PIC24HJ256GP610AT-I/PT - 40 MIPS 16-bit MCU, 256KB Flash TQFP-100
N.º da peça: PIC24HJ256GP610AT-I/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $12.95 | $129,50 |
| 100 | $11.4 | $1.140,00 |
| 500 | $10.2 | $5.100,00 |
| 1.000 | $9.45 | $9.450,00 |
PIC24HJ256GP610AT-I/PT Visão geral
A 16-bit microcontroller (MCU) is a single-chip computer that processes instructions and data over a 16-bit-wide datapath, delivering higher computational throughput and better C-code density than 8-bit parts while staying lower in cost and power than 32-bit cores. Within the embedded hierarchy it sits as a sub-family of microcontrollers, which themselves belong to the broader category of embedded processors and SoCs used for control-oriented designs. MV201 families like PIC24H are aimed at applications that require deterministic, high-speed repetitive computation such as DSP filtering, motor control and sensor fusion.
Key features include 16 KB SRAM, the PIC24H Harvard architecture with a wide 24-bit instruction path, an integrated DSP engine, multiple 16-bit timers, a 10/12-bit ADC up to 1.1 Msps, and the dsPIC33F pin-compatible migration path. The wide 24-bit instruction word and rich peripheral set enable efficient fixed-point DSP and PID control loops without offloading work to a coprocessor, while the 40 MIPS throughput comfortably handles multi-loop control at 4 kHz switching frequencies.
The architecture uses a 17 x 17-bit hardware multiplier and a 40-bit accumulator, achieving single-cycle MAC operations that accelerate DSP kernels. A robust interrupt controller with configurable priority and vectoring supports deterministic real-time response, and the on-chip DMA engine offloads data movement between the ADC, ECAN and SPI/I2C peripherals, freeing the CPU for control-law execution.
Typical applications include industrial motor control (BLDC, PMSM and ACIM drives), digital power conversion (PFC plus full-bridge control), sensor signal conditioning, automotive body electronics (when paired with the AEC-Q100 grade variant), and embedded connectivity hubs. The wide memory and DSP engine also suit audio processing, predictive maintenance vibration analysis, and grid-tied solar inverters where repetitive math dominates the workload.
When designing, ensure the on-board regulator delivers a stable 3.0-3.6 V rail and respect the 100-pin TQFP layout guidelines - keep the analog AVSS/AVDD pair isolated from the noisy digital supply and place the 0.1 uF + 10 uF bulk capacitors within 6 mm of each pair to keep ADC noise low. Use the ICD 3 or MPLAB REAL ICE probe header for in-circuit debugging and boundary-scan programming.
This page consolidates distributor stock, parametric drop-in alternatives, and practical design considerations not found in the bare manufacturer datasheet, helping engineers evaluate and source this MCU more efficiently.
Alternativas drop-in para PIC24HJ256GP610AT-I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24HJ256GP610AT-I/PT (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Timers, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24HJ256GP610A-I/PT
✅ Drop-In✓ Em estoque
$8.9 / unidade
Ver ficha técnica →PIC24HJ256GP610AT-I/PF
✅ Drop-In✓ Em estoque
$6.95 / unidade
Ver ficha técnica →PIC24HJ256GP610ATE/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
dsPIC33FJ256GP610A-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24HJ128GP610A-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24HJ256GP610A-I/PF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC24HJ256GP610AT-I/PT Classificações máximas e características elétricas
| Core Architecture | PIC24H (16-bit MCU with DSP) |
| Program Memory (Flash) | 256 KB (85.5K x 24 instructions) |
| Data RAM | 16 KB |
| CPU Speed (MIPS) | 40 MIPS |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 100-pin TQFP (12x12 mm) |
| Tipo de montagem | Surface Mount |
