PIC32MX550F256H-50I/MR - 50MHz 256KB Flash 32-bit MCU | Microchip
N.º da peça: PIC32MX550F256H-50I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.95 | $5,95 |
| 10 | $5.45 | $54,50 |
| 100 | $4.85 | $485,00 |
| 500 | $4.3 | $2.150,00 |
| 1.000 | $3.85 | $3.850,00 |
PIC32MX550F256H-50I/MR Visão geral
A 32-bit microcontroller (MCU) is an integrated processor core, program memory, data memory, and peripherals on a single die. Within the broader taxonomy of embedded semiconductors, this device belongs to the application-specific microcontroller category, which itself sits inside the integrated circuit (IC) hierarchy of power-managed mixed-signal processors used in embedded systems. Microcontrollers in the PIC32MX class target HMI (human-machine interface) applications with audio, graphics, and touch peripherals.
Key differentiating features include Peripheral Pin Select (PPS) for flexible signal routing, dual CAN 2.0B modules with DeviceNet addressing, 16-channel 10-bit ADC at 1 Msps, and a Charge Time Measurement Unit (CTMU) for capacitive touch. The integrated USB 2.0 Full-Speed OTG controller enables device/host/OTG roles without external PHY. The 64-pin QFN package supports compact PCB layouts while exposing ample I/O for parallel interfaces.
Architecturally, the device uses a MIPS32 M4K Harvard-style core with 5-stage pipeline, separate instruction and data paths, hardware multiply/divide, and zero overhead looping. The 50 MHz core provides 83 DMIPS, sufficient for protocol stacks and moderate DSP loads. The integrated DMA controller offloads data movement from the CPU.
Typical applications include industrial control with CAN bus connectivity, USB-based human interface devices, audio playback systems using I2S codecs, and low-cost graphics terminals with PMP-driven LCDs. The PPS remapping and dual CAN modules make it suitable for automotive body electronics and building automation.
When designing with this MCU, allocate at least one 10uF bulk and one 0.1uF decoupling capacitor adjacent to each power pin pair, route the 50 MHz crystal traces symmetrically, and use a 4-layer PCB with continuous ground pour under the QFN thermal pad to manage dissipation.
This page consolidates distributor pricing, drop-in same-package alternates, and practical design considerations beyond the manufacturer datasheet to accelerate sourcing and design-in decisions.
Alternativas drop-in para PIC32MX550F256H-50I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX550F256H-50I/MR (mesmo formato e footprint) — diferindo em Package, USB, Operating Temperature, Parallel Master Port (PMP), ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX570F512H-50I/MR
✅ Drop-In✓ Em estoque
$4.25 / unidade
Ver ficha técnica →PIC32MX550F256H-50I/PT
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →PIC32MX550F256HT-50I/MR
✅ Drop-In✓ Em estoque
$3.4 / unidade
Ver ficha técnica →PIC32MX550F256H-V/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX570F512L-50I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX450F256H-50I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX550F256H-50I/MR Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Encapsulamento | 64-pin QFN (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B active with DeviceNet addressing |
| I2S / SPI | Two I2S and up to four SPI modules |
| PMP | Parallel Master Port with dual read/write buffers |
