PIC24FJ1024GA610-I/BG - 16-bit 1MB Flash MCU, 100-TFBGA | Microchip
N.º da peça: PIC24FJ1024GA610-I/BG ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.4 | $12,40 |
| 10 | $11.15 | $111,50 |
| 100 | $9.95 | $995,00 |
| 500 | $9.05 | $4.525,00 |
| 1.000 | $8.2 | $8.200,00 |
PIC24FJ1024GA610-I/BG Visão geral
A 16-bit microcontroller is a microprocessor whose data path is 16 bits wide, sitting between 8-bit MCUs (lower cost, lower performance) and 32-bit MCUs (higher performance, higher power). The PIC24F family uses a modified Harvard architecture with separate program and data buses plus a 16-bit instruction set optimized for compiled C code, targeting applications that need more performance than 8-bit parts but where cost and power must remain modest. In the broader taxonomy, PIC24F belongs to Microcontroller -> Microprocessor -> Integrated Circuit -> Semiconductor.
Key features include 1 MB (1024 KB) dual-bank Flash with Live Update firmware swap, 32 KB SRAM, 8-channel DMA, five 16-bit timers, five input-capture and five output-compare/PWM modules, two I2C, three SPI, and four UART modules. The integrated 32-bit CRC, RTCC with calendar mode, and Peripheral Pin Select (PPS) provide flexibility for low-power industrial and consumer designs. Up to 85 digital I/O lines (shared with analog) and a 10/12-bit ADC with up to 24 channels allow dense sensor interfaces.
Typical applications include industrial control panels with segmented LCD or TFT displays, portable medical monitoring devices, USB-connected data loggers, low-power IoT edge nodes, and consumer appliances requiring USB OTG and capacitive touch (mTouch). The TFBGA-100 package (10x10 mm, 0.5 mm pitch) supports compact handheld form factors.
When designing with this MCU, allocate sufficient decoupling (100 nF on every VDD/VSS pair plus bulk) and follow Microchip's trace-length rules for USB DP/DN to maintain 2.0 full-speed compliance. Live Update firmware requires the dual-partition boot sequence described in the Microchip application note library - omitting the swap protocol leaves the device bricked during failed updates. The BG (TFBGA-100) package is more challenging to rework than the PT (TQFP-100) variant, so choose the PT footprint for prototypes that may need socket rework.
Alternativas drop-in para PIC24FJ1024GA610-I/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ1024GA610-I/BG (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ1024GB610-I/BG
✅ Drop-In✓ Em estoque
$7.44 / unidade
Ver ficha técnica →PIC24FJ1024GA610T-I/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ1024GA610-E/BG
✅ Drop-In✓ Em estoque
$7.1 / unidade
Ver ficha técnica →PIC24FJ1024GB610-I/BG
✅ Drop-In✓ Em estoque
$7.44 / unidade
Ver ficha técnica →PIC24FJ1024GA610-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ1024GA610-I/BG Classificações máximas e características elétricas
| CPU Architecture | 16-bit modified Harvard |
| CPU Family | PIC24F |
| Instruction Set | 16-bit |
| Max CPU Speed | 32 MHz (8 MIPS with 4x PLL) |
| Program Memory (Flash) | 1024 KB (1 MB) dual partition |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| I/O Pins | 85 (max) |
| ADC | 10/12-bit, up to 24 channels |
| USB | USB 2.0 Full-Speed OTG |
| Timers | 5 x 16-bit |
| Input Capture / Output Compare / PWM | 5 / 5 (16-bit) |
| UART | 4 |
| SPI | 3 |
| I2C | 2 |
| DMA Channels | 8 |
| RTCC | Yes, with calendar mode |
| Temperatura de operação | -40C to +85C (industrial, -I) |
| Encapsulamento | 100-ball TFBGA (BG), 10x10 mm |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Live Update / Dual-Bank Flash | Yes |
Guia de Configuração de Pinos do PIC24FJ1024GA610-I/BG 100-ball tfbga (bg), 10x10 mm
Configuração de pinos para PIC24FJ1024GA610-I/BG (pacote 100-ball tfbga (bg), 10x10 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC24FJ1024GA610-I/BG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC24FJ1024GA610-I/BG é adequado para 6 aplicaçãos: Industrial HMI Control Panels, Portable Medical Monitoring Devices, USB-Connected Data Loggers, Low-Power IoT Edge Nodes, Consumer Appliances with USB OTG, Capacitive Touch HMI with mTouch.
Industrial HMI Control Panels
The PIC24FJ1024GA610-I/BG fits industrial HMI panels because it combines 1 MB Flash for graphics assets and multi-language UI strings with 32 KB SRAM for frame buffers. Its 85 I/O pins drive segmented LCDs, keypads, and LEDs directly. Live Update dual-partition Flash allows safe OTA firmware rollout on factory floors without downtime. The 32 MHz core renders menus quickly while XLP modes keep standby under 1 uA between button presses.
