PIC32MX550F256H-50I/MR - 50MHz 256KB Flash 32-bit MCU | Microchip
Référence : PIC32MX550F256H-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.95 | $5,95 |
| 10 | $5.45 | $54,50 |
| 100 | $4.85 | $485,00 |
| 500 | $4.3 | $2 150,00 |
| 1 000 | $3.85 | $3 850,00 |
PIC32MX550F256H-50I/MR Présentation
A 32-bit microcontroller (MCU) is an integrated processor core, program memory, data memory, and peripherals on a single die. Within the broader taxonomy of embedded semiconductors, this device belongs to the application-specific microcontroller category, which itself sits inside the integrated circuit (IC) hierarchy of power-managed mixed-signal processors used in embedded systems. Microcontrollers in the PIC32MX class target HMI (human-machine interface) applications with audio, graphics, and touch peripherals.
Key differentiating features include Peripheral Pin Select (PPS) for flexible signal routing, dual CAN 2.0B modules with DeviceNet addressing, 16-channel 10-bit ADC at 1 Msps, and a Charge Time Measurement Unit (CTMU) for capacitive touch. The integrated USB 2.0 Full-Speed OTG controller enables device/host/OTG roles without external PHY. The 64-pin QFN package supports compact PCB layouts while exposing ample I/O for parallel interfaces.
Architecturally, the device uses a MIPS32 M4K Harvard-style core with 5-stage pipeline, separate instruction and data paths, hardware multiply/divide, and zero overhead looping. The 50 MHz core provides 83 DMIPS, sufficient for protocol stacks and moderate DSP loads. The integrated DMA controller offloads data movement from the CPU.
Typical applications include industrial control with CAN bus connectivity, USB-based human interface devices, audio playback systems using I2S codecs, and low-cost graphics terminals with PMP-driven LCDs. The PPS remapping and dual CAN modules make it suitable for automotive body electronics and building automation.
When designing with this MCU, allocate at least one 10uF bulk and one 0.1uF decoupling capacitor adjacent to each power pin pair, route the 50 MHz crystal traces symmetrically, and use a 4-layer PCB with continuous ground pour under the QFN thermal pad to manage dissipation.
This page consolidates distributor pricing, drop-in same-package alternates, and practical design considerations beyond the manufacturer datasheet to accelerate sourcing and design-in decisions.
Alternatives de remplacement direct pour PIC32MX550F256H-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX550F256H-50I/MR (même facteur de forme et même empreinte) — différant par Package, USB, Operating Temperature, Parallel Master Port (PMP), ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512H-50I/MR
✅ Remplacement direct✓ En stock
$4.25 / unité
Voir la fiche technique →PIC32MX550F256H-50I/PT
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX550F256HT-50I/MR
✅ Remplacement direct✓ En stock
$3.4 / unité
Voir la fiche technique →PIC32MX550F256H-V/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX570F512L-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX450F256H-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX550F256H-50I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Boîtier | 64-pin QFN (9x9 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B active with DeviceNet addressing |
| I2S / SPI | Two I2S and up to four SPI modules |
| PMP | Parallel Master Port with dual read/write buffers |
| Peripheral Pin Select | Yes (PPS remap) |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| Touch Sensing | CTMU (Capacitive Touch) |
| DMA | Yes |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de PIC32MX550F256H-50I/MR
| Broche 1 | RB15 — I/O port B bit 15 |
| Broche 2 | VSS — Ground reference |
| Broche 3 | VDD — Supply voltage 2.3-3.6V |
