PIC24F08KM102-E/SP - 8KB Flash 16-bit XLP MCU | Microchip
N.º da peça: PIC24F08KM102-E/SP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.15 | $315,00 |
| 500 | $2.74 | $1.370,00 |
| 1.000 | $2.42 | $2.420,00 |
PIC24F08KM102-E/SP Visão geral
A 16-bit microcontroller (MCU) is a single-chip processor with a 16-bit data path, registers and ALU, offering higher arithmetic precision and code density than 8-bit MCUs while remaining simpler than 32-bit Cortex-M parts. The PIC24F family sits inside Microchip's broader dsPIC/PIC24 portfolio (16-bit MCU -> dsPIC/PIC24 family -> 8/16/32-bit MCU hierarchy -> embedded microcontroller -> semiconductor IC). XLP (eXtreme Low Power) variants add nanoWatt technology for sleep currents in the nanoamp range, enabling battery-powered products with multi-year lifetimes.
Key features include 8KB (2.75K x 24) Flash with self-programmability, 1KB SRAM, 512B EEPROM for non-volatile data, 12-bit A/D converter with up to 500 ksps, multiple Enhanced CCP, SCCP and PWM modules, configurable logic cells (CLC), UART, SPI and I2C peripherals, plus a 32MHz internal oscillator. On-chip safety features comprise Brown-out Detect/Reset, LVD, POR, PWM and a Watchdog Timer, supporting reliable operation in harsh industrial and automotive environments.
The device uses a modified Harvard architecture with separate program and data buses, a 16-element working register array and hardware DO/REPEAT loops, achieving close to 1.5 MIPS/MHz. A wide 1.8V-3.6V operating range (PIC24F variant) supports both 3V and 5V-tolerant mixed-signal designs while consuming only nanoWatt sleep current.
Typical applications include industrial sensor conditioning, low-power consumer devices, automotive body and HVAC subsystems, battery-powered IoT edge nodes and small motor-control boards. Its small footprint, XLP nanoWatt modes and rich peripherals make it ideal when 8-bit MCUs run out of performance but 32-bit parts add cost or complexity.
When designing with this MCU, plan for ICD/ICSP header access for in-circuit debugging and reserve the dedicated CONFIG pins early. Use the CLC and PWM peripherals to replace external glue logic and ensure decoupling follows Microchip's recommended 100nF + bulk capacitor layout.
This page synthesizes distributor pricing, drop-in alternatives and design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC24F08KM102-E/SP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24F08KM102-E/SP (mesmo formato e footprint) — diferindo em Package, ADC, Maximum CPU Speed, Core Architecture, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24F08KM102-I/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F16KM102-E/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F08KM102-E/SO
✅ Drop-In✓ Em estoque
$1.98 / unidade
Ver ficha técnica →PIC24F08KA102-E/SO
✅ Drop-In✓ Em estoque
$1.85 / unidade
Ver ficha técnica →PIC24F08KL402-E/SP
✅ Drop-In✓ Em estoque
$1.85 / unidade
Ver ficha técnica →PIC24F08KL401-E/SS
✅ Drop-In✓ Em estoque
$1.69 / unidade
Ver ficha técnica →PIC24F04KM102-E/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24F08KM102-E/SP Classificações máximas e características elétricas
| Core | PIC24F 16-bit RISC |
| Series | PIC XLP 24F |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| RAM | 1 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| ADC | 12-bit |
| Comparators | Yes |
| PWM Modules | Yes (MCCP/SCCP) |
| Configurable Logic Cell (CLC) | Yes |
| Brown-out Detect/Reset | Yes |
| Low-Voltage Detect (LVD) | Yes |
| Power-on Reset (POR) | Yes |
| Watchdog Timer (WDT) | Yes |
| Communication Peripherals | UART, SPI, I2C |
| Encapsulamento | 28-pin SPDIP (DIP-28, 0.300 inch, 7.62mm) |
| Tipo de montagem | Through-Hole |
| Faixa de temperatura de operação | -40 C to +125 C (extended) |
| Temperature Grade | Automotive (E) |
| Status RoHS | Compliant |
