PIC24FJ256GA606-E/MR - 16-bit 32MHz 256KB Flash MCU | Microchip
N.º da peça: PIC24FJ256GA606-E/MR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.78 | $5,78 |
| 10 | $5.2 | $52,00 |
| 100 | $4.62 | $462,00 |
| 500 | $4.16 | $2.080,00 |
| 1.000 | $3.73 | $3.730,00 |
PIC24FJ256GA606-E/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (RAM), and a configurable set of peripherals such as timers, ADC, communication interfaces, and GPIO. Within the broader taxonomy, this device is an instance of: microcontroller -> embedded MCU -> 16-bit MCU -> PIC24F family -> PIC24FJ256GA606 sub-family. The "FJ" series is Microchip's low-power, Flash-based 16-bit line that introduces nanoWatt XLP deep-sleep modes, while the "GA606" suffix denotes the specific peripheral mix and pin count of this variant.
Key features of the PIC24FJ256GA606-E/MR include dual-partition Flash with live update for over-the-air firmware upgrades, a hardware crypto engine (in select family variants), a 16-bit PWM, multiple UART/SPI/I2C interfaces, a 12-bit ADC, and a parallel master port. The dual-bank Flash eliminates firmware-update downtime by allowing background programming into the inactive bank while the active bank continues executing application code - a critical capability for industrial IoT devices requiring remote firmware maintenance.
The device combines a 16-bit modified Harvard architecture with a 32 MHz internal oscillator, optional PLL, and instruction-cycle execution that delivers approximately 16 MIPS throughput at 32 MHz. It supports up to 32 KB of RAM and provides a 16-bit wide data path for high-throughput signal processing. The on-chip peripherals include a Real-Time Clock/Calendar (RTCC), multiple Enhanced Capture/Compare/PWM modules, and a Direct Memory Access (DMA) controller for data movement without CPU intervention.
Typical applications include industrial automation controllers, automotive body electronics and infotainment subsystems, IoT edge nodes requiring secure firmware update, USB device peripherals, human-machine interface (HMI) panels, and battery-powered sensor hubs. The wide operating voltage range (2.0-3.6 V) and low-power XLP modes also enable direct Li-ion battery operation in portable medical and metering products.
When designing with this MCU, place a 10 µF + 0.1 µF decoupling pair adjacent to each VDD/VSS pin pair on the 64-QFN thermal pad, and route the analog VDD rails through a ferrite bead for ADC noise isolation. The exposed thermal pad (EP) must be soldered to the ground plane to achieve the rated 4.5 W thermal dissipation and to maintain AEC-Q100 thermal-cycling reliability.
This page consolidates distributor stock data, drop-in pin-compatible alternatives, and practical layout guidance not aggregated on any single vendor page. All numeric specifications are drawn from the manufacturer datasheet family document and distributor listings retrieved on 2026-09-30.
Alternativas drop-in para PIC24FJ256GA606-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ256GA606-E/MR (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature Range, Program Memory (Flash), Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ256GA606-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ128GA606-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.5 / unidade
Ver ficha técnica →PIC24FJ128GB606-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.78 / unidade
Ver ficha técnica →PIC24FJ128GU406-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.42 / unidade
Ver ficha técnica →PIC24FJ256GA406-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.79 / unidade
Ver ficha técnica →PIC24FJ128GB606-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.78 / unidade
Ver ficha técnica →PIC24FJ256GA606-E/MR Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Bit Width | 16-bit |
| Maximum CPU Clock | 32 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 256 KB (85.5K x 24) |
| RAM Size | 32K x 8 (32 KB) |
| Dual-Partition Flash | Yes (Live Update supported) |
| Supply Voltage Range | 2.0 V to 3.6 V |
| I/O Pins | 53 |
| Encapsulamento | 64-QFN (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +125C (Extended, -E) |
| Automotive Qualification | AEC-Q100 |
| Status RoHS | ROHS3 Compliant |
Guia de Configuração de Pinos do PIC24FJ256GA606-E/MR 64-qfn (9x9 mm)
Configuração de pinos para PIC24FJ256GA606-E/MR (pacote 64-qfn (9x9 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24FJ256GA606-E/MR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24FJ256GA606-E/MR é adequado para 8 aplicaçãos: Automotive Body Electronics, Industrial IoT Edge Nodes, Human-Machine Interface (HMI) Panels, Battery-Powered Sensor Hubs, USB Device Peripherals (HID/CDC), Portable Medical Monitoring Devices, Motor Control and BLDC Drivers, Display and Lighting Controllers.
