PIC32MX150F256H-V/MR - 32-bit MCU 256KB Flash 50MHz QFN-64 | Microchip
N.º da peça: PIC32MX150F256H-V/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.05 | $7,05 |
| 10 | $6.42 | $64,20 |
| 100 | $5.78 | $578,00 |
| 500 | $5.21 | $2.605,00 |
| 1.000 | $4.74 | $4.740,00 |
PIC32MX150F256H-V/MR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including analog-to-digital converters, communication interfaces, and timers. The PIC32 family uses a MIPS32 M4K RISC core architecture, sitting within the broader hierarchy of 32-bit microcontrollers -> embedded processors -> integrated circuits -> semiconductors. Compared to 8/16-bit MCUs, 32-bit devices offer higher throughput, larger address spaces, and richer peripherals for connected and graphics-enabled products.
Key features of the PIC32MX150F256H-V/MR include: two I2S and four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible signal routing, and a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces. Operating voltage is 2.5 V or 3.3 V, with an industrial temperature range of -40C to +105C (V-temp grade).
Technically, the MIPS32 M4K core combines a 5-stage pipeline with single-cycle multiply and divide, while PPS remapping lets designers assign digital peripherals to physical pins in firmware, simplifying PCB layout. Internal 8 MHz and 32 kHz oscillators plus a wide PLL provide flexible clocking for low-EMI designs.
Typical applications include automotive body and infotainment modules, industrial control, USB/graphics human-machine interfaces, and portable consumer products. When designing with this device, plan a stable 3.3 V rail, keep analog/digital grounds separated, and use the PPS feature to optimize trace routing on multi-layer boards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternativas drop-in para PIC32MX150F256H-V/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX150F256H-V/MR (mesmo formato e footprint) — diferindo em ADC, Package, Operating Temperature, Parallel Master Port (PMP), Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX150F256H-I/MR
✅ Drop-In✓ Em estoque
$3.75 / unidade
Ver ficha técnica →PIC32MX150F256H-50I/MR
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX150F256HT-V/MR
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →PIC32MX150F256HT-I/MR
✅ Drop-In✓ Em estoque
$5.45 / unidade
Ver ficha técnica →PIC32MX120F064H-V/MR
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →PIC32MX130F128H-V/MR
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC32MX150F256H-V/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K |
| Core Size | 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| SRAM | 32 KB |
| Tensão de alimentação | 2.5 V / 3.3 V |
| Faixa de temperatura de operação | -40C to +105C (V-temp) |
| Encapsulamento | 64-pin QFN (MR) 9x9 mm with EP |
| Tipo de montagem | Surface Mount |
| AEC-Q100 Qualified | Yes (automotive grade) |
| I2S Modules | 2 |
| SPI Modules | 4 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| CTMU | Yes |
| UART | Yes |
| ADC | Yes |
| Tube Packaging | Tube |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MX150F256H-V/MR
| Pino 1 | RA0 — I/O port A bit 0 / analog input AN0 |
| Pino 2 | RA1 — I/O port A bit 1 / analog input AN1 |
| Pino 3 | RA2 — I/O port A bit 2 / analog input AN2 |
| Pino 4 | RA3 — I/O port A bit 3 / analog input AN3 |
| Pino 5 | RA4 — I/O port A bit 4 / analog input AN4 |
| Pino 6 | RA5 — I/O port A bit 5 / analog input AN5 |
| Pino 7 | RA6 — I/O port A bit 6 |
| Pino 8 | RA7 — I/O port A bit 7 |
| Pino 9 | RB0 — I/O port B bit 0 / programming pin PGED1 |
| Pino 10 | RB1 — I/O port B bit 1 / programming pin PGEC1 |
| Pino 11 | RB2 — I/O port B bit 2 |
| Pino 12 | RB3 — I/O port B bit 3 |
| Pino 13 | RB4 — I/O port B bit 4 |
| Pino 14 | RB5 — I/O port B bit 5 |
| Pino 15 | RB6 — I/O port B bit 6 |
| Pino 16 | RB7 — I/O port B bit 7 |
