PIC24EP256GP202T-E/MM - 16-Bit 60 MIPS MCU 256KB Flash 28-QFN | Microchip
N.º da peça: PIC24EP256GP202T-E/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.92 | $6,92 |
| 10 | $6.23 | $62,30 |
| 100 | $5.55 | $555,00 |
| 500 | $4.98 | $2.490,00 |
| 1.000 | $4.42 | $4.420,00 |
PIC24EP256GP202T-E/MM Visão geral
What is a PIC24EP microcontroller? A 16-bit PIC microcontroller (MCU) is a Harvard-architecture device that uses a 16-bit instruction word with separate program and data buses, giving it roughly 2x the code density of 8-bit MCUs and 70 MIPS peak throughput. The PIC24EP family sits in the upper-middle tier of Microchip's dsPIC/PIC24 lineup, above PIC24F and below dsPIC33F DSC parts. It bridges general-purpose control and signal-processing applications, fitting between basic 8-bit PIC16/PIC18 control and full dsPIC33 motor/DSP designs.
Key features include 60 MIPS core throughput from a 70 MIPS-capable CPU, a 12-bit ADC with 500 ksps sampling rate, four on-chip op amps for analog front-end signal conditioning, a CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, and a Peripheral Trigger Generator (PTG) that sequences peripherals without CPU intervention. Communication peripherals include I2C, IrDA, SPI, UART/USART with LINbus support, and a Parallel Master Port for external memory. The AEC-Q100 qualification and -40C to +125C operating temperature range make this part suitable for automotive and industrial environments.
Architecturally, the PIC24EP256GP202 uses a modified Harvard core with a 24-bit instruction path feeding a 16-bit data ALU and DSP engine. This combination enables zero-overhead hardware loops and 16x16-bit single-cycle MAC operations, supporting digital filter and control-loop code at no DSP cost. The internal voltage regulator allows single 3.3V supply operation, and the 28-QFN package offers a thermal pad for improved power dissipation.
Typical applications include automotive body and chassis control modules, industrial sensor signal conditioning with on-chip op amps, consumer appliance motor control, USB device peripherals using the Parallel Master Port, and capacitive touch human-machine interfaces using the CTMU. The compact 6x6 mm QFN footprint suits space-constrained designs.
When designing with the PIC24EP256GP202T-E/MM, ensure the PCB thermal pad is soldered to a properly sized copper pour for heat extraction. Decouple VDD with 10uF and 0.1uF ceramic capacitors placed within 5 mm of the supply pins. For CTMU-based capacitive touch, calibrate the trim register per Microchip application note AN1250 for production yield.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with actionable selection and sourcing information.
Alternativas drop-in para PIC24EP256GP202T-E/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24EP256GP202T-E/MM (mesmo formato e footprint) — diferindo em ADC, Operating Temperature, Package, CPU Speed, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24EP256GP202-E/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24EP128GP202-E/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24EP256MC202-E/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24EP128MC202-E/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24EP256GP202-H/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.5 / unidade
Ver ficha técnica →PIC24EP256GP202T-E/MM Classificações máximas e características elétricas
| Core Architecture | PIC 16-bit (modified Harvard, 24-bit instruction path) |
| Family | PIC24EP |
| Core Performance | 60 MIPS (70 MIPS-capable CPU, specified at 60 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data Memory (RAM) | 16 KB |
| Encapsulamento | 28-QFN-S (6x6 mm) |
| Tipo de montagem | Surface Mount |
| Tensão de alimentação | 3.0 V to 3.6 V |
| Temperatura de operação | -40C to +125C |
| ADC | 12-bit, 500 ksps |
| On-chip Op Amps | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Communication Peripherals | I2C, IrDA, LINbus, SPI, UART/USART |
| Parallel Master Port | Yes |
| Automotive Qualification | AEC-Q100 |
| Status RoHS | Compliant |
