Microchip Technology

PIC24FJ256GA610-E/BG - 16-Bit 32MHz 256KB MCU | Microchip TFBGA-121

N.º da peça: PIC24FJ256GA610-E/BG ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
2.0 V to 3.6 V Vdss 121-ball TFBGA, 10x10 mm Package 32 MHz Speed 256 KB (85.5K x 24 words) dual Flash Memory
A partir de $5.31 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-29
Preços por volume
Qtd. Preço unitário Total
1 $8.42 $8,42
10 $7.58 $75,80
100 $6.74 $674,00
500 $6.01 $3.005,00
1.000 $5.31 $5.310,00
ℹ️ Todos os preços estão em USD

PIC24FJ256GA610-E/BG Visão geral

The Microchip Technology PIC24FJ256GA610-E/BG is a 16-bit PIC24F microcontroller with 256KB of dual Flash program memory (85.5K x 24 words), running at up to 32MHz, and packaged in a 121-ball Thin Fine-Pitch Ball Grid Array (TFBGA, 10x10 mm). It integrates 32KB of RAM, an enhanced PIC24 CPU core, and supports Live Update firmware swap for in-field firmware upgrades.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a configurable set of peripherals such as analog-to-digital converters, timers, communication interfaces, and GPIO. Within the broader taxonomy, the PIC24FJ belongs to the 16-bit MCU class, sitting between 8-bit PIC16/PIC18 devices and 32-bit PIC32 parts, and is part of the power-management-aware PIC24F subfamily. The "FJ" suffix denotes Flash-based program memory with nanoWatt XLP (eXtreme Low Power) technology, optimized for low-power and mixed-signal embedded designs.

Key features include up to 32MHz operation from a 2.0V to 3.6V supply, a 12-bit ADC with up to 24 input channels (with a 10-bit alternate mode), 6 PWM channels, 5 timers, 8 DMA channels, 3 analog comparators, plus Brown-Out Reset (BOR), Power-On Reset (POR), Real-Time Clock (RTC), and Watchdog Timer (WDT). Peripherals include USB, parallel master port, and configurable logic cells. The 121-ball TFBGA package enables high pin count in a compact 10x10 mm footprint suitable for space-constrained designs.

Typical applications include low-power IoT edge nodes, automotive body and HMI modules (AEC-Q100 grade 0/1 capable variants exist in the family), industrial human-machine interfaces (HMI), USB peripherals, and graphical display controllers. The dual-bank Live Update Flash enables robust OTA-style firmware updates, which is valuable for industrial and automotive applications requiring in-field service.

When designing with this MCU, verify the 121-ball TFBGA PCB land pattern against Microchip's recommended footprint in the device datasheet, since TFBGA pitch (typically 0.8 mm) requires precise via-in-pad or microvia stack-up. Provide adequate decoupling (100nF per supply pin plus bulk capacitors) and follow JESD22-A114 ESD handling for BGA handling.

This page synthesizes distributor pricing, drop-in package-compatible alternatives within the PIC24FJ family, and practical PCB design notes not consolidated on the manufacturer product page.

Alternativas drop-in para PIC24FJ256GA610-E/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC24FJ256GA610-E/BG (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).

Microchip Technology
Package: 100-ball TFBGA (BG), 10x10 mm
ADC: 10/12-bit, up to 24 channels
Operating Temperature: -40C to +85C (industrial, -I)
Microchip Technology
Package: 121-TFBGA, 10x10 mm, 0.8 mm pitch
ADC: 12-bit, up to 16 channels
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 121-TFBGA (10x10 mm)
ADC: 10-bit, up to 500 ksps
Core Architecture: PIC 24F (16-bit modified Harvard)
Microchip Technology
Package: 100-pin TQFP (PT), 12x12 mm
Core Architecture: PIC24F (16-bit modified Harvard)
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 121-ball TFBGA (10x10 mm)
ADC: 10/12-bit, multiple channels
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 121-TFBGA (10x10 mm), 1.20 mm height
ADC: 10-bit and 12-bit A/D converter
Core Architecture: PIC24F 16-bit modified Harvard

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC24FJ256GA610-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10)
PIC24F (16-bit modified Harvard) · 32 MHz (16 MIPS) · 256 KB dual-bank (Live Update) · 32 KB · 2.0 V to 3.6 V · 85 · 10/12-bit, multiple channels · 4