| Pino 17 | RC0 — I/O port C bit 0 |
| Pino 18 | RC1 — I/O port C bit 1 |
| Pino 19 | RC2 — I/O port C bit 2 |
| Pino 20 | RC3 — I/O port C bit 3 |
| Pino 21 | RC4 — I/O port C bit 4 |
| Pino 22 | RC5 — I/O port C bit 5 |
| Pino 23 | RC6 — I/O port C bit 6 |
| Pino 24 | RC7 — I/O port C bit 7 |
| Pino 25 | RD0 — I/O port D bit 0 |
| Pino 26 | RD1 — I/O port D bit 1 |
| Pino 27 | RD2 — I/O port D bit 2 |
| Pino 28 | RD3 — I/O port D bit 3 |
| Pino 29 | RD4 — I/O port D bit 4 |
| Pino 30 | RD5 — I/O port D bit 5 |
| Pino 31 | RD6 — I/O port D bit 6 |
| Pino 32 | RD7 — I/O port D bit 7 |
| Pino 33 | RE0 — I/O port E bit 0 |
| Pino 34 | RE1 — I/O port E bit 1 |
| Pino 35 | RE2 — I/O port E bit 2 |
| Pino 36 | RE3 — I/O port E bit 3 |
| Pino 37 | RE4 — I/O port E bit 4 |
| Pino 38 | RE5 — I/O port E bit 5 |
| Pino 39 | RE6 — I/O port E bit 6 |
| Pino 40 | RE7 — I/O port E bit 7 |
| Pino 41 | RF0 — I/O port F bit 0 |
| Pino 42 | RF1 — I/O port F bit 1 |
| Pino 43 | RF2 — I/O port F bit 2 |
| Pino 44 | RF3 — I/O port F bit 3 |
| Pino 45 | RF4 — I/O port F bit 4 |
| Pino 46 | RF5 — I/O port F bit 5 |
| Pino 47 | RF6 — I/O port F bit 6 |
| Pino 48 | RF7 — I/O port F bit 7 |
| Pino 49 | RG0 — I/O port G bit 0 |
| Pino 50 | RG1 — I/O port G bit 1 |
| Pino 51 | RG2 — I/O port G bit 2 |
| Pino 52 | RG3 — I/O port G bit 3 |
| Pino 53 | RG6 — I/O port G bit 6 |
| Pino 54 | RG7 — I/O port G bit 7 |
| Pino 55 | RG8 — I/O port G bit 8 |
| Pino 56 | RG9 — I/O port G bit 9 |
| Pino 57 | AVDD — Analog supply voltage |
| Pino 58 | AVSS — Analog ground |
| Pino 59 | VDD — Digital supply voltage |
| Pino 60 | VSS — Digital ground |
| Pino 61 | VDD — Digital supply voltage (2nd pin) |
| Pino 62 | VSS — Digital ground (2nd pin) |
| Pino 63 | OSC1 — Oscillator input |
| Pino 64 | OSC2 — Oscillator output |
Aplicações típicas
PIC32MX150F256H-V/MR é adequado para 6 aplicaçãos: Automotive Body Control Modules, Industrial Control and HMI, Audio and Codec Interfaces, USB Device and Embedded Host, Graphics Display Controller, Portable Consumer Electronics.
Automotive Body Control Modules
The PIC32MX150F256H-V/MR is well suited for automotive body control applications such as BCM, HVAC, and lighting controllers, where AEC-Q100 qualification and 256 KB Flash are mandatory. Its 50 MHz MIPS32 M4K core at 83 DMIPS executes CAN/LIN stacks plus application logic with deterministic real-time response, and the V-temp grade (-40C to +105C) covers under-hood and cabin ambient conditions. The two I2S and four SPI modules interface to audio codecs and peripheral drivers, while the Parallel Master Port drives segment LCD or graphic displays commonly used in instrument clusters and HVAC panels.
Recomendado
Industrial Control and HMI
Industrial HMI panels, PLCs, and motor-control front-ends benefit from the 256 KB Flash for storing graphical objects and the Parallel Master Port driving TFT or OLED displays directly. The Peripheral Pin Select feature allows flexible PCB routing, reducing layer count and BOM cost on space-constrained industrial boards. With 32 KB SRAM and 50 MHz core, the PIC32MX150F256H-V/MR runs real-time control loops while servicing USB, UART, and SPI peripherals for sensor aggregation and Modbus/fieldbus communication. The wide operating temperature (-40C to +105C) handles factory-floor environments.
Recomendado
Audio and Codec Interfaces
With two I2S interfaces and four SPI modules, the PIC32MX150F256H-V/MR serves as a controller for audio codecs, Bluetooth audio sinks, and digital microphone arrays. Its 256 KB Flash accommodates compressed audio streaming libraries and DSP routines, while 32 KB SRAM buffers audio samples in real time. The PPS feature simplifies PCB routing of I2S clocks, frame-sync, and data lines. Used with companion audio DACs and amplifiers, this MCU builds full-feature audio products from headphones to conference speakerphones.
