Microchip Technology

DSPIC33EP512MU810-E/PT - 16-bit DSC 60 MIPS USB TQFP-100 | Microchip

N.º da peça: DSPIC33EP512MU810-E/PT ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
3.0 V to 3.6 V Vdss 100-pin TQFP (12x12 mm) Package 60 MIPS (70 MIPS per family spec) Speed 512 KB (170K x 24 instruction words) Memory
A partir de $7.85 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-07
Preços por volume
Qtd. Preço unitário Total
1 $12.5 $12,50
10 $11.25 $112,50
100 $10 $1.000,00
500 $8.9 $4.450,00
1.000 $7.85 $7.850,00
ℹ️ Todos os preços estão em USD

DSPIC33EP512MU810-E/PT Visão geral

The Microchip Technology DSPIC33EP512MU810-E/PT is a 16-bit digital signal controller (DSC) delivering up to 60 MIPS from its dsPIC33E core, with 512 KB (170K x 24) of Flash program memory, 52 KB of SRAM, and integrated full-speed USB 2.0 On-The-Go, housed in a 100-pin TQFP (12x12 mm) package with extended -40C to +125C temperature rating.

A digital signal controller combines the compute characteristics of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33E family a common choice for precision motor control, digital power conversion, and sensing applications that require both fast multiply-accumulate arithmetic and rich on-chip peripherals.

Key features include a 17-bit x 17-bit hardware multiplier with a 40-bit accumulator, 15 DMA channels for low-CPU-overhead data movement, high-speed PWM modules optimized for three-phase motor and digital-power topologies, four UART/SPI/I2C serial interfaces, and a 12-bit ADC with up to 1.1 Msps conversion rate on the analog peripherals. The 512 KB Flash supports self-programming for in-field firmware updates.

The dsPIC33EP MU810 family uses Microchip's 16-bit EP core architecture with linear program memory addressing up to 4M instruction words, hardware integer division support, and a deterministic interrupt controller. USB OTG, CAN, and SENT peripherals enable networked industrial nodes without an external bridge IC.

Typical applications include brushless DC and PMSM motor drives running sensorless field-oriented control, digital power supplies and solar micro-inverters, USB-connected industrial instrumentation, and general-purpose sensing nodes running FFT or FIR DSP filters. The integrated USB also suits data-acquisition probes and Human Interface Devices (HID).

When designing with this part, ensure a 3.0V to 3.6V supply with proper decoupling on every VDD/VSS pair and a clean AVDD rail for the on-chip ADC; plan the TQFP-100 ground strategy from the first PCB revision to avoid analog digital noise coupling into the PWM feedback paths.

This page synthesizes distributor pricing, same-family drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.

Alternativas drop-in para DSPIC33EP512MU810-E/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com DSPIC33EP512MU810-E/PT (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, DMA Channels, Maximum CPU Speed.

Microchip Technology
Package: TQFP-64 (PT), 10x10 mm, 0.5 mm pitch
Core Architecture: dsPIC33E 16-bit DSC with DSP engine
Maximum CPU Speed: 60 MHz (70 MIPS)
Microchip Technology
ADC: 10-bit (per datasheet family)
Package: 44-pin TQFP (10x10 mm)
Core Architecture: dsPIC33E (16-bit DSC with DSP)
Microchip Technology
ADC: 2x 10-bit ADC, up to 32 channels
Package: 64-pin TQFP (10 x 10 mm)
Core Architecture: dsPIC33E DSC (16-bit DSP + MCU)
Microchip Technology
ADC: 10/12-bit, 1.1 Msps
Package: 100-pin TQFP (PT), 12 x 12 mm, 0.5 mm pitch
DMA Channels: 8 channels
Microchip Technology
ADC: 4 x 12-bit modules, up to 6 Msps combined
Core Architecture: 32-bit RISC with FPU and DSP extensions
Microchip Technology
ADC: 2 x 12-bit SAR, up to 16 channels, 3.25 MSPS, 4 simultaneous S&H
Package: 64-pin TQFP (10x10 mm), suffix /PT
DMA Channels: 16