| Peripheral Pin Select | Yes (PPS remap) |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| Touch Sensing | CTMU (Capacitive Touch) |
| DMA | Yes |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do PIC32MX550F256H-50I/MR
| Pino 1 | RB15 — I/O port B bit 15 |
| Pino 2 | VSS — Ground reference |
| Pino 3 | VDD — Supply voltage 2.3-3.6V |
| Pino 4 | RB14 — I/O port B bit 14 |
| Pino 5 | RB13 — I/O port B bit 13 |
| Pino 6 | RB12 — I/O port B bit 12 |
| Pino 7 | RB11 — I/O port B bit 11 |
| Pino 8 | RB10 — I/O port B bit 10 |
| Pino 9 | RB9 — I/O port B bit 9 |
| Pino 10 | RB8 — I/O port B bit 8 |
| Pino 11 | RB7 — I/O port B bit 7 |
| Pino 12 | RB6 — I/O port B bit 6 |
| Pino 13 | RB5 — I/O port B bit 5 |
| Pino 14 | RB4 — I/O port B bit 4 |
| Pino 15 | RB3 — I/O port B bit 3 |
| Pino 16 | RB2 — I/O port B bit 2 |
| Pino 17 | RB1 — I/O port B bit 1 |
| Pino 18 | RB0 — I/O port B bit 0 |
| Pino 19 | VSS — Ground reference |
| Pino 20 | VDD — Supply voltage 2.3-3.6V |
| Pino 21 | RF0 — I/O port F bit 0 |
| Pino 22 | RF1 — I/O port F bit 1 |
| Pino 23 | RD11 — I/O port D bit 11 |
| Pino 24 | RD10 — I/O port D bit 10 |
| Pino 25 | RD9 — I/O port D bit 9 |
| Pino 26 | RD8 — I/O port D bit 8 |
| Pino 27 | RD7 — I/O port D bit 7 |
| Pino 28 | RD6 — I/O port D bit 6 |
| Pino 29 | RD5 — I/O port D bit 5 |
| Pino 30 | RD4 — I/O port D bit 4 |
| Pino 31 | RD3 — I/O port D bit 3 |
| Pino 32 | RD2 — I/O port D bit 2 |
| Pino 33 | RD1 — I/O port D bit 1 |
| Pino 34 | RD0 — I/O port D bit 0 |
| Pino 35 | RC15 — I/O port C bit 15 |
| Pino 36 | RC14 — I/O port C bit 14 |
| Pino 37 | RC13 — I/O port C bit 13 |
| Pino 38 | VSS — Ground reference |
| Pino 39 | VDD — Supply voltage 2.3-3.6V |
| Pino 40 | RC12 — I/O port C bit 12 |
| Pino 41 | RC11 — I/O port C bit 11 |
| Pino 42 | RC10 — I/O port C bit 10 |
| Pino 43 | RC9 — I/O port C bit 9 |
| Pino 44 | RC8 — I/O port C bit 8 |
| Pino 45 | RC7 — I/O port C bit 7 |
| Pino 46 | RC6 — I/O port C bit 6 |
| Pino 47 | RC5 — I/O port C bit 5 |
| Pino 48 | RC4 — I/O port C bit 4 |
| Pino 49 | RC3 — I/O port C bit 3 |
| Pino 50 | RC2 — I/O port C bit 2 |
| Pino 51 | RC1 — I/O port C bit 1 |
| Pino 52 | RC0 — I/O port C bit 0 |
| Pino 53 | RA15 — I/O port A bit 15 |
| Pino 54 | RA14 — I/O port A bit 14 |
| Pino 55 | RA9 — I/O port A bit 9 |
| Pino 56 | RA10 — I/O port A bit 10 |
| Pino 57 | RA7 — I/O port A bit 7 |
| Pino 58 | RA6 — I/O port A bit 6 |
| Pino 59 | RA5 — I/O port A bit 5 |
| Pino 60 | RA4 — I/O port A bit 4 |
| Pino 61 | RA3 — I/O port A bit 3 |
| Pino 62 | RA2 — I/O port A bit 2 |
| Pino 63 | RA1 — I/O port A bit 1 |
| Pino 64 | RA0 — I/O port A bit 0 |
Aplicações típicas
PIC32MX550F256H-50I/MR é adequado para 6 aplicaçãos: USB Audio Device (USB Headset / Speakerphone), Industrial CAN Node (Building Automation, Body Electronics), Graphics Terminal with PMP-driven LCD, Capacitive Touch HMI Panel, IoT Sensor Hub with USB Diagnostic Port, Automotive Body Electronics (Non-Circuit Infotainment).
USB Audio Device (USB Headset / Speakerphone)
The PIC32MX550F256H-50I/MR fits USB audio class designs because it integrates a USB 2.0 Full-Speed OTG controller plus two I2S modules, removing the need for a dedicated audio bridge IC. At 50 MHz and 83 DMIPS, the MIPS M4K core comfortably handles isochronous USB audio endpoints, sample-rate conversion, and basic DSP such as AEC or EQ at 48 kHz. The 256 KB Flash accommodates USB stack plus I2S driver, while 64 KB SRAM buffers stereo 16-bit/48 kHz streams without overrun.
