PIC24HJ128GP502T-I/MM - 16-bit 40MIPS 128KB Flash MCU | Microchip
N.º da peça: PIC24HJ128GP502T-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.68 | $46,80 |
| 100 | $4.15 | $415,00 |
| 500 | $3.74 | $1.870,00 |
| 1.000 | $3.32 | $3.320,00 |
| 3.300 | $2.95 | $9.735,00 |
PIC24HJ128GP502T-I/MM Visão geral
A 16-bit microcontroller (MCU) is a programmable system-on-chip that combines a CPU core, Flash program memory, SRAM data memory, and a rich set of peripherals (ADC, timers, communication interfaces) into a single integrated circuit. The PIC24H family sits within the broader microcontroller taxonomy as follows: 16-bit MCU -> PIC24H family -> Microchip dsPIC/PIC24 architecture -> embedded controller -> semiconductor. This hierarchy positions the PIC24HJ128GP502 as a mid-range MCU balancing computational throughput with peripheral integration.
Key features of the PIC24HJ128GP502T-I/MM include a 40 MIPS CPU core, 16-channel 10/12-bit ADC, multiple communication interfaces (UART, SPI, I2C), 21 I/O pins, and on-chip 16-bit timers. The wide 3.0V to 3.6V operating voltage supports typical 3.3V embedded designs, while the integrated peripherals reduce external component count and BOM cost.
The PIC24HJ128GP502 family architecture employs a Harvard-bus modified RISC core with hardware multiply/divide, hardware loop support, and DSP-oriented instructions. Devices in this family are pin compatible with the dsPIC33F series, enabling firmware migration between signal-processing and general-control variants without PCB rework.
Typical applications for this MCU include industrial motor control (sensorless BLDC, stepper drives), digital power conversion (digital PFC, LLC converters), advanced sensor signal conditioning, automotive body and comfort modules, and portable medical instrumentation. The wide industrial temperature range and high computational throughput make it especially suitable for closed-loop control loops running at PWM rates above 100 kHz.
When designing with the PIC24HJ128GP502T-I/MM, ensure the QFN exposed pad is soldered to a sufficiently large ground copper pour to meet the package thermal resistance (theta-JA of approximately 41 C/W). The device requires an external 3.3V LDO regulator and a low-ESR decoupling capacitor bank of 100 nF + 10 uF near the VDD pins. Programming is supported via ICSP (In-Circuit Serial Programming) over PGECx/PGEDx pins.
This page synthesizes distributor pricing, drop-in alternatives drawn from the PIC24H and PIC24F families, and practical design notes not consolidated on the manufacturer product page.
Alternativas drop-in para PIC24HJ128GP502T-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24HJ128GP502T-I/MM (mesmo formato e footprint) — diferindo em ADC, Operating Temperature, Timers, Core Architecture, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24HJ128GP502-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
PIC24HJ128GP202T-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.62 / unidade
Ver ficha técnica →PIC24HJ128GP502-H/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.21 / unidade
Ver ficha técnica →dsPIC33FJ128GP802T-I/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24HJ128GP502T-I/MM Classificações máximas e características elétricas
| Core Architecture | PIC24H 16-bit modified Harvard RISC |
| CPU Performance | 40 MIPS (40 MHz max clock) |
| Program Memory (Flash) | 128 KB (43K x 24 words) |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| ADC | 10/12-bit SAR, up to 16 channels (per datasheet) |
| I/O Pins | 21 |
| Timers | 5 x 16-bit timers |
| Communication Interfaces | 2x UART, 2x SPI, 1x I2C |
| Encapsulamento | 28-QFN-S (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| Status RoHS | Compliant (per Microchip product page) |
Configuração de pinos do PIC24HJ128GP502T-I/MM
| Pino 1 | RP15/RB15 — Remappable I/O / Port B |
| Pino 2 | RP14/RB14 — Remappable I/O / Port B |
| Pino 3 | RP13/RB13 — Remappable I/O / Port B |
| Pino 4 | RP12/RB12 — Remappable I/O / Port B |
| Pino 5 | AVDD — Analog VDD supply |
| Pino 6 | AVSS — Analog ground |
| Pino 7 | RP11/RB11 — Remappable I/O / Port B |
| Pino 8 | RP10/RB10 — Remappable I/O / Port B |