Recomendado
USB Device and Embedded Host
The PIC32MX150F256H-V/MR includes an integrated USB 2.0 full-speed controller with on-chip transceiver, enabling USB device, embedded host, or OTG functionality without external PHY. The 256 KB Flash stores USB class stacks (CDC, HID, MSD, audio) plus composite-device firmware, while 32 KB SRAM buffers USB endpoints and descriptors. Pair with external USB power switches and ESD protection diodes for a complete USB-equipped product spanning HID input devices, data loggers, and instrumentation.
Recomendado
Graphics Display Controller
The Parallel Master Port with dual read/write buffers enables the PIC32MX150F256H-V/MR to drive external graphics controllers or directly interface to parallel TFT/OLED panels, supporting segment and dot-matrix LCDs in instrumentation. Designers can render UI elements, status icons, and simple animations from 256 KB Flash while the M4K core handles touch input via SPI and ADC channels. The AEC-Q100 grade and -40C to +105C range make this combination ideal for automotive dashboards and outdoor industrial HMIs.
Recomendado
Portable Consumer Electronics
Battery-powered wearables, fitness trackers, and portable consumer devices benefit from the PIC32MX150F256H-V/MR's 2.5/3.3 V supply and low-power sleep modes. The 50 MHz MIPS32 M4K provides sufficient throughput for sensor fusion, BLE companion control, and user-interface tasks, while 256 KB Flash holds application code and 32 KB SRAM handles BLE event buffers. The exposed-pad QFN enables compact PCB designs with thermal dissipation under moderate loads.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX150F256H-V/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX150F256H-I/MR | PIC32MX150F256H-50I/MR | PIC32MX150F256HT-V/MR | PIC32MX150F256HT-I/MR | PIC32MX120F064H-V/MR | PIC32MX130F128H-V/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB (-75%) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 8 KB (-75%) | 16 KB (-50%) |
| Temperature Grade | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) | V-temp -40C to +105C (AEC-Q100) |
| Packaging Format | Tube | Tube | Tube | Tape and Reel | Tape and Reel | Tube | Tube |
Principais diferenciais
- AEC-Q100 automotive qualification with V-temp grade (vs PIC32MX150F256H-I/MR)
- Full 256 KB Flash and 32 KB SRAM in same 64-pin QFN footprint (vs PIC32MX120F064H-V/MR)
- Largest memory option in the PIC32MX1xx 64-QFN family (vs PIC32MX130F128H-V/MR)
Notas de projeto
Provide a stable 3.3 V rail with bulk capacitance of at least 10 uF near the MCU's VDD pins (pin 59, 61). Decoupling: place 0.1 uF ceramic capacitors as close as possible to each VDD pin and a 1 uF bulk cap on AVDD (pin 57). For battery applications, use a low-dropout regulator with 100 mA headroom to handle peak current during USB or peripheral activity.
The 64-pin QFN with exposed pad requires thermal vias under the EP for heat dissipation. Use a 3x3 array of 0.3 mm thermal vias connecting the EP to the internal ground plane. At maximum core frequency (50 MHz) and ambient up to +105C, junction temperature remains within limits if the EP is properly soldered. Without EP soldering, thermal resistance increases dramatically and the part may overheat.
Separate analog ground (AVSS) and digital ground (VSS) with a single-point connection at the MCU's ground pins. Place the analog supply (AVDD) and its bypass cap close to pin 57. Use PPS to remap peripherals to inner layers to keep high-speed traces short. For USB applications, maintain 90-ohm differential impedance on D+/D- traces and route them with matched length.
Do not exceed 50 MHz core clock without proper PLL configuration; ensure the input reference oscillator is stable before switching to PLL mode. The ICSP pins (RB0/PGED1, RB1/PGEC1) must be accessible for in-circuit programming - do not route high-current signals to these pins. PPS remapping must be unlocked via CFGCON register before configuration or peripherals will not function.
Place the 8 MHz or 32 kHz crystal as close to OSC1/OSC2 (pins 63/64) as possible with short, symmetric traces and a guard ring to ground. For best EMI performance, use a 4-layer PCB with continuous ground plane beneath the MCU. Decoupling capacitors should be placed on the same layer as the MCU when possible to minimize via inductance.
Informações de conformidade
AEC-Q100 qualified per Microchip product page. RoHS compliant. Lead-free reflow-compatible. Halogen-free status not explicitly confirmed in available data.
