PIC16F777-I/ML - 14KB Flash, 14x10-bit ADC 8-bit MCU | Microchip
N.º da peça: PIC16F777-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.61 | $76,10 |
| 100 | $6.85 | $685,00 |
| 500 | $6.12 | $3.060,00 |
| 1.000 | $5.48 | $5.480,00 |
PIC16F777-I/ML Visão geral
What is a flash-based 8-bit PIC microcontroller? It is a single-chip computer that combines a CPU, non-volatile flash program memory, SRAM, EEPROM, and configurable peripherals on one die. Within Microchip's portfolio, the PIC16F family sits between the baseline PIC10/12/16 and the high-performance PIC18/dsPIC families, offering an enhanced mid-range 14-bit instruction set with nanoWatt Technology dynamic power management. The PIC16F777 occupies the upper end of this family - the highest pin count (in 40/44-pin variants) and the largest memory mix - making it a natural choice for systems that need more I/O and peripherals than a 28-pin PIC16F73/76 can deliver.
The defining features are its 14-channel 10-bit ADC, 36 I/O lines (PIC16F747/777 only - the PIC16F737/767 28-pin parts expose fewer), dual analog comparators, and nanoWatt Technology that drops I_DD below 1 µA in sleep. Internal 8 MHz oscillator accuracy is factory calibrated to within ±1 %, and an optional 31 kHz LFINTOSC plus software PLL lets the system wake, process, and return to sleep with very low average current. The PIC16F777 also has 256 bytes of internal EEPROM for non-volatile data.
Typical applications include industrial sensor hubs with 4-20 mA or 0-10 V analog front-ends, HVAC and appliance control boards, BLDC/PMSM low-speed fan or pump controllers, automotive body and accessory ECUs, and home-automation gateways. Its five CCP/ECCP channels and dual analog comparators enable mixed-signal feedback control without external logic. The industrial temperature grade plus wide supply range makes it suitable for both indoor consumer devices and rugged industrial enclosures.
When designing with the PIC16F777-I/ML, budget VQFN PCB real estate for the exposed thermal pad and route the supply pins (VDD/VSS pairs) with a star or grid topology to keep ADC noise low. For 10-bit ADC accuracy, follow Microchip application note AN546 (PCB layout for PICmicro MCUs) and keep analog and digital ground domains separated under a single-point tie at the VSS pins. Verify ISP timing against the PIC16F777 programming specification (DS39025) if you use AC244061 in-circuit debug headers. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC16F777-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F777-I/ML (mesmo formato e footprint) — diferindo em Package, I/O Pins, Core Architecture, Power-Saving Modes, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F777-E/ML
✅ Drop-In✓ Em estoque
$5.21 / unidade
Ver ficha técnica →PIC16F777-I/PT
✅ Drop-In✓ Em estoque
$5.75 / unidade
Ver ficha técnica →PIC16F767-I/ML
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →PIC16F747-I/ML
✅ Drop-In✓ Em estoque
$3.65 / unidade
Ver ficha técnica →PIC16F877A-I/ML
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →PIC16F777-I/ML Classificações máximas e características elétricas
| Family | PIC 16F |
| Core | 8-bit enhanced mid-range PIC16 |
| Program Memory Size | 14 KB (8K x 14) flash |
| RAM Size | 368 bytes |
| EEPROM Size | 256 bytes |
| Maximum CPU Frequency | 20 MHz |
| Supply Voltage Range | 2.0 V to 5.5 V |
| Faixa de temperatura de operação | -40 C to +85 C (industrial grade) |
| I/O Pins | 36 (PIC16F747/777, 40/44-pin) |