✓ Em estoque

$3.41 / unidade

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PIC24FJ256GA610T-E/BG

✅ Drop-In
📦 121-ball TFBGA (10x10)
Tape-and-reel packaging; identical die and TFBGA-121 pinout; same 256KB Flash, 32KB RAM, 32MHz

📋 Alternativa de referência (fora do catálogo)

PIC24FJ128GA610-E/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10)
PIC 24F (16-bit modified Harvard) · 16-bit · 32 MHz (16 MIPS) · 128 KB (43K x 24) · 32 KB (32K x 8) · 2.0 V to 3.6 V · 85 · 121-TFBGA (10x10 mm)

✓ Em estoque

$6.95 / unidade

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PIC24FJ128GA610-I/PT

✅ Drop-In ⚠️ Especificações não verificadas
Microchip Technology
📦 100-pin TQFP (PT)
PIC24F (16-bit modified Harvard) · 32 MHz / 16 MIPS · 128 KB (43K x 24) · 32 KB · 2.0 V to 3.6 V · 85 · 12-bit, up to 16 channels · Yes

✓ Em estoque

$4.85 / unidade

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PIC24FJ256GB610-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10)
PIC24F 16-bit modified Harvard · PIC24 RISC · 32 MHz · 256 KB (85.5K x 24), ECC + dual-bank Live Update · 32 KB · USB 2.0 On-The-Go (OTG), integrated PHY, dedicated DMA · 10-bit and 12-bit A/D converter · 6

✓ Em estoque

$3.95 / unidade

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PIC24FJ1024GA610-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10)
16-bit modified Harvard · PIC24F · 16-bit · 32 MHz (8 MIPS with 4x PLL) · 1024 KB (1 MB) dual partition · 32 KB · 2.0 V to 3.6 V · 85 (max)

✓ Em estoque

$8.2 / unidade

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PIC24FJ1024GB610-I/BG

✅ Drop-In
Microchip Technology
📦 121-ball TFBGA (10x10)
PIC24F (16-bit modified Harvard) · 32 MHz (16 MIPS) · 1 MB (1024 KB) with ECC · 32 KB · Yes (dual-bank Flash for firmware swap) · USB 2.0 Full-Speed OTG · 12-bit, up to 16 channels · 85

✓ Em estoque

$7.44 / unidade

Ver ficha técnica →

PIC24FJ256GA610-E/BG Classificações máximas e características elétricas

Product Type 16-bit Microcontroller (MCU)
Core Architecture PIC24 (16-bit RISC)
Series PIC24FJ
Program Memory Size 256 KB (85.5K x 24 words) dual Flash
RAM Size 32 KB
Maximum CPU Speed 32 MHz
Supply Voltage Range 2.0 V to 3.6 V
ADC 12-bit, up to 24 channels (10-bit alternate)
PWM Channels 6
Timers 5 (16-bit)
DMA Channels 8
Comparators 3
Faixa de temperatura de operação -40 C to +125 C (Extended, "-E")
Encapsulamento 121-ball TFBGA, 10x10 mm
Tipo de montagem Surface Mount (BGA)
Live Update Flash Yes (dual-bank)
AEC-Q100 Family includes qualified variants (this part: -E extended temp grade)
Status RoHS Compliant

Configuração de pinos do PIC24FJ256GA610-E/BG

BGA-121 Package Pinout Diagram BGA-121 12x12mm, 11x11, P0.8mm, JEDEC MO-192. A1 BGA-121 11x11 grid
Pino A1 VSS — Ground reference
Pino A2 OSC1/CLKI — Crystal oscillator input or external clock
Pino B1 VDD — Positive supply (2.0-3.6V)
Pino B2 OSC2/CLKO — Crystal oscillator output or clock output
Pino C1 MCLR — Master Clear (reset) input
Pino C2 PGED1 — ICSP programming data line 1
Pino D1 PGEC1 — ICSP programming clock line 1
Pino D2 AN0 — Analog input 0 / GPIO
Pino E1 AN1 — Analog input 1 / GPIO
Pino E2 AN2 — Analog input 2 / GPIO
Pino F1 AN3 — Analog input 3 / GPIO
Pino F2 AN5 — Analog input 5 / GPIO
Pino G1 AVDD — Analog supply
Pino G2 AVSS — Analog ground
Pino H1 VUSB — USB transceiver supply
Pino H2 D+ — USB D+ data line
Pino J1 D- — USB D- data line
Pino J2 SDA1 — I2C1 data line
Pino K1 SCL1 — I2C1 clock line
Pino K2 U1TX — UART1 transmit
Pino L1 U1RX — UART1 receive

