
N.º da peça: PC28F256P33TFE ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.65 | $765,00 |
| 500 | $6.4 | $3.200,00 |
| 1.000 | $5.2 | $5.200,00 |
PC28F256P33TFE Visão geral
A NOR Flash (Not-OR gate Flash) is a non-volatile memory technology that provides random read access at byte/word granularity and executes-in-place (XIP) directly from the array, distinguishing it from NAND Flash which requires block-level access and external ECC management. NOR Flash belongs to the hierarchy: NOR Flash -> non-volatile memory -> semiconductor memory -> integrated circuit. It is commonly used as boot ROM, firmware storage, and parameter backup where reliability and deterministic read latency outweigh cost-per-bit.
Key features of the PC28F256P33TFE include top-boot block architecture, asynchronous and synchronous burst read modes, hardware write protection, and a deep power-down mode for battery-powered designs. The device provides 100K endurance cycles per sector and a 20-year data retention rating. Operating temperature spans -40C to +85C, qualifying it for industrial-grade embedded systems. The 64-ball EasyBGA package offers a small 11x13 mm footprint compatible with high-density PCB layouts.
The PC28F256 family uses a 16-bit data bus and a multiplexed address/data interface. The top-boot configuration places the parameter and boot sectors at the lowest addresses, simplifying bootloader mapping in many embedded architectures. Synchronous burst reads deliver up to 52 MHz, enabling fast shadowing and execute-in-place performance comparable to older pSRAM.
Typical applications include networking routers and switches, industrial PLCs and HMI controllers, automotive infotainment, medical instrumentation, set-top box firmware storage, and aerospace embedded controllers. In these systems the PC28F256P33TFE stores the operating system, configuration tables, and device firmware that must survive power cycles without reloading from external media.
When designing with this part, derate the junction temperature using a 1 oz copper pour under the BGA, observe the 100 ms maximum erase and 4 s program timings for sector updates, and follow the JEDEC JESD22-A114 moisture sensitivity level handling. The original Micron part has been transferred to Alliance Memory, which now produces it as a long-term supply drop-in.
This page synthesizes distributor pricing, parametric cross-references, and practical design notes for engineers evaluating the PC28F256P33TFE for both new designs and legacy board refresh cycles.
Alternativas drop-in para PC28F256P33TFE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PC28F256P33TFE
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →PC28F256P33BFE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PC28F256P33TFA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PC28F256P33TFE Classificações máximas e características elétricas
| Tipo de memória | FLASH - NOR (MLC), non-volatile |
| Tamanho da memória | 256 Mbit (16M x 16) |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel CFI (Common Flash Interface) |
| Clock Frequency (Synchronous) | 52 MHz |
| Access Time | 95 ns |
| Supply Voltage (VCC) | 2.3 V to 3.6 V |
| Temperatura de operação | -40C to +85C (TA) |
| Boot Sector Configuration | Top Boot |
| Tipo de montagem | Surface Mount (SMT) |
| Encapsulamento / Caixa | 64-LBGA EasyBGA (11x13 mm) |
| Sector Endurance | 100,000 erase/program cycles per sector (typical) |
| Data Retention | 20 years (typical) |
| Status RoHS | Compliant |
| Sector Architecture | Uniform 64-Kword sectors, top-boot |
Guia de Configuração de Pinos do PC28F256P33TFE 64-lbga easybga (11x13 mm)
Configuração de pinos para PC28F256P33TFE (pacote 64-lbga easybga (11x13 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PC28F256P33TFE.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PC28F256P33TFE é adequado para 7 aplicaçãos: Industrial PLC Firmware Storage, Networking Router/Switch Firmware, Automotive Infotainment System, Set-Top Box Firmware and Conditional Access, Medical Instrumentation Data Logger, Aerospace Embedded Controller, HMI Touch Panel Controller.
Industrial PLC Firmware Storage
The PC28F256P33TFE stores ladder-logic firmware and runtime parameters in industrial PLCs. Its 256-Mbit capacity (16M x 16) accommodates the operating system plus diagnostic logs, while the 95 ns initial access time supports deterministic scan-cycle timing. The -40C to +85C industrial temperature range covers factory-floor cabinets and outdoor control enclosures. Top-boot sector architecture simplifies the PLC bootloader layout, allowing the device to act as the only boot source on the controller board.
Recomendado
Networking Router/Switch Firmware
Embedded routers and Layer-2/3 switches use the PC28F256P33TFE to hold the network operating system, routing tables, and configuration. The 52 MHz synchronous burst interface accelerates firmware shadowing into DDR SDRAM at boot, while the 16-bit data bus matches typical network processor interfaces. Hardware write protection pins let the design lock the boot sector against accidental reprogramming. The EasyBGA package supports high-density multilayer PCB layouts required for managed switches.
Recomendado
Automotive Infotainment System
Non-safety automotive infotainment head units can use the PC28F256P33TFE for OS image and navigation map storage. Its 256-Mbit capacity covers Linux/Android boot images and resource bundles, while the 52 MHz burst read delivers rapid boot times required by automotive UX expectations. Designers should validate AEC-Q100 status for any safety-relevant subsystem; the PC28F256P33TFE itself is suitable for non-safety body and infotainment ECUs. Top-boot sector simplifies the head-unit boot chain.