| ADC | 14 channels x 10-bit |
| Timers | 3 (Timer0/Timer1/Timer2) |
| CCP/ECCP Modules | 3 (2 CCP + 1 ECCP) |
| Analog Comparators | 2 |
| Serial Interfaces | Enhanced USART + MSSP (SPI/I2C) |
| Internal Oscillator | 8 MHz LFINTOSC, factory calibrated ±1% |
| Power-Saving Modes | nanoWatt Technology (sleep, low-power modes) |
| Encapsulamento | 44-pin VQFN (8x8 mm) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do PIC16F777-I/ML
| Pino 1 | VDD — Positive supply voltage (2.0 V to 5.5 V) |
| Pino 2 | OSC1/CLKI/RA7 — Crystal/clock input or digital I/O |
| Pino 3 | OSC2/CLKO/RA6 — Crystal/clock output or digital I/O |
| Pino 4 | RC0/T1OSO/T1CKI — Digital I/O, Timer1 oscillator output |
| Pino 5 | RC1/T1OSI/CCP2 — Digital I/O, Timer1 oscillator input, CCP2 output |
| Pino 6 | RC2/CCP1 — Digital I/O, CCP1 output |
| Pino 7 | RC3/SCK/SCL — Digital I/O, SPI clock, I2C clock |
| Pino 8 | RC4/SDI/SDA — Digital I/O, SPI data in, I2C data |
| Pino 9 | RC5/SDO — Digital I/O, SPI data out |
| Pino 10 | RC6/TX/CK — Digital I/O, USART TX, USART clock |
| Pino 11 | RC7/RX/DT — Digital I/O, USART RX, USART data |
| Pino 12 | VSS — Ground reference |
| Pino 13 | VSS — Ground reference (second bond pad) |
| Pino 14 | RB0/INT0/FLT0 — Digital I/O, external interrupt 0, ECCP fault input |
| Pino 15 | RB1/INT1 — Digital I/O, external interrupt 1 |
| Pino 16 | RB2/INT2 — Digital I/O, external interrupt 2 |
| Pino 17 | RB3/CCP2 — Digital I/O, CCP2 alternate pin |
| Pino 18 | RB4 — Digital I/O, interrupt-on-change |
| Pino 19 | RB5 — Digital I/O, interrupt-on-change |
| Pino 20 | RB6/PGC — Digital I/O, in-circuit debugger clock |
| Pino 21 | RB7/PGD — Digital I/O, in-circuit debugger data |
| Pino 22 | MCLR/VPP/RE3 — Reset, programming high voltage, or digital I/O |
| Pino 23 | RA0/AN0 — Digital I/O, ADC input 0 |
| Pino 24 | RA1/AN1 — Digital I/O, ADC input 1 |
| Pino 25 | RA2/AN2/VREF- — Digital I/O, ADC input 2, ADC reference negative |
| Pino 26 | RA3/AN3/VREF+ — Digital I/O, ADC input 3, ADC reference positive |
| Pino 27 | RA4/T0CKI/C1OUT — Digital I/O, Timer0 clock, Comparator 1 output |
| Pino 28 | RA5/AN4/SS/C2OUT — Digital I/O, ADC input 4, SPI slave select, Comparator 2 output |
| Pino 29 | RE0/RD/AN5 — Digital I/O, parallel port read, ADC input 5 |
| Pino 30 | RE1/WR/AN6 — Digital I/O, parallel port write, ADC input 6 |
| Pino 31 | RE2/CS/AN7 — Digital I/O, parallel port chip select, ADC input 7 |
| Pino 32 | RD0/PSP0/C1IN+ — Parallel port data, Comparator 1 positive input |
| Pino 33 | RD1/PSP1/C1IN- — Parallel port data, Comparator 1 negative input |
| Pino 34 | RD2/PSP2/C2IN+ — Parallel port data, Comparator 2 positive input |
| Pino 35 | RD3/PSP3/C2IN- — Parallel port data, Comparator 2 negative input |
| Pino 36 | RD4/PSP4 — Parallel port data |
| Pino 37 | RD5/PSP5/AN11 — Parallel port data, ADC input 11 |
| Pino 38 | RD6/PSP6/AN12 — Parallel port data, ADC input 12 |
| Pino 39 | RD7/PSP7/AN13 — Parallel port data, ADC input 13 |
| Pino 40 | VSS — Ground reference (third bond pad) |
| Pino 41 | VDD — Positive supply (second bond pad) |
| Pino 42 | NC — Not connected (per datasheet) |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | NC — Not connected (per datasheet) |
Aplicações típicas
PIC16F777-I/ML é adequado para 6 aplicaçãos: Industrial Sensor Hub, HVAC and Appliance Control, BLDC and PMSM Fan/Pump Controller, Home-Automation Gateway, Automotive Body and Accessory ECU, Battery-Operated Portable Measurement.
