PIC32MX330F064HT-V/MR - 32-bit MCU 80MHz 64KB Flash USB-OTG | Microchip
부품 번호: PIC32MX330F064HT-V/MR ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.15 | $515.00 |
| 500 | $4.61 | $2,305.00 |
| 1,000 | $4.12 | $4,120.00 |
PIC32MX330F064HT-V/MR 개요
What is a PIC32MX microcontroller? The PIC32MX family from Microchip combines the legacy PIC ecosystem with a 32-bit MIPS core, occupying the middle ground between 8/16-bit PIC MCUs and high-performance Cortex-M parts. PIC32MX devices integrate rich peripherals (USB-OTG, I2S, CTMU, DMA, PMP) into a low-cost single-core package and run at 50–120 MHz with up to 150 DMIPS, making them suitable for USB connectivity, audio processing, and low-power edge applications.
Key features of the PIC32MX330F064HT-V/MR include 64 KB on-chip Flash with 12 KB auxiliary boot Flash, 16 KB SRAM, hardware USB 2.0 full-speed OTG, dual SPI/I2S ports, dual I2C, four UART, a 10-bit 1 Msps ADC with up to 28 channels, CTMU for capacitive touch, DMA controller, peripheral pin select, and an internal 8 MHz RC oscillator with PLL. The 64-pin VQFN package has a 0.5 mm pitch and an exposed thermal pad.
The architecture is based on the MIPS32 M4K Harvard core with hardware multiply/divide and a 5-stage pipeline, providing deterministic interrupt response. Memory is mapped as 64 KB Flash plus 12 KB boot Flash for safe firmware updates, with 16 KB SRAM supporting standard C library builds. The integrated USB-OTG controller enables device, host, or OTG operation without an external PHY.
Typical applications for the PIC32MX330F064HT-V/MR include automotive infotainment control, industrial HMI with capacitive touch, USB device/hid peripherals, low-cost audio playback over I2S, and small graphical displays using the PMP interface. The -V temperature grade extends operation to -40 °C to +105 °C, meeting AEC-Q100 Grade 2 expectations for automotive cabin modules.
When designing with this part, ensure the exposed thermal pad of the VQFN is soldered to a properly sized ground copper pour; missing this pad increases thermal resistance and degrades ADC accuracy. Decouple VDD/VUSB with 100 nF plus 4.7 µF ceramics placed within 3 mm of the supply pins, and configure the PLL only after the primary oscillator has stabilized.
This page synthesizes distributor pricing, AEC-Q100 alternative variants, and practical USB+CTMU design notes that go beyond the bare PIC32MX3XX/4XX family datasheet.
드롭인 대체품: PIC32MX330F064HT-V/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX330F064HT-V/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, USB, Operating Temperature, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX330F064H-V/MR
✅ 드롭인✓ 재고 있음
$4.15 / 개
데이터시트 보기 →PIC32MX330F064HT-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX330F064HT-120V/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX430F064H-V/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX330F064H-I/MR
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →PIC32MX330F064HT-V/MR 최대 정격 & 전기적 특성
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit |
| Core Speed | 80 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Boot Flash | 12 KB (auxiliary) |
| RAM | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 패키지 | 64-VQFN (MR) 9x9 mm with EP, 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 °C to +105 °C (V-grade) |
| Automotive Qualification | AEC-Q100 Grade 2 |
| USB | USB 2.0 Full-Speed OTG |
| SPI | 2 x SPI / I2S |
| I2C | 2 x I2C |
| UART | 4 x UART |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| DMA | Yes, 8-channel |
| CTMU (Capacitive Touch) | Yes |
| I/O Pins | 53 |
| RoHS 상태 | Compliant |
PIC32MX330F064HT-V/MR 핀 구성
| 핀 1 | RB15 — General purpose I/O / PGECx |
| 핀 2 | RB14 — General purpose I/O / VBUSON |
| 핀 3 | RB13 — General purpose I/O / AN13 |
| 핀 4 | RB12 — General purpose I/O / AN12 |
| 핀 5 | RB11 — General purpose I/O / AN11 |
| 핀 6 | RB10 — General purpose I/O / AN10 |
| 핀 7 | RB9 — General purpose I/O / AN9 |
| 핀 8 | RB8 — General purpose I/O / AN8 |
| 핀 9 | RB7 — General purpose I/O / AN7 |
| 핀 10 | RB6 — General purpose I/O / AN6 / PGECx |
| 핀 11 | RB5 — General purpose I/O / AN5 |
