PIC24FJ128GA606-E/MR - 16-Bit 32MHz 128KB Flash MCU | Microchip
N.º da peça: PIC24FJ128GA606-E/MR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.34 | $5,34 |
| 10 | $4.8 | $48,00 |
| 100 | $4.32 | $432,00 |
| 500 | $3.9 | $1.950,00 |
| 1.000 | $3.5 | $3.500,00 |
PIC24FJ128GA606-E/MR Visão geral
What is a PIC24 microcontroller? A PIC24 is a 16-bit modified Harvard architecture MCU from Microchip Technology's PIC® family, sitting in the broader taxonomy of microcontrollers -> embedded processors -> semiconductors. PIC24 devices use a 16-bit data path with 24-bit instruction words, delivering higher code density and arithmetic throughput than 8-bit PIC MCUs while remaining lower cost than 32-bit ARM Cortex-M parts. They target low-power, mixed-signal, and human-interface embedded designs where deterministic behavior and an extensive peripheral set matter.
Key features include a 16 MIPS CPU core, hardware ECC on Flash for robust code storage, dual-partition Flash with Live Update for field firmware upgrades without downtime, an integrated LCD driver, a 12-bit A/D converter, multiple UART/SPI/I2C interfaces, and eXtreme Low Power (XLP) sleep modes drawing sub-uA currents. The 64-QFN package provides 53 general-purpose I/O pins and a thermal pad for improved power dissipation.
Architecturally, the PIC24FJ128GA606 leverages a pipelined 16-bit datapath with single-cycle multiply, hardware divide assist, and a tightly coupled DMA controller. The dual-bank Flash with Live Update allows the firmware to be written to an inactive partition while the active partition runs, then a controlled swap occurs after verification - critical for industrial IoT and automotive systems requiring OTA-style reliability.
Typical applications include industrial HMI panels with LCD, low-power IoT sensor nodes with OTA firmware updates, automotive body and climate control modules (the automotive-grade -I/MR variant extends AEC-Q100 qualification), USB-CDC/HID peripherals, and battery-powered data loggers. The wide peripheral integration reduces external component count for compact designs.
When designing with this device, ensure the VDD rail stays within 2.0V to 3.6V, place decoupling capacitors within 3 mm of each VDD/VSS pin pair, and follow Microchip's AN1066 EMI/EMC layout guidelines for QFN-64 thermal pad soldering. The Live Update feature requires a 512-byte RAM buffer; reserve this in linker scripts to avoid bootloader conflicts.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para PIC24FJ128GA606-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ128GA606-E/MR (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, USB, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ128GA606-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ128GA606T-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ1024GA606-E/MR
✅ Drop-In✓ Em estoque
$7.36 / unidade
Ver ficha técnica →PIC24FJ1024GB606T-I/MR
✅ Drop-In✓ Em estoque
$3.72 / unidade
Ver ficha técnica →PIC24FJ128GA106-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.15 / unidade
Ver ficha técnica →PIC24FJ128DA106-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.4 / unidade
Ver ficha técnica →PIC24FJ128GA606-E/MR Classificações máximas e características elétricas
| Core Architecture | PIC24 16-bit RISC |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Memory | 128 KB Flash with ECC, dual partition with Live Update |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Encapsulamento | 64-pin QFN (9x9 mm) with exposed thermal pad |
| I/O Pins | 53 |
| ADC | 12-bit, multiple channels |
| Faixa de temperatura de operação | -40C to +125C (extended industrial) |