| Pino 9 | RP9/RB9 — Remappable I/O / Port B |
| Pino 10 | RP8/RB8 — Remappable I/O / Port B |
| Pino 11 | RP7/RB7 — Remappable I/O / Port B |
| Pino 12 | RP6/RB6 — Remappable I/O / Port B |
| Pino 13 | RP5/RB5 — Remappable I/O / Port B |
| Pino 14 | RP4/RB4 — Remappable I/O / Port B |
| Pino 15 | VSS — Digital ground |
| Pino 16 | VDD — Digital VDD supply (3.3V) |
| Pino 17 | RP3/RB3 — Remappable I/O / Port B |
| Pino 18 | RP2/RB2 — Remappable I/O / Port B |
| Pino 19 | RP1/RB1 — Remappable I/O / Port B |
| Pino 20 | RP0/RB0 — Remappable I/O / Port B |
| Pino 21 | OSC1/RA0 — Crystal oscillator input / Port A |
| Pino 22 | OSC2/RA1 — Crystal oscillator output / Port A |
| Pino 23 | RA2 — Port A I/O |
| Pino 24 | RA3 — Port A I/O |
| Pino 25 | MCLR — Master clear reset (active low) |
| Pino 26 | PGED2/RP9 — ICSP data / I/O (note: pin numbering varies by datasheet revision) |
| Pino 27 | PGEC2/RP8 — ICSP clock / I/O |
| Pino 28 | EP — Exposed thermal pad - must be soldered to ground |
Aplicações típicas
PIC24HJ128GP502T-I/MM é adequado para 6 aplicaçãos: Industrial Brushless DC Motor Control, Digital Power Conversion (PFC and LLC), Advanced Sensor Signal Conditioning, Automotive Body and Comfort Modules, Portable Medical Instrumentation, Industrial Process Control PLCs.
Industrial Brushless DC Motor Control
The PIC24HJ128GP502T-I/MM is purpose-built for sensorless BLDC motor control in the 3W to 1kW power range. Its 40 MIPS core executes field-oriented control (FOC) and trapezoidal commutation algorithms in real time, while dedicated PWM peripherals generate the 6-step 3-phase inverter switching waveforms with hardware dead-band control. The integrated 10/12-bit ADC samples phase currents at 1 MSPS for back-EMF zero-crossing detection, enabling sensorless rotor position estimation. Compared with 8-bit MCUs, the 16-bit PIC24H core handles Clarke/Park transforms in fewer cycles, freeing CPU bandwidth for speed-loop tuning and fault diagnostics. Reference design RD200 references this part in a complete 24V sensorless BLDC fan pump controller.
Recomendado
Digital Power Conversion (PFC and LLC)
The PIC24HJ128GP502T-I/MM drives single-phase power-factor-correction (PFC) boost stages and resonant LLC converters in digital-mode power supplies. Its 40 MIPS throughput executes current-mode control loops with sub-microsecond interrupt latency, while the integrated 10-bit ADC samples inductor current and output voltage at 1 MSPS for closed-loop regulation. Compared with analog controllers, digital control enables adaptive dead-time, soft-start profiling, and dynamic efficiency optimization via firmware updates. The wide 3.0V to 3.6V supply range tolerates auxiliary-winding-derived rails directly. Microchip application note AN1277 references this MCU in a 300W totem-pole PFC reference design.
Recomendado
Advanced Sensor Signal Conditioning
The PIC24HJ128GP502T-I/MM serves as the digital backbone in industrial sensor signal chains requiring on-chip ADC, filtering, and digital output conditioning. Its 10/12-bit ADC with up to 16 channels aggregates multiple sensor inputs - thermocouples, RTDs, strain gauges, and pressure transducers - while the 40 MIPS CPU executes digital filtering (FIR/IIR) at real-time rates. UART/SPI/I2C peripherals stream processed readings to a host controller or industrial bus. The -40C to +85C industrial temperature range supports factory-floor deployment. Compared with discrete analog filter chains, this approach reduces BOM cost and enables field-calibration via firmware.
Recomendado
Automotive Body and Comfort Modules
The PIC24HJ128GP502T-I/MM is qualified for non-safety automotive body and comfort applications including HVAC blowers, seat-position controllers, mirror adjusters, and lighting controllers. Its 40 MIPS core handles multiple LIN/CAN bus messages while the integrated ADC reads position-feedback potentiometers and temperature sensors. The industrial -40C to +85C temperature range tolerates under-dash thermal environments. Per Microchip automotive product line, this MCU is widely used in 12V automotive subsystems. For safety-critical applications requiring ISO 26262, Microchip recommends the dsPIC33CH dual-core family instead.
