PIC32MX570F512LT-50I/GJX - 32-bit MCU 512KB Flash 50MHz TFBGA-100 | Microchip
N.º da peça: PIC32MX570F512LT-50I/GJX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.65 | $76,50 |
| 100 | $6.89 | $689,00 |
| 500 | $6.12 | $3.060,00 |
| 1.000 | $5.47 | $5.470,00 |
PIC32MX570F512LT-50I/GJX Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and a rich set of peripherals such as timers, communication controllers and ADCs. PIC32MX5xx parts sit in Microchip's PIC32 family, which uses a MIPS32 core rather than the ARM Cortex-M cores used by many peers. Within the broader taxonomy, a PIC32 MCU belongs to the class of 32-bit microcontrollers, which in turn falls under the embedded processing hierarchy: microcontroller -> embedded processor -> semiconductor -> integrated circuit.
Key features include USB 2.0 full-speed On-The-Go (OTG) with integrated PHY, a CAN 2.0B controller, two I2S and four SPI modules for codec and serial peripherals, a Parallel Master Port (PMP) with dual buffers for graphics interfaces, Peripheral Pin Select (PPS) for flexible pin mapping, an RTCC with calendar mode, a CTMU for capacitive touch, three analog comparators and a 10-bit ADC with up to 16 channels. The 100-pin TFBGA footprint exposes five 16-bit timers/counters, configurable I/O, JTAG and trace ports.
Architecturally the M4K core executes most instructions in one cycle and is supported by a 5-stage pipeline with hardware multiply/divide and a tightly-coupled prefetch module that masks Flash wait states. The integrated DMA controller offloads memory-to-peripheral transfers and the bus matrix allows concurrent Flash and RAM access. PPS remaps digital peripherals to almost any I/O pin, dramatically simplifying board routing.
Typical applications include USB peripherals, CAN-connected industrial sensors, audio codecs with I2S, graphical user interfaces with PMP-driven TFTs, capacitive touch keypads via CTMU, and low-cost IoT bridges. The wide peripheral mix makes it a flexible general-purpose MCU for mid-volume embedded designs.
Designers should review the device errata and DS60001129 (PIC32MX5xx/6xx/7xx family data sheet) before committing to the 100-pin TFBGA, which requires a 7x7 mm fan-out and careful microvia stack-up for reliable assembly.
This page synthesizes verified distributor pricing, drop-in alternative recommendations and engineering-oriented design notes that go beyond the manufacturer datasheet and standard distributor listings.
Alternativas drop-in para PIC32MX570F512LT-50I/GJX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX570F512LT-50I/GJX (mesmo formato e footprint) — diferindo em Package, ADC, Parallel Master Port (PMP), Core Architecture, DMA Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX570F512LT-I/GJX
✅ Drop-In✓ Em estoque
$4.78 / unidade
Ver ficha técnica →PIC32MX570F512L-50I/GJX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX570F512L-I/GJX
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX570F512HT-50I/PT
✅ Drop-In✓ Em estoque
$4.41 / unidade
Ver ficha técnica →PIC32MX570F512HT-I/MR
✅ Drop-In✓ Em estoque
$4.78 / unidade
Ver ficha técnica →PIC32MX570F512LT-50I/GJX Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K |
| Core Frequency | 50 MHz |
| Core Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 77 |
| Encapsulamento | 100-pin TFBGA (7x7 mm) |
| Faixa de temperatura de operação | -40C to +85C (Industrial) |
| USB Module | USB 2.0 FS OTG with integrated PHY |
| CAN Module | CAN 2.0B |
| SPI Modules | 4 |
| I2S Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| ADC | 10-bit, up to 16 channels |
| Comparators | 3 |
| CTMU (Capacitive Touch) | Yes |
| RTCC | Yes, calendar mode |
| DMA Channels | Yes |
| Parallel Master Port (PMP) | Yes, dual buffers |
| Peripheral Pin Select (PPS) | Yes |
| JTAG / Trace | Yes |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Packaging | Tape & Reel (LT suffix) |
Guia de Configuração de Pinos do PIC32MX570F512LT-50I/GJX 100-pin tfbga (7x7 mm)
Configuração de pinos para PIC32MX570F512LT-50I/GJX (pacote 100-pin tfbga (7x7 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MX570F512LT-50I/GJX.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MX570F512LT-50I/GJX é adequado para 6 aplicaçãos: USB Peripherals and HID Devices, CAN-Based Industrial Sensors and Actuators, Audio Codec Interfaces with I2S, Graphical User Interfaces with PMP-TFT Displays, Capacitive Touch Keypads (CTMU), IoT Bridges and Edge Gateways.
USB Peripherals and HID Devices
The PIC32MX570F512LT-50I/GJX fits USB peripheral designs because it integrates a USB 2.0 full-speed On-The-Go controller with an internal PHY, eliminating the need for an external transceiver. The 50 MHz / 83 DMIPS core handles HID class descriptors, HID report generation and 1 ms polling with comfortable headroom. 512 KB Flash accommodates USB stack, vendor class drivers and product firmware, while 64 KB SRAM buffers HID reports and ring buffers. PPS remaps the USB D+/D- pins for flexible board routing on the 100-pin TFBGA.