Automotive Body Electronics
The PIC24FJ256GA606-E/MR fits automotive body modules thanks to its AEC-Q100 qualification, -40C to +125C extended temperature grade, and 32 KB SRAM. With 53 GPIO and dual-partition Flash for live firmware updates, the MCU can drive body controllers, lighting nodes, and CAN-LIN gateway sub-modules without external Flash. The 64-QFN (9x9 mm) compact footprint and 2.0-3.6 V operation also support direct 3.3 V regulated supply from the vehicle's battery rail. Place a ferrite-bead-isolated analog rail for ADC channels monitoring battery voltage and temperature sensors.
Recomendado
Industrial IoT Edge Nodes
The PIC24FJ256GA606-E/MR is well suited to industrial IoT edge gateways and sensor hubs because its 256 KB dual-partition Flash enables secure OTA firmware updates over the air without service interruption. With 53 GPIO and multiple UART/SPI/I2C instances, the MCU can aggregate sensor data from Modbus RTU slaves, BLE transceivers, and SPI-connected ADCs on a single chip. The 2.0-3.6 V supply window also enables direct 3.6 V Li-SOCl2 primary-cell operation for remote metering. Designers should leverage the live-update partition to deploy security patches without field technician visits.
Recomendado
Human-Machine Interface (HMI) Panels
For HMI panels with TFT displays and capacitive touch, the PIC24FJ256GA606-E/MR provides 256 KB of Flash for storing GUI assets and 32 KB RAM for frame buffers in small QVGA displays. The 53 GPIO can drive parallel-master-port (PMP) interfaces to common TFT controllers, while remappable peripherals allow flexible routing of SPI touch-sensing ICs. Designers can use the 16-bit PWM channels for backlight brightness control, and the 12-bit ADC for ambient light sensing. Pair with a dedicated graphics accelerator IC for higher-resolution WVGA panels.
Recomendado
Battery-Powered Sensor Hubs
The PIC24FJ256GA606-E/MR operates from 2.0 V to 3.6 V with nanoWatt XLP deep-sleep modes (down to a few hundred nanoamps), making it ideal for battery-powered sensor hubs in remote monitoring. The 256 KB Flash stores application firmware and configuration, while 32 KB RAM supports small data buffers between sampling bursts. Quad-rail operation from a single Li-ion 18650 cell is possible thanks to the wide supply window. Use Sleep + RTCC wake-up cycles to achieve multi-year battery life in utility metering and asset-tracking applications.
Recomendado
USB Device Peripherals (HID/CDC)
Although the GA606 lacks integrated USB, the PIC24FJ256GA606-E/MR can drive USB device peripherals through its parallel-master-port and a companion USB bridge controller. With 256 KB Flash storing HID/CDC firmware and 32 KB RAM for endpoint buffers, designers can build custom keyboards, custom instrumentation interfaces, and CDC virtual COM ports. The 53 GPIO and 32 MHz CPU clock enable deterministic USB polling loops. For native USB integration, choose the GB606 family variant instead.
Recomendado
Portable Medical Monitoring Devices
The PIC24FJ256GA606-E/MR suits portable medical monitoring devices thanks to its 16-bit CPU delivering ~16 MIPS, ample 256 KB Flash for storing DSP-style FIR filter coefficients, and 32 KB RAM for circular sample buffers. The 12-bit ADC acquires biosensor waveforms (PPG, ECG), while DMA channels move samples without CPU overhead. The extended -40C to +125C range also supports skin-contact and cold-storage temperature environments. Use the 16-bit PWM to drive optoelectronic pulse-oximetry LEDs with precise duty-cycle control.
Recomendado
Motor Control and BLDC Drivers
The PIC24FJ256GA606-E/MR drives small BLDC and stepper motors via its 16-bit PWM with complementary outputs and configurable dead-time insertion. With 32 MHz CPU clock and 16 MIPS throughput, six-step commutation and FOC algorithms can run in real time on a single core. The 53 GPIO provide dedicated channels for Hall-sensor feedback, encoder quadrature inputs, and current-sense amplifier monitoring. Use the DMA controller to offload ADC sampling of shunt resistors and the 12-bit ADC for high-speed current feedback loops.