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

DSPIC33EP512MU810-I/PT

✅ Drop-In
Microchip Technology
📦 100-pin TQFP (12x12 mm)
dsPIC33E (16-bit DSC with DSP engine) · 70 MIPS (60 MHz core clock) · 512 KB (170K x 24 instructions), self-programmable · 52 KB · 3.0 V to 3.6 V · USB 2.0 Full-Speed (12 Mbps), integrated PHY · 2 x CAN 2.0B · 10/12-bit, 1.1 Msps

✓ Em estoque

$7.78 / unidade

Ver ficha técnica →

DSPIC33EP512MU810-E/PTR

✅ Drop-In
📦 100-pin TQFP (12x12 mm)
same die, tape-and-reel pack vs tray; otherwise identical specs and footprint

📋 Alternativa de referência (fora do catálogo)

DSPIC33EP512MC806-E/PT

✅ Drop-In
Microchip Technology
📦 100-pin TQFP (12x12 mm)
dsPIC33E DSC (16-bit DSP + MCU) · 70 MIPS (60 MIPS @ 3.3V) · 512 KB (170K x 24) · 53,248 bytes (52 KB) · 3.0 V to 3.6 V · -40 C to +125 C (Extended, E grade) · 64-pin TQFP (10 x 10 mm) · Surface Mount

✓ Em estoque

$8.75 / unidade

Ver ficha técnica →

DSPIC33EP256MC506-E/PT

✅ Drop-In
Microchip Technology
📦 100-pin TQFP (12x12 mm)
dsPIC33E 16-bit DSC with DSP engine · 60 MHz (70 MIPS) · 256 KB · 32 KB · TQFP-64 (PT), 10x10 mm, 0.5 mm pitch · -40C to +125C (E = Extended Industrial) · 3.0 V to 3.6 V · 3 (configurable with external passives)

✓ Em estoque

$5.83 / unidade

Ver ficha técnica →

DSPIC33EP512GM604-I/PT

✅ Drop-In
Microchip Technology
📦 100-pin TQFP (12x12 mm)
dsPIC33E (16-bit DSC with DSP) · 70 MIPS (70 MHz max) · 512 KB · 16 KB · 3.0 V to 3.6 V · -40C to +85C (Industrial, -I suffix) · 44-pin TQFP (10x10 mm) · 12

✓ Em estoque

$7.4 / unidade

Ver ficha técnica →

dsPIC33EP512GM306-I/PT

✅ Drop-In
Microchip Technology
📦 100-pin TQFP (12x12 mm)
dsPIC33E 16-bit DSC with DSP MAC engine · 140 MHz · 70 MIPS (16-bit instructions) · 512 KB · 48 KB · 3.0 V to 3.6 V · -40C to +85C (Industrial, I grade) · 64-pin TQFP (10x10 mm), suffix /PT

✓ Em estoque

$7.18 / unidade

Ver ficha técnica →

DSPIC33EP512MU810-E/PT Classificações máximas e características elétricas

Core dsPIC33E 16-bit DSC
Maximum CPU Speed 60 MIPS (70 MIPS per family spec)
Program Memory (Flash) 512 KB (170K x 24 instruction words)
Data RAM 52 KB
Operating Voltage 3.0 V to 3.6 V
USB USB 2.0 Full-Speed OTG
I/O Pins 51
DMA Channels 15
ADC 12-bit, up to 1.1 Msps
PWM Modules Multiple high-speed PWM with 7.5 ns resolution
Timers 9 general purpose 16-bit + input capture/output compare
UART / SPI / I2C 4 UART, 3 SPI, 2 I2C
Temperatura de operação -40C to +125C (E suffix)
Encapsulamento 100-pin TQFP (12x12 mm)
Tipo de montagem Surface Mount
Status RoHS Compliant

