PIC16LF1768-I/ML - 8-Bit 32MHz MCU 7KB Flash 20-QFN | Microchip
N.º da peça: PIC16LF1768-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.35 | $2,35 |
| 10 | $2.1 | $21,00 |
| 100 | $1.78 | $178,00 |
| 500 | $1.55 | $775,00 |
| 1.000 | $1.32 | $1.320,00 |
PIC16LF1768-I/ML Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), and a mix of digital and analog peripherals. The 8-bit PIC16 architecture uses a RISC-style instruction set with a 14-bit wide instruction word, which improves code density versus 32-bit cores for simple control tasks. PIC16F176x devices sit in Microchip's enhanced mid-range family, which is one step above the baseline PIC10/12/16 families and supports C-compiler friendly development with MPLAB X IDE and XC8 toolchains.
Key features include 7KB Flash, 512 bytes SRAM, 256 bytes EEPROM, 18 I/O pins, integrated op-amps for signal conditioning, 10-bit ADC with computation, and peripheral pin select (PPS) for flexible signal routing. The XLP sleep currents are designed for coin-cell applications where quiescent draw dominates battery life. PPS allows remapping of digital peripherals onto different physical pins, simplifying PCB layout versus fixed-pin-function MCUs.
The device is built on a CMOS process and uses an 8-bit data path with a 14-bit instruction word, which is more efficient than 8-bit-wide instruction architectures. Internal oscillators reduce external component count, while the 32MHz operation provides 8 MIPS throughput - adequate for sensor sampling, PWM control loops, and simple communication protocols (I2C/SPI/EUSART). The 20-QFN (4x4mm) package suits space-constrained designs, with an exposed pad for thermal dissipation.
Typical applications include IoT sensor nodes, low-power wireless sensor hubs, battery-powered thermostats, LED lighting controllers, and small motor drivers. The combination of integrated op-amps, zero-cross detect, and programmable ramp generator makes the PIC16LF1768 a strong fit for closed-loop analog control with minimal external components.
When designing with this part, pay attention to the exposed thermal pad soldering recommendation (must be soldered to the ground plane for electrical and thermal performance), use the MPLAB X IDE with XC8 compiler, and ensure decoupling capacitors are placed within 3mm of VDD pins for noise immunity.
This page synthesizes distributor pricing, drop-in alternatives within the PIC16LF176x family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC16LF1768-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC16LF1768-I/ML (mesmo formato e footprint) — diferindo em Package, ADC, Program Memory (Flash), DAC, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC16F1768-I/ML
✅ Drop-In✓ Em estoque
$1.55 / unidade
Ver ficha técnica →PIC16LF1769-I/ML
✅ Drop-In✓ Em estoque
$1.65 / unidade
Ver ficha técnica →PIC16LF1765-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC16LF1764-I/ML
✅ Drop-In✓ Em estoque
$0.54 / unidade
Ver ficha técnica →PIC16LF1718-I/ML
✅ Drop-In✓ Em estoque
$1.55 / unidade
Ver ficha técnica →PIC16LF15376-I/ML
✅ Drop-In✓ Em estoque
$1.32 / unidade
Ver ficha técnica →PIC16LF1709-I/ML
✅ Drop-In✓ Em estoque
$1.21 / unidade
Ver ficha técnica →PIC16LF1768-I/ML Classificações máximas e características elétricas
| Core | PIC16 (8-bit, 14-bit instruction word) |
| Family | PIC® XLP™ 16F |
| CPU Speed | 32 MHz (8 MIPS) |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data RAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 18 |
| ADC | 10-bit |
| Encapsulamento | 20-QFN (4x4 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Status RoHS | Compliant |
| Integrated Analog Peripherals | Op-amps, zero-cross detect, programmable ramp generator |
Configuração de pinos do PIC16LF1768-I/ML