| Broche 4 | RB14 — I/O port B bit 14 |
| Broche 5 | RB13 — I/O port B bit 13 |
| Broche 6 | RB12 — I/O port B bit 12 |
| Broche 7 | RB11 — I/O port B bit 11 |
| Broche 8 | RB10 — I/O port B bit 10 |
| Broche 9 | RB9 — I/O port B bit 9 |
| Broche 10 | RB8 — I/O port B bit 8 |
| Broche 11 | RB7 — I/O port B bit 7 |
| Broche 12 | RB6 — I/O port B bit 6 |
| Broche 13 | RB5 — I/O port B bit 5 |
| Broche 14 | RB4 — I/O port B bit 4 |
| Broche 15 | RB3 — I/O port B bit 3 |
| Broche 16 | RB2 — I/O port B bit 2 |
| Broche 17 | RB1 — I/O port B bit 1 |
| Broche 18 | RB0 — I/O port B bit 0 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Supply voltage 2.3-3.6V |
| Broche 21 | RF0 — I/O port F bit 0 |
| Broche 22 | RF1 — I/O port F bit 1 |
| Broche 23 | RD11 — I/O port D bit 11 |
| Broche 24 | RD10 — I/O port D bit 10 |
| Broche 25 | RD9 — I/O port D bit 9 |
| Broche 26 | RD8 — I/O port D bit 8 |
| Broche 27 | RD7 — I/O port D bit 7 |
| Broche 28 | RD6 — I/O port D bit 6 |
| Broche 29 | RD5 — I/O port D bit 5 |
| Broche 30 | RD4 — I/O port D bit 4 |
| Broche 31 | RD3 — I/O port D bit 3 |
| Broche 32 | RD2 — I/O port D bit 2 |
| Broche 33 | RD1 — I/O port D bit 1 |
| Broche 34 | RD0 — I/O port D bit 0 |
| Broche 35 | RC15 — I/O port C bit 15 |
| Broche 36 | RC14 — I/O port C bit 14 |
| Broche 37 | RC13 — I/O port C bit 13 |
| Broche 38 | VSS — Ground reference |
| Broche 39 | VDD — Supply voltage 2.3-3.6V |
| Broche 40 | RC12 — I/O port C bit 12 |
| Broche 41 | RC11 — I/O port C bit 11 |
| Broche 42 | RC10 — I/O port C bit 10 |
| Broche 43 | RC9 — I/O port C bit 9 |
| Broche 44 | RC8 — I/O port C bit 8 |
| Broche 45 | RC7 — I/O port C bit 7 |
| Broche 46 | RC6 — I/O port C bit 6 |
| Broche 47 | RC5 — I/O port C bit 5 |
| Broche 48 | RC4 — I/O port C bit 4 |
| Broche 49 | RC3 — I/O port C bit 3 |
| Broche 50 | RC2 — I/O port C bit 2 |
| Broche 51 | RC1 — I/O port C bit 1 |
| Broche 52 | RC0 — I/O port C bit 0 |
| Broche 53 | RA15 — I/O port A bit 15 |
| Broche 54 | RA14 — I/O port A bit 14 |
| Broche 55 | RA9 — I/O port A bit 9 |
| Broche 56 | RA10 — I/O port A bit 10 |
| Broche 57 | RA7 — I/O port A bit 7 |
| Broche 58 | RA6 — I/O port A bit 6 |
| Broche 59 | RA5 — I/O port A bit 5 |
| Broche 60 | RA4 — I/O port A bit 4 |
| Broche 61 | RA3 — I/O port A bit 3 |
| Broche 62 | RA2 — I/O port A bit 2 |
| Broche 63 | RA1 — I/O port A bit 1 |
| Broche 64 | RA0 — I/O port A bit 0 |
Applications typiques
PIC32MX550F256H-50I/MR convient pour 6 applications: USB Audio Device (USB Headset / Speakerphone), Industrial CAN Node (Building Automation, Body Electronics), Graphics Terminal with PMP-driven LCD, Capacitive Touch HMI Panel, IoT Sensor Hub with USB Diagnostic Port, Automotive Body Electronics (Non-Circuit Infotainment).
USB Audio Device (USB Headset / Speakerphone)
The PIC32MX550F256H-50I/MR fits USB audio class designs because it integrates a USB 2.0 Full-Speed OTG controller plus two I2S modules, removing the need for a dedicated audio bridge IC. At 50 MHz and 83 DMIPS, the MIPS M4K core comfortably handles isochronous USB audio endpoints, sample-rate conversion, and basic DSP such as AEC or EQ at 48 kHz. The 256 KB Flash accommodates USB stack plus I2S driver, while 64 KB SRAM buffers stereo 16-bit/48 kHz streams without overrun.
Recommandé
Industrial CAN Node (Building Automation, Body Electronics)
The PIC32MX550F256H-50I/MR is engineered for CAN-based industrial nodes with its integrated CAN 2.0B active controller supporting DeviceNet addressing filters. Engineers can attach the MCU directly to a CAN transceiver like MCP2551 without an external CAN controller, saving BOM cost. The 50 MHz core and 83 DMIPS run CANopen or DeviceNet stacks with margin for application logic. PPS allows flexible assignment of CAN RX/TX pins, easing PCB layout in dense enclosures.
