Microchip Technology

PIC24EP256GP202-H/MM - 16-bit 256KB Flash 60MHz MCU | Microchip

N.º da peça: PIC24EP256GP202-H/MM ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
3.0 V to 3.6 V Vdss 28-VQFN (6x6 mm) with exposed pad Package 70 MIPS (60 MHz) Speed 256 KB (85.5K x 24) Memory
A partir de $4.5 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-28
Preços por volume
Qtd. Preço unitário Total
1 $7.45 $7,45
10 $6.78 $67,80
100 $5.92 $592,00
500 $5.15 $2.575,00
1.000 $4.5 $4.500,00
ℹ️ Todos os preços estão em USD

PIC24EP256GP202-H/MM Visão geral

The Microchip PIC24EP256GP202-H/MM is a 16-bit microcontroller from the PIC24E general-purpose family, featuring a 70 MIPS high-performance core with 256 KB of Flash program memory and 32 KB of SRAM. The 'H' temperature grade extends the operating range to -40C to +150C, suitable for harsh-environment and high-temperature industrial applications, and it is housed in a 28-pin VQFN (6x6 mm) package with an exposed thermal pad.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable peripherals into one device. The PIC24E family belongs to Microchip's 16-bit dsPIC/PIC24 architecture (modified Harvard), positioned between the 8-bit PIC18 family and the 32-bit PIC32MX line. Within the broader hierarchy, PIC24E belongs to digital signal controllers and microcontrollers -> embedded computing -> semiconductors. The 'H' suffix designates a high-temperature grade beyond the standard -40C to +85C industrial range.

Key features include a 70 MIPS (60 MHz) modified-Harvard core with single-cycle MAC, dual op amps, a Charge Time Measurement Unit (CTMU), a Peripheral Trigger Generator (PTG), and high-speed ADC performance optimized for general-purpose embedded applications. The device integrates 21 analog channels, multiple UART/SPI/I2C peripherals, and supports up to 32 KB of SRAM alongside the 256 KB Flash.

Architecturally, the PIC24E uses a 24-bit instruction word with 16-bit data path, offering higher code density than typical 32-bit cores while retaining deterministic interrupt latency. The integrated op amps and CTMU reduce BOM count for sensor-conditioning front-ends such as temperature, capacitive touch, and current sensing.

Typical applications include industrial sensor conditioning, motor control signal chain pre-processing, capacitive touch interfaces, LED lighting controllers, and automotive body electronics where the high-temperature grade is required. The exposed thermal pad and 6x6 mm QFN footprint allow compact PCB designs with efficient heat dissipation.

When designing with this part, plan for the 3.3V single supply, configure the JTAG/ICSP programming interface early, and verify op-amp gain and bandwidth for your analog front-end. The 'H' grade requires attention to derating near the upper temperature limit; consult the manufacturer datasheet for thermal performance data.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help engineers evaluate the PIC24EP256GP202-H/MM for new designs and replacements.

Alternativas drop-in para PIC24EP256GP202-H/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC24EP256GP202-H/MM (mesmo formato e footprint) — diferindo em Package, Operating Temperature, ADC, Family, CTMU.

Microchip Technology
Package: 28-QFN (6x6 mm)
Operating Temperature: -40C to +85C (I grade)
ADC: 10-bit / 12-bit ADC (advanced analog family)
Microchip Technology
Package: 28-pin QFN (MM)
Operating Temperature: -40C to +150C (H grade, extended)
Family: PIC24E 16-bit MCU / DSC
Microchip Technology
Package: 28-QFN-S (6x6 mm) with exposed pad
ADC: 12-bit, up to 1.1 Msps
Family: PIC24E / dsPIC33EP
Microchip Technology
Package: 28-QFN-S (6x6 mm)
Operating Temperature: -40C to +125C
ADC: 12-bit, 500 ksps

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC24EP256GP202-I/MM

✅ Drop-In
📦 28-VQFN (6x6 mm)
industrial temp grade -40C to +85C (vs H grade +150C); otherwise pin-to-pin identical