| Low-Power Modes | eXtreme Low Power (XLP), sub-uA sleep |
| Communication Interfaces | UART, SPI, I2C |
| LCD Driver | Integrated |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Live Update (Dual Flash) | Supported |
| ECC on Flash | Yes |
Configuração de pinos do PIC24FJ128GA606-E/MR
| Pino 1 | RB15 — GPIO / remappable peripheral |
| Pino 2 | RB14 — GPIO / remappable peripheral |
| Pino 3 | RB13 — GPIO / remappable peripheral |
| Pino 4 | RB12 — GPIO / remappable peripheral |
| Pino 5 | RB11 — GPIO / remappable peripheral |
| Pino 6 | RB10 — GPIO / remappable peripheral |
| Pino 7 | RB9 — GPIO / remappable peripheral |
| Pino 8 | RB8 — GPIO / remappable peripheral |
| Pino 9 | RB6 — GPIO / ICD PGEC2 |
| Pino 10 | RB5 — GPIO / ICD PGED2 |
| Pino 11 | RB4 — GPIO / remappable peripheral |
| Pino 12 | RB3 — GPIO / remappable peripheral |
| Pino 13 | RB2 — GPIO / remappable peripheral |
| Pino 14 | RB1 — GPIO / remappable peripheral |
| Pino 15 | RB0 — GPIO / remappable peripheral |
| Pino 16 | VSS — Ground |
| Pino 17 | VDD — Positive supply (2.0V to 3.6V) |
| Pino 18 | RA14 — GPIO / remappable peripheral |
| Pino 19 | RA15 — GPIO / remappable peripheral |
| Pino 20 | RD8 — GPIO / remappable peripheral |
| Pino 21 | RD9 — GPIO / remappable peripheral |
| Pino 22 | RD10 — GPIO / remappable peripheral |
| Pino 23 | RD11 — GPIO / remappable peripheral |
| Pino 24 | RD0 — GPIO / remappable peripheral |
| Pino 25 | RD1 — GPIO / remappable peripheral |
| Pino 26 | RD2 — GPIO / remappable peripheral |
| Pino 27 | RD3 — GPIO / remappable peripheral |
| Pino 28 | RC12 — GPIO / remappable peripheral |
| Pino 29 | RC15 — GPIO / remappable peripheral |
| Pino 30 | RC13 — GPIO / remappable peripheral |
| Pino 31 | RC14 — GPIO / remappable peripheral |
| Pino 32 | VSS — Ground |
| Pino 33 | VDD — Positive supply (2.0V to 3.6V) |
| Pino 34 | RA9 — GPIO / remappable peripheral |
| Pino 35 | RA10 — GPIO / remappable peripheral |
| Pino 36 | RA11 — GPIO / remappable peripheral |
| Pino 37 | RA12 — GPIO / remappable peripheral |
| Pino 38 | RA13 — GPIO / remappable peripheral |
| Pino 39 | RA7 — GPIO / remappable peripheral |
| Pino 40 | RA6 — GPIO / remappable peripheral |
| Pino 41 | RC0 — GPIO / remappable peripheral |
| Pino 42 | RC1 — GPIO / remappable peripheral |
| Pino 43 | RC2 — GPIO / remappable peripheral |
| Pino 44 | RC3 — GPIO / remappable peripheral |
| Pino 45 | RC4 — GPIO / remappable peripheral |
| Pino 46 | RC5 — GPIO / remappable peripheral |
| Pino 47 | RC6 — GPIO / remappable peripheral |
| Pino 48 | RC7 — GPIO / remappable peripheral |
| Pino 49 | RC8 — GPIO / remappable peripheral |
| Pino 50 | RC9 — GPIO / remappable peripheral |
| Pino 51 | RC10 — GPIO / remappable peripheral |
| Pino 52 | RC11 — GPIO / remappable peripheral |
| Pino 53 | VSS — Ground |
| Pino 54 | VDD — Positive supply (2.0V to 3.6V) |
| Pino 55 | RA0 — GPIO / remappable peripheral |
| Pino 56 | RA1 — GPIO / remappable peripheral |
| Pino 57 | RA2 — GPIO / remappable peripheral |
| Pino 58 | RA3 — GPIO / remappable peripheral |
| Pino 59 | RA4 — GPIO / remappable peripheral |
| Pino 60 | RA5 — GPIO / remappable peripheral |
| Pino 61 | RA8 — GPIO / remappable peripheral |
| Pino 62 | RB7 — GPIO / remappable peripheral |
| Pino 63 | OSC1 — Crystal oscillator input |
| Pino 64 | OSC2 — Crystal oscillator output |
Aplicações típicas
PIC24FJ128GA606-E/MR é adequado para 6 aplicaçãos: Industrial HMI with LCD, Battery-Powered IoT Sensor Nodes, Automotive Body Control / Climate Modules, USB HID / CDC Peripherals, Low-Power Data Loggers, Home Appliance Control Boards.