| 핀 12 | RB4 — General purpose I/O / AN4 |
| 핀 13 | RB3 — General purpose I/O / AN3 |
| 핀 14 | RB2 — General purpose I/O / AN2 |
| 핀 15 | RB1 — General purpose I/O / AN1 / PGEDx |
| 핀 16 | RB0 — General purpose I/O / AN0 |
| 핀 17 | VSS — Ground reference |
| 핀 18 | VDD — Digital supply (2.3-3.6 V) |
| 핀 19 | RA15 — General purpose I/O / SS2 |
| 핀 20 | RA14 — General purpose I/O / SDA2 |
| 핀 21 | RA13 — General purpose I/O |
| 핀 22 | RA12 — General purpose I/O |
| 핀 23 | RA11 — General purpose I/O |
| 핀 24 | RA10 — General purpose I/O / SDA1 |
| 핀 25 | RA9 — General purpose I/O / SCL1 |
| 핀 26 | RA8 — General purpose I/O / SCL2 |
| 핀 27 | RA7 — General purpose I/O / VREF- |
| 핀 28 | RA6 — General purpose I/O / VREF+ |
| 핀 29 | RA5 — General purpose I/O |
| 핀 30 | RA4 — General purpose I/O / TCK |
| 핀 31 | RA3 — General purpose I/O |
| 핀 32 | RA2 — General purpose I/O |
| 핀 33 | RA1 — General purpose I/O |
| 핀 34 | RA0 — General purpose I/O |
| 핀 35 | VSS — Ground reference |
| 핀 36 | RC15 — General purpose I/O / OCFB |
| 핀 37 | RC13 — General purpose I/O |
| 핀 38 | RC14 — General purpose I/O |
| 핀 39 | VSS — Ground reference |
| 핀 40 | RC1 — General purpose I/O |
| 핀 41 | RC2 — General purpose I/O |
| 핀 42 | RC3 — General purpose I/O / SDA1 |
| 핀 43 | RC4 — General purpose I/O / SCL1 |
| 핀 44 | VUSB — USB internal transceiver supply (3.3 V) |
| 핀 45 | VBUS — USB VBUS detect input |
| 핀 46 | D- — USB D- data line |
| 핀 47 | D+ — USB D+ data line |
| 핀 48 | VDD — Digital supply (2.3-3.6 V) |
| 핀 49 | RD15 — General purpose I/O |
| 핀 50 | RD14 — General purpose I/O |
| 핀 51 | RD13 — General purpose I/O |
| 핀 52 | RD12 — General purpose I/O |
| 핀 53 | RD11 — General purpose I/O |
| 핀 54 | RD10 — General purpose I/O |
| 핀 55 | RD9 — General purpose I/O |
| 핀 56 | RD8 — General purpose I/O |
| 핀 57 | RD7 — General purpose I/O |
| 핀 58 | RD6 — General purpose I/O |
| 핀 59 | RD5 — General purpose I/O |
| 핀 60 | RD4 — General purpose I/O |
| 핀 61 | RD3 — General purpose I/O |
| 핀 62 | RD2 — General purpose I/O |
| 핀 63 | RD1 — General purpose I/O |
| 핀 64 | RD0 — General purpose I/O |
일반적인 애플리케이션
PIC32MX330F064HT-V/MR 적합 용도: 6 애플리케이션s: Automotive Infotainment Control Module, USB HID Peripherals, Capacitive Touch Industrial HMI, Low-Cost Audio Player / I2S Streaming, Small TFT Graphical Display Module, Data Acquisition / Sensor Hub.
Automotive Infotainment Control Module
The PIC32MX330F064HT-V/MR fits automotive cabin HMI controllers because it combines AEC-Q100 Grade 2 qualification with the CTMU peripheral that handles capacitive touch buttons and slider strips behind 3 mm of glass. With 80 MHz MIPS32 M4K performance, the device can drive a small TFT over PMP while polling 24 touch channels at 100 Hz each, keeping CPU headroom for CAN/J1939 stacks and audio mixing. The integrated USB-OTG controller simplifies firmware updates via a USB stick port on the dashboard, and the 64 KB Flash comfortably holds a TouchGFX-style lightweight GUI plus bootloader.
추천
USB HID Peripherals
The PIC32MX330F064HT-V/MR suits USB HID peripherals such as keyboards, mice, custom joysticks, and USB-to-UART adapters because the integrated USB-OTG full-speed transceiver eliminates external PHY cost and the 64 KB Flash holds USB stacks plus application code. At 80 MHz, the M4K core easily sustains 1 kHz HID polling while servicing LED animations and macros through the DMA controller. The 16 KB SRAM supports ring buffers for bulk endpoints, and the dual I2S ports allow audio passthrough on gaming headsets with deterministic latency.
추천
Capacitive Touch Industrial HMI
The PIC32MX330F064HT-V/MR is well-suited for industrial touch panels because its CTMU peripheral measures capacitance with sub-pF resolution, enabling reliable touch detection through 6 mm of acrylic or glass while the MCU runs a 50 ms scan loop. With 53 I/O pins, designers can drive up to 64 mutual-cap sense electrodes plus a 7-inch TFT directly through the PMP interface. The 80 MHz MIPS core is fast enough to run noise-immune charge-timing algorithms and a real-time Modbus RTU master over UART without missing touch samples.