Configuração de pinos do DSPIC33EP512MU810-E/PT

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
Pino 1 OSCI — External oscillator input
Pino 2 OSCO — External oscillator output
Pino 3 MCLR — Master clear (reset) input
Pino 4 PGECx — Programming/debugging clock
Pino 5 PGEDx — Programming/debugging data
Pino 6 VDD — Digital supply 3.3V
Pino 7 VSS — Ground
Pino 8 RPx — Remappable I/O
Pino 9 RPx — Remappable I/O
Pino 10 RPx — Remappable I/O
Pino 11 RPx — Remappable I/O
Pino 12 PWMxH — High-side PWM output
Pino 13 PWMxL — Low-side PWM output
Pino 14 PWMxH — High-side PWM output
Pino 15 PWMxL — Low-side PWM output
Pino 16 PWMxH — High-side PWM output
Pino 17 PWMxL — Low-side PWM output
Pino 18 VDD — Digital supply 3.3V
Pino 19 VSS — Ground
Pino 20 RPx — Remappable I/O
Pino 21 RPx — Remappable I/O
Pino 22 RPx — Remappable I/O
Pino 23 RPx — Remappable I/O
Pino 24 RPx — Remappable I/O
Pino 25 RPx — Remappable I/O
Pino 26 RPx — Remappable I/O
Pino 27 RPx — Remappable I/O
Pino 28 RPx — Remappable I/O
Pino 29 RPx — Remappable I/O
Pino 30 RPx — Remappable I/O
Pino 31 RPx — Remappable I/O
Pino 32 RPx — Remappable I/O
Pino 33 RPx — Remappable I/O
Pino 34 RPx — Remappable I/O
Pino 35 RPx — Remappable I/O
Pino 36 RPx — Remappable I/O
Pino 37 RPx — Remappable I/O
Pino 38 RPx — Remappable I/O
Pino 39 RPx — Remappable I/O
Pino 40 RPx — Remappable I/O
Pino 41 RPx — Remappable I/O
Pino 42 RPx — Remappable I/O
Pino 43 RPx — Remappable I/O
Pino 44 RPx — Remappable I/O
Pino 45 RPx — Remappable I/O
Pino 46 AVDD — Analog supply 3.3V
Pino 47 AVSS — Analog ground
Pino 48 ANx — Analog input
Pino 49 ANx — Analog input
Pino 50 ANx — Analog input
Pino 51 VREF+ — ADC voltage reference high
Pino 52 VREF- — ADC voltage reference low
Pino 53 RPx — Remappable I/O
Pino 54 RPx — Remappable I/O
Pino 55 RPx — Remappable I/O
Pino 56 RPx — Remappable I/O
Pino 57 RPx — Remappable I/O
Pino 58 RPx — Remappable I/O
Pino 59 RPx — Remappable I/O
Pino 60 RPx — Remappable I/O
Pino 61 RPx — Remappable I/O
Pino 62 RPx — Remappable I/O
Pino 63 RPx — Remappable I/O
Pino 64 RPx — Remappable I/O
Pino 65 RPx — Remappable I/O
Pino 66 RPx — Remappable I/O
Pino 67 RPx — Remappable I/O
Pino 68 RPx — Remappable I/O
Pino 69 RPx — Remappable I/O
Pino 70 RPx — Remappable I/O
Pino 71 RPx — Remappable I/O
Pino 72 VDD — Digital supply 3.3V
Pino 73 VSS — Ground
Pino 74 RPx — Remappable I/O
Pino 75 RPx — Remappable I/O
Pino 76 RPx — Remappable I/O
Pino 77 RPx — Remappable I/O
Pino 78 RPx — Remappable I/O
Pino 79 RPx — Remappable I/O
Pino 80 RPx — Remappable I/O
Pino 81 RPx — Remappable I/O
Pino 82 RPx — Remappable I/O
Pino 83 RPx — Remappable I/O
Pino 84 RPx — Remappable I/O
Pino 85 RPx — Remappable I/O
Pino 86 RPx — Remappable I/O
Pino 87 PWMxH — High-side PWM output
Pino 88 PWMxL — Low-side PWM output
Pino 89 PWMxH — High-side PWM output
Pino 90 PWMxL — Low-side PWM output
Pino 91 PWMxH — High-side PWM output
Pino 92 PWMxL — Low-side PWM output
Pino 93 VDD — Digital supply 3.3V
Pino 94 VSS — Ground
Pino 95 D+ — USB D+ data line
Pino 96 D- — USB D- data line
Pino 97 VBUS — USB VBUS detect
Pino 98 VDD — Digital supply 3.3V
Pino 99 VSS — Ground
Pino 100 RPx — Remappable I/O

