PIC32MX330F064HT-V/MR - 32-bit MCU 80MHz 64KB Flash USB-OTG | Microchip
N.º da peça: PIC32MX330F064HT-V/MR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.15 | $515,00 |
| 500 | $4.61 | $2.305,00 |
| 1.000 | $4.12 | $4.120,00 |
PIC32MX330F064HT-V/MR Visão geral
What is a PIC32MX microcontroller? The PIC32MX family from Microchip combines the legacy PIC ecosystem with a 32-bit MIPS core, occupying the middle ground between 8/16-bit PIC MCUs and high-performance Cortex-M parts. PIC32MX devices integrate rich peripherals (USB-OTG, I2S, CTMU, DMA, PMP) into a low-cost single-core package and run at 50–120 MHz with up to 150 DMIPS, making them suitable for USB connectivity, audio processing, and low-power edge applications.
Key features of the PIC32MX330F064HT-V/MR include 64 KB on-chip Flash with 12 KB auxiliary boot Flash, 16 KB SRAM, hardware USB 2.0 full-speed OTG, dual SPI/I2S ports, dual I2C, four UART, a 10-bit 1 Msps ADC with up to 28 channels, CTMU for capacitive touch, DMA controller, peripheral pin select, and an internal 8 MHz RC oscillator with PLL. The 64-pin VQFN package has a 0.5 mm pitch and an exposed thermal pad.
The architecture is based on the MIPS32 M4K Harvard core with hardware multiply/divide and a 5-stage pipeline, providing deterministic interrupt response. Memory is mapped as 64 KB Flash plus 12 KB boot Flash for safe firmware updates, with 16 KB SRAM supporting standard C library builds. The integrated USB-OTG controller enables device, host, or OTG operation without an external PHY.
Typical applications for the PIC32MX330F064HT-V/MR include automotive infotainment control, industrial HMI with capacitive touch, USB device/hid peripherals, low-cost audio playback over I2S, and small graphical displays using the PMP interface. The -V temperature grade extends operation to -40 °C to +105 °C, meeting AEC-Q100 Grade 2 expectations for automotive cabin modules.
When designing with this part, ensure the exposed thermal pad of the VQFN is soldered to a properly sized ground copper pour; missing this pad increases thermal resistance and degrades ADC accuracy. Decouple VDD/VUSB with 100 nF plus 4.7 µF ceramics placed within 3 mm of the supply pins, and configure the PLL only after the primary oscillator has stabilized.
This page synthesizes distributor pricing, AEC-Q100 alternative variants, and practical USB+CTMU design notes that go beyond the bare PIC32MX3XX/4XX family datasheet.
Alternativas drop-in para PIC32MX330F064HT-V/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX330F064HT-V/MR (mesmo formato e footprint) — diferindo em Package, ADC, USB, Operating Temperature, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX330F064H-V/MR
✅ Drop-In✓ Em estoque
$4.15 / unidade
Ver ficha técnica →PIC32MX330F064HT-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX330F064HT-120V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX430F064H-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX330F064H-I/MR
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →PIC32MX330F064HT-V/MR Classificações máximas e características elétricas
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit |
| Core Speed | 80 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Boot Flash | 12 KB (auxiliary) |
| RAM | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Encapsulamento | 64-VQFN (MR) 9x9 mm with EP, 0.5 mm pitch |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 °C to +105 °C (V-grade) |
| Automotive Qualification | AEC-Q100 Grade 2 |
| USB | USB 2.0 Full-Speed OTG |
| SPI | 2 x SPI / I2S |
| I2C | 2 x I2C |
| UART | 4 x UART |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| DMA | Yes, 8-channel |
| CTMU (Capacitive Touch) | Yes |
| I/O Pins | 53 |
| Status RoHS | Compliant |
Configuração de pinos do PIC32MX330F064HT-V/MR
| Pino 1 | RB15 — General purpose I/O / PGECx |
| Pino 2 | RB14 — General purpose I/O / VBUSON |
| Pino 3 | RB13 — General purpose I/O / AN13 |
| Pino 4 | RB12 — General purpose I/O / AN12 |
| Pino 5 | RB11 — General purpose I/O / AN11 |
| Pino 6 | RB10 — General purpose I/O / AN10 |
| Pino 7 | RB9 — General purpose I/O / AN9 |
| Pino 8 | RB8 — General purpose I/O / AN8 |
| Pino 9 | RB7 — General purpose I/O / AN7 |
| Pino 10 | RB6 — General purpose I/O / AN6 / PGECx |
| Pino 11 | RB5 — General purpose I/O / AN5 |
