DSPIC33EP16GS502T-I/MM - 16-bit 70MIPS Digital Power DSC | Microchip
N.º da peça: DSPIC33EP16GS502T-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.9 | $3,90 |
| 10 | $3.55 | $35,50 |
| 100 | $3.25 | $325,00 |
| 500 | $2.95 | $1.475,00 |
| 1.000 | $2.75 | $2.750,00 |
DSPIC33EP16GS502T-I/MM Visão geral
A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, the DSC sits above a generic MCU for closed-loop conversion tasks: it executes control-loop mathematics (PID, 3p3z compensation) at switching frequencies reaching hundreds of kilohertz, while dedicated analog and timing peripherals offload the CPU. The dsPIC33EP family is Microchip's 16-bit DSC generation designed specifically for digital power and conversion applications.
Key features of the GS502 variant include interconnected high-speed PWM modules with individual duty-cycle, phase and dead-time resolution down to sub-nanosecond steps for LLC and phase-shifted topologies; a high-speed 10-bit ADC with multiple sample-and-hold modules able to trigger synchronously from the PWM; on-chip programmable gain amplifiers (PGA) and high-speed comparators that close current-mode loops in hardware; and DSP engine instructions (MAC, DSP multiply) for fast loop execution.
Architecturally, the device runs a modified Harvard 16-bit core at up to 70 MIPS from an internal PLL, with interrupt latency low enough for per-cycle current sampling. The GS50x subfamily adds peripheral interconnection (PWM-to-ADC-to-comparator crossbars) that reduces software intervention in the control path.
Typical applications include interleaved power factor correction (Microchip's 350 W interleaved PFC reference design uses this family), zero-voltage-switching full-bridge AC-DC converters such as Microchip's 750 W reference design, and digital lighting or telecom power supplies.
Design consideration: the 'T' suffix denotes tape-and-reel supply and the 'I' grade specifies -40C to +85C operation; verify the QFN exposed pad is well grounded for thermal and EMC performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP16GS502T-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP16GS502T-I/MM (mesmo formato e footprint) — diferindo em Package, Packaging, Mounting Type, Operating Temperature, Analog Peripherals.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP16GS502T-E/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GS502T-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.85 / unidade
Ver ficha técnica →DSPIC33EP64GS502T-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128MC202T-E/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.41 / unidade
Ver ficha técnica →DSPIC33EP16GS502T-I/MM Classificações máximas e características elétricas
| Core | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Flash Memory | 16 KB (16K x 8) |
| RAM | 2 KB |
| Tensão de alimentação | 3.0 V to 3.6 V (3.3 V nominal) |
| Temperatura de operação | -40C to +85C (I grade) |
| Encapsulamento | 28-QFN-S (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| PWM | High-speed PWM for digital power |
| ADC | High-speed 10-bit ADC with multiple S/H |
| Analog Peripherals | PGA and high-speed comparators |
| Application Focus | Digital power (SMPS, PFC, LLC) |
| Packaging | Tape and Reel (T suffix) |
| Family | dsPIC33EP16GS502 (GS50x digital power subfamily) |
| Functional Safety | FuSa-classified variant family (per DigiKey) |
Configuração de pinos do DSPIC33EP16GS502T-I/MM
| Pino 1 | MCLR — Master clear reset / programming voltage input |
| Pino 2 | AN0/CN0/RB0 — Analog input 0 / change notification / port B bit 0 |
| Pino 3 | AN1/CN1/RB1 — Analog input 1 / change notification / port B bit 1 |
| Pino 4 | AN2/CN2/RB2 — Analog input 2 / change notification / port B bit 2 |
| Pino 5 | AN3/CN3/RB3 — Analog input 3 / change notification / port B bit 3 |
| Pino 6 | VSS — Ground reference |
| Pino 7 | VDD — Positive supply (3.0 V to 3.6 V) |
| Pino 8 | OSC1/CLKI/RA2 — Oscillator input / external clock input |
| Pino 9 | OSC2/CLKO/RA3 — Oscillator output / clock output |
| Pino 10 | AN4/CN4/RB4 — Analog input 4 / change notification / port B bit 4 |
| Pino 11 | AN5/CN5/RB5 — Analog input 5 / change notification / port B bit 5 |