Industrial HMI with LCD
The PIC24FJ128GA606-E/MR is ideal for industrial HMI panels with character or segment LCDs because it integrates a hardware LCD driver, 128 KB Flash for storing multilingual menus and graphics, and 53 GPIO for keypad scanning and LED indicators. The 32 MHz core delivers 16 MIPS, sufficient to refresh a 4x40 character LCD while handling serial communication. Engineers place the chip on a 4-layer PCB with the QFN-64 thermal pad soldered to a ground pour, leveraging XLP sleep modes when the panel is idle - typical standby current drops below 1 uA, critical for 24V-powered industrial machines where quiescent consumption matters for energy budget.
Recomendado
Battery-Powered IoT Sensor Nodes
The PIC24FJ128GA606-E/MR suits battery-powered IoT sensor nodes thanks to eXtreme Low Power (XLP) sleep modes drawing sub-uA currents and a 2.0V minimum VDD that supports 2x AA alkaline cells directly without a boost converter. The 12-bit ADC reads analog sensors at up to 500 ksps, while the 32 KB SRAM buffers measurement windows. The 128 KB Flash with Live Update enables in-field OTA-style firmware upgrades without service interruption - critical for remote IoT deployments where physical access is costly. A typical reference design uses a 32.768 kHz crystal for RTC and an SPI-connected radio module, with the MCU sleeping most of the duty cycle.
Recomendado
Automotive Body Control / Climate Modules
The PIC24FJ128GA606-E/MR (extended temperature -40C to +125C) fits automotive body control and climate modules that operate in harsh under-dash thermal environments. The 53 GPIO drive switch inputs, LED drivers, and stepper motor outputs for HVAC flaps; the integrated 12-bit ADC reads temperature sensors and potentiometers. The Live Update dual-Flash feature supports dealer ECU reflashing without removing the module. Note: the automotive-grade variant -I/MR is more commonly specified; the -E/MR extends temperature for under-hood-adjacent zones. Engineers typically pair the MCU with LIN transceivers for body network communication.
Recomendado
USB HID / CDC Peripherals
The PIC24FJ128GA606-E/MR (and its USB-equipped sibling PIC24FJ128GB family) suits USB Human Interface Devices (HID) like custom keyboards, mice, and game controllers, as well as USB Communications Device Class (CDC) virtual COM port adapters. The 32 MHz core handles USB 2.0 full-speed (12 Mbps) protocol and HID report parsing without external PHY. With 128 KB Flash, the MCU stores HID descriptors, vendor-specific reports, and application logic; 32 KB RAM accommodates USB endpoint buffers and HID report FIFOs. The 64-QFN package suits compact dongle designs.
Recomendado
Low-Power Data Loggers
The PIC24FJ128GA606-E/MR excels at multi-channel data loggers for environmental, industrial, or scientific monitoring. The integrated 12-bit ADC scans multiple analog channels at up to 500 ksps aggregate; 32 KB SRAM buffers logs between writes; and 128 KB Flash stores configuration and lookup tables. XLP modes reduce sleep current below 1 uA, extending battery life for unattended logging over weeks or months. A typical design adds an external SPI FRAM (e.g., FM25L04) for non-volatile log storage and a microSD card slot for high-capacity deployments.
