PIC18F66K22-E/MR - 8-bit 64MHz 64KB Flash MCU 64-VQFN | Microchip
N.º da peça: PIC18F66K22-E/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.92 | $5,92 |
| 10 | $5.42 | $54,20 |
| 100 | $4.78 | $478,00 |
| 500 | $4.21 | $2.105,00 |
| 1.000 | $3.79 | $3.790,00 |
PIC18F66K22-E/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, and integrated peripherals such as ADCs, timers, and communication controllers. The PIC18 family belongs to Microchip's 8-bit PIC® RISC architecture hierarchy: PIC18 -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The K-series adds the nanoWatt XLP technology for ultra-low-power operation, targeting battery-powered and energy-harvesting applications where sleep current and wake-up time dominate energy budgets.
Key features include the Charge Time Measurement Unit (CTMU) for capacitive touch sensing, multiple communication peripherals (UART, SPI, I2C), enhanced PWM modules, and configurable logic cells. The device operates from 1.8 V to 5.5 V (wide Vdd) and supports self-programmability for bootloader-based firmware updates. The 12-bit ADC provides up to 16 channels for sensor interfacing.
The PIC18F66K22 is built on an enhanced Harvard architecture with a modified RISC instruction set, 16-bit wide instructions, and a hardware multiplier for arithmetic-intensive tasks. Its XLP technology delivers nanoamp-level sleep currents, allowing years of operation from a single coin cell. The 64-VQFN package provides excellent thermal dissipation for sustained 64 MHz operation.
Typical applications include capacitive touch human-machine interfaces (HMI), battery-powered sensor nodes, IoT edge devices, industrial control, and automotive body/comfort modules. The wide voltage range and robust peripheral set make it a flexible platform for both consumer and industrial products.
When designing with this MCU, allocate a 0.1 uF decoupling capacitor adjacent to every Vdd pin and follow Microchip's recommended PCB layout for the VQFN exposed pad to achieve specified thermal performance. The CTMU requires careful calibration for reliable capacitive touch performance across environmental conditions.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC18F66K22-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F66K22-E/MR (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature Range, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F66K22-I/MR
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →PIC18F66K22T-I/MR
✅ Drop-In✓ Em estoque
$4.2 / unidade
Ver ficha técnica →PIC18F66K22T-E/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC18F65K22-E/MR
✅ Drop-In✓ Em estoque
$3.5 / unidade
Ver ficha técnica →PIC18F65K90-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.02 / unidade
Ver ficha técnica →PIC18F65K90-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.6 / unidade
Ver ficha técnica →PIC18F66K22-E/MR Classificações máximas e características elétricas
| Core Architecture | PIC18 (8-bit, enhanced RISC) |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data RAM | 4 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS at 4x PLL) |
| Operating Voltage | 1.8 V to 5.5 V |
| Temperature Grade | -40 C to +125 C (Extended, -E suffix) |
| I/O Pins | 54 |
| ADC | 12-bit, up to 16 channels |
| Encapsulamento | 64-pin VQFN (9x9 mm) with EP |
| Tipo de montagem | Surface Mount |
| Low-Power Technology | nanoWatt XLP |
| CTMU (Capacitive Touch) | Yes (Charge Time Measurement Unit) |
| Communication Peripherals | UART, SPI, I2C (multiple instances) |
| Self-Programming | Yes (Flash boot loader capable) |
| Status RoHS | Compliant |
Configuração de pinos do PIC18F66K22-E/MR
| Pino 1 | RB5/KBI1/PWM3H/CCP5 — I/O port B bit 5; KBI interrupt; PWM3 high; CCP5 capture/compare |
| Pino 2 | RB4/KBI0/PWM3L — I/O port B bit 4; KBI interrupt; PWM3 low |
| Pino 3 | RB3/CCP2/PWM2H — I/O port B bit 3; CCP2; PWM2 high |
| Pino 4 | RB2/PWM2L/CANTX — I/O port B bit 2; PWM2 low; CAN TX |
| Pino 5 | RB1/CANRX/PWM1H — I/O port B bit 1; CAN RX; PWM1 high |
| Pino 6 | RB0/PWM1L — I/O port B bit 0; PWM1 low |
| Pino 7 | VDD — Digital supply voltage |
| Pino 8 | VSS — Digital ground |
