PIC16F819-I/ML - 8-Bit MCU 3.5KB Flash 20MHz QFN-28 | Microchip
N.º da peça: PIC16F819-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.05 | $3,05 |
| 10 | $2.84 | $28,40 |
| 100 | $2.42 | $242,00 |
| 500 | $2.18 | $1.090,00 |
| 1.000 | $1.92 | $1.920,00 |
PIC16F819-I/ML Visão geral
An 8-bit Flash microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile Flash program memory, RAM, EEPROM data memory, and a rich set of peripherals (timers, ADC, communication ports) onto one silicon die. The PIC16F family sits within the broader PIC microcontroller hierarchy: PIC16F -> PIC16 mid-range -> 8-bit PIC -> Microcontroller -> Embedded IC -> Semiconductor. These devices are widely used in cost-sensitive embedded designs where deterministic performance, low power, and small package footprint are critical.
Key features include a 10-bit Analog-to-Digital Converter (ADC) with 5 input channels, a synchronous serial port configurable as SPI or I2C, a Capture/Compare/PWM (CCP) module, an 8MHz internal oscillator, and nanoWatt power management. The QFN-28 (ML) package provides 16 digital I/O pins and a small 6x6 mm footprint with an exposed pad for improved thermal dissipation. Operating voltage spans 2.0V to 5.5V, supporting both 3.3V and 5V systems.
The architecture uses a 14-bit instruction word with 35 single-word instructions, achieving 200ns instruction execution at 20MHz. The Harvard architecture separates program and data memory buses, allowing simultaneous fetch and access. The nanoWatt Technology features include sleep current below 1µA, ultra-low-power wake-up, and multiple oscillator modes for energy-constrained designs.
Typical applications include consumer electronics, sensor signal conditioning, battery-powered handheld devices, LED lighting controllers, and low-cost industrial control nodes. The integrated ADC and PWM make it well suited for closed-loop sensor control, while the I2C/SPI port enables peripheral expansion.
When designing with this device, ensure proper decoupling (100nF plus 10µF bulk) near VDD, and connect the exposed pad of the QFN package to a ground copper pour for thermal and electrical performance. The internal oscillator eliminates external crystal components in many applications.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, with cross-references to same-family variants and pin-compatible drop-in replacements.
Alternativas drop-in para PIC16F819-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16F819-I/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Architecture, Internal Oscillator, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F88-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F819-I/PTSL
✅ Drop-In✓ Em estoque
$1.78 / unidade
Ver ficha técnica →PIC16LF819-I/ML
✅ Drop-In✓ Em estoque
$1.94 / unidade
Ver ficha técnica →PIC16F18855-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.38 / unidade
Ver ficha técnica →PIC16F18446-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC16F819-I/ML Classificações máximas e características elétricas
| Core Architecture | PIC 8-bit (14-bit instruction word, Harvard) |
| CPU Speed | 20 MHz |
| Instruction Execution Time | 200 ns at 20 MHz |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| Data Memory (SRAM) | 256 bytes |
| Data EEPROM | 256 bytes |
| I/O Pins | 16 |
| ADC | 10-bit, 5 channels |
| Serial Communication | SPI / I2C (MSSP module) |
| PWM/CCP Modules | 1 (Capture/Compare/PWM) |
| Timers | 3 (Timer0, Timer1, Timer2) |
| Internal Oscillator | 8 MHz (calibrated) |
| Tensão de alimentação | 2.0 V to 5.5 V |
| Operating Temperature (Industrial) | -40C to +85C |
| Encapsulamento | 28-pin QFN (ML) 6x6 mm with exposed thermal pad |
| Power-Saving Technology | nanoWatt Technology |
| Instruction Set | 35 single-word instructions |
Configuração de pinos do PIC16F819-I/ML
| Pino 1 | RA0/AN0 — PORTA bit 0 / Analog input 0 |
| Pino 2 | RA1/AN1 — PORTA bit 1 / Analog input 1 |
| Pino 3 | RA2/AN2/CVREF — PORTA bit 2 / Analog input 2 / CVREF output |
| Pino 4 | RA3/AN3/VREF+ — PORTA bit 3 / Analog input 3 / VREF+ input |
| Pino 5 | RA4/AN4/T0CKI — PORTA bit 4 / Analog input 4 / Timer0 clock input |
| Pino 6 | RA5/SS/AN4 — PORTA bit 5 / SPI Slave Select / analog channel (Note: AN4 shared) |
