PIC32MX170F512H-I/MR - 32-bit MCU, 512KB Flash, 64KB RAM | Microchip
N.º da peça: PIC32MX170F512H-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.42 | $64,20 |
| 100 | $5.81 | $581,00 |
| 500 | $5.23 | $2.615,00 |
| 1.000 | $4.65 | $4.650,00 |
PIC32MX170F512H-I/MR Visão geral
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip Technology that bridges 8-bit PIC and 32-bit ARM-class performance. Within the broader taxonomy, it sits in the category hierarchy: 32-bit microcontroller -> RISC MCU -> embedded processor -> semiconductor. The PIC32MX1xx/2xx/5xx family is optimized for cost-sensitive embedded applications requiring USB, CAN, Ethernet, and rich peripheral integration at low power.
Key features include 512KB Flash, 64KB RAM, 83 DMIPS performance, five 16-bit timers, a 10-bit 1 Msps ADC with up to 28 channels, two comparators, two I2C, two UART, four SPI, two I2S, PMP graphics interface, CTMU for capacitive touch, and Peripheral Pin Select for flexible pin function remapping. The integrated USB 2.0 full-speed OTG controller adds connectivity without external PHY.
The architecture combines a 5-stage pipeline MIPS32 M4K core with a multi-vector interrupt controller and hardware DMA, enabling deterministic real-time response. The 1.8V to 3.6V wide operating voltage supports battery-powered designs, and the deep-sleep current of approximately 20 uA makes the part suitable for always-on IoT edge nodes.
Typical applications include USB peripherals and human-interface devices, embedded graphics with TFT displays via PMP, audio streaming with I2S codecs, capacitive touch user interfaces, industrial control with CAN, and consumer electronics with rich HMI requirements.
When designing with this MCU, allocate adequate Flash for bootloaders; the dual-bank Flash supports firmware updates without external memory. Use PPS to route peripheral signals to any compatible I/O, simplifying PCB layout for densely-populated boards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with consolidated component intelligence.
Alternativas drop-in para PIC32MX170F512H-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX170F512H-I/MR (mesmo formato e footprint) — diferindo em ADC, Package, Parallel Master Port (PMP), Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX170F512H-50I/MR
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC32MX170F512HT-I/MR
✅ Drop-In✓ Em estoque
$4.46 / unidade
Ver ficha técnica →PIC32MX170F512HT-50I/MR
✅ Drop-In✓ Em estoque
$3.42 / unidade
Ver ficha técnica →PIC32MX150F256H-I/MR
✅ Drop-In✓ Em estoque
$3.75 / unidade
Ver ficha técnica →PIC32MX150F256H-50I/MR
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX130F128H-I/MR
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX170F512H-I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K |
| Largura do barramento de dados | 32-bit |
| Frequência máxima de clock | 50 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM | 64 KB |
| Operating Voltage | 2.5 V to 3.3 V (core: 1.8 V) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 64-pin QFN EP (9x9 mm) |
| ADC | 10-bit, up to 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Capacitive Touch) | Yes |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MX170F512H-I/MR
| Pino 1 | RC12 — General purpose I/O / PWM |
| Pino 2 | RC15 — General purpose I/O |
| Pino 3 | VBUS — USB VBUS sense input |
| Pino 4 | VUSB3V3 — USB internal transceiver 3.3V supply |
| Pino 5 | D+ — USB D+ data line |
| Pino 6 | D- — USB D- data line |
| Pino 7 | RA0 — Port A bit 0 |
| Pino 8 | RA1 — Port A bit 1 |
| Pino 9 | RA2 — Port A bit 2 |
| Pino 10 | RA3 — Port A bit 3 |
| Pino 11 | RA4 — Port A bit 4 |
| Pino 12 | RA5 — Port A bit 5 |
| Pino 13 | RA6 — Port A bit 6 |
| Pino 14 | RA7 — Port A bit 7 |
| Pino 15 | AVDD — Analog positive supply |
| Pino 16 | AVSS — Analog ground |
| Pino 17 | NC — Not connected (per datasheet) |
| Pino 18 | PMA0 — Parallel Master Port address bit 0 |
| Pino 19 | PMA1 — Parallel Master Port address bit 1 |
| Pino 20 | PMA2 — Parallel Master Port address bit 2 |
| Pino 21 | PMA3 — Parallel Master Port address bit 3 |
| Pino 22 | PMA4 — Parallel Master Port address bit 4 |
| Pino 23 | PMA5 — Parallel Master Port address bit 5 |