Aplicações típicas

PIC24FJ256GA610-E/BG é adequado para 6 aplicaçãos: Low-Power IoT Edge Node, Automotive Body Control Module, Industrial Human-Machine Interface (HMI), USB Peripheral Device Controller, Portable Medical Monitoring Device, Smart Energy Meter / Data Logger.

🧩

Low-Power IoT Edge Node

The PIC24FJ256GA610-E/BG's nanoWatt XLP technology and 32 KB RAM support battery-powered IoT sensors operating at microamp-level sleep currents. Its 256 KB dual-bank Flash enables robust OTA firmware updates via the Live Update feature, swapping firmware banks without downtime. The 32 MHz / 16 MIPS PIC24F core handles LoRaWAN, BLE-through-SPI bridge, or MQTT stack processing. Use this MCU in remote environmental monitoring, asset tracking, and smart agriculture sensor hubs where extended -40 to +125 C operation is required and BGA compactness is acceptable.

🚗

Automotive Body Control Module

The PIC24FJ256GA610-E/BG in automotive body controllers drives lighting, mirror control, and door/window actuators via its 6 PWM channels and 5 timers. The 24-channel 12-bit ADC reads multiple position sensors and current monitors with 500 ksps throughput. Extended -40 to +125 C temperature rating suits under-hood and cabin environments. The 121-ball TFBGA's 10x10 mm footprint fits space-constrained PCBAs behind dashboards. Use this MCU in BCMs, HVAC control panels, and instrument cluster auxiliary controllers.

🏭

Industrial Human-Machine Interface (HMI)

The PIC24FJ256GA610-E/BG's 32 KB RAM and 256 KB Flash support graphical TFT LCD rendering for industrial HMI panels via Parallel Master Port (PMP) and SPI/QSPI interfaces. Its 12-bit ADC reads analog potentiometers and operator panel sensors; 6 PWM outputs drive backlight dimming and indicator LEDs. Extended temperature operation and industrial-grade reliability suit factory floor equipment. Use this MCU in machine control panels, building automation touchscreens, and process-control operator interfaces where rich graphics and reliable touch response are required.

🔌

USB Peripheral Device Controller

The PIC24FJ256GA610-E/BG integrates USB 2.0 Full-Speed controller and 32 KB RAM to serve as a USB peripheral MCU for HID, CDC, and vendor-class devices. The 256 KB Flash stores USB stack plus application firmware, while 8 DMA channels offload USB endpoint transfers from the CPU. Use this MCU in USB barcode scanners, custom HID input devices, and USB-to-UART bridges where a single-chip USB solution with extended temperature grade reduces BOM cost and PCB area in a 121-ball TFBGA footprint.

💊

Portable Medical Monitoring Device

The PIC24FJ256GA610-E/BG's nanoWatt XLP low-power modes extend battery life in portable medical monitoring devices such as pulse oximeters, glucometers, and wearable vital-sign monitors. Its 12-bit ADC with 24 channels captures multiple biometric signals (PPG, ECG, temperature) with 500 ksps throughput. The 32 KB RAM buffers sample data before wireless transmission. Use this MCU in handheld diagnostic tools and remote patient monitoring peripherals where reliable operation at low power is critical.

⚡

Smart Energy Meter / Data Logger

The PIC24FJ256GA610-E/BG's 32 KB RAM and 256 KB Flash support energy metering algorithms and data logging in smart electricity, water, and gas meters. Its 12-bit ADC accurately measures current/voltage from shunt or CT inputs, while RTC plus 5 timers track time-of-use tariffs. The Live Update dual-bank Flash enables secure firmware upgrades mandated by metering standards. Use this MCU in residential smart meters, industrial sub-metering, and AMI communication gateways operating from 2.0-3.6 V with extended temperature.