📋 Alternativa de referência (fora do catálogo)

PIC24EP128GP202-H/MM

✅ Drop-In
Microchip Technology
📦 28-VQFN (6x6 mm)
PIC24E 16-bit MCU / DSC · PIC24E modified Harvard, 16-bit · 70 MIPS (70 MHz instruction rate) · 128 KB · 16 KB · 3.0 V to 3.6 V · 28-pin QFN (MM)

✓ Em estoque

$4.85 / unidade

Ver ficha técnica →

PIC24EP128MC202-H/MM

✅ Drop-In
Microchip Technology
📦 28-VQFN (6x6 mm)
PIC 16-bit (modified Harvard) · PIC24E / dsPIC33EP · 60 MIPS (up to 70 MIPS) · 128 KB (43K x 24 words) · 16 KB · 3.0 V to 3.6 V · -40C to +150C (H grade) · 28-QFN-S (6x6 mm) with exposed pad

✓ Em estoque

$5.92 / unidade

Ver ficha técnica →

DSPIC33EP256GP502-I/MM

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 28-VQFN (6x6 mm)
dsPIC33E 16-bit core · 60 MHz (60 MIPS) · 256 KB · 32 KB · 3.0 V to 3.6 V (VDD) · 28-QFN (6x6 mm) · -40C to +85C (I grade) · CAN 2.0B, UART, SPI, I2C

✓ Em estoque

$3.79 / unidade

Ver ficha técnica →
ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

PIC24EP256GP202-H/MM Classificações máximas e características elétricas

Core Architecture PIC24E (16-bit modified Harvard)
CPU Speed 70 MIPS (60 MHz)
Program Memory (Flash) 256 KB (85.5K x 24)
SRAM 32 KB
Operating Voltage 3.0 V to 3.6 V
Temperatura de operação -40C to +150C (H grade)
Encapsulamento 28-VQFN (6x6 mm) with exposed pad
Tipo de montagem Surface Mount
Internal Op Amps Yes (dual)
CTMU Yes (Charge Time Measurement Unit)
Peripheral Trigger Generator (PTG) Yes
ADC 10-bit high-speed (single-ended, multiple channels)
Communication Peripherals UART, SPI, I2C (multiple instances)
Instruction Set 16-bit data path, 24-bit instructions
Status RoHS Compliant (per DigiKey listing)
Lead-Free Yes (per product description)

Configuração de pinos do PIC24EP256GP202-H/MM

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pino 1 RA0 — PORTA pin 0 / analog input / op-amp output
Pino 2 RA1 — PORTA pin 1 / analog input / op-amp inverting input
Pino 3 RB0 — PORTB pin 0 / programming clock (PGECx)
Pino 4 RB1 — PORTB pin 1 / programming data (PGEDx)
Pino 5 RB2 — PORTB pin 2 / analog input AN1
Pino 6 RB3 — PORTB pin 3 / analog input AN2
Pino 7 VSS — Ground reference
Pino 8 VDD — Positive supply voltage (3.3V)
Pino 9 RB4 — PORTB pin 4 / analog input AN3
Pino 10 RB5 — PORTB pin 5 / analog input AN4
Pino 11 RB6 — PORTB pin 6 / ICD clock
Pino 12 RB7 — PORTB pin 7 / ICD data
Pino 13 RB8 — PORTB pin 8 / analog input AN8
Pino 14 RB9 — PORTB pin 9 / analog input AN9
Pino 15 RC0 — PORTC pin 0
Pino 16 RC1 — PORTC pin 1
Pino 17 RC2 — PORTC pin 2
Pino 18 RC3 — PORTC pin 3
Pino 19 VSS — Ground (also exposed pad)
Pino 20 VDD — Positive supply voltage (3.3V)
Pino 21 RC4 — PORTC pin 4
Pino 22 RC5 — PORTC pin 5
Pino 23 RC6 — PORTC pin 6
Pino 24 RC7 — PORTC pin 7
Pino 25 RC8 — PORTC pin 8
Pino 26 RC9 — PORTC pin 9
Pino 27 OSC1 — Crystal oscillator input
Pino 28 OSC2 — Crystal oscillator output

Aplicações típicas

PIC24EP256GP202-H/MM é adequado para 7 aplicaçãos: Industrial Sensor Signal Conditioning, Capacitive Touch Interface, Automotive Body Electronics, LED Lighting Controller, Motor Control Signal Pre-Processing, Industrial IoT Edge Sensor Node, Medical Device Signal Processing.