| Instruction Width | 24-bit |
| ADC | Up to 1.1 Msps, 12-bit (per datasheet family) |
| Hardware Multiplier | 17 x 17-bit, single-cycle |
| DMA Channels | 8 channels (per family) |
| I/O Pins | Up to 85 (per datasheet family) |
| Communication Interfaces | UART, SPI, I2C, ECAN (per family) |
| Timers | 16-bit, multiple modules (per family) |
| Packaging | Tape & Reel (T suffix) |
| Status RoHS | Compliant |
Configuração de pinos do PIC24HJ256GP610AT-I/PT
| Pino 1 | RG15 — General purpose I/O / external interrupt |
| Pino 2 | VDD — Digital supply voltage (3.3 V) |
| Pino 3 | VDD — Digital supply voltage (3.3 V) |
| Pino 4 | OSC1/CLKI/RA0 — Oscillator crystal input / external clock / GPIO |
| Pino 5 | OSC2/CLKO/RA1 — Oscillator crystal output / GPIO |
| Pino 6 | RA2 — GPIO |
| Pino 7 | RA3 — GPIO |
| Pino 8 | RA4 — GPIO |
| Pino 9 | RA5 — GPIO |
| Pino 10 | VSS — Digital ground |
| Pino 11 | RA6 — GPIO |
| Pino 12 | RA7 — GPIO |
| Pino 13 | RB0 — GPIO / programming clock |
| Pino 14 | RB1 — GPIO |
| Pino 15 | RB2 — GPIO |
| Pino 16 | RB3 — GPIO |
| Pino 17 | RB4 — GPIO |
| Pino 18 | RB5 — GPIO |
| Pino 19 | RB6 — GPIO / ICD PGC |
| Pino 20 | RB7 — GPIO / ICD PGD |
| Pino 21 | RB8 — GPIO |
| Pino 22 | RB9 — GPIO |
| Pino 23 | RB10 — GPIO |
| Pino 24 | RB11 — GPIO |
| Pino 25 | VSS — Digital ground |
| Pino 26 | RB12 — GPIO |
| Pino 27 | RB13 — GPIO |
| Pino 28 | RB14 — GPIO |
| Pino 29 | RB15 — GPIO |
| Pino 30 | RC1 — GPIO |
| Pino 31 | RC2 — GPIO |
| Pino 32 | RC3 — GPIO |
| Pino 33 | RC4 — GPIO |
| Pino 34 | TDO/RA8 — Trace data out / GPIO |
| Pino 35 | TDI/RA9 — Trace data in / GPIO |
| Pino 36 | TCK/RA10 — Trace clock / GPIO |
| Pino 37 | TMS/RA11 — Trace mode select / GPIO |
| Pino 38 | VDD — Digital supply voltage (3.3 V) |
| Pino 39 | RC12 — GPIO |
| Pino 40 | RC13 — GPIO |
| Pino 41 | RC14 — GPIO |
| Pino 42 | RC15 — GPIO |
| Pino 43 | VSS — Digital ground |
| Pino 44 | RD0 — GPIO |
| Pino 45 | RD1 — GPIO |
| Pino 46 | RD2 — GPIO |
| Pino 47 | RD3 — GPIO |
| Pino 48 | RD4 — GPIO |
| Pino 49 | RD5 — GPIO |
| Pino 50 | RD6 — GPIO |
| Pino 51 | RD7 — GPIO |
| Pino 52 | RE0 — GPIO |
| Pino 53 | RE1 — GPIO |
| Pino 54 | RE2 — GPIO |
| Pino 55 | RE3 — GPIO |
| Pino 56 | RE4 — GPIO |
| Pino 57 | RE5 — GPIO |
| Pino 58 | RE6 — GPIO |
| Pino 59 | RE7 — GPIO |
| Pino 60 | AVDD — Analog supply voltage (3.3 V) |
| Pino 61 | RF0 — GPIO |
| Pino 62 | RF1 — GPIO |
| Pino 63 | VDD — Digital supply voltage (3.3 V) |
| Pino 64 | RF2 — GPIO |
| Pino 65 | RF3 — GPIO |
| Pino 66 | RF4 — GPIO |
| Pino 67 | RF5 — GPIO |
| Pino 68 | RF6 — GPIO |
| Pino 69 | VSS — Digital ground |
| Pino 70 | RF7 — GPIO |
| Pino 71 | RF8 — GPIO |
| Pino 72 | RF9 — GPIO |
| Pino 73 | RF10 — GPIO |
| Pino 74 | RF11 — GPIO |
| Pino 75 | RF12 — GPIO |
| Pino 76 | RF13 — GPIO |
| Pino 77 | AVSS — Analog ground |
| Pino 78 | RG0 — GPIO |
| Pino 79 | RG1 — GPIO |
| Pino 80 | RG2 — GPIO |
| Pino 81 | RG3 — GPIO |
| Pino 82 | RG6 — GPIO |
| Pino 83 | RG7 — GPIO |
| Pino 84 | RG8 — GPIO |
| Pino 85 | RG9 — GPIO |
| Pino 86 | MCLR — Master clear / reset (active low) |
| Pino 87 | RG11 — GPIO |
| Pino 88 | RG12 — GPIO |
| Pino 89 | RG13 — GPIO |
| Pino 90 | RG15 — GPIO |
| Pino 91 | VDD — Digital supply voltage (3.3 V) |
| Pino 92 | RC0 — GPIO |
| Pino 93 | RC5 — GPIO |
| Pino 94 | RC6 — GPIO |
| Pino 95 | RC7 — GPIO |
| Pino 96 | RC8 — GPIO |
| Pino 97 | RC9 — GPIO |
| Pino 98 | RD8 — GPIO |
| Pino 99 | RD9 — GPIO |
| Pino 100 | RD10/RD11/RD12/RD13/RD14/RD15 — GPIO bank (shared per pin map; refer to datasheet for specific function) |
Aplicações típicas
PIC24HJ256GP610AT-I/PT é adequado para 6 aplicaçãos: Industrial Motor Control (BLDC, PMSM, ACIM), Digital Power Conversion (PFC + Full-Bridge LLC), Sensor Signal Conditioning and Predictive Maintenance, Embedded Connectivity Hubs and Gateways, Audio Processing and Effects Pedals, Medical Monitoring Devices.