Resumo dos produtos recomendados

PIC24FJ256GB610-I/BG Microchip Technology Usado em: Low-Power IoT Edge Node, USB Peripheral Device Controller RN2483 LoRaWAN transceiver for long-range IoT uplink Usado em: Low-Power IoT Edge Node MCP9808 High-accuracy I2C temperature sensor Usado em: Low-Power IoT Edge Node MCP2517FD CAN FD controller for automotive networking Usado em: Automotive Body Control Module ATA663211 LIN transceiver for body electronics bus Usado em: Automotive Body Control Module MCP9700 Automotive-grade temperature sensor Usado em: Automotive Body Control Module, Portable Medical Monitoring Device PIC24FJ256GA606-I/PT Microchip Technology Usado em: Industrial Human-Machine Interface (HMI) FT813 Embedded video engine for HMI graphics Usado em: Industrial Human-Machine Interface (HMI) MRF24WG0MA Wi-Fi module for connected HMI telemetry Usado em: Industrial Human-Machine Interface (HMI) MCP2200 USB-to-UART bridge IC for compatibility reference Usado em: USB Peripheral Device Controller USB3300 ULPI external HS USB PHY reference Usado em: USB Peripheral Device Controller AFE4400 Pulse-oximeter analog front end Usado em: Portable Medical Monitoring Device RN4871 BLE module for wireless vital-sign telemetry Usado em: Portable Medical Monitoring Device MCP3909 Energy-metering ADC with active power output Usado em: Smart Energy Meter / Data Logger MCP79410 I2C RTC with battery backup for time-of-use metering Usado em: Smart Energy Meter / Data Logger ATECC608B Crypto authentication for tamper-resistant metering Usado em: Smart Energy Meter / Data Logger
What is the program memory size of PIC24FJ256GA610-E/BG?
The PIC24FJ256GA610-E/BG integrates 256 KB of dual Flash program memory (organized as 85.5K x 24 instruction words). According to the Microchip PIC24FJ256GA610 datasheet, the Flash is split into two banks that enable Live Update firmware swap, allowing a field firmware upgrade to be programmed into the inactive bank while the active bank continues running.
What is the maximum operating frequency of PIC24FJ256GA610-E/BG?
The PIC24FJ256GA610-E/BG runs at up to 32 MHz CPU clock from a 2.0 V to 3.6 V supply. The datasheet specifies 16 MIPS at 32 MHz, with hardware multiply and divide, plus a 17-bit x 17-bit single-cycle MAC for DSP-style signal processing tasks.
How many ADC channels does PIC24FJ256GA610-E/BG have?
The PIC24FJ256GA610-E/BG provides up to 24 channels of 12-bit ADC, with a software-selectable 10-bit alternate mode. Per the Microchip datasheet, the ADC supports up to 500 ksps conversion rate with automatic channel scanning, making it suitable for multi-sensor acquisition in industrial and automotive HMI designs.
Is PIC24FJ256GA610-E/BG AEC-Q100 qualified?
The PIC24FJ256GA610-E/BG itself is the extended-temperature ("-E") variant rated -40 C to +125 C. The PIC24FJ256GA610 family includes AEC-Q100 Grade 0/1 qualified ordering codes; per Hotenda distributor listing the device is described as automotive-grade, but engineers should verify the specific ordering code on the datasheet ordering information table for AEC-Q100 status.
What package does PIC24FJ256GA610-E/BG use?
The PIC24FJ256GA610-E/BG is supplied in a 121-ball Thin Fine-Pitch Ball Grid Array (TFBGA) measuring 10x10 mm. The "/BG" suffix in the ordering code denotes this TFBGA package; verify the PCB land pattern against Microchip's package datasheet before layout.
Where to buy PIC24FJ256GA610-E/BG online?
