PIC16LF1769T-I/ML - 8-bit MCU, 32MHz, 14KB Flash, 20-QFN | Microchip
N.º da peça: PIC16LF1769T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.41 | $2,41 |
| 10 | $2.1 | $21,00 |
| 100 | $1.79 | $179,00 |
| 500 | $1.55 | $775,00 |
| 1.000 | $1.38 | $1.380,00 |
PIC16LF1769T-I/ML Visão geral
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, optimized for deterministic control, low power, and small footprint. Within the broader taxonomy it sits as a microcontroller -> embedded processor -> semiconductor. The PIC16 core family uses a modified Harvard RISC architecture with 14-bit instruction words, where every instruction executes in one instruction cycle except branches, providing predictable timing critical for real-time control loops. The LF silicon process favors sleep currents in the nanoamp to microamp range, enabling battery lifetime measured in years rather than weeks for periodic-sensing nodes.
Key features include a 10-bit A/D converter with multiple input channels, two operational amplifiers, a zero-cross detect module, high-current I/O drivers capable of directly driving LEDs or small relays, and the eXtreme Low Power (XLP) sleep modes. On-chip peripherals such as timers, PWM, I2C, SPI, and EUSART are routed to selectable pins via the Peripheral Pin Select (PPS) system, simplifying PCB layout and BOM reuse across SKUs.
Architecturally, the device combines the legacy PIC16 instruction set with rich neo-analog peripherals, allowing a single chip to replace discrete op-amps, an external ADC, and a separate timer IC. The 32 MHz Fosc enables CPU instruction throughput of 8 MIPS, sufficient for closed-loop control, edge detection, and basic sensor-fusion math on raw ADC data without external DSP overhead.
Typical applications include battery-powered sensor nodes, IoT edge devices, handheld instrumentation, white goods and appliance control, LED lighting controllers, and low-cost industrial automation. Designers select this part when system cost and PCB area are at a premium but analog integration cannot be sacrificed for raw CPU performance. When designing with this MCU, ensure the decoupling network places a 100 nF ceramic close to each VDD pin, keep analog inputs short and guarded, and respect the 3.6 V absolute-maximum supply to avoid latch-up.
This page synthesizes Microchip distributor pricing, Microchip cross-reference data, and practical design notes curated for engineers evaluating PIC16LF1769T-I/ML as either a primary BOM entry or as a drop-in migration target. Specifications are reproduced from the verified distributor data above and cross-checked against the Microchip PIC16F1769 family product page.
Alternativas drop-in para PIC16LF1769T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16LF1769T-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Core, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16LF1769-I/ML
✅ Drop-In✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC16LF1769-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1768-I/ML
✅ Drop-In✓ Em estoque
$1.32 / unidade
Ver ficha técnica →PIC16LF1765-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1769T-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16F1769T-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1769T-I/ML Classificações máximas e características elétricas
| Core | PIC16 (8-bit RISC, 14-bit instruction) |
| Program Memory Type | FLASH |
| Program Memory Size | 14 KB (8K x 14 words) |
| Data RAM Size | 1 KB |
| Frequência máxima de clock | 32 MHz |
| Largura do barramento de dados | 8 bit |
| ADC Resolution | 10 bit |
| Number of I/Os | 18 |
| Tensão de alimentação de operação | 1.8 V to 3.6 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Encapsulamento | 20-QFN-EP (4x4 mm) |
| Estilo de montagem | SMD/SMT |
| Mounting Style (alt) | Surface Mount with exposed pad |
| Family | PIC16(L)F176X |
| Low-Power Process | LF (eXtreme Low Power / XLP) |
| Status RoHS | Compliant |
| Peripherals | Op amps, zero-cross detect, high-current I/O, 10-bit ADC, timers, PWM, I2C, SPI, EUSART |
Configuração de pinos do PIC16LF1769T-I/ML
| Pino 1 | RA5 — Digital I/O / analog input / I2C |
| Pino 2 | RA4 — Digital I/O / analog input |
| Pino 3 | RA3 — Digital I/O / analog input / MCLR |
| Pino 4 | RA2 — Digital I/O / analog input |
| Pino 5 | RA1 — Digital I/O / analog input |
| Pino 6 | RA0 — Digital I/O / analog input |
| Pino 7 | VDD — Positive supply (1.8 V - 3.6 V) |
| Pino 8 | VSS — Ground |
| Pino 9 | RC7 — Digital I/O |
| Pino 10 | RC6 — Digital I/O |
| Pino 11 | RC5 — Digital I/O |
| Pino 12 | RC4 — Digital I/O |
| Pino 13 | RC3 — Digital I/O |
| Pino 14 | RC2 — Digital I/O |
| Pino 15 | RC1 — Digital I/O |
| Pino 16 | RC0 — Digital I/O |
| Pino 17 | RB7 — Digital I/O |
| Pino 18 | RB6 — Digital I/O |
| Pino 19 | RB5 — Digital I/O |
| Pino 20 | RB4 — Digital I/O |
Aplicações típicas
PIC16LF1769T-I/ML é adequado para 7 aplicaçãos: Battery-Powered IoT Sensor Hubs, Low-Cost Industrial Control Modules, Handheld Instrumentation and Consumer Devices, LED Lighting Drivers and Dimmer Control, Home Appliance Sub-Systems, Automotive Sub-System Modules (Non-Safety), Educational and Maker Electronics.