| Pino 12 | RB4 — General purpose I/O / AN4 |
| Pino 13 | RB3 — General purpose I/O / AN3 |
| Pino 14 | RB2 — General purpose I/O / AN2 |
| Pino 15 | RB1 — General purpose I/O / AN1 / PGEDx |
| Pino 16 | RB0 — General purpose I/O / AN0 |
| Pino 17 | VSS — Ground reference |
| Pino 18 | VDD — Digital supply (2.3-3.6 V) |
| Pino 19 | RA15 — General purpose I/O / SS2 |
| Pino 20 | RA14 — General purpose I/O / SDA2 |
| Pino 21 | RA13 — General purpose I/O |
| Pino 22 | RA12 — General purpose I/O |
| Pino 23 | RA11 — General purpose I/O |
| Pino 24 | RA10 — General purpose I/O / SDA1 |
| Pino 25 | RA9 — General purpose I/O / SCL1 |
| Pino 26 | RA8 — General purpose I/O / SCL2 |
| Pino 27 | RA7 — General purpose I/O / VREF- |
| Pino 28 | RA6 — General purpose I/O / VREF+ |
| Pino 29 | RA5 — General purpose I/O |
| Pino 30 | RA4 — General purpose I/O / TCK |
| Pino 31 | RA3 — General purpose I/O |
| Pino 32 | RA2 — General purpose I/O |
| Pino 33 | RA1 — General purpose I/O |
| Pino 34 | RA0 — General purpose I/O |
| Pino 35 | VSS — Ground reference |
| Pino 36 | RC15 — General purpose I/O / OCFB |
| Pino 37 | RC13 — General purpose I/O |
| Pino 38 | RC14 — General purpose I/O |
| Pino 39 | VSS — Ground reference |
| Pino 40 | RC1 — General purpose I/O |
| Pino 41 | RC2 — General purpose I/O |
| Pino 42 | RC3 — General purpose I/O / SDA1 |
| Pino 43 | RC4 — General purpose I/O / SCL1 |
| Pino 44 | VUSB — USB internal transceiver supply (3.3 V) |
| Pino 45 | VBUS — USB VBUS detect input |
| Pino 46 | D- — USB D- data line |
| Pino 47 | D+ — USB D+ data line |
| Pino 48 | VDD — Digital supply (2.3-3.6 V) |
| Pino 49 | RD15 — General purpose I/O |
| Pino 50 | RD14 — General purpose I/O |
| Pino 51 | RD13 — General purpose I/O |
| Pino 52 | RD12 — General purpose I/O |
| Pino 53 | RD11 — General purpose I/O |
| Pino 54 | RD10 — General purpose I/O |
| Pino 55 | RD9 — General purpose I/O |
| Pino 56 | RD8 — General purpose I/O |
| Pino 57 | RD7 — General purpose I/O |
| Pino 58 | RD6 — General purpose I/O |
| Pino 59 | RD5 — General purpose I/O |
| Pino 60 | RD4 — General purpose I/O |
| Pino 61 | RD3 — General purpose I/O |
| Pino 62 | RD2 — General purpose I/O |
| Pino 63 | RD1 — General purpose I/O |
| Pino 64 | RD0 — General purpose I/O |
Aplicações típicas
PIC32MX330F064HT-V/MR é adequado para 6 aplicaçãos: Automotive Infotainment Control Module, USB HID Peripherals, Capacitive Touch Industrial HMI, Low-Cost Audio Player / I2S Streaming, Small TFT Graphical Display Module, Data Acquisition / Sensor Hub.
Automotive Infotainment Control Module
The PIC32MX330F064HT-V/MR fits automotive cabin HMI controllers because it combines AEC-Q100 Grade 2 qualification with the CTMU peripheral that handles capacitive touch buttons and slider strips behind 3 mm of glass. With 80 MHz MIPS32 M4K performance, the device can drive a small TFT over PMP while polling 24 touch channels at 100 Hz each, keeping CPU headroom for CAN/J1939 stacks and audio mixing. The integrated USB-OTG controller simplifies firmware updates via a USB stick port on the dashboard, and the 64 KB Flash comfortably holds a TouchGFX-style lightweight GUI plus bootloader.
Recomendado
USB HID Peripherals
The PIC32MX330F064HT-V/MR suits USB HID peripherals such as keyboards, mice, custom joysticks, and USB-to-UART adapters because the integrated USB-OTG full-speed transceiver eliminates external PHY cost and the 64 KB Flash holds USB stacks plus application code. At 80 MHz, the M4K core easily sustains 1 kHz HID polling while servicing LED animations and macros through the DMA controller. The 16 KB SRAM supports ring buffers for bulk endpoints, and the dual I2S ports allow audio passthrough on gaming headsets with deterministic latency.
Recomendado
Capacitive Touch Industrial HMI
The PIC32MX330F064HT-V/MR is well-suited for industrial touch panels because its CTMU peripheral measures capacitance with sub-pF resolution, enabling reliable touch detection through 6 mm of acrylic or glass while the MCU runs a 50 ms scan loop. With 53 I/O pins, designers can drive up to 64 mutual-cap sense electrodes plus a 7-inch TFT directly through the PMP interface. The 80 MHz MIPS core is fast enough to run noise-immune charge-timing algorithms and a real-time Modbus RTU master over UART without missing touch samples.