Configuração de pinos do PIC24EP256GP202T-E/MM
| Pino 1 | OSC1/RA0 — Oscillator input or general I/O RA0 |
| Pino 2 | OSC2/RA1 — Oscillator output or general I/O RA1 |
| Pino 3 | RA2 — General I/O RA2 |
| Pino 4 | RA3 — General I/O RA3 |
| Pino 5 | RA4 — General I/O RA4 |
| Pino 6 | VDD — Positive supply 3.0-3.6V |
| Pino 7 | VSS — Ground reference |
| Pino 8 | RB0 — General I/O RB0 / PGED1 (programming) |
| Pino 9 | RB1 — General I/O RB1 / PGEC1 (programming) |
| Pino 10 | RB2 — General I/O RB2 |
| Pino 11 | RB3 — General I/O RB3 |
| Pino 12 | RB4 — General I/O RB4 |
| Pino 13 | RB5 — General I/O RB5 |
| Pino 14 | RB6 — General I/O RB6 |
| Pino 15 | RB7 — General I/O RB7 |
| Pino 16 | RC0 — General I/O RC0 |
| Pino 17 | RC1 — General I/O RC1 |
| Pino 18 | RC2 — General I/O RC2 |
| Pino 19 | RC3 — General I/O RC3 |
| Pino 20 | RC4 — General I/O RC4 |
| Pino 21 | RC5 — General I/O RC5 |
| Pino 22 | RC6 — General I/O RC6 |
| Pino 23 | RC7 — General I/O RC7 |
| Pino 24 | RD0 — General I/O RD0 |
| Pino 25 | RD1 — General I/O RD1 |
| Pino 26 | VSS — Ground reference |
| Pino 27 | VDD — Positive supply 3.0-3.6V |
| Pino 28 | RA5 — General I/O RA5 |
Aplicações típicas
PIC24EP256GP202T-E/MM é adequado para 6 aplicaçãos: Automotive Body Control Module, Industrial Sensor Signal Conditioning, Capacitive Touch Human-Machine Interface, Consumer Appliance Motor Control, USB Device Peripheral Interface, Lighting Control and Driver Module.
Automotive Body Control Module
The PIC24EP256GP202T-E/MM fits automotive body controllers because of its AEC-Q100 qualification, -40C to +125C operating range, and 256KB Flash for CAN/LIN stack plus body-control firmware. Its 60 MIPS core processes multiple LINbus messages and PWM-driven loads (lighting, mirror actuators, window lifters) concurrently. The on-chip CTMU and op amps allow direct interface to capacitive touch panels and analog sensor conditioning, replacing external analog front-end ICs and reducing BOM cost in zonal body controllers.
Recomendado
Industrial Sensor Signal Conditioning
With four on-chip operational amplifiers and a 12-bit 500 ksps ADC, the PIC24EP256GP202T-E/MM can directly condition and digitize bridge sensors, thermocouples, and 4-20 mA loops without external analog ICs. The PIC24EP core handles linearization, filtering, and calibration in firmware, while the 256KB Flash stores lookup tables and calibration coefficients. The AEC-Q100 grade also makes it viable for factory automation sensors exposed to wide temperature swings on the plant floor.
Recomendado
Capacitive Touch Human-Machine Interface
The PIC24EP256GP202T-E/MM integrates a CTMU peripheral that, combined with the 60 MIPS core and 256KB Flash, supports robust capacitive touch button, slider, and wheel implementations. The CTMU provides sub-nanosecond timing resolution for capacitive measurement, while the on-chip op amps buffer analog touch electrodes. Firmware libraries from Microchip (mTouch) run comfortably within the Flash budget, leaving room for application UI logic and communication stacks.
Recomendado
Consumer Appliance Motor Control
Although the PIC24EP256GP202T-E/MM is the GP (general-purpose) variant, it can drive BLDC, stepper, and brushed DC motors when paired with external gate drivers, using its on-chip op amps for current sensing and ADC for back-EMF. The 60 MIPS core runs FOC and PID control loops in real time, and 256KB Flash stores lookup tables for sinusoidal commutation. The -40C to +125C range and AEC-Q100 grade ensure reliable operation in appliance environments near heating elements.
Recomendado
USB Device Peripheral Interface
The PIC24EP256GP202T-E/MM integrates a Parallel Master Port and sufficient peripherals to act as a USB device controller with external ULPI/UTMI PHY or bit-banged USB via software on the I/O pins, depending on firmware architecture. The 256KB Flash accommodates USB class drivers (CDC, HID, MSD) and the 60 MIPS core handles USB interrupt latency requirements. The compact 28-QFN-S package suits USB dongles, HID peripherals, and industrial USB-to-CAN bridge designs.