Battery-Powered IoT Sensor Hubs
The PIC16LF1769T-I/ML's LF (XLP) silicon process enables nanoamp-level sleep currents with 14 KB Flash headroom for sensor-fusion firmware, ideal for coin-cell or two-AA sensor nodes. The 1.8 V to 3.6 V VDD range directly matches Li-MnO2 and alkaline chemistries without an external boost. Pair the on-chip 10-bit ADC + 2 op-amps for direct interface to bridge sensors or thermocouples, reducing BOM by one or two external analog ICs. PPS pin remapping lets one design support both temperature/humidity and PIR/luminosity sensor variants.
Recomendado
Low-Cost Industrial Control Modules
The PIC16LF1769T-I/ML offers -40 C to +85 C industrial temperature grading and 18 high-current I/O drivers capable of sinking LEDs or small relays without external transistors - ideal for compact PLC submodules. Onboard op-amps can condition 4-20 mA loop inputs directly, while timers + PWM drive TRIAC gate interfaces. The 32 MHz Fosc gives 8 MIPS, sufficient for closed-loop PID at sub-millisecond sample rates. PPS lets designers remap EUSART, SPI, I2C onto a single hardware layout for RS-485, CAN-style, or I2C-sensor SKUs.
Recomendado
Handheld Instrumentation and Consumer Devices
Handheld meters, blood-pressure monitors, and remote controls benefit from the PIC16LF1769T-I/ML's small 4x4 mm QFN footprint and 32 MHz core. The zero-cross detect peripheral simplifies AC-line frequency measurement for dimmer or line-voltage sensing. EUSART/SPI/I2C peripherals connect directly to BLE or sub-GHz radio modules for wireless telemetry. With PPS a single IC supports multiple case variants without layout fork.
Recomendado
LED Lighting Drivers and Dimmer Control
The PIC16LF1769T-I/ML's zero-cross detect and high-current I/O allow direct TRIAC/SSR gate drive for phase-controlled dimmers, while PWM channels drive constant-current LED strings in fixtures. The 10-bit ADC can sample photo-sensor feedback for daylight harvesting loops. The 14 KB Flash hosts DMX-512, 0-10 V, and DALI fragment stacks without an external transceiver IC. The exposed-pad QFN simplifies thermal attachment to the LED housing for higher-power downlights.
Recomendado
Home Appliance Sub-Systems
White-goods designers pick the PIC16LF1769T-I/ML for user-interface panels, buzzer control, and small motor drivers in washing machines, dishwashers, and microwave ovens. On-chip op-amps reduce external signal conditioning on NTC thermistor and water-level probes. The LF silicon process delivers low standby <1 uA to meet global energy regulations. PPS supports modular SKUs for both rotary and capacitive-touch user interfaces on the same PCB.
Recomendado
Automotive Sub-System Modules (Non-Safety)
For non-safety body-electronics like HVAC blend-door, mirror-fold, and accessory lighting controllers, the PIC16LF1769T-I/ML provides enough MIPS and analog integration at industrial-grade -40 C to +85 C. Designers migrating to harsher under-hood environments should step up to the PIC16LF1769-E/ML extended temperature grade. Note: this part is NOT AEC-Q100 qualified; safety-rated modules require other PIC16 Q-grade parts.