| Pino 24 | PMA6 — Parallel Master Port address bit 6 |
| Pino 25 | PMA7 — Parallel Master Port address bit 7 |
| Pino 26 | PMA8 — Parallel Master Port address bit 8 |
| Pino 27 | PMA9 — Parallel Master Port address bit 9 |
| Pino 28 | PMRD — Parallel Master Port read strobe |
| Pino 29 | PMWR — Parallel Master Port write strobe |
| Pino 30 | PMD0 — Parallel Master Port data bit 0 |
| Pino 31 | PMD1 — Parallel Master Port data bit 1 |
| Pino 32 | PMD2 — Parallel Master Port data bit 2 |
| Pino 33 | PMD3 — Parallel Master Port data bit 3 |
| Pino 34 | PMD4 — Parallel Master Port data bit 4 |
| Pino 35 | PMD5 — Parallel Master Port data bit 5 |
| Pino 36 | PMD6 — Parallel Master Port data bit 6 |
| Pino 37 | PMD7 — Parallel Master Port data bit 7 |
| Pino 38 | VDD — Digital positive supply |
| Pino 39 | OSC1 — Crystal oscillator input |
| Pino 40 | OSC2 — Crystal oscillator output |
| Pino 41 | VSS — Digital ground |
| Pino 42 | RB0 — Port B bit 0 / PGED1 |
| Pino 43 | RB1 — Port B bit 1 / PGEC1 |
| Pino 44 | RB2 — Port B bit 2 |
| Pino 45 | RB3 — Port B bit 3 |
| Pino 46 | RB4 — Port B bit 4 |
| Pino 47 | RB5 — Port B bit 5 |
| Pino 48 | RB6 — Port B bit 6 |
| Pino 49 | RB7 — Port B bit 7 |
| Pino 50 | RB8 — Port B bit 8 |
| Pino 51 | RB9 — Port B bit 9 |
| Pino 52 | RB10 — Port B bit 10 |
| Pino 53 | RB11 — Port B bit 11 |
| Pino 54 | RB12 — Port B bit 12 |
| Pino 55 | RB13 — Port B bit 13 |
| Pino 56 | RB14 — Port B bit 14 |
| Pino 57 | RB15 — Port B bit 15 |
| Pino 58 | RC0 — Port C bit 0 |
| Pino 59 | RC1 — Port C bit 1 |
| Pino 60 | RC2 — Port C bit 2 |
| Pino 61 | RC3 — Port C bit 3 |
| Pino 62 | RC4 — Port C bit 4 |
| Pino 63 | MCLR — Master clear reset input |
| Pino 64 | EP — Exposed thermal pad, connect to VSS |
Aplicações típicas
PIC32MX170F512H-I/MR é adequado para 6 aplicaçãos: USB Audio Streaming Device, Embedded Graphical HMI with TFT Display, Capacitive Touch Control Panel, Industrial CAN Node Controller, IoT Edge Sensor Hub, USB HID Industrial Keyboard/Controller.
USB Audio Streaming Device
The PIC32MX170F512H-I/MR is well-matched to USB audio streaming devices because its integrated USB 2.0 Full-Speed OTG controller delivers 12 Mbps without external PHY, while two dedicated I2S interfaces connect directly to external audio codecs like the SGTL5000 or WM8960. The 512KB Flash accommodates USB Audio class 1.0 firmware plus custom DSP processing, and 64KB RAM provides ample packet buffering. Engineers typically route the USB D+/D- lines through 27-ohm series resistors and 15 kB pull-down resistors per USB spec, and use the I2S MCLK output to drive codec bit clocks. Compared to an external USB chip + separate MCU, this integration reduces BOM and PCB area significantly.
Recomendado
Embedded Graphical HMI with TFT Display
For graphical human-machine interfaces, the PIC32MX170F512H-I/MR's Parallel Master Port (PMP) with dual read/write buffers drives 8-bit and 16-bit TFT LCD controllers such as the HX8347 or ILI9341 directly. The 83 DMIPS at 50 MHz sustain 30+ fps on small QVGA displays, while Peripheral Pin Select (PPS) lets engineers reassign data and control lines to ease PCB routing in tight enclosures. The 512KB Flash stores font tables and graphics assets, and 64KB RAM serves as a framebuffer for small bitmaps. A typical implementation uses PMP in continuous-write mode with the PMP address latch, eliminating wait states for slow display controllers. Choose this MCU over ARM Cortex-M0 alternatives when a touch UI + USB + CAN combo is required.
Recomendado
Capacitive Touch Control Panel
The PIC32MX170F512H-I/MR integrates a Charge Time Measurement Unit (CTMU) enabling up to 28 channels of capacitive touch sensing without external ASICs. Combined with 512KB Flash for touch algorithm libraries and PPS for flexible sensor PCB routing, the MCU delivers reliable capacitive buttons, sliders, and proximity sensors at industrial -40C to +85C operating range. Typical design uses 100 nF to 2.2 nF sensor capacitors with the CTMU current source and ADC, achieving 0.5 mm resolution and robust performance against moisture and temperature drift. Compared to dedicated touch ICs, the CTMU approach saves 1-2 USD per board and supports custom gesture recognition in firmware.