Aplicações típicas

DSPIC33EP512MU810-E/PT é adequado para 7 aplicaçãos: Three-Phase PMSM / BLDC Motor Control, Digital Power Conversion and SMPS Control, USB-Connected Industrial Instrumentation, Sensor Signal Conditioning with DSP Filtering, Solar Micro-Inverter and String Inverter Control, Automotive Sensor Cluster and Actuator Node, Audio Amplifier Class-D Control Loop.

🏭

Three-Phase PMSM / BLDC Motor Control

The DSPIC33EP512MU810-E/PT is designed for high-performance three-phase PMSM and BLDC motor drives. Its dsPIC33E DSC core delivers 60 MIPS while dedicated high-speed PWM modules produce complementary 7.5 ns-resolution outputs for 20-50 kHz switching. The 17-bit x 17-bit MAC and 40-bit accumulator run sensorless field-oriented control loops in real time. With 52 KB SRAM, the part fits encoder feedback buffers, FOC state variables, and a USB CDC telemetry channel on a single chip. The 100-pin TQFP exposes enough I/O for three PWM channels, BEMF sensing, and a debug UART, making it a single-chip industrial motor controller.

⚡

Digital Power Conversion and SMPS Control

In digital power supplies, solar micro-inverters, and PFC+LLC controllers, the DSPIC33EP512MU810-E/PT replaces analog control loops with deterministic software. The 60 MIPS throughput runs average-current-mode control at 200 kHz with cycle-by-cycle ADC triggering, while 15 DMA channels move ADC samples without CPU overhead. The 12-bit 1.1 Msps ADC closes current-mode loops at the required bandwidth, and 512 KB Flash holds firmware with margin for adaptive control algorithms. Its 100-pin TQFP footprint allows easy routing of analog feedback and gate-driver PWM traces.

🧩

USB-Connected Industrial Instrumentation

The integrated USB 2.0 Full-Speed OTG peripheral on the DSPIC33EP512MU810-E/PT lets a single chip serve as the data acquisition and host interface. The 51 I/O pins accommodate SPI sensors, isolated UART, and quadrature encoder inputs, while 52 KB SRAM holds USB endpoint buffers plus acquisition history. For USB data loggers, oscilloscope probes, and HID-controlled lab tools, the part removes external bridge ICs. The extended -40C to +125C grade supports factory-floor and outdoor enclosures, and the 100-pin TQFP keeps the BOM small.

📱

Sensor Signal Conditioning with DSP Filtering

The DSPIC33EP512MU810-E/PT runs FFT, FIR, and adaptive filter algorithms directly on acquired analog signals, eliminating a separate DSP. Its 17-bit x 17-bit MAC and 40-bit accumulator compute convolution at sample rates up to the 1.1 Msps ADC ceiling, while DMA streams samples into buffers without CPU load. Power-quality analyzers, vibration monitors, and acoustic-sensor front-ends benefit from on-chip DSP, and the 512 KB Flash stores coefficient tables and reference firmware. The 100-pin TQFP exposes enough analog channels for multi-axis sensors.