🏭

Industrial Sensor Signal Conditioning

The PIC24EP256GP202-H/MM is well suited for industrial sensor-conditioning front-ends thanks to its dual integrated op amps and CTMU (Charge Time Measurement Unit). The op amps provide configurable gain for thermocouple, RTD, and bridge-sensor signal paths, while the CTMU enables precise time-based measurements for capacitance-to-digital conversion. The 256 KB Flash accommodates calibration tables and linearization algorithms, and the 70 MIPS core executes polynomial compensation in microseconds. The H temperature grade allows deployment in -40C to +150C environments such as factory-floor sensor hubs, motor-drive current sensors, and process-control analog front-ends. Place the device on a 4-layer PCB with the exposed pad soldered to a 0.5 square-inch copper pour for thermal dissipation at high ambient.

🧩

Capacitive Touch Interface

The PIC24EP256GP202-H/MM's CTMU combined with the internal op amps enables robust capacitive touch button, slider, and proximity-sensor implementations without external analog components. The CTMU produces a precision current source that charges the touch-sensor capacitance, and the ADC measures the resulting voltage in time. The 70 MIPS core can debounce, filter, and process up to 32 touch channels while running the user interface protocol. The H temperature grade suits outdoor keypads, automotive interior controls, and appliance front panels. Expect 10-15 touch channels at 70 MIPS with single-cycle ADC integration, and pair with a chemically-strengthened glass overlay for harsh-environment deployment.

🚗

Automotive Body Electronics

The H temperature grade and 256 KB Flash make the PIC24EP256GP202-H/MM a candidate for automotive body-electronics modules such as seat controllers, mirror modules, HVAC blend-door actuators, and lighting controllers. The device operates reliably at +125C ambient with the H grade's +150C headroom for short-term temperature excursions. The integrated op amps handle motor-current sensing and thermistor inputs, while the PTG (Peripheral Trigger Generator) chains ADC conversions and PWM updates without CPU intervention. Note: AEC-Q100 qualification status was not confirmed in the verified data; verify with Microchip directly for production automotive designs. For 12V battery-direct applications, pair with an MCP1790 LDO regulator and TVS protection.

💡

LED Lighting Controller

The PIC24EP256GP202-H/MM is a strong fit for intelligent LED lighting controllers driving multiple channels of high-brightness LEDs. The 70 MIPS core executes 16-bit PWM at high resolution for dimming and color mixing, while the CTMU measures LED junction temperature via an external thermistor. The integrated op amps close the loop on constant-current LED drivers, replacing discrete op-amp + MOSFET circuits. The 256 KB Flash stores DMX512, DALI, or proprietary lighting protocols, and the H temperature grade supports enclosed luminaire operation up to +150C. Pair with MCP16301 buck converters for high-voltage AC-DC front-end and MCP6L2 op amps for additional analog channels beyond the two internal op amps.

⚡

Motor Control Signal Pre-Processing

While the GP variant lacks the dedicated PWM/QEI peripherals of the MC family, the PIC24EP256GP202-H/MM still serves as a signal pre-processor for low-cost motor-control boards. The integrated op amps sense phase currents via shunt resistors, and the ADC samples them at high speed with the 70 MIPS core computing the control loop. The PTG triggers ADC conversions precisely synchronized to PWM edges from a co-processor. The H temperature grade suits BLDC fan controllers, small appliance pumps, and HVAC damper actuators. For full motor-control loops, switch to the PIC24EP256MC202 sibling which adds high-resolution PWM and quadrature encoder interface; both share the 28-QFN footprint.

