Microchip Technology

PIC18F66K22-E/MR - 8-bit 64MHz 64KB Flash MCU 64-VQFN | Microchip

N.º da peça: PIC18F66K22-E/MR ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.8 V to 5.5 V Vdss 64-pin VQFN (9x9 mm) with EP Package 64 MHz (16 MIPS at 4x PLL) Speed 64 KB (32K x 16) Memory
A partir de $3.79 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-27
Preços por volume
Qtd. Preço unitário Total
1 $5.92 $5,92
10 $5.42 $54,20
100 $4.78 $478,00
500 $4.21 $2.105,00
1.000 $3.79 $3.790,00
ℹ️ Todos os preços estão em USD

PIC18F66K22-E/MR Visão geral

The Microchip Technology PIC18F66K22-E/MR is an 8-bit PIC18 microcontroller built on the nanoWatt XLP low-power architecture, delivering 64 MIPS performance at 64 MHz, packaged in a 64-pin VQFN (9x9 mm) with an exposed thermal pad. It integrates 64 KB of Flash program memory, 4 KB of RAM, and 1 KB of EEPROM, with a 12-bit A/D converter supporting up to 16 input channels. The -E temperature grade indicates an extended operating range of -40 C to +125 C.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, and integrated peripherals such as ADCs, timers, and communication controllers. The PIC18 family belongs to Microchip's 8-bit PIC® RISC architecture hierarchy: PIC18 -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor. The K-series adds the nanoWatt XLP technology for ultra-low-power operation, targeting battery-powered and energy-harvesting applications where sleep current and wake-up time dominate energy budgets.

Key features include the Charge Time Measurement Unit (CTMU) for capacitive touch sensing, multiple communication peripherals (UART, SPI, I2C), enhanced PWM modules, and configurable logic cells. The device operates from 1.8 V to 5.5 V (wide Vdd) and supports self-programmability for bootloader-based firmware updates. The 12-bit ADC provides up to 16 channels for sensor interfacing.

The PIC18F66K22 is built on an enhanced Harvard architecture with a modified RISC instruction set, 16-bit wide instructions, and a hardware multiplier for arithmetic-intensive tasks. Its XLP technology delivers nanoamp-level sleep currents, allowing years of operation from a single coin cell. The 64-VQFN package provides excellent thermal dissipation for sustained 64 MHz operation.

Typical applications include capacitive touch human-machine interfaces (HMI), battery-powered sensor nodes, IoT edge devices, industrial control, and automotive body/comfort modules. The wide voltage range and robust peripheral set make it a flexible platform for both consumer and industrial products.

When designing with this MCU, allocate a 0.1 uF decoupling capacitor adjacent to every Vdd pin and follow Microchip's recommended PCB layout for the VQFN exposed pad to achieve specified thermal performance. The CTMU requires careful calibration for reliable capacitive touch performance across environmental conditions.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para PIC18F66K22-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC18F66K22-E/MR (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature Range, Timers.

Microchip Technology
Package: 64-pin VQFN (9x9 mm, exposed pad)
Operating Temperature Range: -40C to +125C (Extended)
Timers: 4 x 16-bit, 2 x 8-bit
Microchip Technology
ADC: 12-bit, up to 24 channels
Timers: 11 (3x16-bit, 8x8-bit)
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
ADC: 12-bit
Operating Temperature Range: -40C to +85C (Industrial)
Microchip Technology
Package: 64-VQFN (9x9 mm) with exposed pad
Operating Temperature Range: -40C to +85C (industrial, "I")
Timers: 8-bit/16-bit, CCP/ECCP modules
Microchip Technology
Package: 64-pin QFN (MR) with exposed pad, 9x9 mm
Core Architecture: PIC18 (RISC, 16-bit instructions)
Timers: 4 x 16-bit / 2 x 8-bit
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
Core Architecture: PIC18 (8-bit RISC, Harvard)
Operating Temperature Range: -40 C to +85 C (Industrial)
Microchip Technology
Package: 64-VQFN Exposed Pad (QFN-64, 9x9 mm)
ADC: 12-bit, multi-channel
Core Architecture: PIC 8-bit RISC (Harvard)

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC18F66K22-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9)
PIC18F "K22" 8-bit MCU · PIC18 8-bit RISC, 16-bit instruction word · 64 KB Flash · 4 KB · 1 KB · 64 MHz · 2.5 V to 5.5 V · 12-bit, up to 16 channels