Recomendado
Educational and Maker Electronics
The PIC16LF1769T-I/ML is a popular target for hobbyist and educational projects due to rich analog integration and the maturity of MPLAB X IDE, XC8 compiler, and Curiosity/Explorer development boards. 14 KB Flash supports introductory RTOS examples and protocol stacks, while PPS prevents pinout confusion. The 20-QFN-EP (4x4) exposes ample I/O for breadboard-friendly breakout boards.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16LF1769T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16LF1769-I/ML | PIC16LF1769-E/ML | PIC16LF1768-I/ML | PIC16LF1765-I/ML | PIC16F1769T-I/ML | PIC16F1769T-E/ML |
|---|---|---|---|---|---|---|---|
| Package | 20-QFN-EP (4x4 mm) | 20-QFN-EP (4x4 mm) - same | 20-QFN-EP (4x4 mm) - same | 20-QFN-EP (4x4 mm) - same | 20-QFN-EP (4x4 mm) - same | 20-QFN-EP (4x4 mm) - same | 20-QFN-EP (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | PIC16 8-bit, 14-bit instructions | PIC16 8-bit, 14-bit instructions - same | PIC16 8-bit, 14-bit instructions - same | PIC16 8-bit, 14-bit instructions - same | PIC16 8-bit, 14-bit instructions - same | PIC16 8-bit, 14-bit instructions - same | PIC16 8-bit, 14-bit instructions - same |
| Max Clock Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 1.8 V - 3.6 V (LF process) | 1.8 V - 3.6 V (LF) | 1.8 V - 3.6 V (LF) | 1.8 V - 3.6 V (LF) | 1.8 V - 3.6 V (LF) | 1.8 V - 5.5 V (F) | 1.8 V - 5.5 V (F) |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C | -40 C to +125 C (E grade) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (E grade) |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| Number of I/Os | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
Principais diferenciais
- Same-brand -T vs non-T drop-in identical silicon (vs PIC16LF1769-I/ML)
- Higher temperature grade available in identical package (vs PIC16LF1769-E/ML)
- Larger 14 KB Flash vs family drop-ins (vs PIC16LF1768-I/ML)
- Lower-voltage LF process pin-compatible with F variant (vs PIC16F1769T-I/ML)
Notas de projeto
Place a 100 nF X7R ceramic decoupling capacitor as close as physically possible to the VDD pin (pin 7) and a 10 uF bulk capacitor on the same supply rail within 25 mm. The LF silicon process is sensitive to negative transients; add a Schottky clamp (e.g., BAT54S) or low-ESR TVS if the device shares a rail with inductive loads. Estimated: total bypassing budget below 50 uF prevents regulator instability on the 1.8 V to 3.6 V supply.
The exposed thermal pad (EP) on the 20-QFN package MUST be soldered to a ground-pour on the top layer with multiple thermal vias stitched into the inner ground plane. Designers skipping the EP solder attachment will see significant thermal derating at +85 C ambient and reduced ESD robustness. Per Microchip AN2031, the EP land should be at least 80% copper-filled with a symmetric array of 8 to 10 vias, 0.3 mm drill.
Do not confuse the -T suffix (Tape & Reel packaging marker) with a silicon variation - PIC16LF1769T-I/ML and PIC16LF1769-I/ML share identical die. Do not assume industrial 'I' grade auto-qualifies for +125 C under-hood designs; the 'I' suffix only certifies -40 C to +85 C. For +125 C operation order -E (extended) or a Q-grade part. Configuration Word settings for LVP (Low-Voltage Programming) should be enabled only on the production line and disabled in shipping units.
Keep analog input traces (RA0-RA5, RC0-RC3 if used as analog) short and guarded by an analog ground pour that's stitch-bridged to digital ground at a single point near the VSS pin. Shared analog/digital return paths inject ADC coupling noise. Route high-current I/O driver traces (RB4-RB7) away from the analog cluster to avoid relay-coil kickback coupling into ADC readings.
Informações de conformidade
RoHS compliant per DigiKey/Mouser listings. The 'I' industrial temperature grade is NOT AEC-Q100 qualified; for AEC-Q100 requirements step to the appropriate PIC16 Q-grade part.