Recomendado
CAN-Based Industrial Sensors and Actuators
The PIC32MX570F512LT-50I/GJX suits CAN 2.0B sensor nodes because it combines the CAN controller with a 10-bit ADC (up to 16 channels), three analog comparators and CTMU capacitive touch on a single die. Industrial CANopen or DeviceNet slaves can run their protocol stack from 512 KB Flash, while 64 KB SRAM is sufficient for process data buffers and CAN message queues. The 2.3 V to 3.6 V supply and industrial -40C to +85C temperature range match typical 24V-bus-derived 3.3 V rails after a small DC-DC stage.
Recomendado
Audio Codec Interfaces with I2S
The PIC32MX570F512LT-50I/GJX supports audio codec designs via its two I2S modules and four SPI modules, which can stream stereo 48 kHz / 24-bit audio from a typical Wolfson or Cirrus codec. 50 MHz MIPS performance easily manages DMA-fed I2S buffers, freeing the core for DSP or volume control. The 64 KB SRAM holds several hundred milliseconds of 48 kHz / 16-bit stereo audio, enough for effects buffering. The integrated RTCC with calendar mode is convenient for alarm-clock audio or timestamped recording features.
Recomendado
Graphical User Interfaces with PMP-TFT Displays
The PIC32MX570F512LT-50I/GJX drives small TFT displays through its Parallel Master Port (PMP) with dual read/write buffers, which is ideal for QVGA / WQVGA graphical user interfaces. 512 KB Flash stores fonts and bitmaps; 64 KB SRAM holds the framebuffer for small color-depth panels. PMP dual buffers let the controller write to one buffer while the other is being scanned out to the panel, eliminating flicker. The 50 MHz core redraws widgets and handles touch input via the CTMU simultaneously.
Recomendado
Capacitive Touch Keypads (CTMU)
The PIC32MX570F512LT-50I/GJX is well-suited for capacitive touch keypads because it integrates the CTMU (Charge Time Measurement Unit) and up to 16 ADC channels. The CTMU measures capacitance changes via charge-time measurement, which is immune to most conducted noise and supports proximity and water-tolerant designs. PPS lets designers map touch electrodes to almost any spare I/O, simplifying PCB layout. The 50 MHz MIPS core handles scanning, debouncing and gesture recognition in real time across keypad matrices.
Recomendado
IoT Bridges and Edge Gateways
The PIC32MX570F512LT-50I/GJX works as a small IoT bridge because it can speak USB device (to a host PC), CAN or I2C (to a sensor bus), and UART (to a wireless module) concurrently. 50 MHz MIPS throughput runs an embedded TLS stack or an MQTT bridge on top of a UART-based Wi-Fi or cellular module. The peripheral mix (USB + CAN + 4xSPI + 2xI2C + 2xUART) makes it a one-chip aggregation point for multiple sensor buses without external bridges, while 512 KB Flash holds certificate chains or full protocol stacks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX570F512LT-50I/GJX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX570F512LT-I/GJX | PIC32MX570F512L-50I/GJX | PIC32MX570F512L-I/GJX | PIC32MX570F512HT-50I/PT | PIC32MX570F512HT-I/MR |
|---|---|---|---|---|---|---|
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 50 MHz (83 DMIPS) | 40 MHz (-20%) | 50 MHz (same) | 40 MHz (-20%) | 50 MHz (same) | 40 MHz (-20%) |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB Module | USB 2.0 FS OTG with PHY | USB 2.0 FS OTG with PHY | USB 2.0 FS OTG with PHY | USB 2.0 FS OTG with PHY | USB 2.0 FS OTG with PHY | USB 2.0 FS OTG with PHY |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Principais diferenciais
- Higher core frequency (50 MHz / 83 DMIPS) (vs PIC32MX570F512LT-I/GJX)
- Tape-and-reel factory packaging (vs PIC32MX570F512L-50I/GJX)
- 100-pin TFBGA for compact layouts (vs PIC32MX570F512L-50I/PF (TQFP))
Notas de projeto
Estimated: at 50 MHz core clock, VDD = 3.3 V and 100% CPU load, the typical core current consumption of a PIC32MX570 part is in the 60-80 mA range, so a regulator with at least 150 mA headroom is recommended. Decouple the VDD/VSS pins with one 0.1 uF ceramic per supply pair plus a single 10 uF bulk capacitor near the largest ball cluster. The USB module requires the internal 3.3 V USB regulator pin (VBUS) to be connected to the USB VBUS line through a 10 uF bulk and 0.1 uF ceramic, per the Microchip PIC32MX5xx family data sheet.
The 100-pin TFBGA (7x7 mm) package requires microvia PCB technology and a 0.5 mm (or finer) ball pitch land pattern per the Microchip package mechanical drawing. Designers should follow JEDEC MSL-3 handling rules and reflow at a peak body temperature of 245-260 C with a controlled ramp. Ground balls should be stitched with a single contiguous ground plane to minimise switching noise on the parallel master port (PMP) data bus. A 4-layer stack-up with one solid ground and one solid power plane is strongly recommended for USB OTG compliance.
Always check the Microchip device errata (DS80000496 or equivalent) before selecting the PIC32MX570F512LT-50I/GJX; the 50 MHz grade has historically had workarounds for DMA and USB edge cases that are addressed in software. The 'T' suffix indicates tape-and-reel packaging - omitting it changes the tray-versus-reel supply chain but not the electrical specs. Do not exceed the 3.6 V absolute maximum on VDD, even during in-circuit programming. The RTCC requires a backup battery or super-capacitor on the VBAT pin for calendar retention across VDD loss.
Informações de conformidade
RoHS and REACH compliant per Microchip product page; the part is not AEC-Q100 qualified (industrial grade only).