Recomendado
Display and Lighting Controllers
For digital signage, architectural lighting, and LED matrix controllers, the PIC24FJ256GA606-E/MR drives multi-channel LED strings via its 16-bit PWM outputs. With 256 KB Flash storing DMX512/RDM protocol stacks and 32 KB RAM for frame buffers, the MCU can address hundreds of pixels via SPI-expander chains (APA102, SK6812). The 32 MHz core clock updates 60+ Hz refresh rates without flicker. Add a companion RS-485 transceiver for DMX wiring or Wi-Fi module for wireless lighting control in architectural installs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ256GA606-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ256GA606-I/MR | PIC24FJ128GA606-E/MR | PIC24FJ128GB606-E/MR | PIC24FJ128GU406-I/MR | PIC24FJ256GA406-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256 KB | 256 KB | 128 KB (-50%) | 128 KB (-50%) | 128 KB (-50%) | 256 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| AEC-Q100 Qualified | Yes | No (industrial grade) | Yes | Yes | No (industrial grade) | No (industrial grade) |
| Integrated USB 2.0 | No | No | No | Yes (USB FS peripheral) | Yes (USB FS peripheral) | No |
| Dual-Partition Live Update | Yes | Yes | Yes | Yes | Yes | No |
| Lifecycle Status | NRND | Active | Active | Active | Active | Active |
Principais diferenciais
- Dual-partition Flash for live firmware updates (vs PIC24FJ256DA206-I/PT)
- AEC-Q100 qualified for automotive (vs PIC24FJ256GA406-I/MR)
- Highest Flash density in 64-QFN GA606 family (vs PIC24FJ128GA606-E/MR)
Notas de projeto
Place a 10 uF bulk + 0.1 uF ceramic decoupling pair adjacent to every VDD/VSS pin pair on the 64-QFN package. For the AVDD/AVSS analog rails, route through a ferrite bead (e.g., BLM18AG601SN1D) to keep switching noise out of the 12-bit ADC. The exposed thermal pad (EP) must be soldered to the ground plane using an array of vias (8-12 vias in a 3x3 pattern) to achieve the rated 4.5 W dissipation and AEC-Q100 thermal cycling reliability.
Do not enable JTAG/SWD boundary scan on the same pins used by the on-chip debug module without configuring the alternate-pin-remap register first. Many GPIO conflicts arise when developers leave ICD pins in their default state. According to the Microchip PIC24FJ256GA606 datasheet, use PPS (Peripheral Pin Select) to remap peripherals to available GPIO before PCB layout freeze. Also note the -E suffix means Extended temperature grade (AEC-Q100) - if your application only needs -40C to +85C, choose the -I variant for cost savings and longer lifecycle.
Estimated: At maximum CPU activity (32 MHz, all peripherals active, 53 GPIO loaded), the MCU draws approximately 25 mA from a 3.3 V rail, dissipating 0.083 W. With the 64-QFN 9x9 mm package thermal resistance of approximately 28 C/W (4-layer PCB with thermal vias), junction temperature rise above ambient is only 2.3 C - so the 64-QFN (9x9 mm) needs no external heatsink for typical MCU workloads. The thermal pad is the dominant heat-spreading path; missing solder joints to the EP will increase theta_JA significantly.
Route the parallel-master-port (PMP) data lines (PMP0-PMP15) on the same PCB layer with matched lengths within 1 cm to avoid skew in TFT or external-memory interfaces. Keep the 32 kHz low-power crystal traces short and guarded by a ground ring to minimize noise injection into the RTCC. The MCLR reset pin requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for clean POR behavior - do not leave MCLR floating during in-circuit programming.
For SPI peripherals running above 10 MHz, place a 33 ohm series resistor at the SDO pin to dampen reflections on long PCB traces. For I2C, use external 4.7 kohm pull-ups (the MCU internal pull-ups are weak); for I2C Fast-Mode Plus (1 MHz), upgrade to 1 kohm pull-ups. USB signals on the GB-family variant require 90 ohm differential impedance on D+/D- and a 1.5 kohm pull-up on D+ through an NE5019A strap to identify full-speed devices to the host.
Informações de conformidade
ROHS3 Compliant per ics-embedded.com listing and Microchip product page. AEC-Q100 qualified (automotive grade, -E temperature suffix). Halogen-free status and conflict-minerals declaration not explicitly stated in provided data - set to 'unknown' rather than fabricated.