Recomendado
Low-Cost Audio Player / I2S Streaming
The PIC32MX330F064HT-V/MR handles entry-level audio playback and I2S streaming because its dual SPI/I2S ports connect directly to a stereo DAC such as the TI PCM5101A or a MEMS microphone, while the 80 MHz core decodes MP3 or AAC streams at 96 kHz / 24-bit without DMA overruns. The 16 KB SRAM holds roughly 170 ms of stereo audio at 48 kHz, large enough for elastic buffer-based streaming over USB or SD card. Designers commonly add the PMP interface to drive a small OLED for track info, keeping the BOM under USD 5.
Recomendado
Small TFT Graphical Display Module
The PIC32MX330F064HT-V/MR drives QVGA (320x240) TFT panels through the Parallel Master Port (PMP) at up to 25 fps because the 80 MHz core and 8-channel DMA can refresh the frame buffer with minimal CPU intervention, leaving cycles for touch polling and GUI logic. With 64 KB Flash, the firmware comfortably holds a lightweight GUI library plus custom icons, and the 16 KB SRAM can double as a partial frame buffer for 8-bit color depth. The dual I2C interface attaches to a capacitive touch controller and a GPIO expander.
Recomendado
Data Acquisition / Sensor Hub
The PIC32MX330F064HT-V/MR is a fit for compact sensor hubs because its 10-bit 1 Msps ADC can sample up to 28 analog channels while the DMA controller moves conversion results into SRAM without CPU load. With 16 KB SRAM, the device can hold a circular buffer of 8 ksamples at full speed, then post-process and stream over UART, USB, or I2C to a host. The CTMU peripheral also adds ratiometric temperature measurement and ratiometric resistive bridges for strain or pressure sensors in industrial nodes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX330F064HT-V/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX330F064H-V/MR | PIC32MX330F064HT-I/MR | PIC32MX330F064HT-120V/MR | PIC32MX430F064H-V/MR | PIC32MX330F064H-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 80 MHz | 80 MHz | 80 MHz | 120 MHz | 80 MHz | 80 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +85C (-I) | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +85C (-I) |
| AEC-Q100 Grade | Grade 2 | Grade 2 | Not qualified (industrial) | Grade 2 | Grade 2 | Not qualified (industrial) |
| USB-OTG | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) |
| Lifecycle Status | Obsolete | Obsolete | Active | Active | Active | Active |
| Crypto Engine | No | No | No | No | Yes | No |
Principais diferenciais
- AEC-Q100 Grade 2 qualification in the -V temperature grade (vs PIC32MX330F064HT-I/MR)
- Hardware USB-OTG full-speed transceiver integrated (vs PIC32MX430F064H-V/MR)
- Same 64-VQFN MR footprint as the entire PIC32MX330 family (vs PIC32MX330F064H-I/PT)
Notas de projeto
The 64-VQFN (MR) package has an exposed thermal pad (EP) on pin 65 (center pad) that MUST be soldered to a continuous ground copper pour of at least 50 mm² for proper thermal and electrical performance. Missing or undersized EP soldering increases junction-to-ambient thermal resistance, can degrade ADC readings due to ground bounce, and violates JEDEC JESD51 classification. Tie all VSS pins (17, 35, 39) to the same ground pour and add stitching vias on a 1.5 mm pitch around the EP edge to improve thermal spreading.
Decouple every VDD pin (18, 48) with a 100 nF X7R ceramic placed within 3 mm of the pin, plus a bulk 4.7 µF X5R within 10 mm. For USB operation add a 100 nF plus 10 µF network on VUSB (pin 44) and ensure VBUS (pin 45) is routed with a 100 kΩ pull-down if no USB host detect is needed. Estimated: with three VDD domains and one VUSB domain, total bulk capacitance of 22 µF minimum keeps the core rail within 5% tolerance during USB suspend-to-resume transitions.
Route USB D+/D- (pins 46, 47) as a 90 Ω differential pair with matched lengths under 50 mil delta, and place a common-mode choke within 5 mm of the connector to meet FCC/CE Class B radiated emissions. Keep the pair over a continuous ground pour with no splits, and avoid crossing any digital switching signal (PWM, SPI clocks) over the pair. Place the crystal traces (if external) inside a guarded ground ring to prevent PLL jitter.
Do not leave the MCLR pin floating in the schematic; tie it to VDD through a 10 kΩ pull-up and to the ICSP programmer through a diode or resistor, or use the internal pull-up via the CONFIG3 register. Failing to do this results in random reset events during in-circuit programming. Additionally, when using CTMU for capacitive touch, calibrate the internal current source on every power-up because absolute current varies ±10% across temperature, and do not exceed 12 mA source/sink total per pin or the absolute maximum ratings will be violated.
Informações de conformidade
AEC-Q100 Grade 2 per Microchip product line documents. RoHS/REACH compliant per Microchip material declaration. Halogen-free per Microchip green-compound datasheet addendum.
