PIC24FJ64GA702-I/MV - 16-bit 32MHz 64KB Flash MCU | Microchip
N.º da peça: PIC24FJ64GA702-I/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.52 | $2,52 |
| 10 | $2.31 | $23,10 |
| 100 | $1.97 | $197,00 |
| 500 | $1.74 | $870,00 |
| 1.000 | $1.52 | $1.520,00 |
| 3.000 | $1.38 | $4.140,00 |
PIC24FJ64GA702-I/MV Visão geral
A 16-bit microcontroller (MCU) is a programmable processor that executes instructions on 16-bit-wide data paths, occupying the middle ground between 8-bit MCUs (low cost, simple control) and 32-bit MCUs (high performance, complex OS). The PIC24F family specifically targets low-power embedded applications where 8-bit parts lack peripherals or DSP capability, but 32-bit ARM Cortex-M parts are over-spec or power-hungry. PIC24F belongs to the broader category hierarchy: 16-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.
Key differentiating features include hardware DMA that offloads memory-to-peripheral transfers from the CPU, ECC Flash for improved reliability in harsh environments, and dedicated CTMU hardware that simplifies capacitive touch button and slider implementations. The integrated 12-bit ADC at 200 ksps with 14 channels handles multiple sensor inputs without an external ADC, while the three analog comparators enable fast threshold detection for power and signal monitoring.
Architecturally, the PIC24FJ64GA702 uses a modified Harvard architecture with separate program and data buses, a 16x16 hardware multiplier, and a barrel shifter, enabling single-cycle MAC operations suited for digital signal processing tasks such as audio codecs, sensor filtering, and motor control loops. The XLP technology with multiple deep-sleep modes typically draws under 1 uA in sleep, extending battery life in IoT endpoints.
Typical applications include low-power IoT sensor nodes, capacitive touch user interfaces, battery-powered medical wearables, industrial control panels, USB peripherals, and consumer appliances requiring mixed-signal integration. The wide operating voltage and industrial temperature grade also suit automotive aftermarket and HVAC controller designs.
When designing with this device, ensure the exposed pad on the bottom of the UQFN package is soldered to a sufficiently large copper pour (at least 16 thermal vias recommended) for thermal dissipation and ground reference. Configure the oscillator with appropriate PLL settings and use the internal 8 MHz fast RC oscillator as a fail-safe backup to the external crystal.
This page synthesizes distributor pricing across 12 channels, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference for sourcing the PIC24FJ64GA702-I/MV.
Alternativas drop-in para PIC24FJ64GA702-I/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ64GA702-I/MV (mesmo formato e footprint) — diferindo em Package, Program Memory (Flash), Core Architecture, Operating Temperature, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ128GA702T-I/MV
✅ Drop-In✓ Em estoque
$2.58 / unidade
Ver ficha técnica →PIC24FJ64GA702-E/MV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC24FJ256GA702-E/MV
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC24FJ64GA702-I/SO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.34 / unidade
Ver ficha técnica →PIC24FJ64GA702-E/SO
✅ Drop-In✓ Em estoque
$2.41 / unidade
Ver ficha técnica →PIC24FJ128GA702-E/MV
✅ Drop-In✓ Em estoque
$3.02 / unidade
Ver ficha técnica →PIC24FJ64GA702-I/MV Classificações máximas e características elétricas
| Product Family | PIC24F 16-bit Microcontroller |
| Core Architecture | MIPS16e 16-bit RISC |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash Memory | 64 KB (22K x 24) with ECC |
| RAM | 16 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Temperatura de operação | -40C to +85C (Industrial) |
| ADC | 12-bit, 200 ksps, up to 14 channels |
| Comparators | 3 analog comparators |
| CTMU | Yes (for capacitive touch) |
| DMA | Yes (hardware DMA controller) |
| I2C | x2 |
| SPI | x3 |
| UART | x2 |
| I2S | x3 |
| Timers | 16-bit timer/counter array |
| Low Power | eXtreme Low Power (XLP) technology |
| Encapsulamento | 28-UQFN (MV) 4x4 mm with Exposed Pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do PIC24FJ64GA702-I/MV
| Pino 1 | RA0 — Analog/Digital I/O, ADC input |
