PIC24FJ256GA702-E/MV - 16-bit 256KB Flash MCU, UQFN-28 | Microchip
N.º da peça: PIC24FJ256GA702-E/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.1 | $61,00 |
| 100 | $5.25 | $525,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.1 | $4.100,00 |
PIC24FJ256GA702-E/MV Visão geral
A 16-bit microcontroller (MCU) is a microprocessor that combines a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripheral interfaces on a single integrated circuit. The PIC24F architecture sits within the broader microcontroller hierarchy: 16-bit MCU -> embedded controller -> system-on-chip -> semiconductor. PIC24F devices are known for their eXtreme Low Power (XLP) characteristics, supporting sleep currents in the microamp range and multiple power-saving modes suitable for battery-operated designs.
Key differentiating features include 256 KB of self-programmable Flash with Error-Correcting Code (ECC) for improved reliability, a 16 KB SRAM data store, and the CTMU peripheral that simplifies touch-key, proximity, and time-of-flight measurements by providing a constant current source for capacitive scanning. The device also offers multiple communication interfaces (UART, SPI, I2C), a Real-Time Clock/Calendar (RTCC), and up to 21 general-purpose I/O pins.
The PIC24FJ256GA702-E/MV targets applications that demand low power consumption, robust code storage with ECC protection, and small form factors. Typical use cases include IoT sensor nodes, wearable health monitors, capacitive touch user interfaces, industrial control front-ends, and low-power wireless sensor platforms where the 4x4 mm UQFN package helps minimize PCB area.
Designers should note the 28-UQFN package has an exposed thermal pad that must be soldered to the PCB ground plane for thermal dissipation and electrical performance. The device operates from 2.0 V to 3.6 V and integrates a wide range of peripherals to reduce external component count.
This page combines distributor pricing, drop-in alternatives within the same UQFN-28 footprint, and practical design notes that complement the Microchip datasheet to support component selection and PCB layout decisions.
Alternativas drop-in para PIC24FJ256GA702-E/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ256GA702-E/MV (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Program Memory (Flash), ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ128GA702-E/MV
✅ Drop-In✓ Em estoque
$3.02 / unidade
Ver ficha técnica →PIC24FJ128GA702T-I/MV
✅ Drop-In✓ Em estoque
$2.58 / unidade
Ver ficha técnica →PIC24FJ256GA702-E/SO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ256GA705-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24FJ32KA304-E/MV
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24FJ256GA702-E/MV Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 256 KB with ECC |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Temperatura de operação | -40°C to +125°C (industrial, -E grade) |
| ADC | 12-bit, 200 ksps, up to 14 channels |
| Comparators | 3 |
| CTMU (Touch) | Yes |
| DMA | Yes |
| Communication Interfaces | UART, SPI, I2C |
| RTCC | Yes |
| I/O Pins | Up to 21 |
| Encapsulamento | 28-pin UQFN (4x4 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Low Power Modes | XLP (eXtreme Low Power) |
Configuração de pinos do PIC24FJ256GA702-E/MV
| Pino 1 | RP5/PMD5/RA5 — Remappable peripheral / GPIO |
| Pino 2 | VSS — Ground reference |
| Pino 3 | RP6/PMD6/RA6 — Remappable peripheral / GPIO |
| Pino 4 | RP7/PMD7/RA7 — Remappable peripheral / GPIO |
| Pino 5 | VDD — Positive supply (2.0V to 3.6V) |
| Pino 6 | RP8/SDA1/RB8 — I2C SDA / remappable GPIO |
| Pino 7 | RP9/SCL1/RB9 — I2C SCL / remappable GPIO |
| Pino 8 | RP10/RB10 — Remappable peripheral / GPIO |
| Pino 9 | RP11/RB11 — Remappable peripheral / GPIO |
| Pino 10 | RP12/RB12 — Remappable peripheral / GPIO |
| Pino 11 | RP13/RB13 — Remappable peripheral / GPIO |
| Pino 12 | VSS — Ground reference |
| Pino 13 | OSC1/CLKI/RA1 — Crystal oscillator input or external clock |
| Pino 14 | OSC2/CLKO/RA0 — Crystal oscillator output |
| Pino 15 | MCLR — Master clear reset (active low) |
| Pino 16 | RP0/PMD0/RA0 — Remappable peripheral / GPIO |
| Pino 17 | RP1/PMD1/RA1 — Remappable peripheral / GPIO |
| Pino 18 | VDD — Positive supply (2.0V to 3.6V) |
| Pino 19 | AN0/CVD0/RA0 — ADC input 0 / GPIO |
| Pino 20 | AN1/CVD1/RA1 — ADC input 1 / GPIO |
| Pino 21 | AN2/CVD2/RA2 — ADC input 2 / GPIO |
| Pino 22 | AN3/CVD3/RA3 — ADC input 3 / GPIO |
| Pino 23 | AN4/CVD4/RB0 — ADC input 4 / GPIO |
| Pino 24 | AN5/CVD5/RB1 — ADC input 5 / GPIO |
| Pino 25 | AN6/CVD6/RB2 — ADC input 6 / GPIO |
| Pino 26 | AN7/CVD7/RB3 — ADC input 7 / GPIO |
| Pino 27 | AN8/CVD8/RB4 — ADC input 8 / GPIO |
| Pino 28 | EP — Exposed thermal pad - solder to PCB ground |
Aplicações típicas
PIC24FJ256GA702-E/MV é adequado para 6 aplicaçãos: IoT Sensor Node, Wearable Health Monitor, Capacitive Touch User Interface, Industrial Sensor Front-End, Battery-Powered Data Logger, Low-Power Wireless Sensor Platform.