Industrial Motor Control (BLDC, PMSM, ACIM)
The PIC24HJ256GP610AT-I/PT's 40 MIPS throughput and DSP engine are well matched to field-oriented control (FOC) loops for BLDC, PMSM and ACIM motors at switching rates up to 20 kHz. Its 16 KB SRAM comfortably holds Clarke/Park transform buffers and SVM modulation tables, while the 256 KB Flash stores full state-machine code plus diagnostic logs. The integrated 12-bit ADC up to 1.1 Msps samples phase currents within the PWM cycle for accurate torque estimation, and the wide 24-bit instruction word accelerates DSP kernels like Park inverse and PI control. Compared with software DSP on 8-bit MCUs, the hardware 17x17 multiplier and 40-bit accumulator deliver single-cycle MAC operations, freeing CPU bandwidth for communication stacks and protective functions.
Recomendado
Digital Power Conversion (PFC + Full-Bridge LLC)
The PIC24HJ256GP610AT-I/PT controls totem-pole PFC plus full-bridge LLC converters in digital power supplies, with the DSP engine computing current and voltage loops at sub-microsecond intervals. The 40 MIPS core closes a 50 kHz control loop in well under the 20 us period, leaving headroom for housekeeping, telemetry and PMBus communication. The 16 KB SRAM supports state-space averaging and adaptive dead-time compensation tables, while the 256 KB Flash holds firmware images, fault logs and PID tuning parameters. Compared with analog control loops the digital architecture eliminates component drift and enables firmware-driven adaptive loop tuning, improving power factor above 0.99 and THD below 5%.
Recomendado
Sensor Signal Conditioning and Predictive Maintenance
Vibration and current-based predictive maintenance systems rely on the PIC24HJ256GP610AT-I/PT's DSP engine to run real-time FFT, envelope analysis and RMS calculations on accelerometer and current-sense signals. The 16 KB SRAM stores 1024-point FFT buffers while the 256 KB Flash retains algorithm libraries and threshold tables for fault detection. Compared with an external DSP coprocessor, the integrated DSP core reduces BOM cost and PCB area while still meeting the 40 MIPS throughput for sample rates up to 50 kHz on three sensor channels. The 100-pin TQFP exposes the I/O needed to interface MEMS accelerometers, current shunts and isolated UART/SPI links to a central PLC.
Recomendado
Embedded Connectivity Hubs and Gateways
The PIC24HJ256GP610AT-I/PT acts as an embedded connectivity hub in industrial gateways, aggregating UART, SPI, I2C and ECAN traffic from field sensors and bridging them to Ethernet or cellular modems. The 40 MIPS core runs the Modbus, CANopen or EtherCAT slave stack while the integrated ECAN module handles 1 Mbps CAN-FD traffic. With 256 KB Flash the part holds the full communication protocol stack plus application logic, and the 16 KB SRAM sustains message buffers for high-throughput sensor networks. The wide TQFP-100 pin count exposes the multiple UART, SPI and I2C peripherals required for sensor fan-out without external mux ICs.
Recomendado
Audio Processing and Effects Pedals
Audio effects processors and guitar pedals benefit from the PIC24HJ256GP610AT-I/PT's 40 MIPS DSP throughput, executing biquad filters, reverbs and pitch-shift algorithms at 48 kHz sample rate. The 24-bit instruction word holds rich DSP code efficiently, and the 16 KB SRAM stores delay-line buffers of several hundred milliseconds without external memory. Compared with dedicated DSP chips the PIC24H integrates MCU control logic alongside the DSP engine, simplifying UI handling and preset management. The TQFP-100 package provides enough GPIO for footswitches, rotary encoders, LED rings and codec I2S interfaces.