✓ Em estoque

$4.05 / unidade

Ver ficha técnica →

PIC18F66K22T-I/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9)
PIC18 (8-bit RISC, Harvard) · 64 MHz (16 MIPS at 64 MHz) · 64 KB · 4 KB · 1 KB · 64-pin VQFN (9x9 mm) · 1.8 V to 5.5 V · -40 C to +85 C (Industrial)

✓ Em estoque

$4.2 / unidade

Ver ficha técnica →

PIC18F66K22T-E/MR

✅ Drop-In ⚠️ Especificações não verificadas
📦 64-VQFN (9x9)
Same die, same 64-VQFN package; tape-and-reel packaging format. Pin-to-pin compatible; full -40C to +125C temp range matches the target -E grade.

📋 Alternativa de referência (fora do catálogo)

PIC18F65K22-E/MR

✅ Drop-In
Microchip Technology
📦 64-VQFN (9x9)
PIC18F K-series (PIC18F6XK22) · 8-bit PIC enhanced RISC · 64 KB Flash · 4 KB · 1 KB · 64 MHz (16 MIPS) · 1.8 V to 5.5 V · -40C to +125C (Extended)

✓ Em estoque

$3.5 / unidade

Ver ficha técnica →

PIC18F65K90-I/MR

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 64-VQFN (9x9)
Flash · 32KB (16K x 16) · 2 KB · 1 KB · PIC18 (8-bit) · 64 MHz · 1.8 V to 5.5 V · 54

✓ Em estoque

$3.02 / unidade

Ver ficha técnica →

PIC18F65K90-E/MR

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 64-VQFN (9x9)
PIC18F87K90 · 8-bit PIC RISC · 32 KB · 2 KB · 1 KB · 64 MHz (40 MHz E/MR grade) · 1.8 V to 5.5 V (4.2 V to 5.5 V at full speed) · 54

✓ Em estoque

$4.6 / unidade

Ver ficha técnica →

PIC18F66K22-E/MR Classificações máximas e características elétricas

Core Architecture PIC18 (8-bit, enhanced RISC)
Program Memory (Flash) 64 KB (32K x 16)
Data RAM 4 KB
Data EEPROM 1 KB
Maximum CPU Speed 64 MHz (16 MIPS at 4x PLL)
Operating Voltage 1.8 V to 5.5 V
Temperature Grade -40 C to +125 C (Extended, -E suffix)
I/O Pins 54
ADC 12-bit, up to 16 channels
Encapsulamento 64-pin VQFN (9x9 mm) with EP
Tipo de montagem Surface Mount
Low-Power Technology nanoWatt XLP
CTMU (Capacitive Touch) Yes (Charge Time Measurement Unit)
Communication Peripherals UART, SPI, I2C (multiple instances)
Self-Programming Yes (Flash boot loader capable)
Status RoHS Compliant