| Pino 12 | PGD/EMUD1/RB6 — In-circuit serial programming data / emulator data |
| Pino 13 | PGC/EMUC1/RB7 — In-circuit serial programming clock / emulator clock |
| Pino 14 | VSS — Ground reference |
| Pino 15 | AN6/CN6/RB8 — Analog input 6 / change notification / port B bit 8 |
| Pino 16 | AN7/CN7/RB9 — Analog input 7 / change notification / port B bit 9 |
| Pino 17 | AN8/RB10 — Analog input 8 / port B bit 10 |
| Pino 18 | AN9/RB11 — Analog input 9 / port B bit 11 |
| Pino 19 | AN10/RB12 — Analog input 10 / port B bit 12 |
| Pino 20 | AN11/RB13 — Analog input 11 / port B bit 13 |
| Pino 21 | AN12/RB14 — Analog input 12 / port B bit 14 |
| Pino 22 | AN13/RB15 — Analog input 13 / port B bit 15 |
| Pino 23 | VDD — Positive supply (3.0 V to 3.6 V) |
| Pino 24 | AVSS — Analog ground reference |
| Pino 25 | AVDD — Analog supply (3.0 V to 3.6 V) |
| Pino 26 | RA0/PGD3 — Port A bit 0 / alternate programming data |
| Pino 27 | RA1/PGC3 — Port A bit 1 / alternate programming clock |
| Pino 28 | VCAP/VDDCORE — CPU core voltage regulator capacitor connection |
Aplicações típicas
DSPIC33EP16GS502T-I/MM é adequado para 6 aplicaçãos: Interleaved Power Factor Correction, ZVS Full-Bridge AC-DC Converters, Digital Lighting Power Supplies, Telecom and Server DC-DC Power, Solar Micro-Inverters and Power Optimizers, Digital Control of Uninterruptible Power Supplies.
Interleaved Power Factor Correction
The Microchip 350 W interleaved PFC reference design is built on the dsPIC33EP16GS50x family, demonstrating universal AC input producing a high-voltage DC output. The DSPIC33EP16GS502T-I/MM's interconnected high-speed PWM generates two interleaved phases with precise phase offset, while the high-speed 10-bit ADC samples inductor currents synchronously with PWM switching events. The on-chip comparators provide hardware cycle-by-cycle overcurrent protection with no CPU latency, and the 70 MIPS DSP core executes the average-current-mode compensation loop. Running the control loop in firmware at these speeds eliminates analog control ICs and allows adaptive gain across the universal input range.
Recomendado
ZVS Full-Bridge AC-DC Converters
Microchip's 750 W AC-DC reference design uses a semi-bridgeless PFC followed by a peak-current-controlled zero-voltage-switching full-bridge with digital slope compensation, implemented on the dsPIC33EP16GS50x family. The DSPIC33EP16GS502T-I/MM generates four PWM outputs with sub-nanosecond dead-time resolution to prevent bridge shoot-through, and its PGA plus comparators close the peak current loop in hardware for fast fault response. Digital slope compensation is applied in firmware, enabling very high conversion efficiency without analog slope circuitry. The 16 KB Flash is sufficient for the full PFC plus phase-shift control firmware in this topology.
Recomendado
Digital Lighting Power Supplies
LED drivers and HID electronic ballasts require constant-current regulation with fast transient response and dimming interfaces, which the DSPIC33EP16GS502T-I/MM addresses with its high-speed PWM and on-chip comparators. The PWM modules support multi-channel output for multi-string LED drivers with independent dimming resolution, while the ADC triggered synchronously from the PWM measures output current ripples at optimal instants, minimizing measurement noise. Firmware-based control allows DALI or 0-10 V dimming protocols to run on the same 70 MIPS core. The -40C to +85C I-grade suits outdoor luminaire environments.
Recomendado
Telecom and Server DC-DC Power
Intermediate bus converters and point-of-load digital power in telecom rectifiers benefit from the DSPIC33EP16GS502T-I/MM's ability to run voltage-mode or current-mode control loops at hundreds of kilohertz switching frequency. The 3.0 V to 3.6 V supply matches standard 3.3 V bias rails, and the exposed-pad 28-QFN 6x6 mm package provides low-inductance grounding essential for gate-drive signal integrity. PMBus-style telemetry and fault logging run in firmware, replacing supervisory ICs. Designers needing larger firmware (more topology options) can drop in the pin-compatible 32 KB or 64 KB GS502 variants without PCB change.