| Pino 7 | RA6/OSC2/CLKOUT — PORTA bit 6 / Crystal OSC output / CLKOUT |
| Pino 8 | RA7/OSC1/CLKIN — PORTA bit 7 / Crystal OSC input / CLKIN |
| Pino 9 | VSS — Ground |
| Pino 10 | VDD — Positive supply voltage (2.0V to 5.5V) |
| Pino 11 | RB0/INT — PORTB bit 0 / External interrupt input |
| Pino 12 | RB1/SDI/SDA — PORTB bit 1 / SPI data in / I2C data |
| Pino 13 | RB2/SDO — PORTB bit 2 / SPI data out |
| Pino 14 | RB3/CCP1 — PORTB bit 3 / Capture/Compare/PWM 1 output |
| Pino 15 | RB4/SCK/SCL — PORTB bit 4 / SPI clock / I2C clock |
| Pino 16 | RB5 — PORTB bit 5 |
| Pino 17 | RB6 — PORTB bit 6 |
| Pino 18 | RB7 — PORTB bit 7 |
| Pino 19 | MCLR/VPP — Master Clear reset input / programming voltage |
| Pino 20 | NC — Not connected (per datasheet) |
| Pino 21 | NC — Not connected (per datasheet) |
| Pino 22 | NC — Not connected (per datasheet) |
| Pino 23 | NC — Not connected (per datasheet) |
| Pino 24 | NC — Not connected (per datasheet) |
| Pino 25 | NC — Not connected (per datasheet) |
| Pino 26 | NC — Not connected (per datasheet) |
| Pino 27 | NC — Not connected (per datasheet) |
| Pino 28 | NC — Not connected (per datasheet) |
| Pino 29 | EP — Exposed thermal pad - connect to ground |
Aplicações típicas
PIC16F819-I/ML é adequado para 6 aplicaçãos: Battery-Powered Sensor Hubs, LED Lighting Controllers, Consumer Remote Controls, Industrial Sensor Signal Conditioning, Small BLDC / DC Motor Control, Automotive Body Electronics (non-safety).
Battery-Powered Sensor Hubs
The PIC16F819-I/ML is well suited for battery-powered wireless sensor hubs that aggregate analog signals from temperature, humidity, and motion sensors. Its 5-channel 10-bit ADC samples slow-changing environmental variables with adequate resolution while the nanoWatt sleep mode (typical 1µA standby) extends battery life to multi-year operation on a single CR2032 cell. The MSSP module's I2C master mode connects directly to common digital sensors like SHT21 and MPU-6050 without extra glue logic. At 20MHz, the MCU can wake, acquire, format, and transmit a sensor frame within ~2ms while staying in idle the rest of the time. The 28-pin QFN footprint integrates ADC, timers, and EEPROM into a 36mm² board area - ideal for coin-cell form factors.
Recomendado
LED Lighting Controllers
The PIC16F819-I/ML serves as a low-cost central controller in single-channel and multi-channel LED drivers, especially for indoor SSL fixtures. Its Capture/Compare/PWM (CCP) module plus Timer2 hardware deliver 10-bit PWM at up to 20kHz frequency without CPU overhead, allowing smooth dimming with perceptually flicker-free output. The internal 8MHz oscillator eliminates two crystal pins and simplifies the BOM, while nanoWatt Technology keeps standby power below 50µA in off mode - meeting ENERGY STAR requirements. With 5 ADC channels available, the MCU can monitor NTC thermistors for thermal foldback or daylight sensors for daylight harvesting. Software-configurable SPI/I2C enables connection to DMX/RDM or 0-10V dimming modules.
Recomendado
Consumer Remote Controls
For IR/RF remote controls, the PIC16F819-I/ML offers 3.5KB Flash and 256-byte EEPROM enough for IR protocols (RC5, NEC, SIRC) and pairing logic while the wide 2.0V to 5.5V supply range handles a single lithium coin cell down to near-end-of-discharge voltage. The MSSP module drives peripherals like RTC or external EEPROM via SPI; Timer0 can be reassigned for IR carrier generation by interrupt-driven software. nanoWatt sleep mode (1µA typical) ensures 5+ years battery life in standby. The 6x6mm QFN-28 with exposed pad supports compact handheld designs with adequate thermal headroom.
Recomendado
Industrial Sensor Signal Conditioning
In industrial 4-20mA loops, RTD conditioning, and bridge amplifiers, the PIC16F819-I/ML handles ADC filtering, linearization, and SPI output to a host controller. Its 10-bit ADC with optional hardware accumulator averages 16 samples internally for 12-bit effective resolution, supporting RTD and thermocouple measurements at temperature-compensated accuracy. The Harvard architecture executes 200ns per instruction allowing fast control loops; the programmable BOR and POR improve field reliability. Industrial -40C to +85C range supports factory floor deployments. The QFN-28 footprint fits small termination boards inside sensor heads.