Recomendado
Set-Top Box Firmware and Conditional Access
Set-top boxes store bootloader, demodulator firmware, and conditional-access keys in the PC28F256P33TFE. The 256-Mbit density supports full middleware images, while hardware write protection secures the CA key sector against unauthorized writes. The 2.3 V to 3.6 V supply range operates directly from typical STB power rails, and the EasyBGA package fits the compact mainboard form factor. Synchronous burst reads accelerate channel-change times by quickly loading UI resources.
Recomendado
Medical Instrumentation Data Logger
Patient monitoring and diagnostic instruments use the PC28F256P33TFE for firmware and patient-data logging. Its 20-year data retention ensures long-term log integrity, while the 100K sector endurance tolerates frequent parameter updates. The 95 ns read latency allows deterministic display refresh, and the -40C to +85C range covers clinical and laboratory environments. EasyBGA packaging supports miniaturized portable designs such as handheld ultrasound and bedside monitors.
Recomendado
Aerospace Embedded Controller
Avionics subsystems and UAV flight controllers use the PC28F256P33TFE to store mission firmware and flight parameters. The industrial -40C to +85C range covers most airborne compartments, and the top-boot sector simplifies DO-178 boot chains. Designers should review lot-conformance and counterfeit-mitigation procedures (per SAE AS5553) when sourcing through non-authorized distributors, since legacy NOR Flash supply chains frequently attract counterfeit activity. EasyBGA package supports vibration-resistant PCB layouts.
Recomendado
HMI Touch Panel Controller
Industrial HMI panels use the PC28F256P33TFE for graphic assets, localization tables, and PLC ladder storage. The 256-Mbit capacity holds full multilingual UI resources plus firmware updates, while the 52 MHz burst read accelerates screen-load transitions. Hardware WP pins allow field engineers to lock critical boot sectors against accidental overwrite. Top-boot architecture places the bootloader at the lowest address for predictable cold-start behavior across panel generations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PC28F256P33TFE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PC28F256P33TFE | PC28F256P33BFE | PC28F256P33TFA | S29GL256S90TFI010 |
|---|---|---|---|---|---|
| Brand | Micron Technology | Alliance Memory | Micron Technology | Micron Technology | Infineon |
| Package | 64-LBGA EasyBGA (11x13 mm) | 64-LBGA EasyBGA (11x13 mm) | 64-LBGA EasyBGA (8x10 mm) | 64-LBGA EasyBGA (11x13 mm) | 56-TSOP (not drop-in) |
| Density | 256 Mbit (16M x 16) | 256 Mbit (16M x 16) | 256 Mbit (16M x 16) | 256 Mbit (16M x 16) | 256 Mbit |
| Access Time | 95 ns | 95 ns | 95 ns | 95 ns (approx) | 90 ns |
| Synchronous Burst Clock | 52 MHz | 52 MHz | 52 MHz | 52 MHz | Async only - different interface |
| Supply Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Boot Sector | Top Boot | Top Boot | Top Boot | Top Boot | Uniform (different layout) |
| Lifecycle Status | NRND (Micron) / Active (Alliance Memory) | Active (long-term supply) | Obsolete | Obsolete | Active |
Principais diferenciais
- Long-term production support through Alliance Memory acquisition (vs S29GL256S90TFI010)
- Synchronous burst read at 52 MHz with CFI compliance (vs S29GL256S90TFI010)
- Top-boot sector architecture for simplified boot chains (vs S29GL256S90TFI010)
Notas de projeto
The PC28F256P33TFE draws higher peak current during program and erase operations than during read. Per Micron guidance, decouple VCC with a 0.1 uF ceramic capacitor placed within 5 mm of the supply ball, plus a bulk 4.7 uF tantalum or polymer cap on the same rail. Read-mode current is typically in the low-tens-of-mA range, but program/erase surges can spike higher; ensure the upstream regulator has sufficient transient headroom.
EasyBGA packages require a 4-layer PCB minimum with continuous ground plane under the array for signal integrity and thermal dissipation. Route the 16-bit data bus and address bus with matched lengths (delta < 50 mil for the low-byte group, < 100 mil for address) to avoid setup/hold violations at the 52 MHz synchronous burst clock. Add stitched ground vias around the BGA perimeter to suppress EMI on the WAIT and clock pins.
Do not write to the boot sector without first clearing the appropriate WP# lock bits - accidental writes will brick the system. Verify the top-boot sector address mapping against the Micron datasheet before firmware bring-up; off-by-one errors in the parameter sector address are a frequent cause of boot failures. Also confirm VPP is tied to VCC or left NC per datasheet, never driven externally, unless full-voltage erase acceleration is required.
The EasyBGA-64 package exposes the silicon die through thermal vias; design the PCB land pattern with a 4x4 via array under the die paddle, stitching to the inner ground plane. Although read-mode power dissipation is modest, sustained program/erase operations can elevate junction temperature; for continuous write-heavy workloads, monitor temperature and reduce write throughput if TJ exceeds 100C.
Informações de conformidade
RoHS and REACH compliant per Micron/Alliance Memory declarations. Lead-free EasyBGA-64 package supports reflow up to 260C per JEDEC J-STD-020. Not AEC-Q100 qualified; for safety-critical automotive systems, select an AEC-Q100 qualified NOR Flash instead.