| Pino 9 | RC7/RX1/DT1/CCP4 — I/O port C bit 7; EUSART1 RX; EUSART1 data; CCP4 |
| Pino 10 | RC6/TX1/CK1/PWM4H — I/O port C bit 6; EUSART1 TX; EUSART1 clock; PWM4 high |
| Pino 11 | RC5/PWM4L/SDO2 — I/O port C bit 5; PWM4 low; SPI2 data out |
| Pino 12 | RC4/SDI2/SDA2 — I/O port C bit 4; SPI2 data in; I2C2 data |
| Pino 13 | RC3/SCK2/SCL2 — I/O port C bit 3; SPI2 clock; I2C2 clock |
| Pino 14 | RC2/CCP1/PWM5H — I/O port C bit 2; CCP1; PWM5 high |
| Pino 15 | RC1/CCP8/PWM5L — I/O port C bit 1; CCP8; PWM5 low |
| Pino 16 | RC0/SOSCO — I/O port C bit 0; secondary oscillator output |
| Pino 17 | OSCO/CLKO/RA6 — Oscillator output; clock output; I/O port A bit 6 |
| Pino 18 | OSCI/CLKI/RA7 — Oscillator input; clock input; I/O port A bit 7 |
| Pino 19 | VDD — Digital supply voltage |
| Pino 20 | VSS — Digital ground |
| Pino 21 | RA0/AN0/ULPWU — I/O port A bit 0; analog input 0; ultra-low-power wake-up |
| Pino 22 | RA1/AN1 — I/O port A bit 1; analog input 1 |
| Pino 23 | RA2/AN2/VREF- — I/O port A bit 2; analog input 2; ADC Vref- |
| Pino 24 | RA3/AN3/VREF+ — I/O port A bit 3; analog input 3; ADC Vref+ |
| Pino 25 | RA4/T0CKI/SOSCI — I/O port A bit 4; Timer0 clock input; secondary oscillator input |
| Pino 26 | RA5/AN4/SS1/HLVDIN — I/O port A bit 5; analog input 4; SPI1 slave select; HLVD input |
| Pino 27 | RE0/AN5 — I/O port E bit 0; analog input 5 |
| Pino 28 | RE1/AN6 — I/O port E bit 1; analog input 6 |
| Pino 29 | RE2/AN7 — I/O port E bit 2; analog input 7 |
| Pino 30 | VDDCORE — Regulated core supply (decoupling cap) |
| Pino 31 | VSS — Digital ground |
| Pino 32 | RD0/AN8/CTED1 — I/O port D bit 0; analog input 8; CTMU edge detect 1 |
| Pino 33 | RD1/AN9/CTED2 — I/O port D bit 1; analog input 9; CTMU edge detect 2 |
| Pino 34 | RD2/AN10 — I/O port D bit 2; analog input 10 |
| Pino 35 | RD3/AN11 — I/O port D bit 3; analog input 11 |
| Pino 36 | RD4/AN12/SDO1 — I/O port D bit 4; analog input 12; SPI1 data out |
| Pino 37 | RD5/AN13/SDI1/SDA1 — I/O port D bit 5; analog input 13; SPI1 data in; I2C1 data |
| Pino 38 | RD6/AN14/SCK1/SCL1 — I/O port D bit 6; analog input 14; SPI1 clock; I2C1 clock |
| Pino 39 | RD7/AN15/SS1 — I/O port D bit 7; analog input 15; SPI1 slave select |
| Pino 40 | VSS — Digital ground |
| Pino 41 | VDD — Digital supply voltage |
| Pino 42 | RF7/AN16 — I/O port F bit 7; analog input 16 |
| Pino 43 | RF6/AN17 — I/O port F bit 6; analog input 17 |
| Pino 44 | RF5/AN18 — I/O port F bit 5; analog input 18 |
| Pino 45 | RF4/AN19 — I/O port F bit 4; analog input 19 |
| Pino 46 | RF3/AN20 — I/O port F bit 3; analog input 20 |
| Pino 47 | RF2/AN21 — I/O port F bit 2; analog input 21 |
| Pino 48 | RF1/AN22 — I/O port F bit 1; analog input 22 |
| Pino 49 | RF0/AN23 — I/O port F bit 0; analog input 23 |
| Pino 50 | RG7 — I/O port G bit 7 |
| Pino 51 | RG6 — I/O port G bit 6 |
| Pino 52 | RG5 — I/O port G bit 5 |
| Pino 53 | RG4 — I/O port G bit 4 |
| Pino 54 | RG3 — I/O port G bit 3 |
| Pino 55 | RG2 — I/O port G bit 2 |
| Pino 56 | RG1 — I/O port G bit 1 |
| Pino 57 | RG0 — I/O port G bit 0 |
| Pino 58 | RE3 — I/O port E bit 3 (input only) |
| Pino 59 | RE4 — I/O port E bit 4 |
| Pino 60 | RE5 — I/O port E bit 5 |
| Pino 61 | RE6 — I/O port E bit 6 |
| Pino 62 | RE7 — I/O port E bit 7 |
| Pino 63 | AVDD — Analog supply voltage |
| Pino 64 | AVSS — Analog ground |
Aplicações típicas
PIC18F66K22-E/MR é adequado para 6 aplicaçãos: Capacitive Touch HMI, Battery-Powered IoT Sensor Node, Industrial Control and Automation, Automotive Body and Comfort Modules, Consumer Appliance Control Boards, Medical Monitoring and Diagnostics.
Capacitive Touch HMI
The PIC18F66K22-E/MR's integrated Charge Time Measurement Unit (CTMU) provides a hardware constant-current source and precise timing reference for measuring capacitance changes, making this MCU a strong fit for capacitive touch human-machine interfaces. With 64 KB Flash, designers can implement touch button, slider, and proximity-sensor algorithms using Microchip's mTouch framework, supporting 8-16 touch channels simultaneously. The 12-bit ADC and configurable logic cells complement the CTMU for robust touch decoding in noisy industrial environments.