IoT Sensor Node
The PIC24FJ256GA702-E/MV is well suited for IoT sensor nodes because its eXtreme Low Power (XLP) idle currents in the microamp range allow multi-year battery life on coin cells or 2xAA packs. The 256 KB ECC Flash stores over-the-air update images and protocol stacks, while the 12-bit 200 ksps ADC digitizes environmental sensors. The CTMU and DMA offload capacitive touch and sensor scanning from the CPU, enabling average active-mode current budgets below 1 mA in typical 3.3 V duty-cycled sensor applications.
Recomendado
Wearable Health Monitor
In wearable health monitors, the PIC24FJ256GA702-E/MV provides the 16 MIPS throughput needed to run heart-rate and SpO2 algorithms while keeping average current low through XLP sleep modes. The 16 KB SRAM buffers PPG/ECG sample windows, the 12-bit ADC captures biosensor waveforms at 200 ksps, and the small 4x4 mm UQFN package fits inside wristbands and patches. ECC Flash improves reliability for medical-grade firmware where single-bit upsets cannot be tolerated.
Recomendado
Capacitive Touch User Interface
The PIC24FJ256GA702-E/MV's on-chip CTMU peripheral simplifies capacitive touch button, slider, and proximity-sensor designs by providing a programmable constant-current source and timing measurement. Engineers can implement up to 14 touch channels using only the MCU plus copper pads, with no external analog components. Combined with 256 KB Flash for touch firmware libraries and the -40C to +125C industrial grade, the part supports appliance, automotive HMI, and industrial front-panel interfaces.
Recomendado
Industrial Sensor Front-End
For industrial 4-20 mA loop-powered sensors and field transmitters, the PIC24FJ256GA702-E/MV's -40C to +125C extended temperature range and ECC Flash ensure reliable operation in harsh environments. The 12-bit ADC with up to 14 inputs multiplexes multiple bridge, RTD, and 4-20 mA sense channels, while the DMA controller streams conversion data without CPU intervention. UART/SPI/I2C peripherals connect to HART modems, isolated transceivers, or wireless backhaul modules.
Recomendado
Battery-Powered Data Logger
The PIC24FJ256GA702-E/MV is an effective data-logging controller for battery-powered environmental and asset-tracking applications. Its 256 KB Flash stores months of compressed logs, the 16 KB SRAM buffers one-second to one-minute sample bursts, and the RTCC provides timestamped wake-up events. XLP sleep currents under 1 uA extend 3.6 V lithium-thionyl chloride battery life beyond 10 years in duty-cycled logging scenarios sampling every few seconds.
Recomendado
Low-Power Wireless Sensor Platform
As a host MCU for sub-GHz or BLE sensor modules, the PIC24FJ256GA702-E/MV provides the processing headroom and peripheral integration needed for protocol handling, sensor fusion, and security stack support. The 16 MIPS throughput runs lightweight TLS or proprietary MAC layers while XLP sleep modes preserve battery life between transmissions. UART/SPI interfaces connect to transceivers such as MRF89XA or RN4871 BLE modules with minimal BOM.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ256GA702-E/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ128GA702-E/MV | PIC24FJ128GA702T-I/MV | PIC24FJ256GA705-I/MV | PIC24FJ32KA304-E/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-28 (4x4 mm) | UQFN-28 (4x4 mm) | UQFN-28 (4x4 mm) | UQFN-28 (4x4 mm) | UQFN-28 (4x4 mm) |
| Flash Memory | 256 KB | 128 KB | 128 KB | 256 KB | 32 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 2 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C |
| CTMU (Touch) | Yes | Yes | Yes | Yes | No |
| ECC Flash | Yes | Yes | Yes | Yes | No |
| ADC | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch | 10-bit, 100 ksps, 13 ch |
Principais diferenciais
- Extended -40C to +125C industrial temperature range (vs PIC24FJ256GA705-I/MV)
- 256 KB ECC Flash vs 128 KB on GA702-I/MV (vs PIC24FJ128GA702-E/MV)
- On-chip CTMU peripheral for capacitive touch (vs PIC24FJ32KA304-E/MV)
Notas de projeto
The 28-pin UQFN (4x4 mm) package of the PIC24FJ256GA702-E/MV has a center exposed thermal pad that must be soldered to a corresponding land pattern on the PCB and thermally tied to the ground plane with multiple thermal vias. Without this connection, electrical performance degrades, thermal resistance increases significantly, and reliability suffers under extended industrial temperature operation. Use NSMD pads with 0.2 mm solder mask openings and a 3x3 via array of 0.3 mm finished holes for optimal thermal dissipation.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin, with an additional 4.7 uF bulk capacitor on the 3.3 V rail. The PIC24FJ256GA702-E/MV's XLP wake-from-sleep currents can be in the microamp range, so the decoupling network must source transient bursts when peripherals like ADC or CTMU activate. Estimated: with two VDD pins and typical 50 mA transient peaks, a 4.7 uF bulk cap provides approximately 47 uC of charge reserve, adequate for most XLP wake events.
The MCLR pin requires a 10 kohm pull-up to VDD for normal operation; leaving it floating can cause intermittent resets. Do not exceed 3.6 V on any I/O pin - the device is not 5 V tolerant. When using the CTMU for touch sensing, calibrate the constant current source per PCB layout because parasitic capacitance between the touch pad and ground plane directly affects touch sensitivity. Use guard rings around high-impedance analog inputs to minimize leakage current at +125C operation.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer, not automotive safety-critical applications.