Recomendado
Lighting Control and Driver Module
The PIC24EP256GP202T-E/MM drives LED lighting modules with PWM-controlled dimming, color mixing, and DMX/DALI communication protocols. The CTMU enables capacitive touch dimmers, and the 60 MIPS core runs color-temperature smoothing algorithms. AEC-Q100 qualification supports automotive interior/exterior lighting and architectural lighting controllers. The 28-QFN-S package fits within compact downlight and track-light driver housings alongside the power-stage MOSFETs and inductors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24EP256GP202T-E/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24EP256GP202-E/MM | PIC24EP128GP202-E/MM | PIC24EP256MC202-E/MM | PIC24EP128MC202-E/MM | PIC24EP256GP202-H/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6) | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB | 256 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Motor Control PWM | No (GP variant) | No (GP variant) | No (GP variant) | Yes (MC variant) | Yes (MC variant) | No (GP variant) |
| DSP Engine | No | No | No | Yes (DSP MAC) | Yes (DSP MAC) | No |
| AEC-Q100 Qualified | Yes (E grade -40C to +125C) | Yes (E grade) | Yes (E grade) | Yes (E grade) | Yes (E grade) | Yes (H grade - high reliability) |
| Packaging Form | Tape & Reel (T suffix) | Tray | Tray | Tray | Tray | Tray |
Principais diferenciais
- 256KB Flash at 28-QFN-S footprint (vs PIC24EP128GP202-E/MM)
- General-purpose variant without DSP engine overhead (vs PIC24EP256MC202-E/MM)
- AEC-Q100 automotive qualification standard E grade (vs PIC24EP256GP202-I/MM (industrial I grade))
- Tape-and-reel packaging for high-volume assembly (vs PIC24EP256GP202-E/MM (tray variant))
Notas de projeto
The 28-QFN-S package has an exposed thermal pad (EP) on the bottom that MUST be soldered to a PCB ground copper pour for proper thermal and electrical performance. Estimated: at 60 MIPS active core with peripherals active, total power dissipation is roughly 75 mW at 3.3V; with the QFN theta_JA of approximately 40 C/W on a 4-layer JEDEC test board, junction-to-ambient temperature rise is about 3C, leaving ample margin up to the 125C operating limit. For continuous high-MIPS workloads, expand the thermal-pad copper pour to at least 1 square inch.
Place a 10uF bulk decoupling capacitor and a 0.1uF ceramic high-frequency bypass capacitor within 5 mm of each VDD pin pair (pins 6 and 27 share one VDD rail; pins 7 and 26 share one VSS rail). The PIC24EP datasheet specifies a 1uF minimum on VCAP (internal regulator output capacitor pin). Use wide power traces (at least 0.5 mm) on VDD/VSS to minimize switching-induced voltage drops during peripheral bursts.
Route the external crystal traces (OSC1/OSC2, pins 1-2) as short, symmetric differential pairs with a grounded guard trace to prevent coupling of switching noise from digital I/O. Keep clock traces away from the analog op-amp output pins if used for sensitive signal conditioning. For CTMU capacitive touch applications, dedicate PCB guard rings around touch electrodes routed to a quiet analog ground reference to prevent false touches from nearby high-voltage switching nodes.
Do NOT use the PIC24EP256GP202T-E/MM in motor-control applications requiring dedicated PWM with hardware fault shutdown; the GP variant lacks Motor Control PWM peripherals. For BLDC or PMSM FOC designs, use the PIC24EP256MC202 variant instead. A common error is assuming the E temperature grade is optional; in automotive under-hood environments, the I-grade (-40C to +85C) part will fail EMC and thermal stress tests. Verify the full MPN suffix matches your qualification requirements before PCB layout finalization.
Informações de conformidade
AEC-Q100 qualified per verified DigiKey listing. RoHS compliant. The E temperature grade (-40C to +125C) confirms automotive qualification; the H grade adds high-reliability screening for additional harsh-environment duty.