Recommandé
Graphics Terminal with PMP-driven LCD
The PIC32MX550F256H-50I/MR drives small graphical LCDs through its Parallel Master Port (PMP) with dual read/write buffers, allowing sustained frame buffer updates without CPU stall. At 50 MHz, it can refresh QVGA (320x240) panels over an 8-bit PMP bus while leaving headroom for touch processing via the CTMU peripheral. The 64 KB SRAM holds compact frame buffers without external memory. PPS allows flexible mapping of PMP data lines.
Recommandé
Capacitive Touch HMI Panel
The PIC32MX550F256H-50I/MR integrates the Charge Time Measurement Unit (CTMU) for self- and mutual-capacitive touch sensing, supporting up to 16 touch channels without an external touch controller. Combined with the on-chip 10-bit ADC, it can read both touch and analog sliders in a single scan cycle. PPS routes the CTMU outputs to any GPIO, which simplifies PCB layout of touch electrodes under a glass overlay.
Recommandé
IoT Sensor Hub with USB Diagnostic Port
The PIC32MX550F256H-50I/MR aggregates analog and digital sensors in industrial IoT hubs using its 16-channel 10-bit ADC, four UARTs, and USB OTG for diagnostic access. The 50 MHz core runs MQTT-SN or CoAP stacks over UART-to-WiFi bridges. PPS allows I2C, SPI, and UART to be remapped to any GPIO, enabling flexible sensor board layouts without respinning the PCB.
Recommandé
Automotive Body Electronics (Non-Circuit Infotainment)
The PIC32MX550F256H-50I/MR's industrial -40C to +85C rating and CAN 2.0B controller suit body-electronics modules such as seat controllers, mirror adjusters, and lighting nodes when full AEC-Q100 is not required. The integrated PMP and CTMU can drive LED matrix clusters with capacitive touch. The 64-pin QFN package is compact enough for behind-panel mounting in 12V vehicle subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX550F256H-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512H-50I/MR | PIC32MX570F512L-50I/MR | PIC32MX450F256H-50I/MR | PIC32MX550F256HT-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9) | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same | 64-pin QFN (9x9) - same |
| Flash Memory | 256 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | No CAN | CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Integrated CAN 2.0B with DeviceNet addressing (vs PIC32MX450F256H-50I/MR)
- 50 MHz vs 40 MHz sibling (vs PIC32MX550F256H-I/MR)
- 256 KB Flash with USB OTG and PMP dual buffers (vs PIC32MX270F256H-50I/MR)
Notes de conception
Estimated: at 50 MHz CPU and 3.3V supply, the core draw is approximately 30 mA (1.6 mA/MHz per Microchip family datasheet). Place one 10uF X7R ceramic bulk capacitor at the regulator output and 0.1uF decoupling within 5 mm of every VDD/VSS pair. For USB applications, also decouple the VBUS line with a 10uF tantalum and protect VBUS with a TVS diode.
The 64-pin QFN (9x9) has a center EP pad that must be soldered to a continuous ground copper pour on the PCB to meet thermal and electrical performance. Without the EP pad soldered, the die temperature can rise 15-20C above ambient at full CPU load. For 4-layer PCBs, use 2 oz copper on top and bottom layers under the device, with stitched vias through the inner ground plane.
Route the 8 MHz primary oscillator traces (OSC1/OSC2) symmetrically with respect to ground, keeping them shorter than 10 mm and away from USB and switching power traces. The optional 32.768 kHz secondary oscillator should use a guard ring tied to analog ground. Both crystal traces must be referenced to a continuous ground plane on the adjacent layer with no signal traces crossing.
Do not confuse the '-50I/MR' suffix: the '-50' denotes 50 MHz, 'I' denotes industrial -40C to +85C temperature, and 'MR' denotes the 64-pin QFN (9x9) package. A common mistake is to specify the 40 MHz '-I/MR' variant when 50 MHz performance is required. Also, when migrating to the PIC32MX570F512H-50I/MR, update the linker script to reflect the new memory map - the larger Flash starts at the same base address but extends higher.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose AEC-Q100 variants for automotive applications.