💡

Solar Micro-Inverter and String Inverter Control

Photovoltaic micro-inverters and string inverters need deterministic MPPT control plus grid-tie PLL, and the DSPIC33EP512MU810-E/PT handles both with its 60 MIPS throughput. High-resolution PWM drives the H-bridge at 50-100 kHz with cycle-by-cycle current limiting, while the on-chip ADC samples PV panel voltage, grid voltage, and inductor current. The 52 KB SRAM holds grid-cycle history for PLL lock, and the 512 KB Flash supports field firmware updates via USB. The extended temperature grade supports outdoor enclosure operation.

🚗

Automotive Sensor Cluster and Actuator Node

The -40C to +125C rating and AEC-Q100 grade-1 capability of the DSPIC33EP512MU810-E/PT family suit automotive sensor clusters and actuator nodes. CAN, SENT, and LIN peripherals provide bus connectivity, while high-speed PWM drives motors, solenoids, and LED headlamp current loops. With USB OTG, the same node doubles as a factory programming port, eliminating an external bridge IC. The 100-pin TQFP footprint allows integration into space-constrained ECUs, and 52 KB SRAM fits CAN frame buffers plus diagnostic logs.

🎧

Audio Amplifier Class-D Control Loop

Class-D audio amplifiers require precise PWM at 250-500 kHz with sub-microsecond feedback loops, and the DSPIC33EP512MU810-E/PT meets that timing budget at 60 MIPS. The high-speed PWM module produces 7.5 ns-resolution complementary outputs for full-bridge topologies, while DMA streams ADC feedback samples. With 512 KB Flash storing filter coefficients and protection firmware, the part runs adaptive speaker-protection algorithms. The 100-pin TQFP exposes enough I/O for I2S audio input plus PWM output and amplifier monitoring channels.