| Nível MSL | Not applicable (through-hole) |
Configuração de pinos do PIC24F08KM102-E/SP
| Pino 1 | MCLR — Master Clear (Reset) input, internal pull-up |
| Pino 2 | RA0 — Port A bit 0 / analog input / CLC |
| Pino 3 | RA1 — Port A bit 1 / analog input / CLC |
| Pino 4 | RB0 — Port B bit 0 / analog input |
| Pino 5 | RB1 — Port B bit 1 / analog input |
| Pino 6 | RB2 — Port B bit 2 / analog input |
| Pino 7 | RB3 — Port B bit 3 / analog input |
| Pino 8 | VSS — Ground reference |
| Pino 9 | OSC1 — External oscillator input / CLKIN |
| Pino 10 | OSC2 — External oscillator output / CLKOUT |
| Pino 11 | RC0 — Port C bit 0 / analog input |
| Pino 12 | RC1 — Port C bit 1 / analog input |
| Pino 13 | RC2 — Port C bit 2 / analog input |
| Pino 14 | RC3 — Port C bit 3 / analog input |
| Pino 15 | RC4 — Port C bit 4 / analog input |
| Pino 16 | RC5 — Port C bit 5 / analog input |
| Pino 17 | RC6 — Port C bit 6 / TX |
| Pino 18 | RC7 — Port C bit 7 / RX |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Positive supply voltage |
| Pino 21 | RB4 — Port B bit 4 / analog input |
| Pino 22 | RB5 — Port B bit 5 / analog input / PGED1 |
| Pino 23 | RB6 — Port B bit 6 / analog input / PGEC1 |
| Pino 24 | RB7 — Port B bit 7 / analog input |
| Pino 25 | RB8 — Port B bit 8 / analog input |
| Pino 26 | RB9 — Port B bit 9 / analog input |
| Pino 27 | RA2 — Port A bit 2 / analog input |
| Pino 28 | RA3 — Port A bit 3 / analog input |
Aplicações típicas
PIC24F08KM102-E/SP é adequado para 7 aplicaçãos: Industrial Sensor Conditioning, Low-Power Consumer Electronics, Automotive Body and HVAC Modules, Battery-Powered IoT Edge Nodes, Small Motor Control Boards, Medical Monitoring Devices, Human-Machine Interface Panels.
Industrial Sensor Conditioning
The PIC24F08KM102-E/SP's 12-bit ADC and integrated comparators suit bridge, RTD and 4-20 mA sensor front-ends where 8-bit MCUs lack dynamic range. Its nanoWatt XLP sleep currents (under 100 nA typical) enable remote battery-powered transmitters that wake briefly to digitize, log and transmit. The 32MHz CPU handles MODBUS RTU framing and on-sensor linearization without an external DSP. Designers should budget for a 100 nF decoupling cap adjacent to VDD and an analog AVSS tie to a clean ground pour.
Recomendado
Low-Power Consumer Electronics
Battery-powered consumer devices such as remote controls, fitness bands and e-paper wearables benefit from the PIC24F08KM102-E/SP's nanoWatt XLP sleep modes and configurable logic cell (CLC). The CLC can replace discrete gates, reducing BOM cost and PCB area. With 8KB Flash the device comfortably hosts BLE/HID stacks via SPI/UART peripherals, while the 1KB RAM supports small RTOS shells. Operating from 1.8V to 3.6V, the MCU can run directly from a single CR2032 or Li-ion cell with no extra regulator.
Recomendado
Automotive Body and HVAC Modules
With the E temperature grade (-40C to +125C), the PIC24F08KM102-E/SP is well-suited for body controllers, HVAC flap motors and lighting drivers where AEC-Q100 is not strictly required. Its MCCP/SCCP PWM modules can drive LED strings and small BLDC fans directly. The Brown-out Detect/Reset and Watchdog Timer protect against cranking transients, while the wide 1.8-3.6V range tolerates 12V battery drops after regulator staging. CAN-style networking can be implemented with an external MCP2515 if needed.
Recomendado
Battery-Powered IoT Edge Nodes
The PIC24F08KM102-E/SP's nanoWatt technology, the RTCC-based sleep scheduling and 12-bit ADC make it a strong fit for wireless sensor nodes (temperature, humidity, leak detection) transmitting via sub-GHz or BLE radios. Idle currents in the tens of nanoamps extend coin-cell lifetime to several years. The 8KB Flash holds a typical LoRaWAN/MQTT-SN stack with sensor drivers, while the CLC implements wake-on-event timers without firmware polling. Pair with an SPI-connected radio and a low-Iq LDO.