Configuração de pinos do PIC18F66K22-E/MR

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Pino 1 RB5/KBI1/PWM3H/CCP5 — I/O port B bit 5; KBI interrupt; PWM3 high; CCP5 capture/compare
Pino 2 RB4/KBI0/PWM3L — I/O port B bit 4; KBI interrupt; PWM3 low
Pino 3 RB3/CCP2/PWM2H — I/O port B bit 3; CCP2; PWM2 high
Pino 4 RB2/PWM2L/CANTX — I/O port B bit 2; PWM2 low; CAN TX
Pino 5 RB1/CANRX/PWM1H — I/O port B bit 1; CAN RX; PWM1 high
Pino 6 RB0/PWM1L — I/O port B bit 0; PWM1 low
Pino 7 VDD — Digital supply voltage
Pino 8 VSS — Digital ground
Pino 9 RC7/RX1/DT1/CCP4 — I/O port C bit 7; EUSART1 RX; EUSART1 data; CCP4
Pino 10 RC6/TX1/CK1/PWM4H — I/O port C bit 6; EUSART1 TX; EUSART1 clock; PWM4 high
Pino 11 RC5/PWM4L/SDO2 — I/O port C bit 5; PWM4 low; SPI2 data out
Pino 12 RC4/SDI2/SDA2 — I/O port C bit 4; SPI2 data in; I2C2 data
Pino 13 RC3/SCK2/SCL2 — I/O port C bit 3; SPI2 clock; I2C2 clock
Pino 14 RC2/CCP1/PWM5H — I/O port C bit 2; CCP1; PWM5 high
Pino 15 RC1/CCP8/PWM5L — I/O port C bit 1; CCP8; PWM5 low
Pino 16 RC0/SOSCO — I/O port C bit 0; secondary oscillator output
Pino 17 OSCO/CLKO/RA6 — Oscillator output; clock output; I/O port A bit 6
Pino 18 OSCI/CLKI/RA7 — Oscillator input; clock input; I/O port A bit 7
Pino 19 VDD — Digital supply voltage
Pino 20 VSS — Digital ground
Pino 21 RA0/AN0/ULPWU — I/O port A bit 0; analog input 0; ultra-low-power wake-up
Pino 22 RA1/AN1 — I/O port A bit 1; analog input 1
Pino 23 RA2/AN2/VREF- — I/O port A bit 2; analog input 2; ADC Vref-
Pino 24 RA3/AN3/VREF+ — I/O port A bit 3; analog input 3; ADC Vref+
Pino 25 RA4/T0CKI/SOSCI — I/O port A bit 4; Timer0 clock input; secondary oscillator input
Pino 26 RA5/AN4/SS1/HLVDIN — I/O port A bit 5; analog input 4; SPI1 slave select; HLVD input
Pino 27 RE0/AN5 — I/O port E bit 0; analog input 5
Pino 28 RE1/AN6 — I/O port E bit 1; analog input 6
Pino 29 RE2/AN7 — I/O port E bit 2; analog input 7
Pino 30 VDDCORE — Regulated core supply (decoupling cap)
Pino 31 VSS — Digital ground
Pino 32 RD0/AN8/CTED1 — I/O port D bit 0; analog input 8; CTMU edge detect 1
Pino 33 RD1/AN9/CTED2 — I/O port D bit 1; analog input 9; CTMU edge detect 2
Pino 34 RD2/AN10 — I/O port D bit 2; analog input 10
Pino 35 RD3/AN11 — I/O port D bit 3; analog input 11
Pino 36 RD4/AN12/SDO1 — I/O port D bit 4; analog input 12; SPI1 data out
Pino 37 RD5/AN13/SDI1/SDA1 — I/O port D bit 5; analog input 13; SPI1 data in; I2C1 data
Pino 38 RD6/AN14/SCK1/SCL1 — I/O port D bit 6; analog input 14; SPI1 clock; I2C1 clock
Pino 39 RD7/AN15/SS1 — I/O port D bit 7; analog input 15; SPI1 slave select
Pino 40 VSS — Digital ground
Pino 41 VDD — Digital supply voltage
Pino 42 RF7/AN16 — I/O port F bit 7; analog input 16
Pino 43 RF6/AN17 — I/O port F bit 6; analog input 17
Pino 44 RF5/AN18 — I/O port F bit 5; analog input 18
Pino 45 RF4/AN19 — I/O port F bit 4; analog input 19
Pino 46 RF3/AN20 — I/O port F bit 3; analog input 20
Pino 47 RF2/AN21 — I/O port F bit 2; analog input 21
Pino 48 RF1/AN22 — I/O port F bit 1; analog input 22
Pino 49 RF0/AN23 — I/O port F bit 0; analog input 23
Pino 50 RG7 — I/O port G bit 7
Pino 51 RG6 — I/O port G bit 6
Pino 52 RG5 — I/O port G bit 5
Pino 53 RG4 — I/O port G bit 4
Pino 54 RG3 — I/O port G bit 3
Pino 55 RG2 — I/O port G bit 2
Pino 56 RG1 — I/O port G bit 1
Pino 57 RG0 — I/O port G bit 0
Pino 58 RE3 — I/O port E bit 3 (input only)
Pino 59 RE4 — I/O port E bit 4
Pino 60 RE5 — I/O port E bit 5
Pino 61 RE6 — I/O port E bit 6
Pino 62 RE7 — I/O port E bit 7
Pino 63 AVDD — Analog supply voltage
Pino 64 AVSS — Analog ground

Aplicações típicas

PIC18F66K22-E/MR é adequado para 6 aplicaçãos: Capacitive Touch HMI, Battery-Powered IoT Sensor Node, Industrial Control and Automation, Automotive Body and Comfort Modules, Consumer Appliance Control Boards, Medical Monitoring and Diagnostics.