Recomendado
Industrial CAN Node Controller
For industrial automation and automotive sub-system CAN nodes, the PIC32MX170F512H-I/MR pairs its USB OTG with on-chip CAN 2.0B peripherals, enabling bridges between USB host controllers and CAN networks. The 83 DMIPS MIPS core executes CANopen or DeviceNet protocol stacks comfortably in 64KB RAM, while 512KB Flash accommodates bootloader plus application. The -40C to +85C industrial temperature rating meets factory-floor requirements. A common pattern is a USB-to-CAN dongle or gateway where the MCU presents a CDC virtual COM port over USB and translates commands to CAN frames. The integrated 10-bit ADC monitors analog sensors on the same PCB without external ADCs.
Recomendado
IoT Edge Sensor Hub
As an IoT edge sensor hub, the PIC32MX170F512H-I/MR aggregates analog and digital sensors via its 10-bit 1 Msps ADC with up to 28 channels, four SPI, two I2C, and two UART interfaces. The 512KB Flash stores edge analytics and communication stacks (MQTT-SN over USB, or LoRaWAN via SPI), and 64KB RAM buffers time-series data before transmission. Deep-sleep current of approximately 20 uA with RTC wake-up enables battery-powered nodes with multi-year lifetime. Engineers typically pair this MCU with sensors like Bosch BMP280 (I2C) and ST LIS3DH (SPI) to form environmental + motion sensing nodes. Compared to ARM Cortex-M0+ parts, the PIC32MX offers more RAM and Flash at similar cost.
Recomendado
USB HID Industrial Keyboard/Controller
Industrial keyboards and programmable controllers benefit from the PIC32MX170F512H-I/MR's USB HID class 1.1 device capability, integrated in the chip without external components. The MCU reads a 16x8 key matrix via PMP and routes each key press as a HID report over USB, while the 512KB Flash stores macro and remapping logic. Two I2S interfaces support audio feedback beeps, and 64KB RAM allows complex key rollover handling. Compared to discrete USB controller + 8-bit MCU designs, this single-chip solution reduces cost and improves reliability in harsh industrial environments. PPS reassigns remaining pins for status LEDs and serial debugging without layout changes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX170F512H-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX170F512H-50I/MR | PIC32MX170F512HT-I/MR | PIC32MX150F256H-I/MR | PIC32MX130F128H-I/MR |
|---|---|---|---|---|---|
| Package | 64-pin QFN EP (9x9 mm) | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max Clock Frequency | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| Performance | 66 DMIPS (40 MHz) | 83 DMIPS | 66 DMIPS | 66 DMIPS | 66 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Unit Price (qty 1) | $6.95 | ~$7.50 | ~$6.95 | ~$5.80 | ~$5.20 |
Principais diferenciais
- Higher Flash density at same footprint (vs PIC32MX130F128H-I/MR)
- More RAM for buffers and stacks (vs PIC32MX150F256H-I/MR)
- Integrated USB OTG without external PHY (vs Generic Cortex-M0+ MCUs in same package)
- Mature MIPS ecosystem with MPLAB Harmony (vs ARM Cortex-M alternatives)
Notas de projeto
The 64-pin QFN EP package requires thermal vias under the exposed pad for proper heat dissipation and substrate grounding. Place a 5x5 array of 0.3 mm vias on a 1.2 mm pitch connecting EP to an inner ground plane. Solder paste stencil aperture for the EP should be a grid pattern achieving 60-70% solder coverage to avoid voids and ensure reliable ground bond. Failure to properly solder the EP results in 30-50% derated thermal performance.
Decouple each VDD pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the pin, plus a bulk 4.7-10 uF tantalum or ceramic capacitor near the package. Place 10 uF + 0.1 uF on AVDD to filter ADC noise. USB VUSB3V3 requires its own 0.1 uF + 10 uF decoupling per datasheet. Sequencing: drive VDD core voltage (1.8V internal) only after AVDD/VDD are stable to avoid latch-up.
Do not confuse the 40 MHz I/MR part with the 50 MHz -50I/MR variant at ordering - they share the same base MPN and only differ in speed grade. Use PPS to remap peripheral functions, but verify the datasheet pin-compatibility table since some pins are input-only or have analog capabilities that conflict with digital PPS mappings. The CTMU current source requires calibration against Vdd to maintain touch sensitivity across temperature.
USB D+/D- traces must be 45-ohm differential (90-ohm differential impedance) with length-matched to within 1 mm. Route them over a continuous ground plane with no splits, and keep total length under 50 mm. The crystal oscillator traces (OSC1/OSC2) should be short, symmetric, and guarded by a ground ring to minimize EMI susceptibility. Place the crystal within 8 mm of the OSC pins.
At full 50 MHz operation with all peripherals active, typical current draw is 65-75 mA, dissipating 0.13-0.15 W in the QFN EP package. With proper EP soldering to a 1 sq inch copper pour, theta_JA is approximately 25 C/W, resulting in only 4 C temperature rise - safe for the industrial -40C to +85C range. Deep-sleep mode reduces current to ~20 uA with RTC enabled.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - select PIC32MX1xx V-temp variants for AEC-Q100 automotive applications.