추천
Low-Cost Audio Player / I2S Streaming
The PIC32MX330F064HT-V/MR handles entry-level audio playback and I2S streaming because its dual SPI/I2S ports connect directly to a stereo DAC such as the TI PCM5101A or a MEMS microphone, while the 80 MHz core decodes MP3 or AAC streams at 96 kHz / 24-bit without DMA overruns. The 16 KB SRAM holds roughly 170 ms of stereo audio at 48 kHz, large enough for elastic buffer-based streaming over USB or SD card. Designers commonly add the PMP interface to drive a small OLED for track info, keeping the BOM under USD 5.
추천
Small TFT Graphical Display Module
The PIC32MX330F064HT-V/MR drives QVGA (320x240) TFT panels through the Parallel Master Port (PMP) at up to 25 fps because the 80 MHz core and 8-channel DMA can refresh the frame buffer with minimal CPU intervention, leaving cycles for touch polling and GUI logic. With 64 KB Flash, the firmware comfortably holds a lightweight GUI library plus custom icons, and the 16 KB SRAM can double as a partial frame buffer for 8-bit color depth. The dual I2C interface attaches to a capacitive touch controller and a GPIO expander.
추천
Data Acquisition / Sensor Hub
The PIC32MX330F064HT-V/MR is a fit for compact sensor hubs because its 10-bit 1 Msps ADC can sample up to 28 analog channels while the DMA controller moves conversion results into SRAM without CPU load. With 16 KB SRAM, the device can hold a circular buffer of 8 ksamples at full speed, then post-process and stream over UART, USB, or I2C to a host. The CTMU peripheral also adds ratiometric temperature measurement and ratiometric resistive bridges for strain or pressure sensors in industrial nodes.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX330F064HT-V/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX330F064H-V/MR | PIC32MX330F064HT-I/MR | PIC32MX330F064HT-120V/MR | PIC32MX430F064H-V/MR | PIC32MX330F064H-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same | 64-VQFN (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 80 MHz | 80 MHz | 80 MHz | 120 MHz | 80 MHz | 80 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +85C (-I) | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +85C (-I) |
| AEC-Q100 Grade | Grade 2 | Grade 2 | Not qualified (industrial) | Grade 2 | Grade 2 | Not qualified (industrial) |
| USB-OTG | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) |
| Lifecycle Status | Obsolete | Obsolete | Active | Active | Active | Active |
| Crypto Engine | No | No | No | No | Yes | No |
주요 차별점
- AEC-Q100 Grade 2 qualification in the -V temperature grade (vs PIC32MX330F064HT-I/MR)
- Hardware USB-OTG full-speed transceiver integrated (vs PIC32MX430F064H-V/MR)
- Same 64-VQFN MR footprint as the entire PIC32MX330 family (vs PIC32MX330F064H-I/PT)
설계 노트
The 64-VQFN (MR) package has an exposed thermal pad (EP) on pin 65 (center pad) that MUST be soldered to a continuous ground copper pour of at least 50 mm² for proper thermal and electrical performance. Missing or undersized EP soldering increases junction-to-ambient thermal resistance, can degrade ADC readings due to ground bounce, and violates JEDEC JESD51 classification. Tie all VSS pins (17, 35, 39) to the same ground pour and add stitching vias on a 1.5 mm pitch around the EP edge to improve thermal spreading.
Decouple every VDD pin (18, 48) with a 100 nF X7R ceramic placed within 3 mm of the pin, plus a bulk 4.7 µF X5R within 10 mm. For USB operation add a 100 nF plus 10 µF network on VUSB (pin 44) and ensure VBUS (pin 45) is routed with a 100 kΩ pull-down if no USB host detect is needed. Estimated: with three VDD domains and one VUSB domain, total bulk capacitance of 22 µF minimum keeps the core rail within 5% tolerance during USB suspend-to-resume transitions.
Route USB D+/D- (pins 46, 47) as a 90 Ω differential pair with matched lengths under 50 mil delta, and place a common-mode choke within 5 mm of the connector to meet FCC/CE Class B radiated emissions. Keep the pair over a continuous ground pour with no splits, and avoid crossing any digital switching signal (PWM, SPI clocks) over the pair. Place the crystal traces (if external) inside a guarded ground ring to prevent PLL jitter.
Do not leave the MCLR pin floating in the schematic; tie it to VDD through a 10 kΩ pull-up and to the ICSP programmer through a diode or resistor, or use the internal pull-up via the CONFIG3 register. Failing to do this results in random reset events during in-circuit programming. Additionally, when using CTMU for capacitive touch, calibrate the internal current source on every power-up because absolute current varies ±10% across temperature, and do not exceed 12 mA source/sink total per pin or the absolute maximum ratings will be violated.
규정 준수 정보
AEC-Q100 Grade 2 per Microchip product line documents. RoHS/REACH compliant per Microchip material declaration. Halogen-free per Microchip green-compound datasheet addendum.