🧩

Capacitive Touch HMI

The PIC18F66K22-E/MR's integrated Charge Time Measurement Unit (CTMU) provides a hardware constant-current source and precise timing reference for measuring capacitance changes, making this MCU a strong fit for capacitive touch human-machine interfaces. With 64 KB Flash, designers can implement touch button, slider, and proximity-sensor algorithms using Microchip's mTouch framework, supporting 8-16 touch channels simultaneously. The 12-bit ADC and configurable logic cells complement the CTMU for robust touch decoding in noisy industrial environments.

📱

Battery-Powered IoT Sensor Node

The PIC18F66K22-E/MR's nanoWatt XLP technology delivers nanoamp-level sleep currents and fast wake-up times, enabling multi-year battery life for IoT sensor endpoints. Its 64 MHz CPU (16 MIPS) allows sensor data processing and on-chip decision making without an external coprocessor, while the 12-bit ADC reads analog sensors directly. The wide 1.8 V to 5.5 V supply range accepts single-cell Li-ion, 2x AA alkaline, or energy-harvesting rails without additional regulation.

🏭

Industrial Control and Automation

With 54 I/O pins and operating temperature range of -40 C to +125 C, the PIC18F66K22-E/MR is well suited for industrial PLC expansion modules, motor-control daughter boards, and factory automation peripherals. The multiple UART, SPI, and I2C peripherals allow simultaneous communication with sensors, displays, and fieldbus bridges. Hardware PWM and enhanced timers support closed-loop control algorithms for valves, heaters, and small servo drives.

🚗

Automotive Body and Comfort Modules

The -E temperature grade (-40 C to +125 C) makes the PIC18F66K22-E/MR suitable for under-hood and cabin automotive body controllers, lighting modules, and HVAC interfaces. Its 64 KB Flash accommodates CAN-based stacks and LIN slave firmware. Multiple PWM channels drive LED lighting and small DC motors in seat-control and mirror-adjustment modules where the wide Vdd range tolerates load-dump transients with external protection.

🔧

Consumer Appliance Control Boards

The PIC18F66K22-E/MR is widely deployed in white-goods and small appliance controllers such as washing-machine front panels, coffee-machine interfaces, and induction cooktop user interfaces. The CTMU enables sleek glass-surface capacitive touch buttons that replace mechanical switches, while the 12-bit ADC reads temperature, humidity, and weight sensors. Its low power consumption is well matched to standby-energy regulations worldwide.

💊

Medical Monitoring and Diagnostics

The PIC18F66K22-E/MR's 12-bit ADC resolution, 1 KB EEPROM for calibration constants, and reliable Flash with self-programming support enable medical monitoring peripherals such as blood-pressure meters, glucose monitors, and pulse oximeters. The XLP sleep modes extend battery life across multi-month usage scenarios between recharges. Hardware CRC and enhanced timers support safety-relevant firmware architectures.