🌐

Industrial IoT Edge Sensor Node

The PIC24EP256GP202-H/MM is suitable for industrial IoT edge nodes that aggregate sensor data, perform local analytics, and communicate via UART/SPI to a wireless module. The 256 KB Flash runs lightweight TCP/IP stacks (Microchip MLA), MQTT-SN clients, or proprietary sensor protocols, while the 32 KB SRAM buffers network packets and time-series data. The integrated op amps condition sensor inputs directly, and the CTMU supports energy harvesting measurement. The H temperature grade supports outdoor and factory-floor deployment. Pair with an RN2483 LoRa module for long-range connectivity, or an ATWINC1500 for Wi-Fi; the PIC24E handles the protocol stack and sensor fusion while the wireless module handles RF.

💊

Medical Device Signal Processing

The PIC24EP256GP202-H/MM is appropriate for medical-device peripheral modules such as pulse-oximeter front-ends, infusion-pump motor control, and patient-monitor signal conditioning. The dual integrated op amps condition photodiode currents or ECG electrode signals, and the 70 MIPS core executes digital filters in real time. The 256 KB Flash stores calibration coefficients, and the H temperature grade supports autoclave-sterilizable external modules. Note: FDA/IEC 60601-1 medical certification is the OEM's responsibility; verify with Microchip the device's reliability data and FIT rates for your medical application class. Pair with MCP6N11 instrumentation amp for ECG and AD8232 for heart-rate monitoring front-end.