| Pino 1 | RA5 — Bidirectional I/O / analog input |
| Pino 2 | RA4 — Bidirectional I/O / analog input |
| Pino 3 | RA3/MCLR — Bidirectional I/O / Master Clear reset (active low) |
| Pino 4 | RC5 — Bidirectional I/O |
| Pino 5 | RC4 — Bidirectional I/O |
| Pino 6 | RC3 — Bidirectional I/O |
| Pino 7 | RC6 — Bidirectional I/O / EUSART TX |
| Pino 8 | RC7 — Bidirectional I/O / EUSART RX |
| Pino 9 | RB7 — Bidirectional I/O / ICSPCLK |
| Pino 10 | RB6 — Bidirectional I/O / ICSPDAT |
| Pino 11 | RB5 — Bidirectional I/O |
| Pino 12 | RB4 — Bidirectional I/O |
| Pino 13 | RC2 — Bidirectional I/O |
| Pino 14 | RC1 — Bidirectional I/O |
| Pino 15 | RC0 — Bidirectional I/O |
| Pino 16 | RA2 — Bidirectional I/O / analog input |
| Pino 17 | RA1 — Bidirectional I/O / analog input |
| Pino 18 | RA0 — Bidirectional I/O / analog input |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive power supply (1.8V-3.6V) |
| Pino 21 | EP — Exposed thermal pad - solder to ground plane |
Aplicações típicas
PIC16LF1768-I/ML é adequado para 6 aplicaçãos: IoT Battery-Powered Sensor Nodes, Battery-Powered Thermostats and HVAC Controls, LED Lighting Controllers and Dimmers, Small Motor Control (BLDC / Stepper), Portable Medical and Wellness Devices, Smart Home Sensor Hubs and Bridges.
IoT Battery-Powered Sensor Nodes
The PIC16LF1768-I/ML's XLP technology delivers sub-microamp sleep currents and operates from 1.8V-3.6V, making it ideal for coin-cell and 2xAA powered wireless sensor nodes. Its 32MHz CPU (8 MIPS) handles sensor sampling, local processing, and intermittent LoRa/BLE transmit cycles efficiently. With 7KB Flash and 512 bytes SRAM, it accommodates BLE beacon firmware or simple sensor aggregation routines. The integrated 10-bit ADC and op-amps eliminate external signal conditioning for thermocouple, thermistor, or photodiode interfaces, reducing both BOM cost and PCB footprint in compact IoT devices.
Recomendado
Battery-Powered Thermostats and HVAC Controls
The PIC16LF1768-I/ML's wide 1.8V-3.6V operating range suits 2xAAA or 2xAA battery thermostats, while the integrated op-amps condition thermistor or RTD signals without external components. The zero-cross detect peripheral enables synchronous switching of triac-driven HVAC loads, eliminating inrush current and EMI. Its XLP sleep current below 1uA extends battery life to multi-year durations on standard alkaline cells. With 256 bytes EEPROM, calibration constants and learned user preferences persist across battery swaps without external storage.
Recomendado
LED Lighting Controllers and Dimmers
The PIC16LF1768-I/ML's programmable ramp generator (slope compensation) enables smooth LED dimming curves with hardware-accelerated transitions, offloading the CPU from PWM timing loops. Operating at 32MHz, it generates high-resolution PWM signals (up to 16-bit via CCP modules) for flicker-free dimming. The 1.8V-3.6V range suits direct Li-Ion drive, while 5V-tolerant I/O (on PIC16F1768 variant) supports legacy LED driver stages. Zero-cross detect synchronizes phase-controlled dimming with AC line frequency, reducing flicker and improving dimmer compatibility.
Recomendado
Small Motor Control (BLDC / Stepper)
The PIC16LF1768-I/ML's integrated op-amps handle current sensing in BLDC motor drives, while its 32MHz MIPS throughput implements closed-loop PID control at kHz update rates. The 10-bit ADC with computation performs automated averaging and threshold detection, reducing CPU load on sensor reads. Peripheral Pin Select (PPS) allows flexible routing of PWM outputs and quadrature encoder inputs, simplifying PCB layout for compact motor driver boards. The 20-QFN package suits space-constrained designs such as drone ESCs or small pump controllers.