Industrial Sensor Hub
The PIC16F777's 14 channels of 10-bit ADC and 36 I/O pins make it a strong fit for industrial multi-sensor hubs that aggregate 4-20 mA loops, 0-10 V signals, and digital inputs into a single Modbus-RTU node. The -I industrial temperature grade (-40 to +85 °C) supports control cabinets and outdoor enclosures. Place the PIC16F777 with 10 µF and 100 nF decoupling caps adjacent to VDD/VSS pairs, separate analog and digital ground domains, and tie VSS to a star ground at the VQFN exposed pad for ADC accuracy.
Recomendado
HVAC and Appliance Control
Residential and commercial HVAC control boards benefit from the PIC16F777's combination of nanoWatt sleep current, three CCP/ECCP modules for triac and PWM motor drive, and dual analog comparators for zero-cross detection. The wide 2.0 to 5.5 V supply simplifies integration with 3.3 V sensor front-ends and 5 V relay drivers. Use one ECCP channel for the compressor PWM, one CCP for fan speed, and one analog comparator for line-voltage zero-cross detection.
Recomendado
BLDC and PMSM Fan/Pump Controller
Sensorless BLDC and PMSM controllers for low- to medium-power fans and pumps leverage the PIC16F777's three CCP/ECCP modules, 14 ADC channels for back-EMF sensing, and dual comparators for zero-cross detection. The 20 MHz core provides the bandwidth needed for commutation loops up to a few hundred Hz electrical, while the 14 KB flash supports commutation tables and PI controller code. Add the PIC16F777 in the VQFN-44 package with discrete gate drivers to drive the inverter stage.
Recomendado
Home-Automation Gateway
Home-automation gateways aggregate Zigbee/Wi-Fi/BLE links and local I/O. The PIC16F777 provides 36 I/O for local keypads, LCDs, and relay arrays, plus MSSP (SPI/I2C) and Enhanced USART for talking to wireless modules. The 14 ADC channels monitor battery voltage, light sensors, and analog thermostats directly. The nanoWatt sleep mode lets the gateway idle below 1 µA between sensor polls.
Recomendado
Automotive Body and Accessory ECU
Automotive body and accessory ECUs (lighting controllers, seat modules, mirror controllers) use the PIC16F777 for its 36 I/O, 14 ADC channels for current sensing, and PWM capability for LED dimming. The extended-temperature PIC16F777-E/ML variant is rated -40 to +125 °C and AEC-Q100 qualified for underhood and chassis use. Use the -E grade for AEC-Q100 applications, the -I grade for interior modules.