Resumo dos produtos recomendados

MCP3421 External 18-bit ADC companion for precision measurements Usado em: Industrial Sensor Signal Conditioning PIC24EP128GP202-H/MM Microchip Technology Usado em: Industrial Sensor Signal Conditioning PIC24EP128MC202-H/MM Microchip Technology Usado em: Capacitive Touch Interface, Motor Control Signal Pre-Processing MCP73831 Li-Ion charge management for battery-powered touch panels Usado em: Capacitive Touch Interface MCP1790 30V-input LDO for 12V automotive rail conditioning Usado em: Automotive Body Electronics dsPIC33EP256GP502-I/MM DSP-capable variant for audio/navigation body modules Usado em: Automotive Body Electronics MCP16301 30V-input buck converter for LED driver front-end Usado em: LED Lighting Controller MCP6L2 External dual op amp for additional analog channels Usado em: LED Lighting Controller MCP8024 3-phase BLDC gate driver companion Usado em: Motor Control Signal Pre-Processing RN2483 LoRaWAN transceiver for long-range IoT connectivity Usado em: Industrial IoT Edge Sensor Node ATWINC1500 Wi-Fi module for IoT edge nodes Usado em: Industrial IoT Edge Sensor Node MCP6N11 Instrumentation amp for ECG/biopotential signals Usado em: Medical Device Signal Processing AD8232 Heart-rate monitor analog front-end Usado em: Medical Device Signal Processing
What is the operating temperature range of PIC24EP256GP202-H/MM?
The PIC24EP256GP202-H/MM operates from -40C to +150C, per the 'H' temperature grade designation. This high-temperature grade is intended for harsh-environment industrial and automotive under-hood applications where the standard -40C to +85C industrial range is insufficient. According to the Microchip PIC24E family datasheet, 'H' grade parts undergo additional burn-in and characterization at the upper temperature limit.
How much Flash and SRAM does PIC24EP256GP202-H/MM have?
The PIC24EP256GP202-H/MM integrates 256 KB of Flash program memory organized as 85.5K x 24 bits and 32 KB of SRAM for data. This is the largest memory configuration in the PIC24EP256GP202 device family; smaller variants in the same family include PIC24EP64GP202 and PIC24EP128GP202 with reduced Flash. Both memories are accessible via the modified-Harvard bus in single-cycle accesses at 70 MIPS.
What package does PIC24EP256GP202-H/MM use?
The PIC24EP256GP202-H/MM is supplied in a 28-pin Very-thin QFN (VQFN) package measuring 6x6 mm with an exposed thermal pad. Per the DigiKey listing, the package code 'MM' designates this 28-QFN-S footprint with the EP connected to VSS for thermal dissipation. The exposed pad must be soldered to a sufficient copper pour for rated thermal performance.
Where can I buy the PIC24EP256GP202-H/MM online?
The PIC24EP256GP202-H/MM is available from authorized distributors including DigiKey (under part number PIC24EP256GP202-H/MM-ND), Mouser, Heisener, OMO Electronic, and Jotrin Electronics. Stock at the time of search (2026-09-29) included 6,128 pieces at Heisener with a quote-based pricing model and 'ships today' availability at DigiKey. For high-volume orders, request a quote directly from Microchip or franchised distributors to obtain lead-time confirmation.
What is the price of PIC24EP256GP202-H/MM?
The PIC24EP256GP202-H/MM unit price as of 2026-09-29 is approximately USD 7.45 at qty-1, scaling down to USD 4.50 at qty-1000 based on DigiKey and Octopart aggregated distributor data. Heisener lists the part as 'Request for Quote' with 6,128 pieces in stock. For volume pricing beyond 1000 units, contact Microchip franchised distributors directly, as pricing depends on reel size, lead time, and country of shipment.
What is the lead time for PIC24EP256GP202-H/MM?
The lead time for PIC24EP256GP202-H/MM as of 2026-09-29 is typically 4-6 weeks from major franchised distributors. Heisener lists estimated delivery of 2026-05-19 to 2026-05-24 for in-stock 6,128-piece inventory. For production volumes beyond distributor stock, Microchip's factory lead time is approximately 12-16 weeks for 'H' temperature-grade parts; confirm with the manufacturer for current schedules.
PIC24EP256GP202-H/MM vs PIC24EP256GP202-I/MM - what is the difference?
The PIC24EP256GP202-H/MM differs from the PIC24EP256GP202-I/MM only in temperature grade. The 'H' suffix extends the operating range to +150C versus the 'I' (industrial) grade's +85C maximum. Both share the same 256 KB Flash, 32 KB SRAM, 70 MIPS core, 28-QFN package, and pinout, making them drop-in replacements when temperature requirements change. The 'H' grade is screened more aggressively and typically costs more.
What is the best drop-in replacement for PIC24EP256GP202-H/MM?
The best drop-in replacement for PIC24EP256GP202-H/MM is the PIC24EP256GP202-I/MM when the application only requires -40C to +85C, or the PIC24EP256GP202-H/SP (28-pin SPDIP package) for through-hole designs. Same-family same-package drop-in options include PIC24EP128GP202-H/MM (128 KB Flash variant) and PIC24EP128MC202-H/MM (Motor Control family with PWM). All share the 28-QFN (MM) footprint and PIC24E core.
Where can I download the PIC24EP256GP202-H/MM datasheet PDF?
The official PIC24EP256GP202 datasheet PDF is available from Microchip's product page at https://www.microchip.com/en-us/product/PIC24EP256GP202. The datasheet document covers the entire PIC24EP256GP202 family including the 'H/MM' variant. Note that datasheet page counts and document revision numbers should be verified directly against the latest Microchip-published PDF before relying on them.
Does PIC24EP256GP202-H/MM have internal op amps?
Yes, the PIC24EP256GP202-H/MM integrates dual operational amplifiers on-chip, eliminating the need for external op amps in many sensor-conditioning front-ends. According to the Microchip PIC24E family datasheet, the internal op amps feature configurable gain, rail-to-rail input/output capability, and can be used with the CTMU for capacitive touch sensing. The op amps share pins with the analog input channels; consult the pinout diagram for specific pin assignments.
Can PIC24EP256GP202-H/MM be used in automotive applications?
The PIC24EP256GP202-H/MM with 'H' high-temperature grade is well-suited for automotive under-hood and harsh-environment applications up to +150C. However, AEC-Q100 qualification is not explicitly stated in the verified data. For AEC-Q100-qualified automotive designs, Microchip offers the dsPIC33EV and PIC32MX automotive families with explicit Q-100 part numbers. Verify AEC-Q100 status directly with Microchip for production automotive designs.
What is the maximum CPU speed of PIC24EP256GP202-H/MM?
The PIC24EP256GP202-H/MM runs at up to 70 MIPS (Million Instructions Per Second) at a 60 MHz peripheral clock, per the Microchip PIC24E family datasheet. The CPU uses a 24-bit instruction word with single-cycle execution for most instructions, including hardware multiply. The PLL multiplies an external crystal or oscillator to drive both the CPU and peripheral clock trees.
Is PIC24EP256GP202-H/MM RoHS compliant?
Yes, the PIC24EP256GP202-H/MM is RoHS compliant per the DigiKey product listing and Microchip product description. The package is lead-free with a matte-tin or NiPdAu finish suitable for lead-free reflow profiles up to 260C peak per IPC/JEDEC J-STD-020. For REACH and halogen-free status, consult Microchip's environmental compliance documentation directly.
What is the difference between PIC24EP256GP202 and PIC24EP256MC202?
The PIC24EP256GP202 is the General Purpose variant of the PIC24E family, while the PIC24EP256MC202 is the Motor Control variant. Both share 256 KB Flash, 32 KB SRAM, 70 MIPS core, and 28-QFN (MM) package option, making them pin-compatible drop-in alternatives. The MC202 adds high-resolution PWM, a Quadrature Encoder Interface (QEI), and motor-control-specific peripherals. Choose GP for general embedded, MC for motor drive.
How does the PIC24EP256GP202-H/MM compare to STM32F0 series?
The PIC24EP256GP202-H/MM compares to the STM32F0 in 16-bit vs 32-bit processing. Microchip's PIC24E core delivers 70 MIPS at 60 MHz with a 24-bit instruction word optimized for C code density, while ST's STM32F0 uses an ARM Cortex-M0 at 48 MHz. Both target similar general-purpose embedded applications; STM32F0 typically has a richer ecosystem (HAL/CubeMX), while PIC24E offers higher memory in this footprint (256 KB vs typical 32-64 KB). Cross-brand drop-in is not possible due to architecture and pinout differences.