Recomendado
Portable Medical and Wellness Devices
The PIC16LF1768-I/ML's low-power operation and integrated analog peripherals suit portable pulse oximeters, glucose meters, and digital thermometers. The op-amps interface directly with photodiode sensors (PPG), while the 10-bit ADC captures waveforms with sufficient resolution for SpO2 algorithms. Operating from 1.8V-3.6V with sub-uA sleep current, the MCU enables coin-cell-powered designs with multi-year battery life. The 32MHz core executes lightweight signal-processing routines in real time, balancing measurement accuracy with low power consumption.
Recomendado
Smart Home Sensor Hubs and Bridges
The PIC16LF1768-I/ML serves as a low-cost sensor aggregator in Zigbee or Matter-based smart home networks, leveraging its EUSART and MSSP (I2C/SPI) peripherals to bridge sensors with wireless MCUs. The 1.8V-3.6V operation aligns with battery-powered PIR, door/window, and environmental sensors. With 7KB Flash, it supports local logic for motion-event filtering and tamper detection. The peripheral pin select (PPS) feature simplifies PCB routing when adapting designs across sensor form factors, while the 20-QFN package fits in coin-cell sized enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC16LF1768-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC16F1768-I/ML | PIC16LF1769-I/ML | PIC16LF1765-I/ML | PIC16LF1764-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-QFN (4x4) | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same |
| CPU Speed | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) |
| Flash Memory | 7 KB | 7 KB | 7 KB | 4 KB (-43%) | 4 KB (-43%) |
| SRAM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| Operating Voltage | 1.8V to 3.6V | 1.8V to 5.5V (wider) | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V |
| I/O Pins | 18 | 18 | 18 | 18 | 18 |
| Integrated Op-Amps | Yes (multiple) | Yes (multiple) | Yes | Reduced count | Reduced count |
| XLP Low-Power Sleep | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Integrated op-amps and zero-cross detect in 20-QFN package (vs PIC16LF1764-I/ML)
- 7 KB Flash with full peripheral integration (vs PIC16LF1765-I/ML)
- Wide 1.8V-3.6V operation with XLP technology (vs PIC16F1768-I/ML)
Notas de projeto
The 20-QFN package has an exposed thermal pad (EP) on pin 21 that MUST be soldered to the ground plane for electrical performance and thermal dissipation. Microchip recommends using an array of thermal vias (6-9 vias in a 3x3 grid, 0.3mm drill) to connect the EP to inner ground planes. Failure to solder the EP properly can cause erratic operation, increased EMI susceptibility, and reduced thermal performance during high-CPU-activity operation.
Place a 0.1uF ceramic decoupling capacitor as close as possible to the VDD pin (within 3mm recommended) and a 10uF bulk capacitor near the MCU power pins. For battery-powered designs using XLP sleep modes, add a 10uF tantalum or ceramic capacitor on VDD to handle transient current spikes when waking from sleep. The PIC16LF1768-I/ML has an internal voltage regulator requiring the bulk cap for stable operation during CPU transitions.
Do not confuse the PIC16LF1768 (1.8V-3.6V) with the PIC16F1768 (1.8V-5.5V) when ordering for 5V systems. The MCLR pin (pin 3) is shared with RA3 - when using MCLR as reset, RA3 functionality is unavailable. For ICSP programming, ensure the PGM (RB6/ICSPCLK and RB7/ICSPDAT) pins are not used for output-only functions on production boards without isolation resistors. Use Microchip's MPLAB X IDE with XC8 compiler for firmware development.
Route the 32MHz clock traces as short as possible and keep analog signals (RA0-RA5, RC0-RC2) separated from digital switching signals. Place the crystal or external clock components close to the OSC1/OSC2 pins if used; for internal oscillator configurations (default), no external components are needed. Ground the AVSS and AGND pins properly for ADC accuracy - star-grounding the analog and digital grounds at a single point near the MCU reduces ADC noise.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive applications, consider PIC16F1768-E/ML (extended temperature grade) or contact Microchip for AEC-Q100 alternatives. Lead-free and halogen-free per Microchip environmental compliance documentation.