Recomendado
Battery-Operated Portable Measurement
Handheld multimeters, portable gas detectors, and field measurement tools use the PIC16F777-I/ML for its 14 ADC channels, 256-byte EEPROM for calibration constants, and sub-1 µA nanoWatt sleep current. The wide 2.0-5.5 V supply runs directly from two AA cells. Route the LCD driver via I2C with an external PCF8576, and use the Enhanced USART for diagnostic UART.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F777-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F777-E/ML | PIC16F777-I/PT | PIC16F767-I/ML | PIC16F747-I/ML | PIC16F877A-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-44 (8x8 mm) | VQFN-44 - same | TQFP-44 - same pin count | VQFN-44 - same | VQFN-44 - same | VQFN-44 - same |
| Program Flash | 14 KB | 14 KB | 14 KB | 14 KB | 7 KB (-50 %) | 14 KB |
| RAM | 368 bytes | 368 bytes | 368 bytes | 368 bytes | 368 bytes | 368 bytes |
| ADC Channels | 14 x 10-bit | 14 x 10-bit | 14 x 10-bit | 11 x 10-bit (-21 %) | 14 x 10-bit | 8 x 10-bit (-43 %) |
| I/O Pins | 36 | 36 | 36 | 28 (-22 %) | 36 | 36 |
| Max CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +125 C (extended) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| CCP Modules | 2 CCP + 1 ECCP | 2 CCP + 1 ECCP | 2 CCP + 1 ECCP | 2 CCP + 1 ECCP | 2 CCP + 1 ECCP | 1 CCP + 1 ECCP |
| AEC-Q100 Grade | Not qualified | Not qualified (extended temp only) | Not qualified | Not qualified | Not qualified | Not qualified |
Principais diferenciais
- Highest ADC channel count in the PIC16F7xx family (vs PIC16F767-I/ML)
- 2x program memory versus the PIC16F747 (vs PIC16F747-I/ML)
- 2 analog comparators (most PIC16F7xx lack them) (vs PIC16F877A-I/ML)
- Same VQFN-44 footprint as the 28-pin PIC16F767 (vs PIC16F767-I/ML)
- Industrial -40 to +85 °C operating range as standard (vs PIC16F777-E/ML)
Notas de projeto
Estimated: The PIC16F777-I/ML VQFN package has an exposed thermal pad on the underside that MUST be soldered to the PCB ground plane for electrical and thermal performance. Use a 6×6 to 8×8 thermal via array (0.3 mm drill, 0.6 mm pitch) connecting the pad to the inner ground plane. Without the ground solder, the VQFN may exhibit ADC noise and reduced thermal dissipation. Keep the analog and digital ground domains separated under a single-point tie at the VSS pins per Microchip application note AN546.
Place 100 nF X7R decoupling capacitors within 2 mm of each VDD/VSS pair (the PIC16F777 has multiple VDD/VSS bond pads on a 40/44-pin die). Add a 10 µF bulk capacitor near the chip entry point. For ADC accuracy, isolate the AVDD reference path with a ferrite bead and dedicate a quiet VREF+ filter capacitor. The PIC16F777 nanoWatt Technology sleep current is below 1 µA but the I/O leakage can exceed 1 µA - configure unused I/O as outputs low to minimize leakage.
Route the analog ADC inputs with a ground shield (guard trace tied to analog ground) to prevent digital coupling from adjacent I/O. Keep the MCLR trace short; add a 10 kΩ pull-up and a 100 nF cap for in-circuit debugging. The ICSP clock and data lines (RB6/PGC, RB7/PGD) must be accessible via test pads; do not route them through series resistors in production layout - Microchip ICD uses these for handshaking during programming.
Configuration word programming is critical: an incorrect oscillator selection (e.g., LP instead of HS for a 20 MHz crystal) prevents startup. Watchdog timer must be disabled in software if not needed, or enabled with the correct postscaler - undefined WDT behavior is a common field-failure root cause. Brown-out reset voltage must be configured to match the supply (4.0 V for 5 V systems, 2.1 V for 3.3 V systems). Read the configuration bits carefully before code lock to avoid bricking the device.
Estimated: The PIC16F777-I/ML VQFN has θ_JA of approximately 35 C/W on a 4-layer JEDEC test board. At full 20 MHz and 5 V operation, the active supply current is ~10 mA, dissipating 50 mW - a 1.75 °C junction rise that is well within thermal limits. Worst-case (all peripherals active, 5.5 V, 20 MHz) may reach 15 mA or 82 mW. The exposed pad is critical for thermal relief - without it, θ_JA can rise above 80 C/W. No heatsink is required in normal operation.
Informações de conformidade
RoHS compliant per Microchip product page. The -I suffix indicates industrial temperature grade (not AEC-Q100 qualified); use the PIC16F777-E/ML for AEC-Q100 extended-temperature designs. Lead-free VQFN package rated MSL-3 per JEDEC J-STD-020.
