PIC32MX675F256L-80I/BG - 32-bit MCU 80 MHz 256 KB Flash USB ENET | Microchip
N.º da peça: PIC32MX675F256L-80I/BG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.86 | $9,86 |
| 10 | $8.92 | $89,20 |
| 100 | $7.74 | $774,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $6.2 | $6.200,00 |
PIC32MX675F256L-80I/BG Visão geral
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance CPU core, Flash program memory, SRAM data memory, and a rich peripheral set. Microchip's PIC32 family is positioned between traditional 8/16-bit microcontrollers and high-end application processors, targeting industrial control, embedded connectivity, and USB-centric designs. The MIPS32 M4K core inside PIC32MX devices delivers 1.5 DMIPS/MHz with single-cycle multiply and hardware multiply-accumulate, enabling efficient DSP routines and protocol stack execution.
The PIC32MX675F256L-80I/BG features 256 KB Flash and 64 KB RAM, 8-channel DMA, 16-bit timers, 10-bit ADC, PMP (parallel master port), and integrated Ethernet MAC that connects to a 100 Mbit PHY via RMII/MII. The 121-TFBGA package provides 84 dedicated I/O pins for board-level integration. USB 2.0 full-speed On-The-Go enables dual-role USB peripherals, eliminating the need for external controllers. The device supports 2.3V to 3.6V core VDD and operates from -40C to +85C industrial range.
The architecture uses a Harvard bus with separate 32-bit instruction and 32-bit data paths to the Flash and SRAM, plus a tightly coupled prefetch cache that masks Flash latency. The 10/100 Ethernet MAC includes an MII/RMII interface for external PHY connection, supporting both 10 Mbit and 100 Mbit rates. Dedicated DMA engines offload data movement from the CPU, freeing MIPS for application code.
Typical applications include industrial Ethernet nodes with Modbus TCP, USB peripherals and HID devices, embedded web servers, gateway routers bridging USB to Ethernet, and graphical connectivity with PMP interface. The integrated Ethernet and USB make it a single-chip solution for connected IoT edges.
When designing with this part, reserve 1-2 mA per VDD rail and use a four-layer PCB with dedicated ground plane to keep Ethernet RMII signals clean. The 121-TFBGA package requires reflow soldering with proper thermal relief to the ground pad for reliable power dissipation. The Ethernet MAC requires an external MII/RMII PHY such as the LAN8720A or DP83848 for physical layer termination.
This page synthesizes distributor pricing, drop-in alternatives, and practical engineering notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC32MX675F256L-80I/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX675F256L-80I/BG (mesmo formato e footprint) — diferindo em ADC, Package, USB, DMA Channels, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX675F256LT-80I/BG
✅ Drop-In✓ Em estoque
$6.2 / unidade
Ver ficha técnica →PIC32MX675F256L-80V/BG
✅ Drop-In✓ Em estoque
$7.92 / unidade
Ver ficha técnica →PIC32MX675F512L-80I/BG
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →PIC32MX575F256L-80I/BG
✅ Drop-In✓ Em estoque
$6.12 / unidade
Ver ficha técnica →PIC32MX695F512L-80I/BG
✅ Drop-In✓ Em estoque
$14.85 / unidade
Ver ficha técnica →PIC32MX764F128L-80I/BG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC32MX675F256L-80I/BG Classificações máximas e características elétricas
| Core | MIPS32 M4K |
| Architecture | 32-bit RISC |
| Maximum CPU Speed | 80 MHz |
| Flash Memory | 256 KB |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Ethernet MAC | 10/100 Mbit (RMII/MII) |
| USB | USB 2.0 Full-Speed OTG |
| DMA Channels | 8 |
| Timers | 5 x 16-bit |
| ADC | 10-bit, 16 channels |
| PWM Outputs | 5 PWM channels |
| I/O Pins | 84 |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| Parallel Master Port (PMP) | Yes |
| Temperatura de operação | -40C to +85C (Industrial) |
| Encapsulamento | 121-ball TFBGA (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MX675F256L-80I/BG 121-ball tfbga (10x10 mm)
Configuração de pinos para PIC32MX675F256L-80I/BG (pacote 121-ball tfbga (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MX675F256L-80I/BG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MX675F256L-80I/BG é adequado para 7 aplicaçãos: Industrial Ethernet Gateway, USB HID Peripheral Device, Embedded Web Server, IoT Sensor Node with Ethernet, USB-to-Ethernet Bridge, Graphical Connectivity HMI, Home Automation Hub.
Industrial Ethernet Gateway
The PIC32MX675F256L-80I/BG is well suited for industrial Ethernet gateways because its integrated 10/100 MAC plus 80 MHz MIPS M4K core delivers sufficient MIPS for Modbus TCP, PROFINET and EtherNet/IP stack execution. The 256 KB Flash holds the TCP/IP stack and application code with headroom, while 64 KB SRAM supports packet buffers. The device connects via RMII to a 100 Mbit PHY like LAN8720A, eliminating external MAC chips. Hardware CRC offload and 8-channel DMA accelerate TCP/IP throughput.
Recomendado
USB HID Peripheral Device
The PIC32MX675F256L-80I/BG is ideal for USB Human Interface Devices because its USB 2.0 full-speed OTG controller with internal transceiver requires no external PHY and supports device, host, and dual-role modes. The 80 MHz M4K core can handle HID class drivers plus vendor-specific protocols. The 64 KB SRAM accommodates USB endpoint buffers plus HID report buffers. The 256 KB Flash holds USB stacks including CDC, HID, and vendor classes.