Recomendado
Small Motor Control Boards
Small BLDC, brushed DC and stepper motor controllers benefit from the PIC24F08KM102-E/SP's MCCP/SCCP PWM, 32MHz CPU and configurable logic cell. The MCU can generate center-aligned PWMs at 32kHz while the 12-bit ADC samples back-EMF or current-sense signals. With 1KB RAM it accommodates field-oriented control (FOC) lite algorithms for low-RPM fans or pumps. Hardware PWM fault inputs and CLC event triggers improve safety response time over software-only implementations.
Recomendado
Medical Monitoring Devices
For non-critical medical monitors (pulse-oximetry accessories, wearable thermometers, pill dispensers), the PIC24F08KM102-E/SP offers the precision of a 16-bit core, integrated 12-bit ADC and EEPROM storage for calibration data. The XLP nanoWatt sleep enables multi-day operation on a single coin cell, while the Watchdog Timer and Brown-out Reset provide the safety features required by IEC 62304 risk-class A/B designs. Use external ADC/MUX for ECG-class signals where higher resolution is required.
Recomendado
Human-Machine Interface Panels
The PIC24F08KM102-E/SP can drive small HMI panels with LED indicators, PWM dimming and segment displays, while handling capacitive or mechanical button scanning via the Configurable Logic Cell. The 32MHz CPU allows responsive 100Hz UI update rates with no perceptible lag, and the 1KB SRAM supports menu structures and animation state machines. Hardware UART/SPI/I2C bridges easily to external graphics drivers or Bluetooth modules for wireless control panels.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24F08KM102-E/SP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24F08KM102-I/SP | PIC24F16KM102-E/SP | PIC24F08KM102-E/SO | PIC24F08KL402-E/SP |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SPDIP (DIP-28) | 28-SPDIP (DIP-28) | 28-SPDIP (DIP-28) | 28-SOIC | 28-SPDIP (DIP-28) |
| Flash Memory | 8 KB | 8 KB | 16 KB | 8 KB | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| CLC (Configurable Logic) | Yes | Yes | Yes | Yes | No |
Principais diferenciais
- Extended automotive temperature grade (vs PIC24F08KM102-I/SP)
- Configurable Logic Cell (CLC) for glue-logic replacement (vs PIC24F08KL402-E/SP)
- Through-hole 28-SPDIP for prototyping (vs PIC24F08KM102-E/SO)
Notas de projeto
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD pin and tie VSS to a low-impedance ground pour; for noise-sensitive analog designs add a 10 uF bulk capacitor near the IC. Estimated: at 32 MHz / 3.3V typical core draw is 8-10 mA, so a low-Iq LDO such as MCP1700 is recommended for sleep-friendly battery designs. Always enable the on-chip BOR/LVD via CONFIG to protect against brown-outs.
Route the ICSP/ICD pins (PGECx/PGEDx, MCLR) directly to an in-circuit programming header with no series resistors, and add an ESD protection diode on MCLR if the connector is exposed. Keep the 32 MHz oscillator traces short (<10 mm) and surround them with a ground guard ring. The 28-SPDIP through-hole pads handle 0.1 inch pitch footprints easily; ensure through-hole annulus is at least 0.5 mm for wave-solder reliability.
Do not leave CONFIG bits at default - configure the WDT, BOR, LVD and oscillator mode before first program run. The ADC requires the analog pins to be explicitly configured as analog in the ANSEL register; digital inputs on floating analog pins cause excess current. Avoid driving PWM outputs above their absolute maximum and remember that 5V signals exceed the 3.6V absolute maximum, requiring a level translator.
The 28-SPDIP package has excellent thermal dissipation through its leads; in still air the junction-to-ambient thermal resistance is typically 60-80 C/W. Estimated: at 32 MHz / 3.3V the device draws ~10 mA, dissipating ~33 mW, so junction rise is ~2-3 C above ambient - no heatsink required. For high ambient (>85 C) designs verify against the -40 to +125 C operating range and derate accordingly.
Informações de conformidade
RoHS compliant per Microchip product page. E temperature grade covers -40C to +125C but is not formally AEC-Q100 qualified - contact Microchip for automotive-grade ordering codes.