Recomendado
Battery-Powered IoT Sensor Node
The PIC18F66K22-E/MR's nanoWatt XLP technology delivers nanoamp-level sleep currents and fast wake-up times, enabling multi-year battery life for IoT sensor endpoints. Its 64 MHz CPU (16 MIPS) allows sensor data processing and on-chip decision making without an external coprocessor, while the 12-bit ADC reads analog sensors directly. The wide 1.8 V to 5.5 V supply range accepts single-cell Li-ion, 2x AA alkaline, or energy-harvesting rails without additional regulation.
Recomendado
Industrial Control and Automation
With 54 I/O pins and operating temperature range of -40 C to +125 C, the PIC18F66K22-E/MR is well suited for industrial PLC expansion modules, motor-control daughter boards, and factory automation peripherals. The multiple UART, SPI, and I2C peripherals allow simultaneous communication with sensors, displays, and fieldbus bridges. Hardware PWM and enhanced timers support closed-loop control algorithms for valves, heaters, and small servo drives.
Recomendado
Automotive Body and Comfort Modules
The -E temperature grade (-40 C to +125 C) makes the PIC18F66K22-E/MR suitable for under-hood and cabin automotive body controllers, lighting modules, and HVAC interfaces. Its 64 KB Flash accommodates CAN-based stacks and LIN slave firmware. Multiple PWM channels drive LED lighting and small DC motors in seat-control and mirror-adjustment modules where the wide Vdd range tolerates load-dump transients with external protection.
Recomendado
Consumer Appliance Control Boards
The PIC18F66K22-E/MR is widely deployed in white-goods and small appliance controllers such as washing-machine front panels, coffee-machine interfaces, and induction cooktop user interfaces. The CTMU enables sleek glass-surface capacitive touch buttons that replace mechanical switches, while the 12-bit ADC reads temperature, humidity, and weight sensors. Its low power consumption is well matched to standby-energy regulations worldwide.
Recomendado
Medical Monitoring and Diagnostics
The PIC18F66K22-E/MR's 12-bit ADC resolution, 1 KB EEPROM for calibration constants, and reliable Flash with self-programming support enable medical monitoring peripherals such as blood-pressure meters, glucose monitors, and pulse oximeters. The XLP sleep modes extend battery life across multi-month usage scenarios between recharges. Hardware CRC and enhanced timers support safety-relevant firmware architectures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F66K22-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F66K22-I/MR | PIC18F66K22T-I/MR | PIC18F66K22T-E/MR | PIC18F65K22-E/MR | PIC18F65K90-I/MR | PIC18F65K90-E/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 32 KB | 32 KB |
| Data RAM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Temperature Grade | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Max CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Extended temperature grade for automotive/harsh-environment use (vs PIC18F66K22-I/MR)
- Highest memory density in the 64-VQFN PIC18F6xK22 family (vs PIC18F65K22-E/MR)
- Integrated CTMU for capacitive touch (vs PIC18F65K90-E/MR)
Notas de projeto
Decouple each Vdd pin with a 100 nF ceramic capacitor placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic capacitor near the package. For the VDDCORE pin (pin 30), follow Microchip's reference layout exactly: a 100 nF low-ESR ceramic capacitor must connect directly between VDDCORE and the nearest VSS pin. Insufficient VDDCORE decoupling can cause erratic CPU behavior at 64 MHz operation.
Estimated: At 64 MHz CPU speed, 5.5 V supply, and 50% I/O toggle load, the PIC18F66K22-E/MR dissipates approximately 50 mW typical, well within the 64-VQFN thermal envelope. The exposed pad (EP) on the package underside MUST be soldered to a copper pad of at least 50 mm^2 with multiple thermal vias to the inner ground plane to achieve the datasheet thermal resistance (theta_JA approximately 30 C/W). Without EP soldering, junction temperature rises rapidly and may exceed the +125 C maximum at extended ambient temperatures.
Avoid common pitfalls: (1) Do not exceed 5.5 V on any digital I/O pin - use clamping diodes for load-dump protection in automotive applications. (2) The CTMU constant-current source requires calibration per chip for accurate capacitance measurement; Microchip AN1250 documents the calibration procedure. (3) Flash self-programming requires specific erase/write sequences and the CONFIG bits must enable LVP or enter high-voltage programming mode correctly.
Route the high-speed signals (SPI, EUSART, PWM) above a continuous ground plane and avoid 90-degree bends. Place the analog reference pins AVdd/AVss adjacent to a quiet ground island separated by a small ferrite bead from the digital ground to reduce ADC reference noise. Trace lengths for the 16 MHz crystal (or external oscillator) should be minimized and surrounded by a grounded guard ring to suppress EMI pickup.
Informações de conformidade
RoHS compliant per Microchip product page. The -E temperature grade (-40 C to +125 C) is suitable for many industrial/automotive applications but is NOT AEC-Q100 qualified; for AEC-Q100 automotive designs, see PIC18F46K80 or qualified K-series parts.