Recomendado
Portable Medical Monitoring Devices
Battery-powered medical devices such as pulse oximeters, glucose meters, and portable ECG monitors benefit from the PIC24FJ1024GA610-I/BG's XLP deep-sleep current and 10/12-bit ADC accuracy for sensor readout. The 1 MB Flash stores waveform captures and lookup tables, while USB OTG enables data transfer to a clinic PC. The -I industrial temperature range covers body-worn and clinical environments, and the RTCC with VBAT domain keeps timestamps accurate across battery swaps.
Recomendado
USB-Connected Data Loggers
The PIC24FJ1024GA610-I/BG's integrated USB 2.0 full-speed OTG controller makes it ideal for USB stick-style data loggers used in environmental monitoring and industrial telemetry. The 1 MB Flash stores weeks of sensor samples, while the 8-channel DMA offloads ADC and UART transfers without CPU intervention. Up to four UARTs and three SPI buses let the device aggregate multiple sensor channels, and the 32 MHz core handles CSV encoding and USB transfers in real time.
Recomendado
Low-Power IoT Edge Nodes
IoT edge nodes for smart buildings and asset tracking leverage the PIC24FJ1024GA610-I/BG's combination of 1 MB Flash for MQTT/TLS stacks, XLP sleep modes below 1 uA, and multiple low-power serial interfaces (2x I2C, 3x SPI, 4x UART) for sensor and radio connectivity. Live Update firmware lets vendors push security patches to deployed units without service windows. The 85 I/O lines accommodate many digital sensors in a single node.
Recomendado
Consumer Appliances with USB OTG
Consumer appliances such as coffee machines, smart kitchen hubs, and connected washing machines use the PIC24FJ1024GA610-I/BG for USB OTG firmware update ports and capacitive touch (mTouch) user interfaces. The 1 MB Flash accommodates multiple languages and graphics assets, while 85 I/O pins drive motor controllers and sensor feedback loops. The XLP modes keep standby power compliant with energy-star regulations.
Recomendado
Capacitive Touch HMI with mTouch
The PIC24FJ1024GA610-I/BG's integrated mTouch hardware and CTMU peripheral enable robust capacitive touch keypads and sliders for white-goods and industrial front panels. Its 1 MB Flash stores multi-language UI strings and gesture libraries, while 32 KB SRAM supports touch decoding algorithms. The peripheral pin select (PPS) feature lets designers remap touch channels to nearly any I/O, simplifying PCB layout for irregular panel shapes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ1024GA610-I/BG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ1024GB610-I/BG | PIC24FJ1024GA610T-I/BG | PIC24FJ1024GA610-E/BG | PIC24FJ1024GA610-I/PT |
|---|---|---|---|---|---|
| Package | 100-ball TFBGA (BG) | 100-ball TFBGA (BG) - same | 100-ball TFBGA (BG) - same | 100-ball TFBGA (BG) - same | TQFP-100 (PT) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) | 32 MHz (8 MIPS) |
| Program Memory | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash | 1024 KB Flash |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C |
| Crypto Engine | No | Yes (AES, RNG) | No | No | No |
| Dual-Partition Live Update Flash | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- 1 MB dual-partition Flash with Live Update OTA (vs PIC24FJ1024GB610-I/BG)
- Industrial temperature range with TFBGA footprint (vs PIC24FJ1024GA610-E/BG)
- Hand-rework friendly TQFP-100 variant available (vs PIC24FJ1024GA610-I/PT)
Notas de projeto
Place a 100 nF 0402 decoupling capacitor within 2 mm of every VDD/VSS pair on the PIC24FJ1024GA610-I/BG, plus a single 10 uF bulk capacitor near the power-pin cluster. The 100-ball TFBGA package uses 0.5 mm pitch - escape traces through the inner layers using microvias (8 mil pad, 4 mil drill). Add a ground pour beneath the BGA stitched with thermal vias every 2 mm to reduce ground bounce and improve thermal dissipation during full-speed USB operation.
Do not skip the Live Update firmware swap protocol when implementing OTA updates. According to Microchip application notes, the dual-partition structure requires the bootloader to verify the new image CRC32, mark it as active, and only then swap the bank pointer. Omitting the CRC check leaves the device bricked after a corrupted update. Always test the swap path on bench units before deploying to production fleets.
For USB 2.0 full-speed compliance on the PIC24FJ1024GA610-I/BG, route the D+ and D- traces as a 90-ohm differential pair with length matching within 2 mm. Keep total trace length under 50 mm and avoid routing near high-frequency switching nodes. Place the 27-ohm series damping resistors within 4 mm of the MCU pins. The VUSB pin requires a 0.1 uF decoupling capacitor regardless of whether USB bus power is used.
Estimated: at 32 MHz active core, 3.3 V supply, and 85% I/O toggle load, the PIC24FJ1024GA610-I/BG dissipates approximately 90 mW (estimated based on typical PIC24F XLP core current of ~25 mA). The 100-ball TFBGA has theta-JA around 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of ~3 C above ambient - well within limits. In enclosed housings with poor airflow, derate ambient by 10 C to be safe.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive designs choose PIC24FJ1024GA610-E/BG with extended temperature range. Lead-free and halogen-free packaging.