Recomendado
Embedded Web Server
The PIC32MX675F256L-80I/BG is well matched for embedded web servers because the 10/100 Ethernet MAC with TCP/IP offload, plus 80 MHz M4K core, can serve HTTP, MQTT, or REST APIs at sustained 95+ Mbit throughput. The 256 KB Flash holds a TCP/IP stack plus a lightweight web server, while 64 KB SRAM supports TCP sockets and packet buffers. The integrated USB stack adds field-upgrade capability via USB flash drives.
Recomendado
IoT Sensor Node with Ethernet
The PIC32MX675F256L-80I/BG suits industrial IoT sensor nodes because the integrated Ethernet plus 16-channel 10-bit ADC reads analog sensors and publishes them over IP networks. The 8-channel DMA offloads ADC sampling and TCP transmissions, letting the MCU handle multiple sensor streams. The 84 GPIO accommodate digital sensors and actuators. Operating from -40C to +85C industrial range, it tolerates factory-floor environments.
Recomendado
USB-to-Ethernet Bridge
The PIC32MX675F256L-80I/BG is a natural fit for USB-to-Ethernet bridges because its USB 2.0 full-speed OTG plus integrated 10/100 Ethernet MAC provide both endpoints natively without external PHYs. The 80 MHz M4K core handles USB CDC-ECM class driver plus TCP/IP bridge logic in real time. The 64 KB SRAM accommodates concurrent USB and Ethernet packet buffers. The 256 KB Flash stores dual-stack firmware.
Recomendado
Graphical Connectivity HMI
The PIC32MX675F256L-80I/BG supports graphical HMIs because its Parallel Master Port (PMP) connects to TFT LCD displays for rendering, while Ethernet provides remote monitoring access. The 80 MHz M4K core delivers enough MIPS for driving LCD panels plus HTTP/JSON server in parallel. The 256 KB Flash accommodates graphics libraries plus networking stacks. The 84 GPIO support touch controller, keypad, and audio bus connections.
Recomendado
Home Automation Hub
The PIC32MX675F256L-80I/BG suits home automation hubs because the integrated Ethernet plus USB plus serial peripherals connect to WiFi modules, Z-Wave dongles, and sensor networks. The 80 MHz M4K runs the automation controller logic plus HTTP/MQTT servers. The 256 KB Flash holds the controller firmware plus automation rules. The 84 GPIO drive relays, indicator LEDs, and keypad inputs directly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX675F256L-80I/BG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX675F256LT-80I/BG | PIC32MX675F256L-80V/BG | PIC32MX675F512L-80I/BG | PIC32MX575F256L-80I/BG | PIC32MX695F512L-80I/BG | PIC32MX764F128L-80I/BG |
|---|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Maximum Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB | 512 KB | 128 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB | 32 KB |
| Ethernet MAC | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | 10/100 Mbit | None | 10/100 Mbit | 10/100 Mbit |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | No | No | No | No | No | No | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated 10/100 Ethernet MAC with same PCB footprint (vs PIC32MX575F256L-80I/BG)
- Same silicon as 256LT variant with identical parametric behavior (vs PIC32MX675F256LT-80I/BG)
- Higher SRAM versus MX764 family member (vs PIC32MX764F128L-80I/BG)
- Lower cost when Ethernet not needed (vs PIC32MX675F512L-80I/BG)
Notas de projeto
Estimated: Decouple VDD and AVDD with 100 nF ceramic capacitors placed within 5 mm of each pin, plus 4.7 uF bulk capacitors. The PIC32MX675F256L-80I/BG draws approximately 70 mA typical at 80 MHz with Ethernet and USB active. Add a ferrite bead on AVDD to isolate analog noise from digital supplies, and route AVDD separately from VDD using a star ground topology to minimize ADC reference noise.
The 121-TFBGA package requires a four-layer PCB with a solid ground plane under the BGA footprint for thermal dissipation and signal integrity. Keep the Ethernet RMII traces under 50 mm and 50 ohm impedance, routing them away from switching signals. Place the LAN8720A PHY within 25 mm of the MCU RMII pins to minimize signal degradation. Use matched-length traces for USB DP and DM pair, with 90 ohm differential impedance.
Do not exceed the maximum I/O sink/source current of 15 mA per pin or 200 mA total for the VDDIO supply. The Ethernet MAC requires the MII/RMII reference clock from the external PHY (typically 50 MHz for RMII); do not use the internal PLL output. Enable the on-chip LDO for the PLL core voltage at startup before configuring peripheral clocks. Failure to wait for PLL lock before peripheral access causes bus errors.
Series-terminate USB DP and DM lines with 22 ohm resistors placed within 4 mm of the MCU pins to suppress reflections on the 90 ohm differential pair. For RMII Ethernet, place 33 ohm series resistors on RX, RX_ER, CRS_DV, and TX_EN lines to damp resonances. Keep the 50 MHz RMII reference clock trace shorter than 25 mm and route it on the inner layer with continuous ground beneath to reduce EMI.
Estimated: At 80 MHz with Ethernet and USB active, the device dissipates approximately 250 mW typical, yielding junction-to-ambient temperature rise of roughly 15 C on a four-layer PCB with ground plane. The 121-TFBGA thermal resistance theta_JA is approximately 30 C/W. No external heatsink is needed for industrial temperature operation, but the center ground balls must be soldered to the PCB thermal pad for proper heat spreading.
Informações de conformidade
RoHS compliant per Microchip product page. Lead-free TFBGA package. Not AEC-Q100 qualified - this is a general industrial MCU. Industrial temperature range -40C to +85C only.