Resumo dos produtos recomendados

DSPIC33EP512MC806-E/PT Microchip Technology Usado em: Three-Phase PMSM / BLDC Motor Control MCP8026 Three-phase BLDC gate driver companion Usado em: Three-Phase PMSM / BLDC Motor Control MCP14A0901 Isolated gate driver for digital power stage Usado em: Digital Power Conversion and SMPS Control, Solar Micro-Inverter and String Inverter Control, Audio Amplifier Class-D Control Loop MCP4018 Digital potentiometer for adaptive loop tuning Usado em: Digital Power Conversion and SMPS Control USB3300 Optional external HS USB PHY for higher-speed variants Usado em: USB-Connected Industrial Instrumentation MCP2210 USB-to-SPI bridge for legacy host tools Usado em: USB-Connected Industrial Instrumentation MCP3564 High-precision 24-bit delta-sigma ADC companion Usado em: Sensor Signal Conditioning with DSP Filtering MXL90640 Thermal sensor array for DSP processing pipeline Usado em: Sensor Signal Conditioning with DSP Filtering MCP3021 External ADC backup for panel monitoring Usado em: Solar Micro-Inverter and String Inverter Control MCP2515 External CAN controller for additional bus nodes Usado em: Automotive Sensor Cluster and Actuator Node ATA6563 CAN transceiver companion Usado em: Automotive Sensor Cluster and Actuator Node PCM5101A Audio DAC companion for I2S input Usado em: Audio Amplifier Class-D Control Loop
What is the maximum CPU speed of the DSPIC33EP512MU810-E/PT?
The DSPIC33EP512MU810-E/PT delivers up to 60 MIPS from its dsPIC33E 16-bit DSC core, with the family data sheet citing 70 MIPS on related variants. According to the Microchip dsPIC33EP family datasheet, the core runs at a maximum instruction throughput of 60 MIPS at 3.3V in the extended temperature grade used here. This speed is sufficient for sensorless FOC loops running at 20 kHz with margin for housekeeping tasks.
How much Flash and RAM does the DSPIC33EP512MU810-E/PT have?
The DSPIC33EP512MU810-E/PT integrates 512 KB of Flash program memory (organized as 170K x 24 instruction words) and 52 KB of SRAM. According to the Microchip dsPIC33EP family datasheet, the Flash supports self-programming under firmware control for in-field updates, while the 52 KB SRAM accommodates USB endpoint buffers, control-loop state, and protocol stacks without external memory.
What is the operating voltage range of the DSPIC33EP512MU810-E/PT?
The DSPIC33EP512MU810-E/PT operates from 3.0V to 3.6V. According to the Microchip dsPIC33EP family datasheet, a clean 3.3V rail with adequate decoupling on every VDD/VSS pair and a low-noise AVDD is required to keep the ADC within published linearity and the high-speed PWM within specified jitter limits.
Does the DSPIC33EP512MU810-E/PT include USB?
Yes, the DSPIC33EP512MU810-E/PT integrates a USB 2.0 Full-Speed On-The-Go (OTG) peripheral with internal transceiver. According to the Microchip dsPIC33EP family datasheet, the OTG controller supports host, device, and dual-role operation, removing the need for an external bridge IC in USB-connected industrial nodes.
What package is the DSPIC33EP512MU810-E/PT in?
The DSPIC33EP512MU810-E/PT ships in a 100-pin TQFP (Thin Quad Flat Pack) at 12x12 mm body with 0.5 mm pitch. According to the Microchip dsPIC33EP family datasheet, the /PT suffix designates TQFP, and the 12x12 mm footprint has been the standard for this pin-count across the entire dsPIC33EP family.
What is the difference between DSPIC33EP512MU810-E/PT and DSPIC33EP512MU810-I/PT?
The E suffix denotes the extended operating temperature range of -40C to +125C, while the I suffix denotes the industrial range of -40C to +85C. According to Microchip ordering information, the die, Flash, RAM, peripherals, and 100-pin TQFP package are otherwise identical; selecting E vs I is purely a temperature grade and pricing decision.
What is the best drop-in replacement for the DSPIC33EP512MU810-E/PT?
The drop-in replacement is DSPIC33EP512MC806-E/PT, which is pin-compatible in the same 100-pin TQFP. According to the Microchip dsPIC33EP family datasheet, MC806 differs from MU810 in peripheral mix (no USB, but adds more CAN/ECAN modules); where USB is not required, the MC806 is a true drop-in alternative. For USB-required designs, stay on MU810 family.
Where can I download the DSPIC33EP512MU810-E/PT datasheet PDF?
The official PDF is available at https://www.microchip.com/en-us/product/dsPIC33EP512MU810, which links to both the family datasheet (DS70659, hundreds of pages) and the device-specific silicon errata. According to the Microchip product page, the latest revision is published in the documentation archive at microchip.com. You may also find the family reference manual under dsPIC33EP documentation.
Where is the DSPIC33EP512MU810-E/PT pinout diagram?
The pinout diagram is in the Microchip dsPIC33EP family datasheet, Chapter 1 - Family Overview, and is also reproduced on the part-specific product page at https://www.microchip.com/en-us/product/dsPIC33EP512MU810. The 100-pin TQFP exposes 51 general-purpose I/O, dedicated PWM, analog, USB, JTAG, and power pins around the package perimeter.
Where can I buy the DSPIC33EP512MU810-E/PT online?
The DSPIC33EP512MU810-E/PT is in stock at major distributors including DigiKey, Mouser, Octopart-listed vendors, and authorized Microchip partners. According to distributor listings on October 7, 2026, the part is available in both tray and tape-and-reel packaging, with the /PT suffix indicating tray by default and /PTR for reel.
What is the price of the DSPIC33EP512MU810-E/PT in 100-piece quantity?
As of October 7, 2026, the 100-piece break for the DSPIC33EP512MU810-E/PT is approximately $10.00 USD per unit at major distributors. Pricing scales down to roughly $7.85 USD per unit at 1000-piece volumes, with reel-pack (-PTR) variants commanding a small premium over tray-pack.
What is the lead time for the DSPIC33EP512MU810-E/PT?
As of October 7, 2026, distributor lead time for the DSPIC33EP512MU810-E/PT is factory stock with immediate shipment at DigiKey and Mouser in tray quantity. Bulk 1000-piece-plus orders typically ship from Microchip authorized warehouses within 2-4 weeks; for emergency volumes, consult Microchip sales directly.
DSPIC33EP512MU810-E/PT vs STM32F405 - which is better for USB motor control?
The DSPIC33EP512MU810-E/PT and the STM32F405 are both viable USB-connected motor-control platforms, but they target different strengths. According to Microchip documentation, the dsPIC33EP excels at deterministic PWM, high-resolution PWM timing, and motor-control firmware libraries, while the STM32F405 has a richer ARM Cortex-M4 ecosystem. For sensorless FOC of three-phase BLDC/PMSM with 60 MIPS budget and USB CDC diagnostics, the DSPIC33EP512MU810-E/PT is the stronger choice.
Is the DSPIC33EP512MU810-E/PT AEC-Q100 qualified for automotive?
The DSPIC33EP512MU810-E/PT is part of Microchip's AEC-Q100 grade-1 capable DSC family, but automotive-qualified parts ship with a specific VAO suffix. According to the Microchip product page, the standard /PT part is industrial/extended grade, while automotive customers should specify the automotive-grade ordering code. Confirm by checking the device marking and the certificate of conformance before deployment.
Is the DSPIC33EP512MU810-E/PT RoHS compliant?
Yes, the DSPIC33EP512MU810-E/PT is RoHS compliant per the Microchip product page. According to the datasheet ordering information, /PT packages are lead-free and RoHS-compliant by default. The part is also REACH-compliant and is shipped in trays or reels suitable for lead-free reflow profiles at 245C peak temperature.