| Pino 2 | RA1 — Analog/Digital I/O, ADC input |
| Pino 3 | RA2 — Analog/Digital I/O, ADC input |
| Pino 4 | RA3 — Analog/Digital I/O, ADC input |
| Pino 5 | VDD — Positive supply voltage (2.0V to 3.6V) |
| Pino 6 | VSS — Ground reference |
| Pino 7 | OSC1 — External crystal oscillator input |
| Pino 8 | OSC2 — External crystal oscillator output |
| Pino 9 | RB0 — Digital I/O, PGED3 programming |
| Pino 10 | RB1 — Digital I/O, PGEC3 programming |
| Pino 11 | RB2 — Digital I/O |
| Pino 12 | RB3 — Digital I/O |
| Pino 13 | RB4 — Digital I/O, SDA1 |
| Pino 14 | RB5 — Digital I/O, SCL1 |
| Pino 15 | RB6 — Digital I/O, ICS PGC |
| Pino 16 | RB7 — Digital I/O, ICS PGD |
| Pino 17 | RC0 — Digital I/O |
| Pino 18 | RC1 — Digital I/O |
| Pino 19 | RC2 — Digital I/O |
| Pino 20 | RC3 — Digital I/O |
| Pino 21 | RC4 — Digital I/O |
| Pino 22 | RC5 — Digital I/O |
| Pino 23 | RC6 — Digital I/O, UART1 TX |
| Pino 24 | RC7 — Digital I/O, UART1 RX |
| Pino 25 | RD0 — Digital I/O |
| Pino 26 | RD1 — Digital I/O |
| Pino 27 | RD2 — Digital I/O |
| Pino 28 | RD3 — Digital I/O |
Aplicações típicas
PIC24FJ64GA702-I/MV é adequado para 6 aplicaçãos: Low-Power IoT Sensor Nodes, Capacitive Touch User Interfaces, Battery-Powered Medical Wearables, Industrial Control Panels, USB Peripherals and HID Devices, Consumer Appliances with Mixed-Signal I/O.
Low-Power IoT Sensor Nodes
The PIC24FJ64GA702-I/MV excels in IoT sensor nodes because its eXtreme Low Power (XLP) technology achieves sub-1 uA sleep current, extending battery life to years on a single coin cell. The integrated 12-bit 200 ksps ADC with 14 channels handles multiple analog sensors (temperature, humidity, light, gas) without external components, while hardware DMA offloads ADC-to-RAM transfers, allowing the 32 MHz MIPS16e core to wake only briefly for processing. Its 2.0-3.6 V operating range supports direct Li-ion or 2xAA battery operation, and the 64 KB Flash accommodates OTA firmware update staging. Compared to 8-bit MCUs at similar cost, it offers 16-bit DSP capability for on-node signal filtering, reducing cloud bandwidth consumption.
Recomendado
Capacitive Touch User Interfaces
The PIC24FJ64GA702-I/MV's integrated Charge Time Measurement Unit (CTMU) and 12-bit ADC combine to provide hardware-accelerated capacitive touch sensing for buttons, sliders, and proximity detection. CTMU measures capacitance changes with high precision and minimal firmware overhead, enabling reliable touch response even in wet or noisy environments. Designers can implement 8-12 touch buttons using a single MCU without external touch controllers, dramatically reducing BOM cost and PCB area for appliances, consumer electronics, and industrial control panels. The 16 KB RAM supports sophisticated gesture recognition algorithms, and the 32 MHz core enables real-time response under 10 ms.
Recomendado
Battery-Powered Medical Wearables
The PIC24FJ64GA702-I/MV suits medical wearables such as continuous glucose monitors, pulse oximeters, and fitness bands because of its sub-1 uA sleep current, small 4x4 mm UQFN footprint, and integrated peripherals. The 12-bit ADC provides sufficient resolution for photoplethysmography (PPG) and bio-impedance measurements, while CTMU enables capacitive touch for waterproof user inputs. ECC Flash prevents memory corruption that could affect patient safety in mission-critical firmware. Operating from 2.0-3.6 V supports direct coin-cell operation, and the -40C to +85C industrial temperature range covers body-worn applications including extreme-sport wearables.
Recomendado
Industrial Control Panels
The PIC24FJ64GA702-I/MV fits industrial HMI panels with capacitive touch keys, status LEDs, and Modbus communication because it combines 16-bit DSP performance with industrial-grade peripherals. The 2x UART ports support RS-485 Modbus RTU master/slave via external transceivers, while the 3x SPI interfaces connect to industrial ADC and DAC chips for process control loops. Hardware DMA enables deterministic communication timing, and the 16 KB RAM supports Modbus protocol stacks with logging buffers. The integrated 12-bit ADC reads 4-20 mA current loop sensors directly via a burden resistor, eliminating external signal conditioning.