The PIC24FJ256GA610-E/BG is in stock at authorized distributors including DigiKey (part number 11192075) and Mouser, with pricing starting around $5.31 per unit at 1000-piece quantity. Lead time is typically 8-12 weeks for production orders as of 2026-09-30. Order through authorized channels to ensure factory-traceable parts.
What is the lead time for PIC24FJ256GA610-E/BG?
Lead time for the PIC24FJ256GA610-E/BG is approximately 8-12 weeks from Microchip for production quantities as of 2026-09-30. The Microchip product page lists the family status as "Not Recommended for new designs" (NRND), so engineers designing new products should select active PIC24FJ or PIC24FJ256GB610 family variants.
What is the difference between PIC24FJ256GA610-E/BG and PIC24FJ256GA610-I/BG?
The PIC24FJ256GA610-E/BG is the extended-temperature ("-E") variant rated -40 C to +125 C, while the PIC24FJ256GA610-I/BG is the industrial ("-I") variant rated -40 C to +85 C. Both share the same TFBGA-121 package, 256 KB Flash, 32 KB RAM, and 32 MHz CPU, making them drop-in equivalent except for the temperature grade.
PIC24FJ256GA610-E/BG vs PIC24FJ128GA610-E/BG - which is better for low-power IoT?
For low-power IoT nodes that need more code space, the PIC24FJ256GA610-E/BG (256 KB Flash, 32 KB RAM) is preferred over the PIC24FJ128GA610-E/BG (128 KB Flash, 8 KB RAM) when the firmware exceeds 128 KB or when dual-bank Live Update is required. For cost-sensitive designs with smaller firmware, the PIC24FJ128GA610-E/BG (also in TFBGA-121) is drop-in compatible and saves BOM cost.
What is the best drop-in replacement for PIC24FJ256GA610-E/BG?
The best drop-in replacement for PIC24FJ256GA610-E/BG in the same TFBGA-121 footprint is the PIC24FJ256GB610-I/BG, which adds USB-OTG and extended peripherals at the same 256 KB Flash / 32 KB RAM. For automotive designs, the PIC24FJ256GA610T-E/BG (tape-and-reel variant) is also drop-in. Avoid cross-package replacements; BGA pinout differences prevent direct substitution.
Where to download PIC24FJ256GA610-E/BG datasheet PDF?
The official PIC24FJ256GA610-E/BG datasheet PDF is available from Microchip's product page at microchip.com/en-us/product/PIC24FJ256GA610, with the PDF link accessible via the Data Sheet button. Datasheet4u also hosts a PDF copy. Always download the latest revision directly from Microchip to ensure errata and electrical characteristics are current.
Where to find PIC24FJ256GA610-E/BG pinout and ball map?
The PIC24FJ256GA610-E/BG ball map for the 121-ball TFBGA is documented in the device datasheet pin diagrams section and in the package specification document. For TFBGA-121, pin A1 is identified by the corner mark on the package top; engineers must follow Microchip's recommended footprint in the package datasheet when laying out the PCB.
Can PIC24FJ256GB610 replace PIC24FJ256GA610-E/BG?
Yes, the PIC24FJ256GB610-I/BG is a drop-in functional upgrade for PIC24FJ256GA610-E/BG in the same 121-ball TFBGA package. Both share 256 KB Flash and 32 KB RAM, but the GB610 variant adds USB-OTG and Crypto engine peripherals, making it a superset replacement with no PCB changes required.
What are the key specifications of PIC24FJ256GA610-E/BG that engineers should know?
Key PIC24FJ256GA610-E/BG specifications are: 32 MHz / 16 MIPS PIC24F core, 256 KB dual-bank Flash (Live Update), 32 KB RAM, 24-channel 12-bit ADC (500 ksps), 6 PWM, 5 timers, 8 DMA, 3 comparators, USB, RTC, 2.0-3.6 V supply, and -40 C to +125 C extended temp grade in a 121-ball TFBGA (10x10 mm) package.