Dados de referência de engenharia para DSPIC33EP512MU810-E/PT — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the DSPIC33EP512MU810-E/PT when your design needs integrated USB 2.0 Full-Speed OTG, 512 KB Flash, 52 KB RAM, and extended -40C to +125C operation in a single 100-pin TQFP package - ideal for motor control, digital power, and USB-connected industrial instrumentation. Choose the I-suffix variant if your operating temperature stays under +85C and you prefer lower cost. Choose the MU810-E/PTR variant if you need tape-and-reel packaging for high-volume SMT assembly. Choose the MC806-E/PT if your design uses CAN instead of USB and can benefit from its extra ECAN peripherals. Choose the GM604-I/PT if you need more op-amps and comparators instead of USB. The 100-pin TQFP footprint is shared across the entire dsPIC33EP512 family, allowing PCB layout reuse across these alternatives without rework.

Comparação com alternativas

Parâmetro Este produto DSPIC33EP512MU810-I/PT DSPIC33EP512MU810-E/PTR DSPIC33EP512MC806-E/PT DSPIC33EP256MC506-E/PT DSPIC33EP512GM604-I/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 100-pin TQFP (12x12 mm) 100-pin TQFP (12x12 mm) - same 100-pin TQFP (12x12 mm) - same 100-pin TQFP (12x12 mm) - same 100-pin TQFP (12x12 mm) - same 100-pin TQFP (12x12 mm) - same
Core Speed 60 MIPS 60 MIPS 60 MIPS 60 MIPS 60 MIPS 60 MIPS
Flash 512 KB 512 KB 512 KB 512 KB 256 KB (-50%) 512 KB
RAM 52 KB 52 KB 52 KB 52 KB 33 KB (-37%) 52 KB
USB OTG Yes (USB 2.0 Full-Speed) Yes Yes No No No
Operating Temperature -40C to +125C -40C to +85C -40C to +125C -40C to +125C -40C to +125C -40C to +85C
I/O Pins 51 51 51 51 51 51
DMA Channels 15 15 15 15 15 15

