PIC32MX150F256H-V/MR - 32-bit MCU 256KB Flash 50MHz QFN-64 | Microchip
Référence : PIC32MX150F256H-V/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.05 | $7,05 |
| 10 | $6.42 | $64,20 |
| 100 | $5.78 | $578,00 |
| 500 | $5.21 | $2 605,00 |
| 1 000 | $4.74 | $4 740,00 |
PIC32MX150F256H-V/MR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including analog-to-digital converters, communication interfaces, and timers. The PIC32 family uses a MIPS32 M4K RISC core architecture, sitting within the broader hierarchy of 32-bit microcontrollers -> embedded processors -> integrated circuits -> semiconductors. Compared to 8/16-bit MCUs, 32-bit devices offer higher throughput, larger address spaces, and richer peripherals for connected and graphics-enabled products.
Key features of the PIC32MX150F256H-V/MR include: two I2S and four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible signal routing, and a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces. Operating voltage is 2.5 V or 3.3 V, with an industrial temperature range of -40C to +105C (V-temp grade).
Technically, the MIPS32 M4K core combines a 5-stage pipeline with single-cycle multiply and divide, while PPS remapping lets designers assign digital peripherals to physical pins in firmware, simplifying PCB layout. Internal 8 MHz and 32 kHz oscillators plus a wide PLL provide flexible clocking for low-EMI designs.
Typical applications include automotive body and infotainment modules, industrial control, USB/graphics human-machine interfaces, and portable consumer products. When designing with this device, plan a stable 3.3 V rail, keep analog/digital grounds separated, and use the PPS feature to optimize trace routing on multi-layer boards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MX150F256H-V/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX150F256H-V/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Parallel Master Port (PMP), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX150F256H-I/MR
✅ Remplacement direct✓ En stock
$3.75 / unité
Voir la fiche technique →PIC32MX150F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX150F256HT-V/MR
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →PIC32MX150F256HT-I/MR
✅ Remplacement direct✓ En stock
$5.45 / unité
Voir la fiche technique →PIC32MX120F064H-V/MR
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC32MX130F128H-V/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX150F256H-V/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Core Size | 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| SRAM | 32 KB |
| Tension d'alimentation | 2.5 V / 3.3 V |
| Plage de température de fonctionnement | -40C to +105C (V-temp) |
| Boîtier | 64-pin QFN (MR) 9x9 mm with EP |
| Type de montage | Surface Mount |
| AEC-Q100 Qualified | Yes (automotive grade) |
| I2S Modules | 2 |
| SPI Modules | 4 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| CTMU | Yes |
| UART | Yes |
| ADC | Yes |
| Tube Packaging | Tube |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX150F256H-V/MR
| Broche 1 | RA0 — I/O port A bit 0 / analog input AN0 |
| Broche 2 | RA1 — I/O port A bit 1 / analog input AN1 |
| Broche 3 | RA2 — I/O port A bit 2 / analog input AN2 |
| Broche 4 | RA3 — I/O port A bit 3 / analog input AN3 |
| Broche 5 | RA4 — I/O port A bit 4 / analog input AN4 |
| Broche 6 | RA5 — I/O port A bit 5 / analog input AN5 |
| Broche 7 | RA6 — I/O port A bit 6 |
| Broche 8 | RA7 — I/O port A bit 7 |
| Broche 9 | RB0 — I/O port B bit 0 / programming pin PGED1 |
| Broche 10 | RB1 — I/O port B bit 1 / programming pin PGEC1 |
| Broche 11 | RB2 — I/O port B bit 2 |
| Broche 12 | RB3 — I/O port B bit 3 |
| Broche 13 | RB4 — I/O port B bit 4 |
| Broche 14 | RB5 — I/O port B bit 5 |
| Broche 15 | RB6 — I/O port B bit 6 |
| Broche 16 | RB7 — I/O port B bit 7 |
| Broche 17 | RC0 — I/O port C bit 0 |
| Broche 18 | RC1 — I/O port C bit 1 |