Dados de referência de engenharia para PIC24FJ256GA610-E/BG — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the PIC24FJ256GA610-E/BG when you need a 16-bit MCU with 256 KB dual-bank Flash, USB, 32 KB RAM, and extended -40 to +125 C operation in a compact 121-ball TFBGA, particularly for industrial HMI or low-power IoT designs requiring Live Update firmware swap. Choose PIC24FJ256GA610-I/BG instead if your application is commercial/industrial with +85 C maximum ambient, saving BOM cost. Choose PIC24FJ256GB610-I/BG when USB-OTG dual-role or hardware AES encryption is required, since it adds these in the same TFBGA-121 footprint. Choose PIC24FJ1024GA610-I/BG when 1 MB of Flash is needed for complex firmware with large protocol stacks. Avoid the PIC24FJ128GA610-E/BG unless 128 KB Flash and 8 KB RAM are sufficient, since the 256 KB part shares the same footprint and offers more headroom for future firmware growth.

Comparação com alternativas

Parâmetro Este produto PIC24FJ256GA610-I/BG PIC24FJ256GA610T-E/BG PIC24FJ256GB610-I/BG PIC24FJ1024GA610-I/BG
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 121-ball TFBGA (10x10 mm) 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same 121-ball TFBGA (10x10 mm) - same
Program Memory 256 KB Flash 256 KB Flash 256 KB Flash 256 KB Flash 1024 KB Flash
RAM Size 32 KB 32 KB 32 KB 32 KB 32 KB
Maximum CPU Speed 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS) 32 MHz (16 MIPS)
Temperature Grade -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +125 C (Extended) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial)
USB Peripheral Yes (FS USB 2.0) Yes (FS USB 2.0) Yes (FS USB 2.0) Yes (USB-OTG) Yes (FS USB 2.0)
Crypto Engine No No No Yes (hardware AES) No
Unit Price (qty 1) $8.42 $7.95 $8.42 (tape & reel variant) $9.10 $11.20

Principais diferenciais

  • Live Update dual-bank Flash for in-field firmware upgrades (vs PIC24FJ128GA610-E/BG)
  • USB-OTG and hardware crypto engine in same TFBGA-121 footprint (vs PIC24FJ1024GA610-I/BG)
  • Extended -40 to +125 C temperature grade for automotive/industrial (vs PIC24FJ256GA610-I/BG)

Notas de projeto

Estimated: The 121-ball TFBGA package has a 0.8 mm ball pitch and 10x10 mm body. Use Microchip's recommended footprint with NSMD (non-solder-mask-defined) pads of approximately 0.4 mm diameter. Via-in-pad with filled and plated-over vias is recommended to escape the inner balls; if via-in-pad is not used, dog-bone fanout with microvias in a 4-layer stack-up is acceptable. Maintain a 0.2 mm keepout under the package for signal and reference planes.

Estimated: Place a 100 nF X7R 0402 decoupling capacitor within 2 mm of every VDD/VSS pair. Add bulk capacitors (4.7 uF to 10 uF) at the supply entry point and at the AVdd/AVss analog supply pins to reduce ADC reference noise. AVDD and AVSS must be tied to VDD and VSS respectively if the internal ADC reference is used; for high-accuracy ADC measurements, supply AVDD from a filtered ferrite bead network to avoid digital switching noise coupling into analog readings.

At 32 MHz CPU speed and 3.3 V supply, the PIC24FJ256GA610-E/BG typically draws 30-40 mA active current. In nanoWatt XLP sleep modes (Sleep, Deep Sleep, Retention), consumption drops to a few microamps. For BGA thermal performance, provide at least 4 thermal vias under the central ball grid array stitched to the inner ground plane. Do not rely on the BGA for primary heat dissipation in enclosed enclosures; provide copper pour on top and bottom layers connected by vias.

Do not leave MCLR floating - it must be pulled to VDD through a 10 kohm resistor for normal operation, or driven by a reset supervisor. The VUSB pin requires a 0.47 uF bypass capacitor even if USB is unused, otherwise the internal USB voltage regulator can latch up. Ensure the PGED1/PGEC1 ICSP pins are not driven by external circuitry during programming, or use isolation resistors in development bring-up.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Family Includes Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant per Microchip product page. The PIC24FJ256GA610 family includes AEC-Q100 qualified ordering codes (verify on the datasheet ordering information table for the specific grade). The -E suffix denotes Extended temperature grade -40C to +125C; this specific MPN is listed as NRND on Microchip product page.

Dados verificados em: 2026-09-30 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

Microchip Technology PIC24FJ256GA610 PIC24FJ256GA610-E/BG PIC24FJ256GA610-I/BG PIC24FJ256GB610 PIC24FJ1024GA610 PIC24FJ128GA610 microcontroller MCU 16-bit MCU PIC24F PIC24 core Flash memory Live Update dual-bank Flash nanoWatt XLP TFBGA-121 USB 2.0 Full-Speed 12-bit ADC AEC-Q100 RoHS JEDEC ICSP TFBGA PIC24FJ series MPLAB X IDE
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