What is the Flash memory size of PIC18F66K22-E/MR?
The PIC18F66K22-E/MR provides 64 KB of Flash program memory organized as 32K x 16 words. According to the Microchip datasheet 39984D, the Flash supports self-programming and is split into regions for bootloader operation. The device also includes 4 KB of data RAM and 1 KB of EEPROM for non-volatile parameter storage.
What is the maximum operating frequency of PIC18F66K22-E/MR?
The PIC18F66K22-E/MR runs up to 64 MHz system clock, delivering 16 MIPS instruction throughput. The -E temperature grade supports -40 C to +125 C operation across this frequency range, with internal PLL providing the 4x clock multiplication from an external oscillator source up to 16 MHz.
Does PIC18F66K22-E/MR support capacitive touch sensing?
Yes, the PIC18F66K22-E/MR includes the Charge Time Measurement Unit (CTMU) hardware block that simplifies capacitive touch button, slider, and proximity sensor designs. The CTMU produces a precise constant-current source and timing measurement that the firmware uses to detect capacitance changes caused by finger contact.
What is the operating voltage range of PIC18F66K22-E/MR?
The PIC18F66K22-E/MR operates from 1.8 V to 5.5 V, allowing direct connection to single-cell Li-ion (3.7 V nominal), 3.3 V, or 5 V rails. Below 3.0 V, the maximum CPU speed is reduced per the datasheet frequency-versus-voltage curve; at full 64 MHz operation, Vdd must remain above approximately 4.2 V.
What is the difference between PIC18F66K22-E/MR and PIC18F66K22-I/MR?
The PIC18F66K22-E/MR is the extended temperature grade (-40 C to +125 C), while the PIC18F66K22-I/MR is the industrial temperature grade (-40 C to +85 C). Both share the same 64-VQFN (9x9) package and identical electrical specifications, so the parts are functionally drop-in compatible, differing only in qualified operating temperature.
Where to buy PIC18F66K22-E/MR online?
The PIC18F66K22-E/MR is available from authorized distributors including DigiKey (listing 2681305), Mouser, Microchip Direct, Octopart-aggregated stockists, and LCSC. As of 2026-09-28, distributor pricing starts around $5.92 per unit at qty 1, decreasing to roughly $3.79 per unit at qty 1000 with bulk discounts.
What is the lead time for PIC18F66K22-E/MR?
According to DigiKey and Mouser listings as of 2026-09-28, the PIC18F66K22-E/MR shows 'ships today' status with no factory lead time on stock reels. Factory lead times for non-stocked reels typically range 8-14 weeks from Microchip due to wafer-fab production cycles; order ahead for production runs.
Is PIC18F66K22-E/MR pin-compatible with PIC18F65K22-E/MR?
Yes, the PIC18F66K22-E/MR (64 KB Flash) and PIC18F65K22-E/MR (32 KB Flash) share the same 64-pin VQFN (9x9) package and pinout, allowing drop-in upgrade of memory size without PCB rework. Firmware recompilation is needed because the Flash size differs, but the peripheral set, RAM, and EEPROM are otherwise identical.
What is the best drop-in replacement for PIC18F66K22-E/MR?
The best drop-in replacement is the PIC18F66K22-I/MR (industrial temperature grade), same 64-VQFN package and identical electrical specs. For more Flash memory, PIC18F67K22 or PIC18F87K22 family parts in the same package footprint provide 128 KB Flash. All three options are pin-compatible without PCB modification.
Where to download PIC18F66K22-E/MR datasheet PDF?
The official Microchip datasheet document 39984D can be downloaded from ww1.microchip.com/downloads/en/DeviceDoc/39984D.pdf or via the Microchip product page at microchip.com/en-us/product/PIC18F66K22. The datasheet is approximately 4 MB and covers 64/80-pin device variants with electrical characteristics, peripheral details, and programming specifications.
Where to find PIC18F66K22-E/MR pinout?
The PIC18F66K22-E/MR pinout for the 64-pin VQFN (9x9 mm) package is documented in section 1 of the manufacturer datasheet. Pin 1 is located by the dot marker on the package top; numbered counter-clockwise around the perimeter, with the exposed pad on the underside serving as the main thermal and ground connection.
What are the key specifications of PIC18F66K22-E/MR that engineers should know?
The PIC18F66K22-E/MR integrates an 8-bit PIC18 core at 64 MHz (16 MIPS), 64 KB Flash, 4 KB RAM, 1 KB EEPROM, 12-bit ADC up to 16 channels, CTMU capacitive touch hardware, and nanoWatt XLP low-power technology. It is housed in a 64-VQFN (9x9 mm) package and operates from 1.8 V to 5.5 V across -40 C to +125 C.
What is a cross-brand equivalent for PIC18F66K22-E/MR?
Direct cross-brand pin-compatible equivalents for the PIC18F66K22-E/MR in the 64-VQFN (9x9) package are limited because Microchip's PIC18 architecture is proprietary. Functionally comparable 8-bit MCUs in similar packages include Atmel/Microchip ATmega series and NXP ColdFire parts, but these require firmware porting and potentially PCB rework because pinouts differ.
Can PIC18F66K22T-I/MR replace PIC18F66K22-E/MR?
Yes, the PIC18F66K22T-I/MR is a tape-and-reel packaging variant of the PIC18F66K22 family sharing the same 64-VQFN (9x9) package, die, and pinout. It differs only in temperature grade (-I: -40 C to +85 C versus -E: -40 C to +125 C) and reel orientation; for high-temperature applications the -E variant must remain specified.