| Broche 19 | RC2 — I/O port C bit 2 |
| Broche 20 | RC3 — I/O port C bit 3 |
| Broche 21 | RC4 — I/O port C bit 4 |
| Broche 22 | RC5 — I/O port C bit 5 |
| Broche 23 | RC6 — I/O port C bit 6 |
| Broche 24 | RC7 — I/O port C bit 7 |
| Broche 25 | RD0 — I/O port D bit 0 |
| Broche 26 | RD1 — I/O port D bit 1 |
| Broche 27 | RD2 — I/O port D bit 2 |
| Broche 28 | RD3 — I/O port D bit 3 |
| Broche 29 | RD4 — I/O port D bit 4 |
| Broche 30 | RD5 — I/O port D bit 5 |
| Broche 31 | RD6 — I/O port D bit 6 |
| Broche 32 | RD7 — I/O port D bit 7 |
| Broche 33 | RE0 — I/O port E bit 0 |
| Broche 34 | RE1 — I/O port E bit 1 |
| Broche 35 | RE2 — I/O port E bit 2 |
| Broche 36 | RE3 — I/O port E bit 3 |
| Broche 37 | RE4 — I/O port E bit 4 |
| Broche 38 | RE5 — I/O port E bit 5 |
| Broche 39 | RE6 — I/O port E bit 6 |
| Broche 40 | RE7 — I/O port E bit 7 |
| Broche 41 | RF0 — I/O port F bit 0 |
| Broche 42 | RF1 — I/O port F bit 1 |
| Broche 43 | RF2 — I/O port F bit 2 |
| Broche 44 | RF3 — I/O port F bit 3 |
| Broche 45 | RF4 — I/O port F bit 4 |
| Broche 46 | RF5 — I/O port F bit 5 |
| Broche 47 | RF6 — I/O port F bit 6 |
| Broche 48 | RF7 — I/O port F bit 7 |
| Broche 49 | RG0 — I/O port G bit 0 |
| Broche 50 | RG1 — I/O port G bit 1 |
| Broche 51 | RG2 — I/O port G bit 2 |
| Broche 52 | RG3 — I/O port G bit 3 |
| Broche 53 | RG6 — I/O port G bit 6 |
| Broche 54 | RG7 — I/O port G bit 7 |
| Broche 55 | RG8 — I/O port G bit 8 |
| Broche 56 | RG9 — I/O port G bit 9 |
| Broche 57 | AVDD — Analog supply voltage |
| Broche 58 | AVSS — Analog ground |
| Broche 59 | VDD — Digital supply voltage |
| Broche 60 | VSS — Digital ground |
| Broche 61 | VDD — Digital supply voltage (2nd pin) |
| Broche 62 | VSS — Digital ground (2nd pin) |
| Broche 63 | OSC1 — Oscillator input |
| Broche 64 | OSC2 — Oscillator output |
Applications typiques
PIC32MX150F256H-V/MR convient pour 6 applications: Automotive Body Control Modules, Industrial Control and HMI, Audio and Codec Interfaces, USB Device and Embedded Host, Graphics Display Controller, Portable Consumer Electronics.
Automotive Body Control Modules
The PIC32MX150F256H-V/MR is well suited for automotive body control applications such as BCM, HVAC, and lighting controllers, where AEC-Q100 qualification and 256 KB Flash are mandatory. Its 50 MHz MIPS32 M4K core at 83 DMIPS executes CAN/LIN stacks plus application logic with deterministic real-time response, and the V-temp grade (-40C to +105C) covers under-hood and cabin ambient conditions. The two I2S and four SPI modules interface to audio codecs and peripheral drivers, while the Parallel Master Port drives segment LCD or graphic displays commonly used in instrument clusters and HVAC panels.
Recommandé
Industrial Control and HMI
Industrial HMI panels, PLCs, and motor-control front-ends benefit from the 256 KB Flash for storing graphical objects and the Parallel Master Port driving TFT or OLED displays directly. The Peripheral Pin Select feature allows flexible PCB routing, reducing layer count and BOM cost on space-constrained industrial boards. With 32 KB SRAM and 50 MHz core, the PIC32MX150F256H-V/MR runs real-time control loops while servicing USB, UART, and SPI peripherals for sensor aggregation and Modbus/fieldbus communication. The wide operating temperature (-40C to +105C) handles factory-floor environments.
Recommandé
Audio and Codec Interfaces
With two I2S interfaces and four SPI modules, the PIC32MX150F256H-V/MR serves as a controller for audio codecs, Bluetooth audio sinks, and digital microphone arrays. Its 256 KB Flash accommodates compressed audio streaming libraries and DSP routines, while 32 KB SRAM buffers audio samples in real time. The PPS feature simplifies PCB routing of I2S clocks, frame-sync, and data lines. Used with companion audio DACs and amplifiers, this MCU builds full-feature audio products from headphones to conference speakerphones.
