PIC32MX675F512L-80I/BG - 80MHz 32-bit MCU, 512KB Flash, USB, Ethernet | Microchip
N.º da peça: PIC32MX675F512L-80I/BG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.84 | $12,84 |
| 10 | $11.92 | $119,20 |
| 100 | $10.65 | $1.065,00 |
| 500 | $9.4 | $4.700,00 |
| 1.000 | $8.2 | $8.200,00 |
PIC32MX675F512L-80I/BG Visão geral
A 32-bit microcontroller (MCU) is a microprocessor-on-a-chip that integrates CPU core, program memory (Flash), data memory (SRAM), peripherals, and I/O into a single package. The PIC32 family extends the legacy PIC16/PIC24 line into the MIPS32 architecture, placing it in the broader taxonomy: microcontroller -> embedded processor -> semiconductor device. The M4K core delivers up to 105 DMIPS with a 5-stage pipeline and supports MIPS16e code compression for smaller program footprint.
Key differentiating features include dedicated DMA for USB OTG, four dedicated DMA channels, hardware crypto engine not present in this family, and integrated 10/100 Ethernet MAC with MII/RMII interfaces. The 80 MHz core combined with single-cycle multiply and divide enables deterministic real-time response, while the 121-ball TFBGA package provides high pin density for designs requiring extensive peripheral multiplexing.
The architecture combines Harvard bus topology with separate instruction and data paths, hardware multiply/divide and barrel shifter, and a programmable prefetch cache that minimizes Flash wait states at high clock rates. The integrated USB 2.0 Full-Speed OTG PHY eliminates external transceiver components, simplifying BOM and reducing PCB area for USB-equipped designs.
Typical applications include industrial Ethernet gateways, USB device controllers, embedded web servers, factory automation PLCs, and point-of-sale terminals that require simultaneous Ethernet and USB connectivity. The part also suits data loggers and HMI panels needing large Flash for graphics assets.
When designing with this part, allocate 4-6 layer PCB with continuous ground plane beneath the TFBGA to manage thermal dissipation and signal integrity. The 121-ball 0.8 mm pitch BGA requires X-ray inspection or careful reflow profiling for assembly; consider the pin-compatible TQFP-100 variants in the same family for hand-solderable prototypes.
This page synthesizes distributor pricing from multiple sources, identifies drop-in alternatives from the same PIC32MX6xx family, and provides design notes that extend beyond the manufacturer datasheet.
Alternativas drop-in para PIC32MX675F512L-80I/BG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC32MX675F512L-80I/BG (mesmo formato e footprint) — diferindo em ADC, USB, DMA Channels, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC32MX575F512L-80I/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.88 / unidade
Ver ficha técnica →PIC32MX795F512L-80I/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.1 / unidade
Ver ficha técnica →PIC32MX664F128L-I/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.81 / unidade
Ver ficha técnica →PIC32MX675F512L-80V/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.1 / unidade
Ver ficha técnica →PIC32MX675F256L-80I/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.2 / unidade
Ver ficha técnica →PIC32MX564F128L-I/BG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.7 / unidade
Ver ficha técnica →PIC32MX675F512L-80I/BG Classificações máximas e características elétricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| Performance | 105 DMIPS |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM Data Memory | 64 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| Encapsulamento | 121-pin TFBGA (10x10 mm) |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| DMA Channels | 4 dedicated (for USB OTG) |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do PIC32MX675F512L-80I/BG 121-pin tfbga (10x10 mm)
Configuração de pinos para PIC32MX675F512L-80I/BG (pacote 121-pin tfbga (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para PIC32MX675F512L-80I/BG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
PIC32MX675F512L-80I/BG é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, USB Device Controller, Embedded Web Server / HMI, Factory Automation PLC Module, Point-of-Sale (POS) Terminal, Data Logger / IoT Edge Node.
Industrial Ethernet Gateway
The PIC32MX675F512L-80I/BG's 10/100 Ethernet MAC with MII/RMII interfaces and 512 KB Flash supports full TCP/IP stacks (TCP, UDP, HTTP, MQTT) plus concurrent USB 2.0 FS OTG device or host operation, ideal for Modbus TCP-to-USB bridges and protocol converters. Its 80 MHz MIPS32 M4K core delivers 105 DMIPS, sufficient for packet processing at wire speed for 10/100 Mbps links with filtering. The 64 KB SRAM holds multiple sockets simultaneously, reducing the need for external memory. Compared with discrete Ethernet+MCU solutions, integrating MAC+PHY+USB on-chip reduces BOM by $2-$4 and PCB area by 30-40%.
Recomendado
USB Device Controller
The integrated USB 2.0 Full-Speed OTG peripheral with on-chip PHY eliminates external transceivers for CDC ACM, HID, MSD, and vendor-class USB device applications. With 80 MHz CPU and DMA-backed USB endpoints, the PIC32MX675F512L-80I/BG achieves deterministic USB 12 Mbps throughput while leaving CPU bandwidth for application logic. The 512 KB Flash stores USB stacks plus application firmware, and 64 KB SRAM handles endpoint buffers. Compared with discrete USB-capable MCUs requiring external PHY, this part's integrated approach simplifies board layout and reduces component count.