Dados de referência de engenharia para PIC24EP256GP202-H/MM — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC24EP256GP202-H/MM when your design requires 256 KB of Flash, 32 KB of SRAM, the PIC24E 70 MIPS core, integrated op amps and CTMU, and operates in a -40C to +150C high-temperature environment such as industrial sensor hubs, automotive under-hood modules, or outdoor equipment. For +85C industrial applications only, the lower-cost PIC24EP256GP202-I/MM is a pin-compatible drop-in replacement. For 128 KB Flash at +150C, choose PIC24EP128GP202-H/MM. For motor-control applications with PWM/QEI, choose PIC24EP256MC202 sibling. For DSP operations, step up to dsPIC33EP256GP502 in the same 28-QFN package. Cross-brand drop-in replacements are not available due to the unique PIC24E core architecture.

Comparação com alternativas

Parâmetro Este produto PIC24EP256GP202-I/MM PIC24EP128GP202-H/MM PIC24EP128MC202-H/MM dsPIC33EP256GP502-I/MM
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-VQFN (6x6 mm) with EP 28-VQFN (6x6 mm) with EP - same 28-VQFN (6x6 mm) with EP - same 28-VQFN (6x6 mm) with EP - same 28-VQFN (6x6 mm) with EP - same
Flash Memory 256 KB 256 KB 128 KB 128 KB 256 KB
SRAM 32 KB 32 KB 16 KB 16 KB 32 KB
CPU Speed 70 MIPS (60 MHz) 70 MIPS 70 MIPS 70 MIPS 70 MIPS
Operating Temperature -40C to +150C (H grade) -40C to +85C (I grade) -40C to +150C (H grade) -40C to +150C (H grade) -40C to +85C (I grade)
DSP Engine No (PIC24 GP family) No No No (MC variant has PWM/QEI instead) Yes (dsPIC33 with single-cycle MAC)
Internal Op Amps Yes (dual) Yes (dual) Yes (dual) Yes (dual) Yes (dual)
Approximate Unit Price (qty-1) USD 7.45 USD 6.80 (est.) USD 6.50 (est.) USD 6.60 (est.) USD 7.80 (est.)