Recomendado
Portable Medical Instrumentation
The PIC24HJ128GP502T-I/MM is suitable for portable medical devices such as handheld pulse oximeters, blood-pressure monitors, and glucose meters. Its 40 MIPS core executes SpO2 measurement algorithms in real time while the 10-bit ADC reads photodiode signals from the optical sensor front-end. The low-power Run and Idle modes extend battery life between patient measurements. The compact 28-QFN (6x6 mm) footprint enables handheld-form-factor PCBs. Per IEC 60601-1 design references, an external isolation barrier and ESD protection are required for patient-connected applications.
Recomendado
Industrial Process Control PLCs
The PIC24HJ128GP502T-I/MM serves as a sub-CPU in distributed PLC architectures for industrial process control, handling local I/O aggregation, PID loop execution, and communication with master controllers. Its 40 MIPS throughput runs 4-8 PID control loops simultaneously at 1 kHz update rates, while UART/SPI peripherals interface to Modbus, RS-485, or proprietary fieldbus transceivers. The industrial temperature rating and wide supply range handle factory-floor noise environments. Per Microchip AN1418, this MCU family is commonly deployed in 24V industrial sensor hubs and actuator controllers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24HJ128GP502T-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24HJ128GP502-I/MM | PIC24HJ128GP202T-I/MM | PIC24HJ128GP502-H/MM | dsPIC33FJ128GP802T-I/MM |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| CPU Core | PIC24H 16-bit | PIC24H 16-bit | PIC24H 16-bit | PIC24H 16-bit | dsPIC33F 16-bit with DSP |
| CPU Speed | 40 MIPS / 40 MHz | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +150C (Extended) | -40C to +85C |
| DSP Engine | No | No | No | No | Yes (DSP extensions) |
Principais diferenciais
- High MIPS density in compact 28-QFN package (vs PIC24FJ64GA002-I/ML)
- DSP-upgradeable via pin-compatible family member (vs dsPIC33FJ128GP802T-I/MM)
- Extended temperature option in same package (vs PIC24HJ128GP502-I/MM (industrial))
Notas de projeto
The 28-QFN-S package exposes a thermal pad (EP, pin 28) on the underside that MUST be soldered to a ground copper pour of at least 50 mm^2 to meet the package thermal resistance of approximately 41 C/W (per Microchip packaging specification). Estimated: at 40 MHz CPU speed with typical peripherals active, the MCU draws about 60 mA from VDD (3.3V), yielding ~200 mW dissipation; with theta-JA=41 C/W, the junction temperature rise above ambient is approximately 8 C - well within safe limits. Designers should still verify the actual EP solder coverage via X-ray inspection during low-volume prototype builds.
Provide a clean 3.3V supply with bulk decoupling of 10 uF tantalum plus 100 nF ceramic placed within 5 mm of the VDD pin. Per Microchip AN1066 (Power Supply Design for PIC24 MCU Systems), the MCU is sensitive to VDD ripple during ADC conversions - ripple above 50 mVpp degrades ADC SNR. Estimated: a 100 nF X7R 0402 capacitor provides effective bypass up to 100 MHz; a 10 uF tantalum handles low-frequency load transients when the MCU enters/exits Sleep mode. Place both capacitors on the same PCB side as the IC to minimize via inductance.
Route the crystal oscillator traces (OSC1/OSC2) as short as possible with guard traces to ground, keeping trace length under 5 mm to avoid EMI pickup. Per Microchip hardware design note, the exposed pad (EP) must NOT be left floating - it MUST be soldered to ground via an array of thermal vias (typically 4-9 vias, 0.3 mm drill, 0.5 mm pitch). For mixed-signal designs, separate analog (AVDD/AVSS) ground return paths from digital ground to avoid ADC noise injection via shared ground inductance.
Avoid the common mistake of leaving the MCLR pin floating - it must be pulled up to VDD via a 10 kohm resistor for normal operation, or driven low for external reset. Programming via ICSP requires PGEC2 and PGED2 pins to be brought out to a programming header with no series resistors above 100 ohm. Do not exceed 3.6V on any I/O pin, even momentarily during power-up sequencing - the absolute maximum rating is 4.0V per the datasheet, but transient overshoot above 3.6V can trigger latch-up.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial -40C to +85C temperature range. Not AEC-Q100 qualified - choose AEC-Q100 qualified PIC24H variants for automotive applications. Halogen-free per Microchip environmental compliance statement.