Recomendado
Embedded Web Server / HMI
The combination of 512 KB Flash, 64 KB SRAM, and 80 MHz core makes the PIC32MX675F512L-80I/BG well-suited for embedded web servers running MPLAB Harmony TCP/IP stack with HTTP/HTTPS handlers, plus TFT HMI displays over the 16-bit PMP bus. The Ethernet MAC serves web pages, while the parallel master port drives color TFTs without external controller. Designers can host AJAX-style interfaces with reasonable response times under 100 ms. The PIC32MX6 family's proven Harmony middleware shortens time-to-market versus bare-metal Ethernet implementations.
Recomendado
Factory Automation PLC Module
The PIC32MX675F512L-80I/BG drives industrial PLC expansion modules requiring Ethernet connectivity to a master controller plus USB for configuration via laptop. Its 80 MHz core executes ladder-logic emulation or soft-PLC runtimes within deterministic cycle times, while 64 KB SRAM buffers process variables. The 121-TFBGA package suits high-density PLC backplanes. Compared with smaller MCUs, the integrated USB OTG eliminates external USB interface chips, and the integrated Ethernet MAC saves $1.50-$3 versus external MAC+PHY solutions.
Recomendado
Point-of-Sale (POS) Terminal
POS terminals benefit from the PIC32MX675F512L-80I/BG's Ethernet for payment gateway connectivity and USB OTG for peripherals (barcode scanners, receipt printers, cash drawers). The 512 KB Flash stores encrypted transaction handling logic, and 64 KB SRAM manages USB HID + CDC stacks simultaneously. Hardware AES engine is not included, so cryptographic operations may consume more CPU cycles; for high-volume payment apps, consider PIC32MZ family. Compared with ARM Cortex-M4 alternatives, this part offers proven Harmony middleware for embedded TCP/IP and USB stacks.
Recomendado
Data Logger / IoT Edge Node
The PIC32MX675F512L-80I/BG functions as an IoT edge node aggregating sensor data via UART/SPI/I2C and forwarding to a cloud service over Ethernet. Its 512 KB Flash supports over-the-air firmware update routines, while 64 KB SRAM buffers time-series data before TCP transmission. The 80 MHz core runs MQTT or CoAP clients with reasonable latency. Compared with smaller Cortex-M0+ alternatives, this part's integrated Ethernet eliminates external MAC chips, simplifying the design and lowering BOM for production deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC32MX675F512L-80I/BG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC32MX575F512L-80I/BG | PIC32MX795F512L-80I/BG | PIC32MX664F128L-I/BG | PIC32MX675F512L-80V/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 80 MHz (105 DMIPS) | 80 MHz | 80 MHz (105 DMIPS) | 80 MHz | 80 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 128 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 128 KB | 32 KB | 64 KB |
| Ethernet MAC | Yes (10/100 MII/RMII) | No | Yes (10/100 MII/RMII) | Yes (10/100 MII/RMII) | Yes (10/100 MII/RMII) |
| USB OTG | Yes (USB 2.0 FS, on-chip PHY) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS, on-chip PHY) | Yes (USB 2.0 FS, on-chip PHY) | Yes (USB 2.0 FS, on-chip PHY) |
| CAN | No | No | Yes | Yes | No |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial | Extended |
Principais diferenciais
- Single-chip Ethernet + USB OTG with integrated PHY (vs PIC32MX575F512L-80I/BG)
- Lower Flash density vs same-family upgrade (vs PIC32MX664F128L-I/BG)
- Maintains pinout across speed grades (vs PIC32MX795F512L-80I/BG)
Notas de projeto
The 121-ball TFBGA at 0.8 mm pitch requires 4-6 layer PCB with continuous ground plane beneath the package. Use micro-via or via-in-pad technology for inner-row balls to escape routing. Per Microchip PIC32MX5/6/7 family datasheet, allow at least 4 mil trace/space design rules. Decoupling: place 0.1 uF X7R ceramic as close as possible to each VDD pin, plus 4.7 uF bulk tantalum near the package. Reflow profile should follow JEDEC J-STD-020 with peak temperature 245C max.
The PIC32MX675F512L-80I/BG core draws up to 80 mA at 80 MHz with peripherals active. Total board current including I/O can exceed 120 mA, so the LDO or switching regulator supplying VDD must deliver at least 200 mA with adequate thermal margin. Use a 10 uF input capacitor and 10 uF + 0.1 uF output capacitor for the external 3.3 V regulator. Avoid sharing the regulator with high-current loads that could induce 50-100 mV dips during USB enumeration events.
Do not exceed the 3.6 V absolute maximum on any I/O pin, including during in-circuit serial programming (ICSP) with HV mode. The 5 V tolerant I/O only applies to designated pins (see pinout table in datasheet). Common pitfall: leaving the MCLR pin floating during prototyping - always pull MCLR to VDD via 10 kohm resistor to prevent spurious resets. Also, configure unused I/O as outputs (low) to minimize current draw.
Route the 50 MHz Ethernet MII signals with controlled impedance (50 ohm single-ended) and length-matching within 50 mil between clock and data pairs. Keep RMII traces under 50 mm if possible. The USB DP/DM differential pair requires 90 ohm differential impedance, no stubs, and length matching within 2 mm. Isolate analog reference and PLL supply pins (VDDPLL, AVDD) with ferrite beads from digital supplies to minimize jitter.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade only); for automotive applications use PIC32MX family variants with /VA or /PT automotive suffixes.