Dados de referência de engenharia para PIC18F66K22-E/MR — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC18F66K22-E/MR when you need a 64-pin VQFN 8-bit MCU with 64 KB Flash, 4 KB RAM, capacitive touch (CTMU), and an extended -40 C to +125 C temperature range for industrial, automotive, or outdoor applications. Select the PIC18F66K22-I/MR if your application is confined to -40 C to +85 C and you prefer industrial-grade pricing. Pick the PIC18F65K22-E/MR when 32 KB Flash and 2 KB RAM are sufficient - saving cost while keeping the same PCB footprint. For tape-and-reel assembly lines, the PIC18F66K22T-E/MR is identical to this part with T&R packaging. The PIC18F65K90 variants add specific peripherals and reduced memory, useful only when matched exactly to your BOM.

Comparação com alternativas

Parâmetro Este produto PIC18F66K22-I/MR PIC18F66K22T-I/MR PIC18F66K22T-E/MR PIC18F65K22-E/MR PIC18F65K90-I/MR PIC18F65K90-E/MR
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-VQFN (9x9) 64-VQFN (9x9) - same 64-VQFN (9x9) - same 64-VQFN (9x9) - same 64-VQFN (9x9) - same 64-VQFN (9x9) - same 64-VQFN (9x9) - same
Flash Memory 64 KB 64 KB 64 KB 64 KB 32 KB 32 KB 32 KB
Data RAM 4 KB 4 KB 4 KB 4 KB 2 KB 2 KB 2 KB
EEPROM 1 KB 1 KB 1 KB 1 KB 1 KB 1 KB 1 KB
Temperature Grade -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +125 C (Extended)
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V
Max CPU Speed 64 MHz (16 MIPS) 64 MHz (16 MIPS) 64 MHz (16 MIPS) 64 MHz (16 MIPS) 64 MHz (16 MIPS) 64 MHz (16 MIPS) 64 MHz (16 MIPS)
CTMU (Capacitive Touch) Yes Yes Yes Yes Yes Yes Yes

Principais diferenciais

  • Extended temperature grade for automotive/harsh-environment use (vs PIC18F66K22-I/MR)
  • Highest memory density in the 64-VQFN PIC18F6xK22 family (vs PIC18F65K22-E/MR)
  • Integrated CTMU for capacitive touch (vs PIC18F65K90-E/MR)

Notas de projeto

Decouple each Vdd pin with a 100 nF ceramic capacitor placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic capacitor near the package. For the VDDCORE pin (pin 30), follow Microchip's reference layout exactly: a 100 nF low-ESR ceramic capacitor must connect directly between VDDCORE and the nearest VSS pin. Insufficient VDDCORE decoupling can cause erratic CPU behavior at 64 MHz operation.

Estimated: At 64 MHz CPU speed, 5.5 V supply, and 50% I/O toggle load, the PIC18F66K22-E/MR dissipates approximately 50 mW typical, well within the 64-VQFN thermal envelope. The exposed pad (EP) on the package underside MUST be soldered to a copper pad of at least 50 mm^2 with multiple thermal vias to the inner ground plane to achieve the datasheet thermal resistance (theta_JA approximately 30 C/W). Without EP soldering, junction temperature rises rapidly and may exceed the +125 C maximum at extended ambient temperatures.

Avoid common pitfalls: (1) Do not exceed 5.5 V on any digital I/O pin - use clamping diodes for load-dump protection in automotive applications. (2) The CTMU constant-current source requires calibration per chip for accurate capacitance measurement; Microchip AN1250 documents the calibration procedure. (3) Flash self-programming requires specific erase/write sequences and the CONFIG bits must enable LVP or enter high-voltage programming mode correctly.

Route the high-speed signals (SPI, EUSART, PWM) above a continuous ground plane and avoid 90-degree bends. Place the analog reference pins AVdd/AVss adjacent to a quiet ground island separated by a small ferrite bead from the digital ground to reduce ADC reference noise. Trace lengths for the 16 MHz crystal (or external oscillator) should be minimized and surrounded by a grounded guard ring to suppress EMI pickup.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant per Microchip product page. The -E temperature grade (-40 C to +125 C) is suitable for many industrial/automotive applications but is NOT AEC-Q100 qualified; for AEC-Q100 automotive designs, see PIC18F46K80 or qualified K-series parts.

Dados verificados em: 2026-09-28 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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