Recomendado
Industrial CAN Node (Building Automation, Body Electronics)
The PIC32MX550F256H-50I/MR is engineered for CAN-based industrial nodes with its integrated CAN 2.0B active controller supporting DeviceNet addressing filters. Engineers can attach the MCU directly to a CAN transceiver like MCP2551 without an external CAN controller, saving BOM cost. The 50 MHz core and 83 DMIPS run CANopen or DeviceNet stacks with margin for application logic. PPS allows flexible assignment of CAN RX/TX pins, easing PCB layout in dense enclosures.
Recomendado
Graphics Terminal with PMP-driven LCD
The PIC32MX550F256H-50I/MR drives small graphical LCDs through its Parallel Master Port (PMP) with dual read/write buffers, allowing sustained frame buffer updates without CPU stall. At 50 MHz, it can refresh QVGA (320x240) panels over an 8-bit PMP bus while leaving headroom for touch processing via the CTMU peripheral. The 64 KB SRAM holds compact frame buffers without external memory. PPS allows flexible mapping of PMP data lines.
Recomendado
Capacitive Touch HMI Panel
The PIC32MX550F256H-50I/MR integrates the Charge Time Measurement Unit (CTMU) for self- and mutual-capacitive touch sensing, supporting up to 16 touch channels without an external touch controller. Combined with the on-chip 10-bit ADC, it can read both touch and analog sliders in a single scan cycle. PPS routes the CTMU outputs to any GPIO, which simplifies PCB layout of touch electrodes under a glass overlay.
Recomendado
IoT Sensor Hub with USB Diagnostic Port
The PIC32MX550F256H-50I/MR aggregates analog and digital sensors in industrial IoT hubs using its 16-channel 10-bit ADC, four UARTs, and USB OTG for diagnostic access. The 50 MHz core runs MQTT-SN or CoAP stacks over UART-to-WiFi bridges. PPS allows I2C, SPI, and UART to be remapped to any GPIO, enabling flexible sensor board layouts without respinning the PCB.
Recomendado
Automotive Body Electronics (Non-Circuit Infotainment)
The PIC32MX550F256H-50I/MR's industrial -40C to +85C rating and CAN 2.0B controller suit body-electronics modules such as seat controllers, mirror adjusters, and lighting nodes when full AEC-Q100 is not required. The integrated PMP and CTMU can drive LED matrix clusters with capacitive touch. The 64-pin QFN package is compact enough for behind-panel mounting in 12V vehicle subsystems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX550F256H-50I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX570F512H-50I/MR | PIC32MX570F512L-50I/MR | PIC32MX450F256H-50I/MR | PIC32MX550F256HT-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9) | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same |
| Flash Memory | 256 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | No CAN | CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated CAN 2.0B with DeviceNet addressing (vs PIC32MX450F256H-50I/MR)
- 50 MHz vs 40 MHz sibling (vs PIC32MX550F256H-I/MR)
- 256 KB Flash with USB OTG and PMP dual buffers (vs PIC32MX270F256H-50I/MR)
Notas de projeto
Estimated: at 50 MHz CPU and 3.3V supply, the core draw is approximately 30 mA (1.6 mA/MHz per Microchip family datasheet). Place one 10uF X7R ceramic bulk capacitor at the regulator output and 0.1uF decoupling within 5 mm of every VDD/VSS pair. For USB applications, also decouple the VBUS line with a 10uF tantalum and protect VBUS with a TVS diode.
The 64-pin QFN (9x9) has a center EP pad that must be soldered to a continuous ground copper pour on the PCB to meet thermal and electrical performance. Without the EP pad soldered, the die temperature can rise 15-20C above ambient at full CPU load. For 4-layer PCBs, use 2 oz copper on top and bottom layers under the device, with stitched vias through the inner ground plane.
Route the 8 MHz primary oscillator traces (OSC1/OSC2) symmetrically with respect to ground, keeping them shorter than 10 mm and away from USB and switching power traces. The optional 32.768 kHz secondary oscillator should use a guard ring tied to analog ground. Both crystal traces must be referenced to a continuous ground plane on the adjacent layer with no signal traces crossing.
Do not confuse the '-50I/MR' suffix: the '-50' denotes 50 MHz, 'I' denotes industrial -40C to +85C temperature, and 'MR' denotes the 64-pin QFN (9x9) package. A common mistake is to specify the 40 MHz '-I/MR' variant when 50 MHz performance is required. Also, when migrating to the PIC32MX570F512H-50I/MR, update the linker script to reflect the new memory map - the larger Flash starts at the same base address but extends higher.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive applications.