Recomendado
Small BLDC / DC Motor Control
For small brushed DC and low-current BLDC fans or pumps, the PIC16F819-I/ML provides a 10-bit PWM channel with complementary or push-pull outputs via the CCP module, plus a 16-bit Timer1 for tachometer feedback. Six digital I/O can drive gate drivers like the MCP1416 or TC4427 through external FETs. The 20MHz instruction throughput supports up to 50kHz PWM for quiet operation. The exposed thermal pad of the QFN-28 package dissipates heat from high-side switching efficiently. Its small footprint enables integration into the motor housing.
Recomendado
Automotive Body Electronics (non-safety)
The PIC16F819 family supports non-safety automotive body applications like interior lighting, seat controllers, and HVAC dampers where its -40C to +125C extended temperature variant (PIC16F819-E/ML) operates reliably. The wide 2.0V to 5.5V supply tolerates load-dump transients after external clamping, while the PIC's high ESD rating (HBM ≥ 4kV on I/O) handles body-electronics environments. nanoWatt Technology supports key-off sleep currents required for parasitic drain budgets. Designers using the QFN-28 in cockpit and door modules benefit from its 6x6mm footprint to fit tight spaces between harness connectors and HMI boards.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16F819-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F88-I/ML | PIC16F819-I/PT | PIC16LF819-I/ML | PIC16F18855-I/ML | PIC16F18446-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (ML) 6x6 mm | QFN-28 (ML) - same | QFN-28 (ML) - same | QFN-28 (ML) - same | QFN-28 (ML) - same | QFN-28 (ML) - same |
| Program Flash | 3.5 KB | 7 KB | 3.5 KB | 3.5 KB | 14 KB | 28 KB |
| SRAM | 256 bytes | 368 bytes | 256 bytes | 256 bytes | 1 KB | 2 KB |
| ADC | 10-bit, 5 channels | 10-bit, 7 channels | 10-bit, 5 channels | 10-bit, 5 channels | 10-bit, more channels | 12-bit option |
| Supply Voltage | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 1.8V to 3.6V | 1.8V to 5.5V | 1.8V to 5.5V |
| Pinout Compatibility | Reference | Drop-in compatible | Drop-in compatible | Drop-in compatible | Drop-in compatible | Drop-in compatible |
Principais diferenciais
- Free internal 8 MHz oscillator eliminates external crystal (vs PIC16F88-I/ML)
- Smaller program memory but matching peripherals (vs PIC16F18855-I/ML)
- 2.0V to 5.5V wide supply supports battery and 5V systems (vs PIC16LF819-I/ML)
Notas de projeto
Place a 100 nF X7R ceramic decoupling capacitor as close as possible to each VDD pin (pin 10) to suppress high-frequency noise, supplemented by a bulk 10 µF electrolytic or tantalum capacitor within 1 cm. The PIC16F819-I/ML is specified for 2.0V to 5.5V but the ADC accuracy degrades below 3.0V; for 3.3V systems, enable the internal voltage reference and apply the VREF+ via software. Add a 10 kΩ pull-up on MCLR/VPP (pin 19) for clean resets, and a 100 nF cap on MCLR is optional but recommended in noisy industrial environments.
The PIC16F819-I/ML QFN-28 (ML) package has 29 pads including a centrally located exposed thermal pad (pin 29). This pad is electrically ground but MUST be soldered to a copper pour on the PCB to provide thermal dissipation and mechanical robustness. Use a via array (4-9 thermal vias, 0.3mm drill) under the EP connecting to a ground plane on layer 2. Top-side ground copper pour around the package keeps the die junction temperature low and provides a low-impedance ground return for the ADC.
Do not confuse RA4 with RA6/RA7 on initial bring-up - RA5 is multiplexed with the SPI slave select (SS) so configuring MSSP for slave mode may overwrite PORTA bit 5. Always disable the BOR in software if you use external supervision, but be aware this disables the internal brown-out protection. Watch the MCLR pin during ISP programming - the PGM/RB7 relationship requires high-voltage (12V) on MCLR, so capacitors on MCLR must be limited to < 1 µF to ensure proper programming voltages.
The PIC16F819's 10-bit ADC requires proper acquisition time - allow at least 2 µs between channel switching and conversion start. Allow 100 µs after ADC channel change before reading ADRES. A common bug is forgetting to set TRISA bits correctly; since the PIC defaults TRISA to 1 (input) on POR, verify TRISA configuration in init code before starting ADC reads. The internal voltage reference has a 1 ms typical settling time after enabling.
Informações de conformidade
RoHS and REACH compliant per Microchip PIC16F819 product page. Not AEC-Q100 qualified - for AEC-Q100 automotive, choose PIC16F819T-I/ML (automotive grade with extended -40C to +125C) or PIC16F18446-I/ML. Halogen-free per Microchip green-compliance documentation.