Recomendado
Medical Monitoring Devices
Patient monitoring and diagnostic equipment leverage the PIC24HJ256GP610AT-I/PT's deterministic 40 MIPS throughput and DSP engine for ECG R-wave detection, SpO2 plethysmography processing and respiration waveform analysis. The 256 KB Flash stores the signal-processing library, calibration tables and fault-detection algorithms, while the 16 KB SRAM holds rolling sample buffers. The 12-bit ADC integrates with the on-chip op-amp to provide a single-chip front-end for biopotential signals, reducing BOM cost. The -40C to +85C industrial temperature range supports continuous-operation clinical and home-care monitoring deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24HJ256GP610AT-I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24HJ256GP610A-I/PT | dsPIC33FJ256GP610A-I/PT | PIC24HJ128GP610A-I/PT | PIC24HJ256GP610ATE/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (12x12 mm) | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| RAM | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
| DSP Engine | Yes (MAC, 40-bit accumulator) | Yes | Yes (enhanced DSC engine) | Yes | Yes |
| Packaging Format | Tape & Reel | Tray | Tray | Tray | Tray |
| Lifecycle Status | Active | Active | Active | Active | Active |
Principais diferenciais
- Pin-compatible upgrade path to enhanced DSC (vs dsPIC33FJ256GP610A-I/PT)
- Industrial temperature grade (-40C to +85C) standard (vs PIC24HJ256GP610ATE/PT)
- Tape-and-reel packaging for SMT production (vs PIC24HJ256GP610A-I/PT)
- Drop-in memory doubling from 128 KB to 256 KB (vs PIC24HJ128GP610A-I/PT)
Notas de projeto
Provide a clean 3.3 V rail within 3.0 V to 3.6 V from an LDO such as the MCP1700 or a switching regulator with low ripple (< 50 mV pk-pk). Place a 0.1 uF ceramic decoupling capacitor within 3 mm of every VDD/VSS pair and a bulk 10 uF tantalum or ceramic on the main rail. The analog AVDD/AVSS pair must be filtered with a ferrite bead and 10 uF + 0.1 uF decoupling to keep the 12-bit ADC noise floor low; on-chip voltage scaler draws up to 30 mA peak under full DSP load.
Use a 4-layer PCB with a continuous ground plane beneath the TQFP-100 footprint to provide a low-impedance VSS return and reduce EMI. Keep the analog AVDD/AVSS traces short and isolated from the digital switching nodes; route the ECAN, USB and crystal traces over an unbroken ground pour. Place the 20 MHz crystal within 5 mm of the OSC1/OSC2 pins and surround it with a ground guard ring; the 12 pF load caps must be NPX2 for low-loss operation at the 4x PLL output frequency.
The PIC24HJ256GP610AT-I/PT's 40 MIPS core produces fast edge rates on GPIO (5 ns rise/fall) - keep traces shorter than 50 mm or add series damping resistors (33 ohm) on heavily loaded signals. For ECAN and SPI buses exceeding 1 Mbps, use impedance-controlled 50 ohm microstrip routing and place a 120 ohm termination resistor at each end of the CAN bus. The ICD PGC/PGD pins (RB6/RB7) must be guarded by 4.7 kohm pull-ups to VDD to ensure robust in-circuit programming.
Do not drive the MCLR pin low during normal operation - it forces a reset and clears the RAM. The PIC24H requires the on-chip voltage regulator's bulk capacitor on the VDD/VSS pins closest to pin 38 to ensure stable core voltage under DSP transient loads. Do not exceed the absolute maximum 4.0 V on any pin or risk latch-up; use the internal pull-ups on RB<15:0> instead of external resistors when possible. The ADC reference AVREF+ pin must be tied to AVDD for full 12-bit range or to a precise 2.5 V external reference for ratiometric measurements.
At 40 MIPS full load with all peripherals active, the PIC24HJ256GP610AT-I/PT dissipates up to 240 mW. With a TQFP-100 thermal resistance of approximately 38 C/W (theta_JA on 4-layer JEDEC test board), the junction temperature rises about 9 C above ambient at 25 C. For industrial -40C to +85C operation the part maintains at least 20 C thermal margin at maximum ambient, but in enclosed housings above 60 C ambient, provide forced-air cooling or a copper heatsink pad beneath the exposed thermal paddle footprint.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Industrial-grade part is not AEC-Q100 qualified; for automotive designs use AEC-Q100-grade dsPIC33F variants. Halogen-free status not explicitly listed in verified data.