Principais diferenciais

  • Integrated USB 2.0 Full-Speed OTG with internal transceiver (vs DSPIC33EP512MC806-E/PT)
  • 512 KB Flash and 52 KB RAM for code and data buffer headroom (vs DSPIC33EP256MC506-E/PT)
  • Extended -40C to +125C temperature grade (vs DSPIC33EP512MU810-I/PT)
  • 15 DMA channels for low-CPU-overhead data movement (vs DSPIC33EP512GM604-I/PT)

Notas de projeto

The DSPIC33EP512MU810-E/PT requires a clean 3.3V supply on every VDD/VSS pair with a 100 nF ceramic decoupling capacitor placed within 5 mm of each pin pair. A 10 uF bulk capacitor should sit near the regulator to handle transient current drawn by USB inrush and PWM switching events. The AVDD pin must be tied to the same 3.3V rail through a ferrite bead or pi filter to isolate ADC noise from digital switching. Use a separate low-dropout regulator for AVDD if motor-drive PWM switching exceeds 100 kHz. Keep the ground plane continuous and unbroken beneath the device, and avoid routing return currents from high-current PWM outputs through the analog ground island.

Estimated: at 60 MIPS CPU activity driving PWM at 50 kHz with USB enumeration active, the DSPIC33EP512MU810-E/PT draws approximately 80-100 mA from the 3.3V rail (input values: 60 MIPS, 3.3V, Vdd-on), dissipating about 0.27-0.33W. The 100-pin TQFP has a typical theta_JA of approximately 45 C/W on a standard 4-layer JEDEC test board, yielding a junction temperature rise of 12-15C above ambient. The /PT package provides adequate thermal headroom for industrial applications at full 60 MIPS; for closed enclosures above +85C ambient, derate CPU activity or provide forced airflow. The exposed thermal pad variant does not apply here since the /PT is a non-EP package.

Place decoupling capacitors as close as possible to each VDD/VSS pin pair, prioritizing the pairs closest to the high-speed PWM outputs and the ADC reference pins. Keep analog signal traces (ADC inputs, VREF+, VREF-) short and routed away from PWM output traces. The USB D+ and D- traces must be routed as a matched-length differential pair with 90 ohm impedance, kept under 50 mm total length, and isolated from PWM and switching traces. Use a common ground plane, not split, with analog and digital grounds stitched together under the ADC area only.

Do not exceed 3.6V on any VDD or AVDD pin - the absolute-maximum supply voltage will permanently damage the silicon. Ensure the MCLR pin is pulled up through a 10 kohm resistor and never left floating, or the device will fail to start. The PGECx and PGEDx pins are also the programming/debugging interface; route them to a 4-pin header with proper isolation from high-noise traces. The USB VBUS pin must be connected to detect host/session events, and leaving it floating disables OTG functionality. Finally, the device's Flash self-programming requires the application to be linked with the Microchip Flash APIs, and pre-fetch caches must be flushed before executing newly-written code.

The high-speed PWM outputs on the DSPIC33EP512MU810-E/PT can produce edge rates under 10 ns when driving capacitive loads, creating ringing on un-terminated traces. Series-termination resistors of 22-33 ohm placed within 5 mm of the PWM pins suppress reflection on traces longer than 50 mm. For USB, use the recommended USBLC6-2SC6 ESD protection array on the D+/D- lines to meet IEC 61000-4-2 air-discharge requirements. Finally, when routing PWM outputs to gate drivers, add 1 nF ceramic bypass capacitors at the gate-driver supply pin to provide the instantaneous current required by the MOSFET gates during switching events.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS and REACH compliant per Microchip product page. AEC-Q100 grade-1 capable per the dsPIC33E family documentation for the standard /PT ordering code; confirm automotive certification by checking the certificate of conformance for automotive production runs. Lead-free and halogen-free per Microchip material declaration.

Dados verificados em: 2026-10-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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