Recommandé
USB Device and Embedded Host
The PIC32MX150F256H-V/MR includes an integrated USB 2.0 full-speed controller with on-chip transceiver, enabling USB device, embedded host, or OTG functionality without external PHY. The 256 KB Flash stores USB class stacks (CDC, HID, MSD, audio) plus composite-device firmware, while 32 KB SRAM buffers USB endpoints and descriptors. Pair with external USB power switches and ESD protection diodes for a complete USB-equipped product spanning HID input devices, data loggers, and instrumentation.
Recommandé
Graphics Display Controller
The Parallel Master Port with dual read/write buffers enables the PIC32MX150F256H-V/MR to drive external graphics controllers or directly interface to parallel TFT/OLED panels, supporting segment and dot-matrix LCDs in instrumentation. Designers can render UI elements, status icons, and simple animations from 256 KB Flash while the M4K core handles touch input via SPI and ADC channels. The AEC-Q100 grade and -40C to +105C range make this combination ideal for automotive dashboards and outdoor industrial HMIs.
Recommandé
Portable Consumer Electronics
Battery-powered wearables, fitness trackers, and portable consumer devices benefit from the PIC32MX150F256H-V/MR's 2.5/3.3 V supply and low-power sleep modes. The 50 MHz MIPS32 M4K provides sufficient throughput for sensor fusion, BLE companion control, and user-interface tasks, while 256 KB Flash holds application code and 32 KB SRAM handles BLE event buffers. The exposed-pad QFN enables compact PCB designs with thermal dissipation under moderate loads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX150F256H-V/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX150F256H-I/MR | PIC32MX150F256H-50I/MR | PIC32MX150F256HT-V/MR | PIC32MX150F256HT-I/MR | PIC32MX120F064H-V/MR | PIC32MX130F128H-V/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same | 64-pin QFN (MR) 9x9 mm - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB (-75%) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 8 KB (-75%) | 16 KB (-50%) |
| Temperature Grade | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) | V-temp -40C to +105C (AEC-Q100) |
| Packaging Format | Tube | Tube | Tube | Tape and Reel | Tape and Reel | Tube | Tube |
Principaux différenciateurs
- AEC-Q100 automotive qualification with V-temp grade (vs PIC32MX150F256H-I/MR)
- Full 256 KB Flash and 32 KB SRAM in same 64-pin QFN footprint (vs PIC32MX120F064H-V/MR)
- Largest memory option in the PIC32MX1xx 64-QFN family (vs PIC32MX130F128H-V/MR)
Notes de conception
Provide a stable 3.3 V rail with bulk capacitance of at least 10 uF near the MCU's VDD pins (pin 59, 61). Decoupling: place 0.1 uF ceramic capacitors as close as possible to each VDD pin and a 1 uF bulk cap on AVDD (pin 57). For battery applications, use a low-dropout regulator with 100 mA headroom to handle peak current during USB or peripheral activity.
The 64-pin QFN with exposed pad requires thermal vias under the EP for heat dissipation. Use a 3x3 array of 0.3 mm thermal vias connecting the EP to the internal ground plane. At maximum core frequency (50 MHz) and ambient up to +105C, junction temperature remains within limits if the EP is properly soldered. Without EP soldering, thermal resistance increases dramatically and the part may overheat.
Separate analog ground (AVSS) and digital ground (VSS) with a single-point connection at the MCU's ground pins. Place the analog supply (AVDD) and its bypass cap close to pin 57. Use PPS to remap peripherals to inner layers to keep high-speed traces short. For USB applications, maintain 90-ohm differential impedance on D+/D- traces and route them with matched length.
Do not exceed 50 MHz core clock without proper PLL configuration; ensure the input reference oscillator is stable before switching to PLL mode. The ICSP pins (RB0/PGED1, RB1/PGEC1) must be accessible for in-circuit programming - do not route high-current signals to these pins. PPS remapping must be unlocked via CFGCON register before configuration or peripherals will not function.
Place the 8 MHz or 32 kHz crystal as close to OSC1/OSC2 (pins 63/64) as possible with short, symmetric traces and a guard ring to ground. For best EMI performance, use a 4-layer PCB with continuous ground plane beneath the MCU. Decoupling capacitors should be placed on the same layer as the MCU when possible to minimize via inductance.
Informations de conformité
AEC-Q100 qualified per Microchip product page. RoHS compliant. Lead-free reflow-compatible. Halogen-free status not explicitly confirmed in available data.