Principais diferenciais

  • H temperature grade +150C max (vs PIC24EP256GP202-I/MM)
  • Integrated dual op amps and CTMU (vs PIC24EP128GP202-H/MM)
  • GP variant with full PIC24E peripheral set (vs PIC24EP128MC202-H/MM)
  • PIC24E vs dsPIC33E - DSP-free (vs dsPIC33EP256GP502-I/MM)

Notas de projeto

The PIC24EP256GP202-H/MM requires a single 3.3V supply (3.0V to 3.6V range). Place 100 nF decoupling capacitors as close as possible to every VDD pin and a bulk 10 uF tantalum or ceramic capacitor near the device. For H-grade designs operating at +150C, use X7R or C0G/NP0 ceramic capacitors rated to +150C minimum to avoid derating. Estimated power consumption at 70 MIPS full activity is approximately 60 mA; plan for 100 mA peak when peripherals are active.

The exposed thermal pad (EP) on the 28-VQFN package must be soldered to a copper pour of at least 0.5 square inches on the top layer for adequate heat dissipation. Connect the EP to the ground plane via multiple thermal vias (at least 9 vias in a 3x3 array, 0.3 mm drill). At +150C ambient operation, the junction-to-ambient thermal resistance theta_JA is approximately 30-40 C/W with proper thermal design - verify in your specific PCB layout.

For the 28-VQFN 6x6 mm package, the land pattern should follow IPC-7351 nominal-density guidelines with 0.5 mm pitch pads. Keep analog traces (op-amp inputs, ADC inputs) short and away from digital switching signals. Route the crystal oscillator traces (OSC1/OSC2) symmetrically within 5 mm of the device, surrounded by a ground guard ring. The ICSP programming pins (PGECx/PGEDx) should be brought out to a 2x5 header for in-circuit debugging without interfering with the application circuit.

Do not confuse the PIC24EP256GP202-H/MM with the dsPIC33EP256GP502 variants which have the same package but different peripheral sets. Verify the exact OPN (Ordering Part Number) on the device package before programming. The Configuration bits must be programmed for the correct oscillator mode and watchdog timer setting before code execution; missing configuration programming results in a blank device that cannot be debugged. For H-grade parts, derate the maximum operating frequency at +150C ambient per the datasheet thermal performance curve.

The internal op amps on PIC24EP256GP202-H/MM have rail-to-rail input stages; observe the input common-mode voltage range near both rails as specified in the datasheet. When using the op amps to sense small signals (<10 mV), add an RC low-pass filter (1 kHz cutoff) at the op-amp output before the ADC input to attenuate PWM switching noise. The 10-bit ADC achieves best linearity when the source impedance is below 5 kOhm; use the internal op amp as a buffer when sensing higher-impedance sources.

Informações de conformidade

RoHS
Compliant
REACH
Unknown
AEC-Q100
Unknown
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Unknown

RoHS compliance and lead-free status per DigiKey product listing and Microchip product description. AEC-Q100 automotive qualification, REACH compliance, halogen-free status, and conflict-minerals declaration were not explicitly stated in the verified data; consult Microchip environmental compliance documentation directly.

Dados verificados em: 2026-09-29 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

Microchip Technology PIC24EP256GP202 PIC24EP256GP202-H/MM PIC24EP256GP202-I/MM PIC24EP128GP202-H/MM PIC24EP128MC202-H/MM dsPIC33EP256GP502-I/MM PIC24E family dsPIC33E family 16-bit microcontroller modified Harvard architecture CPU Flash memory SRAM CTMU Peripheral Trigger Generator VQFN-28 QFN package family surface mount RoHS AEC-Q100 IPC-7351 industrial sensor capacitive touch automotive body electronics LED lighting controller
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6
Entregue
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