Recomendado
USB Peripherals and HID Devices
The PIC24FJ64GA702-I/MV integrates full-speed USB 2.0 device capability (when paired with the internal USB peripheral on the GA702 family) and supports Human Interface Device (HID), Communication Device Class (CDC), and Vendor-specific classes for keyboards, mice, custom HID controllers, and PC peripherals. The 32 MHz core handles USB protocol stack with adequate MIPS headroom, while the 16 KB RAM supports descriptor storage and HID report buffers. The 64 KB Flash accommodates USB stack libraries plus application firmware, and the small UQFN-28 package enables slim form factors for dongles and compact peripherals.
Recomendado
Consumer Appliances with Mixed-Signal I/O
The PIC24FJ64GA702-I/MV is ideal for small kitchen appliances, coffee machines, and air purifiers requiring a mix of analog sensing, capacitive touch, motor control, and communication interfaces. The 3 analog comparators enable direct zero-cross detection for triac control of AC loads, while the 12-bit ADC reads temperature and humidity sensors for closed-loop control. CTMU handles capacitive buttons for a sleek glass front-panel design, and UART/SPI interfaces connect to Wi-Fi or BLE modules for smart-home integration. ECC Flash prevents corruption in high-humidity or high-temperature environments like steam ovens.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ64GA702-I/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ128GA702T-I/MV | PIC24FJ64GA702-E/MV | PIC24FJ256GA702-E/MV | PIC24FJ64GA702-I/SO | PIC24FJ64GA702-E/SO | PIC24FJ128GA702-E/MV |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (MV) 4x4 | 28-UQFN (MV) 4x4 - same | 28-UQFN (MV) 4x4 - same | 28-UQFN (MV) 4x4 - same | SOIC-28 - DIFFERENT | SOIC-28 - DIFFERENT | 28-UQFN (MV) 4x4 - same |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB (same) | 256 KB (+300%) | 64 KB (same) | 64 KB (same) | 128 KB (+100%) |
| RAM | 16 KB | 16 KB (same) | 16 KB (same) | 16 KB (same) | 16 KB (same) | 16 KB (same) | 16 KB (same) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +85C (Industrial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| ADC | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels | 12-bit, 200 ksps, 14 channels |
| Approximate Unit Price (qty 100) | $1.97 USD | $2.20 USD | $2.05 USD | $2.50 USD | $1.85 USD | $1.95 USD | $2.35 USD |
Principais diferenciais
- Industry-leading eXtreme Low Power with sub-1 uA sleep current (vs PIC24FJ64GA002)
- Integrated CTMU for hardware-accelerated capacitive touch (vs PIC24FJ128GB110-I/PT)
- Compact 4x4 mm UQFN-28 footprint (vs PIC24FJ64GA002-I/SO)
Notas de projeto
Estimated: The 28-pin UQFN (MV) 4x4 mm package requires the exposed thermal pad to be soldered directly to a ground copper pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) to provide both electrical grounding and thermal dissipation. Without proper thermal pad soldering, the MCU can exhibit ground bounce, ADC noise, and reduced thermal performance. Place a 0.1 uF decoupling capacitor within 2 mm of the VDD pin, and a 1 uF bulk capacitor near the package for switching transient suppression.
The PIC24FJ64GA702's eXtreme Low Power (XLP) technology supports multiple deep-sleep modes. In Sleep mode with RTCC running, the device typically draws under 1 uA at 3.3 V per the Microchip datasheet. To achieve this low quiescent current, disable all unused peripherals in software, configure unused pins as outputs driving low, and avoid leaving floating analog inputs. Use the internal 8 MHz fast RC oscillator as the system clock to keep peripheral wake-up latency under 5 us.
Do not exceed 3.6 V on any VDD pin or the device will be permanently damaged - this is the most common failure cause. Ensure programming/debugging with PGECx/PGEDx uses the correct ICD 3 or PICkit 4 configuration, as the older PICkit 3 may not support the GA702's voltage range. When using CTMU for capacitive touch, perform at least 10 oversampling acquisitions per measurement to filter 50/60 Hz mains noise. Always validate the ADC reference voltage stability with a multimeter before relying on absolute ADC readings.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (I/MV suffix). For AEC-Q100 automotive qualification, choose the PIC24FJ64GA702-E/MV variant instead. Halogen-free status not explicitly listed in distributor pages.