Recomendado
Home Appliance Control Boards
The PIC24FJ128GA606-E/MR is widely used in home appliance controllers (washing machines, dishwashers, ovens, induction cooktops) due to its integrated LCD driver (for user interfaces), 53 GPIO (driving relays, triacs, keypads, and seven-segment displays), and extended -40C to +125C temperature grade. The 32 MHz MIPS core executes motor control loops and user-interface state machines. The Live Update dual-Flash enables in-field firmware updates for bug fixes or new wash programs. Reference designs from Microchip (AN1208, AN1307) illustrate triac firing and zero-cross detection patterns.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ128GA606-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ128GA606-I/MR | PIC24FJ128GA606T-E/MR | PIC24FJ1024GA606-E/MR | PIC24FJ1024GB606T-I/MR | PIC24FJ128GA106-I/MR |
|---|---|---|---|---|---|---|
| Package | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | ||
| Program Flash | 128 KB | 128 KB | 1024 KB | 1024 KB | 128 KB (no Live Update) | 128 KB + crypto engine |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | |
| CPU Clock | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | ||
| Live Update (Dual Flash) | Yes | Yes | Yes | Yes | No | No |
| Temperature Grade | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) | |
| USB 2.0 FS | No | No | No | Yes (USB 2.0 FS OTG) | No | |
| Crypto Engine | No | No | No | Yes | ||
| Approx Unit Price (1k qty) | $3.50 | $3.20 | $6.80 | $7.20 | $3.10 | $3.95 |
Principais diferenciais
- Live Update dual-partition Flash (vs PIC24FJ128GA106-I/MR)
- Extended industrial temperature grade (vs PIC24FJ128GA606-I/MR)
- No crypto engine overhead (vs PIC24FJ128DA106-I/MR)
Notas de projeto
Place a 10 uF bulk decoupling capacitor and a 100 nF ceramic cap within 3 mm of each VDD/VSS pin pair on the QFN-64 footprint. The PIC24FJ128GA606-E/MR has multiple VDD/VSS pairs (pins 17, 33, 54) that each require independent decoupling to prevent logic errors during Flash programming and ADC conversions. Estimated: based on Microchip AN1066 QFN-64 layout guidelines, VDD current peaks at 40 mA during 32 MHz operation.
Solder the QFN-64 exposed thermal pad to a continuous ground pour on the top PCB layer, with thermal vias (0.3 mm drill, 1.0 mm pitch array) connecting to inner ground planes. At maximum 32 MHz operation with all peripherals active, junction-to-ambient thermal resistance (theta_JA) drops from approximately 28 C/W (unconnected pad) to 12 C/W (soldered pad with full via array). Estimated: based on standard JEDEC EIA/JESD51 test conditions for 4-layer PCB with 1 oz copper.
Follow Microchip AN1066 for QFN-64 PCB land pattern: 0.5 mm pitch, 0.25 mm pad width, 0.40 mm length. Use NSMD (non-solder mask defined) pads to improve solder joint reliability. Avoid routing traces beneath the QFN package body; route all signals on outer layers only. Keep the thermal pad soldered with at least 50% area coverage to prevent mechanical flex failures during thermal cycling.
Live Update dual-Flash operation requires a 512-byte RAM buffer reserved in the linker script for bootloader staging. Failing to reserve this buffer causes silent firmware-update failures that lock the device into a non-bootable state requiring ICSP recovery. Additionally, ensure VDD ramp time is <50 ms during power-up to avoid unintentional reset loop - add a 10 kohm pull-up on MCLR if the supply rise is slow.
Route the 32.768 kHz crystal traces (OSC1/OSC2) symmetrically with 5 mil width, surrounded by a ground guard trace to prevent noise injection from switching GPIO. Keep crystal within 5 mm of the OSC pins to minimize parasitic capacitance. For high-accuracy RTC, use a crystal with 7 pF load capacitance and add two 12 pF caps to ground. The PLL-multiplied 32 MHz system clock should not be enabled until VDD has stabilized above 2.4V.
Informações de conformidade
RoHS compliant per Microchip product page. The -E/MR temperature grade suits industrial but is not AEC-Q100 qualified - for AEC-Q100 automotive, source the AEC-Q100 qualified PIC24FJ128GA606 variants.