Recomendado
Solar Micro-Inverters and Power Optimizers
Panel-level power electronics combine MPPT algorithms with grid-tied inverter control, a workload the DSPIC33EP16GS502T-I/MM handles with its DSP multiply-accumulate instructions for fast MPPT iteration and its high-speed PWM for the inverter stage. Synchronous ADC sampling captures panel voltage/current at PWM-locked instants, avoiding switching-noise corruption in the MPPT measurement. The 28-pin QFN keeps board area minimal for enclosure-constrained optimizer housings, and the industrial temperature grade covers rooftop environments. The FuSa (functional safety) classification of this device family additionally supports safety-relevant power conversion architectures.
Recomendado
Digital Control of Uninterruptible Power Supplies
UPS systems require coordinated PFC, inverter and battery-charger control with rapid mode transitions between mains and battery operation. The DSPIC33EP16GS502T-I/MM manages one such conversion stage per DSC, using hardware comparators for instantaneous overcurrent shutdown during transfer events and the 70 MIPS core for inverter voltage-loop regulation. Firmware-implemented control enables adaptive transfer strategies impossible with fixed analog control, improving output THD. Extended-temperature variants (DSPIC33EP16GS502T-E/MM) are drop-in upgrades for high-temperature UPS cabinets, and the common footprint supports a single PCB platform across product power tiers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP16GS502T-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP16GS502T-E/MM | DSPIC33EP32GS502T-I/MM | DSPIC33EP64GS502T-I/MM | DSPIC33EP128MC202T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB | 128 KB |
| Subfamily / Peripheral Set | GS (digital power): HS PWM, PGA, comparators | GS - identical | GS - identical | GS - identical | MC (motor control) PWM set |
| Temperature Range | -40C to +85C (I) | Extended (E grade) | -40C to +85C (I) | -40C to +85C (I) | Extended (E grade) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principais diferenciais
- Purpose-built digital power peripherals (vs DSPIC33EP128MC202T-E/MM)
- Extended temperature drop-in option (vs DSPIC33EP16GS502T-E/MM)
- Lowest-memory (lowest-cost) GS50x entry point (vs DSPIC33EP64GS502T-I/MM)
Notas de projeto
The exposed pad of the 28-QFN-S (6x6 mm) package is the primary ground return for the digital power peripherals and must be soldered to a solid ground pour with an array of thermal vias. In SMPS layouts, keep the VDD/AVDD decoupling network (100 nF plus 4.7-10 uF per Microchip layout guidelines) within 2 mm of the pins, and separate the analog ground region under AVSS from the power-stage ground to keep PWM switching noise out of the ADC front end.
Power the core regulator output pin (VCAP/VDDCORE) with the datasheet-specified low-ESR capacitor; omitting or underrating it causes brown-out resets under 70 MIPS load transients. Split the digital and analog supplies with a ferrite bead or RC filter between VDD and AVDD, since the high-speed ADC PGA resolution depends on a quiet AVDD rail. Estimated: at 70 MIPS the device core draws tens of milliamps - budget headroom in the 3.3 V rail accordingly.
Verify the temperature grade before layout sign-off: the 'I' part is -40C to +85C, and power-supply enclosures frequently exceed this. If extended ambient is possible, substitute DSPIC33EP16GS502T-E/MM on the same footprint. Also confirm the 'T' tape-and-reel suffix matches your assembly line feeders - cut-tape quantities ship differently. Finally, ICSP programming requires clean access to MCLR, PGD and PGC; do not load these pins heavily in the power stage circuitry.
Route the high-speed PWM outputs to gate drivers on short, matched traces and keep them away from the ADC analog inputs (ANx pins) to minimize capacitive coupling of switching edges into sampled currents. Use synchronous sampling triggered from the PWM module rather than free-running ADC conversion - this is the whole point of the GS subfamily interconnect and dramatically reduces switching-noise error in current measurements.
Informações de conformidade
Microchip standard dsPIC33EP parts in QFN packaging are RoHS-compliant/lead-free per manufacturer policy and DigiKey catalog classification; formal REACH and conflict-minerals declarations were not present in retrieved data - request Microchip material declarations for certification evidence.
